JPH03112688A - Ic card - Google Patents

Ic card

Info

Publication number
JPH03112688A
JPH03112688A JP1249335A JP24933589A JPH03112688A JP H03112688 A JPH03112688 A JP H03112688A JP 1249335 A JP1249335 A JP 1249335A JP 24933589 A JP24933589 A JP 24933589A JP H03112688 A JPH03112688 A JP H03112688A
Authority
JP
Japan
Prior art keywords
chip
mounting
module
thickness
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1249335A
Other languages
Japanese (ja)
Inventor
Tsumoru Kuwabara
Original Assignee
Asahi Chem Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chem Ind Co Ltd filed Critical Asahi Chem Ind Co Ltd
Priority to JP1249335A priority Critical patent/JPH03112688A/en
Publication of JPH03112688A publication Critical patent/JPH03112688A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors

Abstract

PURPOSE: To thin the thickness of an IC module and to obtain a mass-IC memory card by mounting the IC module, which mounts an IC chip on a patterned printed board having not more than specific thickness dimension and which resin-seals only the IC-chip-mounting surface, in a card.
CONSTITUTION: In an IC module 8 built in an IC card, a thin printed board with a thickness of not more than 200 μm having a conductive layer, e.g. a copper foil is patterned on a substrate 1 composed of an insulating material and a bonding terminal 2 is provided on the mounting side of a chip 4. Also, a connection terminal 3 is provided via a through hole. The chip 4 is bonded onto the substrate 1 by an adhesive 7 and connected with the bonding terminal 2 for the chip 4 by a wire 5 and the side for mounting the IC chip 4 is resin- sealed, e.g. by epoxy resin 6 so that the wire and IC chip are covered and protected sufficiently. The thickness of the whole module 8 is thinned to 700 μm or below.
COPYRIGHT: (C)1991,JPO&Japio
JP1249335A 1989-09-27 1989-09-27 Ic card Pending JPH03112688A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1249335A JPH03112688A (en) 1989-09-27 1989-09-27 Ic card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1249335A JPH03112688A (en) 1989-09-27 1989-09-27 Ic card

Publications (1)

Publication Number Publication Date
JPH03112688A true JPH03112688A (en) 1991-05-14

Family

ID=17191487

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1249335A Pending JPH03112688A (en) 1989-09-27 1989-09-27 Ic card

Country Status (1)

Country Link
JP (1) JPH03112688A (en)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6570825B2 (en) 2001-08-21 2003-05-27 Amkor Technology, Inc. Method and circuit module package for automated switch actuator insertion
US6632997B2 (en) 2001-06-13 2003-10-14 Amkor Technology, Inc. Personalized circuit module package and method for packaging circuit modules
US6717822B1 (en) 2002-09-20 2004-04-06 Amkor Technology, Inc. Lead-frame method and circuit module assembly including edge stiffener
US6900527B1 (en) 2001-09-19 2005-05-31 Amkor Technology, Inc. Lead-frame method and assembly for interconnecting circuits within a circuit module
US6911718B1 (en) 2003-07-03 2005-06-28 Amkor Technology, Inc. Double downset double dambar suspended leadframe
US6910635B1 (en) 2002-10-08 2005-06-28 Amkor Technology, Inc. Die down multi-media card and method of making same
US7019387B1 (en) 2002-02-14 2006-03-28 Amkor Technology, Inc. Lead-frame connector and circuit module assembly
US7074654B1 (en) 2004-04-21 2006-07-11 Amkor Technology, Inc. Tape supported memory card leadframe structure
US7102214B1 (en) 2002-12-26 2006-09-05 Amkor Technology, Inc. Pre-molded leadframe
US7102891B1 (en) 2003-07-23 2006-09-05 Amkor Technology, Inc. Circuit module having interconnects for connecting functioning and non-functioning add ons and method therefor
US7112875B1 (en) 2005-02-17 2006-09-26 Amkor Technology, Inc. Secure digital memory card using land grid array structure
US7193305B1 (en) 2004-11-03 2007-03-20 Amkor Technology, Inc. Memory card ESC substrate insert
US7201327B1 (en) 2004-10-18 2007-04-10 Amkor Technology, Inc. Memory card and its manufacturing method
US7220915B1 (en) 2005-02-17 2007-05-22 Amkor Technology, Inc. Memory card and its manufacturing method
US7358600B1 (en) 2003-05-01 2008-04-15 Amkor Technology, Inc. Interposer for interconnecting components in a memory card
US7359204B1 (en) 2006-02-15 2008-04-15 Amkor Technology, Inc. Multiple cover memory card
US7556986B1 (en) 2004-04-21 2009-07-07 Amkor Technology, Inc. Tape supported memory card leadframe structure
US7633763B1 (en) 2004-01-28 2009-12-15 Amkor Technology, Inc. Double mold memory card and its manufacturing method
US7719845B1 (en) 2005-04-26 2010-05-18 Amkor Technology, Inc. Chamfered memory card module and method of making same
US7837120B1 (en) 2005-11-29 2010-11-23 Amkor Technology, Inc. Modular memory card and method of making same
US9367712B1 (en) 2007-03-01 2016-06-14 Amkor Technology, Inc. High density memory card using folded flex

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6632997B2 (en) 2001-06-13 2003-10-14 Amkor Technology, Inc. Personalized circuit module package and method for packaging circuit modules
US6570825B2 (en) 2001-08-21 2003-05-27 Amkor Technology, Inc. Method and circuit module package for automated switch actuator insertion
US6900527B1 (en) 2001-09-19 2005-05-31 Amkor Technology, Inc. Lead-frame method and assembly for interconnecting circuits within a circuit module
US7019387B1 (en) 2002-02-14 2006-03-28 Amkor Technology, Inc. Lead-frame connector and circuit module assembly
US6717822B1 (en) 2002-09-20 2004-04-06 Amkor Technology, Inc. Lead-frame method and circuit module assembly including edge stiffener
US6910635B1 (en) 2002-10-08 2005-06-28 Amkor Technology, Inc. Die down multi-media card and method of making same
US7011251B1 (en) 2002-10-08 2006-03-14 Amkor Technology, Inc. Die down multi-media card and method of making same
US7102214B1 (en) 2002-12-26 2006-09-05 Amkor Technology, Inc. Pre-molded leadframe
US7358600B1 (en) 2003-05-01 2008-04-15 Amkor Technology, Inc. Interposer for interconnecting components in a memory card
US6911718B1 (en) 2003-07-03 2005-06-28 Amkor Technology, Inc. Double downset double dambar suspended leadframe
US7102891B1 (en) 2003-07-23 2006-09-05 Amkor Technology, Inc. Circuit module having interconnects for connecting functioning and non-functioning add ons and method therefor
US7633763B1 (en) 2004-01-28 2009-12-15 Amkor Technology, Inc. Double mold memory card and its manufacturing method
US7556986B1 (en) 2004-04-21 2009-07-07 Amkor Technology, Inc. Tape supported memory card leadframe structure
US7074654B1 (en) 2004-04-21 2006-07-11 Amkor Technology, Inc. Tape supported memory card leadframe structure
US7201327B1 (en) 2004-10-18 2007-04-10 Amkor Technology, Inc. Memory card and its manufacturing method
US7193305B1 (en) 2004-11-03 2007-03-20 Amkor Technology, Inc. Memory card ESC substrate insert
US7112875B1 (en) 2005-02-17 2006-09-26 Amkor Technology, Inc. Secure digital memory card using land grid array structure
US7485491B1 (en) 2005-02-17 2009-02-03 Amkor Technology, Inc. Secure digital memory card using land grid array structure
US7220915B1 (en) 2005-02-17 2007-05-22 Amkor Technology, Inc. Memory card and its manufacturing method
US7719845B1 (en) 2005-04-26 2010-05-18 Amkor Technology, Inc. Chamfered memory card module and method of making same
US7837120B1 (en) 2005-11-29 2010-11-23 Amkor Technology, Inc. Modular memory card and method of making same
US7359204B1 (en) 2006-02-15 2008-04-15 Amkor Technology, Inc. Multiple cover memory card
US9367712B1 (en) 2007-03-01 2016-06-14 Amkor Technology, Inc. High density memory card using folded flex

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