JPH03124679U - - Google Patents
Info
- Publication number
- JPH03124679U JPH03124679U JP3304790U JP3304790U JPH03124679U JP H03124679 U JPH03124679 U JP H03124679U JP 3304790 U JP3304790 U JP 3304790U JP 3304790 U JP3304790 U JP 3304790U JP H03124679 U JPH03124679 U JP H03124679U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- circuit board
- hybrid
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 2
Description
第１図および第２図はそれぞれ本考案の一実施
例および他の実施例の部分断面図、第３図は従来
の混成集積回路の断面図である。
１，１１，２１……混成集積回路基板、２……
凹み、１２……突起、５……集積回路、６……外
部リード、ｇ……隙間。
1 and 2 are partial sectional views of one embodiment and another embodiment of the present invention, respectively, and FIG. 3 is a sectional view of a conventional hybrid integrated circuit. 1, 11, 21...hybrid integrated circuit board, 2...
Recess, 12...Protrusion, 5...Integrated circuit, 6...External lead, g...Gap.
Claims (1)
してなる混成集積回路装置において、前記表面実
装型集積回路本体の底面とリードの半田付け面と
の間の高さ方向の差に相当する寸法分だけ前記混
成集積回路基板上のリード半田付け部を堀り下げ
るかまたは前記混成集積回路基板の前記集積回路
本体底面と相対する部分を突出させることにより
、前記集積回路本体底面が前記混成集積回路基板
に密着されていることを特徴とする混成集積回路
装置。 In a hybrid integrated circuit device in which a surface-mounted integrated circuit is mounted on a hybrid integrated circuit board, a dimension corresponding to the difference in height between the bottom surface of the surface-mounted integrated circuit body and the soldering surface of the lead. By digging down the lead soldering portions on the hybrid integrated circuit board or by protruding a portion of the hybrid integrated circuit board that faces the bottom surface of the integrated circuit body, the bottom surface of the integrated circuit body is fixed to the hybrid integrated circuit board. A hybrid integrated circuit device characterized in that the hybrid integrated circuit device is closely connected to the .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3304790U JPH03124679U (en) | 1990-03-29 | 1990-03-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3304790U JPH03124679U (en) | 1990-03-29 | 1990-03-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03124679U true JPH03124679U (en) | 1991-12-17 |
Family
ID=31536399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3304790U Pending JPH03124679U (en) | 1990-03-29 | 1990-03-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03124679U (en) |
-
1990
- 1990-03-29 JP JP3304790U patent/JPH03124679U/ja active Pending