JPH0323481U - - Google Patents
Info
- Publication number
- JPH0323481U JPH0323481U JP8126889U JP8126889U JPH0323481U JP H0323481 U JPH0323481 U JP H0323481U JP 8126889 U JP8126889 U JP 8126889U JP 8126889 U JP8126889 U JP 8126889U JP H0323481 U JPH0323481 U JP H0323481U
- Authority
- JP
- Japan
- Prior art keywords
- card
- chip
- external terminal
- conductive path
- card substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 3
- 239000011111 cardboard Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Description
第１図は一部分を切除した平面図、第２図は一
部分を切除した断面図、第３図は成形時の説明図
、第４図は第３図Ａ部の拡大図、第５図は従来の
断面図である。
図中１はカード基板、２は凹所、３はＩＣチツ
プ、４は外部端子、５は導電路を示す。
Figure 1 is a partially cut-away plan view, Figure 2 is a partially cut-out sectional view, Figure 3 is an explanatory diagram during molding, Figure 4 is an enlarged view of part A in Figure 3, and Figure 5 is a conventional FIG. In the figure, 1 is a card board, 2 is a recess, 3 is an IC chip, 4 is an external terminal, and 5 is a conductive path.
Claims (1)
し、該ＩＣチツプと外部端子とを導電路により接
続したＩＣカードにおいて、上記カード基板に外
部端子及び導電路をカード基板成形時に転写する
ことにより設けてあることを特徴とするＩＣカー
ド。 In an IC card in which a recess is formed in a card substrate and an IC chip is built in, and the IC chip and an external terminal are connected by a conductive path, the external terminal and the conductive path are transferred to the card substrate during molding of the card substrate. An IC card characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8126889U JPH0323481U (en) | 1989-07-11 | 1989-07-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8126889U JPH0323481U (en) | 1989-07-11 | 1989-07-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0323481U true JPH0323481U (en) | 1991-03-12 |
Family
ID=31627058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8126889U Pending JPH0323481U (en) | 1989-07-11 | 1989-07-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0323481U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007102360A1 (en) * | 2006-03-06 | 2007-09-13 | Mitsubishi Electric Corporation | Rfid tag, method for manufacturing rfid tag and method for arranging rfid tag |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6456596A (en) * | 1987-08-28 | 1989-03-03 | Dainippon Printing Co Ltd | Manufacture of ic card |
-
1989
- 1989-07-11 JP JP8126889U patent/JPH0323481U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6456596A (en) * | 1987-08-28 | 1989-03-03 | Dainippon Printing Co Ltd | Manufacture of ic card |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007102360A1 (en) * | 2006-03-06 | 2007-09-13 | Mitsubishi Electric Corporation | Rfid tag, method for manufacturing rfid tag and method for arranging rfid tag |
| TWI384403B (en) * | 2006-03-06 | 2013-02-01 | Mitsubishi Electric Corp | Radio frequency identification tag, manufacturing method of radio frequency identification tag, and setting method of radio frequency identification tag |