JPS62158829U - - Google Patents

Info

Publication number
JPS62158829U
JPS62158829U JP4673786U JP4673786U JPS62158829U JP S62158829 U JPS62158829 U JP S62158829U JP 4673786 U JP4673786 U JP 4673786U JP 4673786 U JP4673786 U JP 4673786U JP S62158829 U JPS62158829 U JP S62158829U
Authority
JP
Japan
Prior art keywords
circuit board
opening
view
chip
superimposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4673786U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4673786U priority Critical patent/JPS62158829U/ja
Publication of JPS62158829U publication Critical patent/JPS62158829U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の多層式回路基板の縦断面図、
第2図は第1図の分解縦断面図、第3図は上部回
路基板の平面図、第4図は第3図の―線断面
図、第5図は下部回路基板の平面図、第6図は第
5図の―線断面図である。 尚、図中、A:多層式回路基板、1:上部回路
基板、2:下部回路基板、3:リードピン、5:
開口部、7:ICチツプ、10:マウント部を示
す。
FIG. 1 is a vertical cross-sectional view of the multilayer circuit board of the present invention.
Figure 2 is an exploded longitudinal sectional view of Figure 1, Figure 3 is a plan view of the upper circuit board, Figure 4 is a sectional view taken along the line - - in Figure 3, Figure 5 is a plan view of the lower circuit board, and Figure 6 is a plan view of the lower circuit board. The figure is a sectional view taken along the line -- in FIG. In the figure, A: multilayer circuit board, 1: upper circuit board, 2: lower circuit board, 3: lead pin, 5:
Opening part, 7: IC chip, 10: mount part are shown.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 下部回路基板の上面に、中央部に開口部を開穿
した上部回路基板を重ね合わせ、これらをリード
ピンで接合すると共に、前記開口部により形成さ
れたマウント部にICチツプを搭載して形成した
多層式回路基板。
An upper circuit board with an opening in the center is superimposed on the upper surface of the lower circuit board, and these are joined with lead pins, and an IC chip is mounted on the mount formed by the opening. formula circuit board.
JP4673786U 1986-03-28 1986-03-28 Pending JPS62158829U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4673786U JPS62158829U (en) 1986-03-28 1986-03-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4673786U JPS62158829U (en) 1986-03-28 1986-03-28

Publications (1)

Publication Number Publication Date
JPS62158829U true JPS62158829U (en) 1987-10-08

Family

ID=30866675

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4673786U Pending JPS62158829U (en) 1986-03-28 1986-03-28

Country Status (1)

Country Link
JP (1) JPS62158829U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05121859A (en) * 1991-10-25 1993-05-18 Fujitsu Ltd Wiring connection method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05121859A (en) * 1991-10-25 1993-05-18 Fujitsu Ltd Wiring connection method

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