JPH0390327U - - Google Patents
Info
- Publication number
- JPH0390327U JPH0390327U JP15050889U JP15050889U JPH0390327U JP H0390327 U JPH0390327 U JP H0390327U JP 15050889 U JP15050889 U JP 15050889U JP 15050889 U JP15050889 U JP 15050889U JP H0390327 U JPH0390327 U JP H0390327U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- flexible wiring
- memory module
- memory
- chip capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Semiconductor Memories (AREA)
Description
第１図は本考案の一実施例の平面図、第２図は
本考案の他の実施例２の縦断面図、第３図は従来
のメモリモジユールの平面図である。
１……フレキシブル配線基板、１ａ……配線基
板、２……ＳＲＡＭ、２ａ……メモリＩＣ、３，
３ａ……チツプコンデンサ、４……電極パツド、
４ａ……外部端子である。
FIG. 1 is a plan view of one embodiment of the present invention, FIG. 2 is a vertical sectional view of another embodiment 2 of the present invention, and FIG. 3 is a plan view of a conventional memory module. 1... Flexible wiring board, 1a... Wiring board, 2... SRAM, 2a... Memory IC, 3,
3a... Chip capacitor, 4... Electrode pad,
4a...External terminal.
Claims (1)
びチツプコンデンサが搭載接続された構造を有す
るメモリモジユール。 (2) 前記可撓性を有する配線基板が折り曲げ加
工されていることを特徴とする実用新案登録請求
の範囲第(1)項記載のメモリモジユール。[Claims for Utility Model Registration] (1) A memory module having a structure in which a memory IC and a chip capacitor are mounted and connected to a flexible wiring board. (2) The memory module according to claim 1, wherein the flexible wiring board is bent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15050889U JPH0390327U (en) | 1989-12-26 | 1989-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15050889U JPH0390327U (en) | 1989-12-26 | 1989-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0390327U true JPH0390327U (en) | 1991-09-13 |
Family
ID=31696855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15050889U Pending JPH0390327U (en) | 1989-12-26 | 1989-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0390327U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015015423A (en) * | 2013-07-08 | 2015-01-22 | 富士通セミコンダクター株式会社 | Semiconductor device |
-
1989
- 1989-12-26 JP JP15050889U patent/JPH0390327U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015015423A (en) * | 2013-07-08 | 2015-01-22 | 富士通セミコンダクター株式会社 | Semiconductor device |
| US9748231B2 (en) | 2013-07-08 | 2017-08-29 | Fujitsu Semiconductor Limited | Semiconductor device |
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