JPS63140645U - - Google Patents
Info
- Publication number
- JPS63140645U JPS63140645U JP3265687U JP3265687U JPS63140645U JP S63140645 U JPS63140645 U JP S63140645U JP 3265687 U JP3265687 U JP 3265687U JP 3265687 U JP3265687 U JP 3265687U JP S63140645 U JPS63140645 U JP S63140645U
- Authority
- JP
- Japan
- Prior art keywords
- package
- pins
- board
- packaging
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案によるＩＣパツケージの外形図
、第２図は本考案によるＩＣパツケージの基板上
への実装図、第３図は第２図のＡ―Ｂ線断面図、
第４図は本考案によるＩＣパツケージの実施例２
の外形図、第５図は実施例２のＩＣパツケージの
基板上への実装図、第６図は第５図のＡ―Ｂ線断
面図、第７図、第８図および第９図は従来のパツ
ケージの図である。
１……ＩＣパツケージ本体、２……ＩＣパツケ
ージの底面に構成したピン、３……ＩＣパツケー
ジの側面に構成したピン、４……ＩＣパツケージ
を実装するための基板、５……ＩＣパツケージの
上面に構成したピン、６……４とは別のＩＣパツ
ケージを実装するための基板。
FIG. 1 is an external view of the IC package according to the present invention, FIG. 2 is a diagram of the IC package according to the present invention mounted on a board, and FIG. 3 is a cross-sectional view taken along the line AB in FIG. 2.
Figure 4 shows Example 2 of the IC package according to the present invention.
, FIG. 5 is a diagram of the IC package of Example 2 mounted on a board, FIG. 6 is a sectional view taken along line A-B in FIG. 5, and FIGS. 7, 8, and 9 are conventional FIG. 1... IC package body, 2... Pins configured on the bottom of the IC package, 3... Pins configured on the side of the IC package, 4... Board for mounting the IC package, 5... Top surface of the IC package A board for mounting an IC package different from pins 6...4.
Claims (1)
接続を行うピンを構成することを特徴とするＩＣ
パツケージ。 An IC characterized in that pins for electrical connection with the outside are formed on the bottom surface and at least the side surfaces, respectively.
Packaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3265687U JPS63140645U (en) | 1987-03-05 | 1987-03-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3265687U JPS63140645U (en) | 1987-03-05 | 1987-03-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63140645U true JPS63140645U (en) | 1988-09-16 |
Family
ID=30839543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3265687U Pending JPS63140645U (en) | 1987-03-05 | 1987-03-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63140645U (en) |
-
1987
- 1987-03-05 JP JP3265687U patent/JPS63140645U/ja active Pending