JPH03112688A - Ic card - Google Patents
Ic cardInfo
- Publication number
- JPH03112688A JPH03112688A JP1249335A JP24933589A JPH03112688A JP H03112688 A JPH03112688 A JP H03112688A JP 1249335 A JP1249335 A JP 1249335A JP 24933589 A JP24933589 A JP 24933589A JP H03112688 A JPH03112688 A JP H03112688A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- module
- card
- thickness
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000000758 substrate Substances 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract description 3
- 239000011889 copper foil Substances 0.000 abstract description 3
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- 229920000647 polyepoxide Polymers 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 239000011810 insulating material Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ＩＣモジュールを搭載したＩＣカドに関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC card equipped with an IC module.
ＩＣメモリーカードは、その呼称が示すように、半導体
メモリーＩＣを小型パッケージに埋め込み、持ち運びや
取扱い等を容易にしたリムーバブルな記憶媒体であり、
形状としては、現在クレジットカードサイズで厚さが２
〜５ＩＩＩＩ１１のものが主流を占めている。ＩＣメモ
リーカードは半導体メモリー素子を内蔵した媒体であり
、基本的には、現在普及しているフロッピーディスクと
同じような外部記憶メディアとしてとらえることができ
るが、半導体メディアとして将来の磁気メディアと較べ
、優れた特徴を持っておりこの点に注目して、新しい記
録メディアとしての活用が各分野で進められている。こ
のような中にあってｔＣメモリーカドの大容量化が望ま
れているが、一定の大きさのカード寸法でメモリーの大
容量化を計ることは、従来の技術では、なかなか難しか
った。As the name suggests, an IC memory card is a removable storage medium with a semiconductor memory IC embedded in a small package, making it easy to carry and handle.
The shape is currently credit card size and 2mm thick.
-5III11 are the mainstream. An IC memory card is a medium with a built-in semiconductor memory element, and can basically be seen as an external storage medium similar to the currently popular floppy disk. It has excellent characteristics, and with this point in mind, its use as a new recording medium is being promoted in various fields. Under these circumstances, it is desired to increase the capacity of tC memory cards, but with conventional technology, it has been difficult to increase the capacity of memory with a fixed card size.
従来のメモリーカードに内蔵されるＩＣモジュールは、
通常リードフレーム上にＩＣチップを搭載し、ＩＣチッ
プとリードフレームをワイヤーでボンディングした後、
エポキシで全体を封止したＩＣモジュールを、カード内
のプリント基板に搭載しカード化している。このような
リードフレームを使用したＩＣモジュールの形態として
は、Ｄ Ｉ Ｐ （ｄｕａｌ ｉｎ １ｉｎｅ ｐａｋ
ａｇｅ）やＳ ＯＰ （ｓｍａｌｌｏｕｔｌｉｎｅ ｐ
ａｃｋａｇｅ）等のパッケージがあるが、いずれも構造
上厚みは１．２ｍｍ以上になり、メモリカード内に搭載
して大容量化するには、メモリーカードの大きさや厚み
に制約があるため、多数のＩＣモジュールをカード内に
搭載することは物理的に不可能である。そこで現在ＣＯ
Ｂ （Ｃｈｉｐ ｏｎＢｏａｒｄ）法やＴ Ａ Ｂ （
Ｔａｐｅ Ａｕｔｏｍａｔｅｄ Ｂｏｎｄｉｎｇ）法が
検討されている。ＣＯＢ法は、実装密度を高くできるが
、多数のチップを実装することは、歩留まりが悪くリペ
アが困難なため、製造コストが高くなり現実的には難し
い、またＴＡＢ法は、チップあるいはリード側にバンプ
を設ける工程が必要であり、コストが高く、また技術的
にも難しい。The IC module built into a conventional memory card is
Usually, after mounting an IC chip on a lead frame and bonding the IC chip and lead frame with wire,
The IC module is completely sealed with epoxy and mounted on a printed circuit board inside the card. The format of an IC module using such a lead frame is DIP (dual in 1ine pak).
age) and S OP (smalloutline p
There are packages such as ackage), but all of them have a thickness of 1.2 mm or more due to their structure, and there are restrictions on the size and thickness of the memory card, so in order to increase the capacity by installing it in a memory card, there are many It is physically impossible to mount an IC module inside a card. So now CO
B (Chip on Board) method and T A B (
Tape Automated Bonding) method is being considered. The COB method can increase the packaging density, but mounting a large number of chips has a low yield and is difficult to repair, which increases manufacturing costs and is difficult in practice.Also, the TAB method A process for providing bumps is required, which is expensive and technically difficult.
本発明は、従来のこのような課題を解決しようとするも
ので、ＩＣモジュールの厚みを薄（し、容易に大容量Ｉ
Ｃメモリーカードを提供することを目的とするものであ
る。The present invention aims to solve these conventional problems, and aims to reduce the thickness of an IC module (and easily increase the capacity of a large-capacity IC module).
The purpose is to provide C memory cards.
〔課題を解決するための手段］
本発明は、上述の従来の問題点を解決するために、リー
ドフレームの代わりにプリント基板を使用した薄いＩＣ
モジュールをカード内に搭載することにより大容量ＩＣ
メモリーカードの製造をはじめて可能にした。すなわち
、本発明はパターニングされた厚さ２００μｍ以下のプ
リント基板上にＩＣチップを搭載し、かつＩＣチップ搭
載面のみを樹脂封止したＩＣモジュールをカード内に搭
載したことを特徴とするＩＣカードである。[Means for Solving the Problems] In order to solve the above-mentioned conventional problems, the present invention provides a thin IC using a printed circuit board instead of a lead frame.
Large-capacity IC by mounting the module inside the card
This made it possible to manufacture memory cards for the first time. That is, the present invention is an IC card characterized in that an IC chip is mounted on a patterned printed circuit board with a thickness of 200 μm or less, and an IC module in which only the IC chip mounting surface is sealed with resin is mounted inside the card. be.
本発明についてさらに詳細に説明すると、まずガラス／
エポキシ等からなる、厚さ２００μｍ以下好ましくは１
５０μｍ以下の、薄い、両面に導電層例えば銅箔を有す
る、プリント基板をパターニングし、必要な回路を設け
た基板上に厚さ３００μｍ以下に薄く研摩したＩＣチッ
プをグイボンディングし、ウェッジボンダーによりチッ
プと回路とをワイヤーボンドする。この時ワイヤーの高
さは、本発明の目的を達成できるようなるべく低くなる
ように条件設定する。そしてエポキシ樹脂で、チップの
搭載しである片面のみを、トランスファーモールド、あ
るいは液状エポキシ樹脂などで封止する。この方法によ
り封止後のモジュール全体の厚みは、例えば６００μｍ
以下と非常に薄くすることができる。本発明に係るＩＣ
モジュールを搭載すれば従来のリードフレームを使用し
たモジュールを搭載した場合と比較して、大ｒｊｌに薄
くできるため、例えば、３．４胴厚規格のメモリーカー
ド内に従来のモジュールでは不可能であった、例えば三
層実装が可能になり、カード内に搭載できるＩＣモジュ
ールの数も大巾にアップすることができ、メモリーカー
ドとしての容量も従来品に較べて大容量化することがで
きる。また、従来と同じメモリー容量であれば、本発明
に係る薄いモジュールをカード内、に実装することによ
りカード厚みを更に薄くすることが可能になる。 −さ
らにまた、例えば電子手帳等の厚さ２閣程度の薄いメモ
リーカードにおいても本発明に係る薄いモジュールを使
用することにより大容量化が可能になる。To explain the present invention in more detail, first, glass/
Made of epoxy or the like, preferably 1 µm or less in thickness
A thin printed circuit board of 50 μm or less, with conductive layers such as copper foil on both sides, is patterned, and an IC chip polished to a thickness of 300 μm or less is bonded onto the board on which the necessary circuits are provided, and the chip is bonded using a wedge bonder. and the circuit are wire-bonded. At this time, the height of the wire is set to be as low as possible so as to achieve the object of the present invention. Then, only one side on which the chip is mounted is sealed with epoxy resin using transfer molding or liquid epoxy resin. The thickness of the entire module after sealing using this method is, for example, 600 μm.
It can be made very thin with less. IC according to the present invention
By mounting a module, it can be made much thinner than when mounting a module using a conventional lead frame. In addition, for example, three-layer mounting becomes possible, the number of IC modules that can be mounted in the card can be greatly increased, and the capacity of the memory card can be increased compared to conventional products. Further, if the memory capacity is the same as that of the conventional card, it is possible to further reduce the thickness of the card by mounting the thin module according to the present invention inside the card. -Furthermore, by using the thin module according to the present invention, it is possible to increase the capacity even in a thin memory card, for example, an electronic notebook, which is about two inches thick.
本発明のメモリーカードは、従来のリードフレームを使
用するＩＣモジュールに比較して、モジュール厚みを大
巾に薄くでき、またＣＯＢ法や、ＴＡＢ法等に比べて製
造工程も簡略であり、コストも低減化することができ、
ＩＣモジュールとしての機能の信顛性も良い。The memory card of the present invention allows the module thickness to be significantly reduced compared to IC modules that use conventional lead frames, and also has a simpler manufacturing process and lower cost than the COB method, TAB method, etc. can be reduced,
The reliability of the function as an IC module is also good.
カード内に搭載できるＩＣモジュールの数は現在のカー
ドの規格に大きさの制約（５４，０ｘ８５．６ｘ３．４
ｍｍ）があるためＩＣモジュールの形状や、他の搭載部
品またはその数によって決まるが、通常市販されている
ＤＩＰや、ＳＯＰのパッケージ品では、その形状が大き
いため１０〜２０個搭載するのが限度であるが、本発明
に係るＩＣモジュールは、パッケージ形状が、従来品と
比較して大巾に薄くまた、小さいため、最大４０個程度
の搭載が可能になる。ＩＣモジュールの搭載が１０個程
度ですむメモリーカードにおいては、従来のパッケージ
品でも、カード内のスペースに余裕があるためそれほど
問題は無いが、１０個以上ＩＣモジュールを搭載する場
合には、従来のパッケージ品では、スペースに余裕が無
くなるため、他の部品を搭載することが難しくなる。本
発明にかかるＩＣモジュールは、１０個以上の搭載にお
いても、カード内スペースに大きな余裕があり、何ら問
題は無い。かくして最大４０個程度迄搭載が可能となり
、大容量メモリーカードを容易に製造することができる
。また本発明によれば、同等の機能を有する、より小さ
な寸法のＩＣカードの製造も可能となる。The number of IC modules that can be installed in a card is limited by the size of the current card standard (54,0x85.6x3.4
(mm), so it depends on the shape of the IC module and other mounted components or their number, but with DIP and SOP packaged products that are usually commercially available, the limit is 10 to 20 pieces installed due to their large size. However, since the IC module according to the present invention has a package shape that is much thinner and smaller than conventional products, it is possible to mount a maximum of about 40 IC modules. For memory cards that only require about 10 IC modules to be installed, there is not much of a problem with conventional packaged products as there is plenty of space inside the card. However, when installing more than 10 IC modules, conventional packaging With packaged products, there is no extra space, making it difficult to mount other components. The IC module according to the present invention has a large space within the card even when ten or more IC modules are installed, and there is no problem at all. In this way, up to about 40 cards can be installed, and large capacity memory cards can be manufactured easily. Further, according to the present invention, it is also possible to manufacture an IC card having a smaller size and having equivalent functions.
以下、図面を参照しながら、本発明をさらに詳細に説明
する。Hereinafter, the present invention will be explained in more detail with reference to the drawings.
第１，２図に本発明に係るＩＣモジュール８の断面図を
示す。1 and 2 show cross-sectional views of an IC module 8 according to the present invention.
本発明のＩＣカード内に内蔵するＩＣモジュール８は、
例えばガラス／エポキシ等の絶縁性材料からなる支持体
１の両面または片面に導電層例えば銅箔を有する厚み２
０ Ｑ （ｔｍ以下、好ましくは１５０μｍ以下の薄い
プリント基板をパターニングし、チップ４の搭載側にボ
ンディング用端子２を設ける。また、スルーホールを通
して接続用端子３を設ける。ボンディング用端子２は、
表面を例えば軟質金メツキで形成し、また接続用端子３
面は、半田メツキで形成するのが好ましい。チップ４は
、支持体１の上に、接着剤７で接着する。The IC module 8 built into the IC card of the present invention is
A support 1 made of an insulating material such as glass/epoxy has a conductive layer such as a copper foil on both sides or one side.
0 Q (A thin printed circuit board with a thickness of tm or less, preferably 150 μm or less is patterned, and bonding terminals 2 are provided on the side where the chip 4 is mounted. Connection terminals 3 are also provided through through holes. The bonding terminals 2 are
The surface is made of soft gold plating, for example, and the connection terminal 3
Preferably, the surface is formed by solder plating. The chip 4 is adhered onto the support 1 with an adhesive 7.
チップ４とポンディング端子２とは、ワイヤー５で接続
する。ワイヤーボンディングは、ワイヤーの高さを低く
するためにウェッジボンダーを使用し、ワイヤー高さが
なるべく低くなる条件を設定する。ＩＣチップ４が搭載
された側は、ワイヤならびにＩＣチップが充分被覆され
保護されるように例えばエポキシ樹脂６により樹脂封止
する。The chip 4 and the bonding terminal 2 are connected by a wire 5. Wire bonding uses a wedge bonder to reduce the height of the wire, and conditions are set to make the wire height as low as possible. The side on which the IC chip 4 is mounted is sealed with, for example, epoxy resin 6 so that the wires and the IC chip are sufficiently covered and protected.
この場合の封止は、トランスファーモールドで封止する
のが、厚み、精度、生産性の点で好ましいが液状樹脂で
も構わない。しかしモジュール８全体の厚みを７００好
ましくは６００μｍ以下にすることが本発明において重
要なことである。第２図のように片面基板を用いたスル
ーホールの無い構造であれば、更に薄くすることができ
る。このＩＣモジュール８を第３図のように、プリント
基板９の両面に、表面実装し、カード内に搭載する。In this case, it is preferable to seal by transfer molding in terms of thickness, precision, and productivity, but liquid resin may also be used. However, it is important in the present invention that the overall thickness of the module 8 is 700 μm or less, preferably 600 μm or less. If it has a structure without through holes using a single-sided substrate as shown in FIG. 2, it can be made even thinner. As shown in FIG. 3, this IC module 8 is surface-mounted on both sides of a printed circuit board 9 and mounted in a card.
ＩＣモジュール８の接続端子部３とＩＣカード内のプリ
ント基板９とは、例えば半田ペーストを使用してリフロ
ー法により接続する。The connection terminal portion 3 of the IC module 8 and the printed circuit board 9 in the IC card are connected by a reflow method using, for example, solder paste.
本発明のＩＣモジュール８は、パッケージが従来品に比
べて薄いため例えば第３図のように、厚み３．４ｍｓの
カード内にＩＣモジュールを三層に実装することができ
る。この場合、最大４０個程度まで搭載でき、メモリー
の大容量化を実現し得る。Since the IC module 8 of the present invention has a thinner package than conventional products, the IC module can be mounted in three layers in a card with a thickness of 3.4 ms, as shown in FIG. 3, for example. In this case, up to about 40 devices can be installed, and a large memory capacity can be achieved.
また、第４図のような二層実装の例では、従来のＤＩＰ
やＳＯＰのＩｃモジュールを搭載したカードより薄くで
き、カード全体の厚みは、例えば２叩以下と薄くするこ
とが可能であり、実用上の携帯性、保管性も良くなる。In addition, in the example of two-layer mounting as shown in Fig. 4, conventional DIP
It can be made thinner than a card equipped with an Ic module such as or SOP, and the overall thickness of the card can be reduced to, for example, 2 mm or less, which improves practical portability and storability.
本発明のメモリーカードは、従来のリードフレームを使
用するＩＣモジュールに比較して、モジュール厚みを大
巾に薄（でき、又ＣＯＢ法や、ＴＡＢ法等に比べて製造
工程も簡略であり、コストも低減化することができ、Ｉ
Ｃモジュールとしての機能の信頬性も良い。The memory card of the present invention has a much thinner module thickness (compared to IC modules using conventional lead frames), and has a simpler manufacturing process and lower cost than COB or TAB methods. can also be reduced, I
The reliability of its functionality as a C module is also good.
第１．２図は本発明のＩＣモジュール８の断面構造図で
あるが、第１図は両面基板を用いた構造図であり、第２
図は片面基板を用いた構造図である。第３図は第１図の
ＩＣモジュールを三層に搭載したＩＣカードの断面構造
図、第４図は、第１図のＩＣモジュールを二層に搭載し
たＩＣカードの断面構造図である。
１−・−支持体、２−ボンディング用端子、３・・接続
用端子、４−・ＩＣチップ、５・−・ワイヤー、６・封
止樹脂、７・−・接着剤、８−本発明ＩＣモジュール、
９−プリント基板、１０・−・コネクタ一部。1.2 is a cross-sectional structural diagram of the IC module 8 of the present invention; FIG. 1 is a structural diagram using a double-sided substrate;
The figure is a structural diagram using a single-sided substrate. 3 is a cross-sectional structural diagram of an IC card in which the IC modules of FIG. 1 are mounted in three layers, and FIG. 4 is a cross-sectional structural diagram of an IC card in which the IC modules of FIG. 1 are mounted in two layers. 1--Support, 2--Bonding terminal, 3--Connection terminal, 4--IC chip, 5--Wire, 6--Sealing resin, 7--Adhesive, 8--IC of the present invention module,
9-Printed circuit board, 10--Part of connector.
Claims (1)
基板上にＩＣチップを搭載し、かつＩＣチップ搭載面の
みを樹脂封止したＩＣモジュールをカード内に搭載した
ことを特徴とするＩＣカード。1. An IC card characterized in that an IC chip is mounted on a patterned printed circuit board with a thickness of 200 μm or less, and an IC module is mounted in the card, with only the IC chip mounting surface sealed with resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1249335A JPH03112688A (en) | 1989-09-27 | 1989-09-27 | Ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1249335A JPH03112688A (en) | 1989-09-27 | 1989-09-27 | Ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03112688A true JPH03112688A (en) | 1991-05-14 |
Family
ID=17191487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1249335A Pending JPH03112688A (en) | 1989-09-27 | 1989-09-27 | Ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03112688A (en) |
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6570825B2 (en) | 2001-08-21 | 2003-05-27 | Amkor Technology, Inc. | Method and circuit module package for automated switch actuator insertion |
| US6632997B2 (en) | 2001-06-13 | 2003-10-14 | Amkor Technology, Inc. | Personalized circuit module package and method for packaging circuit modules |
| US6717822B1 (en) | 2002-09-20 | 2004-04-06 | Amkor Technology, Inc. | Lead-frame method and circuit module assembly including edge stiffener |
| US6900527B1 (en) | 2001-09-19 | 2005-05-31 | Amkor Technology, Inc. | Lead-frame method and assembly for interconnecting circuits within a circuit module |
| US6910635B1 (en) | 2002-10-08 | 2005-06-28 | Amkor Technology, Inc. | Die down multi-media card and method of making same |
| US6911718B1 (en) | 2003-07-03 | 2005-06-28 | Amkor Technology, Inc. | Double downset double dambar suspended leadframe |
| US7019387B1 (en) | 2002-02-14 | 2006-03-28 | Amkor Technology, Inc. | Lead-frame connector and circuit module assembly |
| US7074654B1 (en) | 2004-04-21 | 2006-07-11 | Amkor Technology, Inc. | Tape supported memory card leadframe structure |
| US7102891B1 (en) | 2003-07-23 | 2006-09-05 | Amkor Technology, Inc. | Circuit module having interconnects for connecting functioning and non-functioning add ons and method therefor |
| US7102214B1 (en) | 2002-12-26 | 2006-09-05 | Amkor Technology, Inc. | Pre-molded leadframe |
| US7112875B1 (en) | 2005-02-17 | 2006-09-26 | Amkor Technology, Inc. | Secure digital memory card using land grid array structure |
| US7193305B1 (en) | 2004-11-03 | 2007-03-20 | Amkor Technology, Inc. | Memory card ESC substrate insert |
| US7201327B1 (en) | 2004-10-18 | 2007-04-10 | Amkor Technology, Inc. | Memory card and its manufacturing method |
| US7220915B1 (en) | 2005-02-17 | 2007-05-22 | Amkor Technology, Inc. | Memory card and its manufacturing method |
| US7359204B1 (en) | 2006-02-15 | 2008-04-15 | Amkor Technology, Inc. | Multiple cover memory card |
| US7358600B1 (en) | 2003-05-01 | 2008-04-15 | Amkor Technology, Inc. | Interposer for interconnecting components in a memory card |
| US7556986B1 (en) | 2004-04-21 | 2009-07-07 | Amkor Technology, Inc. | Tape supported memory card leadframe structure |
| US7633763B1 (en) | 2004-01-28 | 2009-12-15 | Amkor Technology, Inc. | Double mold memory card and its manufacturing method |
| US7719845B1 (en) | 2005-04-26 | 2010-05-18 | Amkor Technology, Inc. | Chamfered memory card module and method of making same |
| US7837120B1 (en) | 2005-11-29 | 2010-11-23 | Amkor Technology, Inc. | Modular memory card and method of making same |
| US9367712B1 (en) | 2007-03-01 | 2016-06-14 | Amkor Technology, Inc. | High density memory card using folded flex |
-
1989
- 1989-09-27 JP JP1249335A patent/JPH03112688A/en active Pending
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6632997B2 (en) | 2001-06-13 | 2003-10-14 | Amkor Technology, Inc. | Personalized circuit module package and method for packaging circuit modules |
| US6570825B2 (en) | 2001-08-21 | 2003-05-27 | Amkor Technology, Inc. | Method and circuit module package for automated switch actuator insertion |
| US6900527B1 (en) | 2001-09-19 | 2005-05-31 | Amkor Technology, Inc. | Lead-frame method and assembly for interconnecting circuits within a circuit module |
| US7019387B1 (en) | 2002-02-14 | 2006-03-28 | Amkor Technology, Inc. | Lead-frame connector and circuit module assembly |
| US6717822B1 (en) | 2002-09-20 | 2004-04-06 | Amkor Technology, Inc. | Lead-frame method and circuit module assembly including edge stiffener |
| US6910635B1 (en) | 2002-10-08 | 2005-06-28 | Amkor Technology, Inc. | Die down multi-media card and method of making same |
| US7011251B1 (en) | 2002-10-08 | 2006-03-14 | Amkor Technology, Inc. | Die down multi-media card and method of making same |
| US7102214B1 (en) | 2002-12-26 | 2006-09-05 | Amkor Technology, Inc. | Pre-molded leadframe |
| US7358600B1 (en) | 2003-05-01 | 2008-04-15 | Amkor Technology, Inc. | Interposer for interconnecting components in a memory card |
| US6911718B1 (en) | 2003-07-03 | 2005-06-28 | Amkor Technology, Inc. | Double downset double dambar suspended leadframe |
| US7102891B1 (en) | 2003-07-23 | 2006-09-05 | Amkor Technology, Inc. | Circuit module having interconnects for connecting functioning and non-functioning add ons and method therefor |
| US7633763B1 (en) | 2004-01-28 | 2009-12-15 | Amkor Technology, Inc. | Double mold memory card and its manufacturing method |
| US7074654B1 (en) | 2004-04-21 | 2006-07-11 | Amkor Technology, Inc. | Tape supported memory card leadframe structure |
| US7556986B1 (en) | 2004-04-21 | 2009-07-07 | Amkor Technology, Inc. | Tape supported memory card leadframe structure |
| US7201327B1 (en) | 2004-10-18 | 2007-04-10 | Amkor Technology, Inc. | Memory card and its manufacturing method |
| US7193305B1 (en) | 2004-11-03 | 2007-03-20 | Amkor Technology, Inc. | Memory card ESC substrate insert |
| US7220915B1 (en) | 2005-02-17 | 2007-05-22 | Amkor Technology, Inc. | Memory card and its manufacturing method |
| US7485491B1 (en) | 2005-02-17 | 2009-02-03 | Amkor Technology, Inc. | Secure digital memory card using land grid array structure |
| US7112875B1 (en) | 2005-02-17 | 2006-09-26 | Amkor Technology, Inc. | Secure digital memory card using land grid array structure |
| US7719845B1 (en) | 2005-04-26 | 2010-05-18 | Amkor Technology, Inc. | Chamfered memory card module and method of making same |
| US7837120B1 (en) | 2005-11-29 | 2010-11-23 | Amkor Technology, Inc. | Modular memory card and method of making same |
| US7359204B1 (en) | 2006-02-15 | 2008-04-15 | Amkor Technology, Inc. | Multiple cover memory card |
| US9367712B1 (en) | 2007-03-01 | 2016-06-14 | Amkor Technology, Inc. | High density memory card using folded flex |
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