JPS62187780U - - Google Patents

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Publication number
JPS62187780U
JPS62187780U JP7474686U JP7474686U JPS62187780U JP S62187780 U JPS62187780 U JP S62187780U JP 7474686 U JP7474686 U JP 7474686U JP 7474686 U JP7474686 U JP 7474686U JP S62187780 U JPS62187780 U JP S62187780U
Authority
JP
Japan
Prior art keywords
frame
mold
chip
hereinafter referred
nameplate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7474686U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7474686U priority Critical patent/JPS62187780U/ja
Publication of JPS62187780U publication Critical patent/JPS62187780U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、本考案による実施例のＩＣカードの
主要断面図。第２図は、従来のＩＣカードの主要
断面図。第３図は、従来のＩＣカードの欠陥を示
す概念図。 １……プリント基板、２……ＩＣチツプ、３…
…モールド、４……フレーム、５……接着剤、６
……上銘板、７……接着剤、８……下銘板、９…
…凸凹。 FIG. 1 is a main sectional view of an IC card according to an embodiment of the present invention. FIG. 2 is a main cross-sectional view of a conventional IC card. FIG. 3 is a conceptual diagram showing defects in conventional IC cards. 1...Printed circuit board, 2...IC chip, 3...
...Mold, 4...Frame, 5...Adhesive, 6
...Top nameplate, 7...Adhesive, 8...Bottom nameplate, 9...
...Unevenness.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ＩＣチツプとプリント基板と樹脂枠（以下フレ
ームという）と上銘板と下銘板から構成されるＩ
Ｃカードに於いて、該ＩＣチツプの樹脂封止（以
下モールドという）を行なう際、該フレームを用
いてモールドの成形を行なつたことを特徴とする
ＩＣカード。 I consists of an IC chip, a printed circuit board, a resin frame (hereinafter referred to as the frame), an upper nameplate, and a lower nameplate.
An IC card characterized in that the frame is used to form a mold when the IC chip is resin-sealed (hereinafter referred to as a mold) in a C card.
JP7474686U 1986-05-19 1986-05-19 Pending JPS62187780U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7474686U JPS62187780U (en) 1986-05-19 1986-05-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7474686U JPS62187780U (en) 1986-05-19 1986-05-19

Publications (1)

Publication Number Publication Date
JPS62187780U true JPS62187780U (en) 1987-11-30

Family

ID=30920248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7474686U Pending JPS62187780U (en) 1986-05-19 1986-05-19

Country Status (1)

Country Link
JP (1) JPS62187780U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0217381U (en) * 1988-07-20 1990-02-05
JPH03275393A (en) * 1990-03-26 1991-12-06 Ryoden Kasei Co Ltd Semiconductor device card and preparation thereof
JPH0414497A (en) * 1990-05-07 1992-01-20 Mitsubishi Electric Corp Thin semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6163498A (en) * 1984-09-05 1986-04-01 株式会社東芝 Integrated circuit card
JPS6177993A (en) * 1984-09-25 1986-04-21 Kyodo Printing Co Ltd Ic card

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6163498A (en) * 1984-09-05 1986-04-01 株式会社東芝 Integrated circuit card
JPS6177993A (en) * 1984-09-25 1986-04-21 Kyodo Printing Co Ltd Ic card

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0217381U (en) * 1988-07-20 1990-02-05
JPH03275393A (en) * 1990-03-26 1991-12-06 Ryoden Kasei Co Ltd Semiconductor device card and preparation thereof
JPH0414497A (en) * 1990-05-07 1992-01-20 Mitsubishi Electric Corp Thin semiconductor device

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