JP2006073989A - Fitting structure for rotary type electronic component to mounting substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a fitting structure for a rotary type electronic component to a mounting substrate in which the entire thickness, when the rotary electronic component is fitted to the mounting substrate is made thinner, and which will not make the structure complex, even when the adjustment for an electric output of the rotary electronic component mounted on the mounting surface of the mounting substrate is performed from the opposite surface side of the mounting substrate in the structure. <P>SOLUTION: A sliding contact 85 of a rotary body 80 rotatably fitted to an insulating base 10 is brought into contact with a conductor pattern, provided to a flexible circuit board 20 fitted to the insulating base 10 by sliding. The insulating base 10 is made of synthetic resin, and from the periphery thereof, metal terminals 43 and 50 are made to protrude. The rotary electronic component 1-1 is, while the surface thereof to which the rotary body 80 is fitted faces the mounting substrate 110, and further the rotary body 80 and a part of the insulating base 10 are inserted into an opening 111 of the mounting substrate 110, fitted to the mounting substrate 110, by connecting the metal terminals 43 and 50 to a connecting pattern 113 of the mounting surface 112 of the mounting substrate 110. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a structure for mounting a rotary electronic component such as a semi-fixed variable resistor on a mounting board.

  2. Description of the Related Art Conventionally, a chip-type semi-fixed variable resistor includes a ceramic substrate, a slider, and a current collector plate, for example, as shown in Patent Document 1, and a slider is disposed on the upper surface of the ceramic substrate and the ceramic substrate. A current collector plate is arranged on the lower surface of the metal plate, and the cylindrical protrusion provided on the current collector plate is inserted into the through hole provided in the ceramic substrate and the fitting insertion hole provided in the slider, and the tip of the cylindrical protrusion is By tightening, the slider is rotatably fixed on the ceramic substrate. The conventional semi-fixed variable resistor is attached to the mounting surface of the mounting substrate made of a printed wiring board or the like by solder or the like, and the slider is rotated by an adjustment jig from the mounting surface side of the mounting substrate. The value was adjusted.

  However, since the conventional semi-fixed variable resistor uses a ceramic substrate, it is vulnerable to mechanical shock and it is difficult to reduce the thickness thereof. In addition to using a ceramic substrate, the resistor pattern has to be baked on the ceramic substrate, so that the production efficiency is low, the material cost is high, and the cost reduction is limited.

  On the other hand, conventionally, the resistance value of the semi-fixed variable resistor mounted on the mounting board must be adjusted from the opposite side of the mounting board depending on the installation location of the mounting board (see Patent Document 2). . However, in order to adjust the resistance value of the semi-fixed variable resistor from the side opposite to the mounting surface of the mounting substrate, as shown in Patent Document 2, a slider and There is a problem that the adjustment pin that rotates integrally must be attached, and the structure becomes complicated.

Furthermore, the mounting board is either a type that adjusts the resistance value of the semi-fixed variable resistor from the mounting surface side of the mounting board, or a type that adjusts the resistance value of the semi-fixed variable resistor from the opposite side. There is a problem that the thickness cannot be reduced beyond the thickness of the thickness of the semi-fixed variable resistor and the thickness of the semi-fixed variable resistor cannot be reduced, and the demand for further reduction in thickness cannot be met.
JP-A-11-307317 JP-A-6-82806

  The present invention has been made in view of the above points, and its purpose is to reduce the overall thickness when the rotary electronic component is attached to the mounting substrate, to improve production efficiency, and to reduce the price. In addition, even if it is a structure that adjusts the electrical output such as resistance value of the rotary electronic component mounted on the mounting surface of the mounting board from the opposite side of the mounting board, mounting the rotary electronic component that does not complicate the structure It is to provide a mounting structure to a substrate.

  According to the first aspect of the present invention, the sliding contact of the rotating body rotatably attached to the insulating base is brought into sliding contact with the conductor pattern provided on the insulating base directly or via another member. In the structure for attaching the rotary electronic component having the structure to the mounting surface of the mounting substrate, the insulating base is made of a synthetic resin and has a metal terminal electrically connected to the conductor pattern. The metal terminal is exposed to the outside from the inside of the insulating base, and the insulating base of the rotary electronic component is positioned inside or above the opening provided in the mounting board. The rotating electronic component is mounted on a mounting board, and is connected to a connection pattern provided on a surrounding mounting surface.

  The invention according to claim 2 of the present application is characterized in that the connection surface of the metal terminal to the connection pattern is disposed so as to be flush with the surface of the insulating base that faces the side on which the rotating body is attached. The rotary electronic component mounting structure according to claim 1 is mounted on a mounting board.

  The invention according to claim 3 of the present application is such that the metal terminal is freely connected to the first metal terminal exposed to the outside of the insulating base in a state of being electrically connected to the conductor pattern, and the rotating body is rotatable. A cylindrical projection attached to the insulating base and integrally provided on a current collector plate attached to the insulating base by insert molding, exposed to the outside of the insulating base, and electrically connected to the conductor pattern via the rotating body 3. The structure for mounting a rotary electronic component to a mounting board according to claim 1, wherein the second metal terminal is electrically connected to the mounting board.

  According to a fourth aspect of the present invention, the other member attached on the insulating base is a flexible circuit board, and the conductor pattern is provided on the flexible circuit board, and at least one of the current collector plates. 4. The mounting of the rotary electronic component on the mounting board according to claim 3, wherein the surface of the part is disposed so as to contact the surface of the flexible circuit board on which the conductor pattern is not provided. In the structure.

  According to a fifth aspect of the present invention, the flexible circuit board is sandwiched between the current collector plate and the rotating body at a portion where the rotating body is rotatably attached to the cylindrical protrusion of the current collector plate. 5. The structure according to claim 4, wherein the rotary electronic component is attached to a mounting board.

  The invention according to claim 6 of the present application is characterized in that the other member attached on the insulating base is a flexible circuit board, and the conductor pattern is provided on the flexible circuit board. Item 6. The structure for mounting the rotary electronic component according to Item 1 or 2 or 3 to a mounting board.

  The invention according to claim 7 of the present application is the structure for mounting the rotary electronic component to the mounting substrate according to claim 6, wherein the flexible circuit board is insert-molded on the insulating base. .

  In the invention according to claim 8 of the present application, the rotary electronic component is attached to the mounting surface of the mounting board so that the surface on which the rotating body is attached faces the mounting board, and is thereby rotated by an adjusting jig. 8. The structure for mounting a rotary electronic component to a mounting board according to claim 1, wherein the adjustment portion of the rotating body is exposed to an opening of the mounting board. is there.

  The invention according to claim 9 of the present application is characterized in that at least a part of the rotating body of the rotary electronic component is inserted into the opening of the mounting substrate. In the mounting structure to the mounting board.

  The invention according to claim 10 of the present application is characterized in that at least a part of the insulating base of the rotary electronic component is inserted into the opening of the mounting board. It is in the structure for mounting components to the mounting board.

  According to the first aspect of the present invention, since the insulating base is made of synthetic resin, it is more resistant to mechanical impact than the conventional ceramic substrate, can be reduced in thickness, can be easily manufactured, Cost reduction can be achieved, thereby reducing the thickness of the mounting substrate and the entire rotary electronic component mounted on the mounting substrate. In addition, the insulating base is provided with the metal terminal exposed from the inside, and this metal terminal is connected and attached to the connection pattern provided on the mounting surface around the opening of the mounting board. Can be easily attached to

  According to the second aspect of the present invention, when the rotary electronic component is attached to the mounting surface of the mounting substrate, the surface of the rotating electronic component on the mounting substrate side is positioned substantially on the same surface as the mounting surface of the mounting substrate. Thus, the thickness of the mounting substrate and the entire rotary electronic component mounted on the mounting substrate can be reduced.

  According to the invention described in claim 3, since the current collector plate having the second metal terminal is insert-molded on the insulating base made of synthetic resin, an assembly work for separately attaching the current collector plate to the insulating base is unnecessary. In addition, it is easy to manufacture an insulating base with a current collector plate, the material cost can be reduced compared to a ceramic substrate, and the thickness can be reduced easily and inexpensively.

  According to the fourth aspect of the present invention, it is possible to increase the thickness of the insulating substrate formed on the portion of the current collecting plate on the opposite side where the flexible circuit substrate is in contact with the collector, thereby increasing the strength.

  According to the invention described in claim 5, for example, when plating is applied to the cylindrical protrusion portion of the current collector plate, when the rotary electronic component is attached to the mounting substrate and heated by reflowing, The plating may melt and the rotating body may be fixed to the cylindrical projection. However, if a flexible circuit board is interposed between the two as in the present invention, the surface of the rotating body on the current collector plate side and the current collector are collected. Contact with the outer peripheral surface of the cylindrical projection of the electric plate can be prevented. Therefore, both can be prevented from being fixed by plating. The electrical conduction between the rotating body and the current collector plate may be performed by the outer peripheral side surface of the cylindrical protrusion and the inner peripheral side surface of the opening of the rotating body that is rotatably attached to the cylindrical projection.

  According to the invention described in claim 6, since the conductor pattern is provided on the flexible circuit board, it is possible to divide a large flexible circuit board on which the same many conductor patterns are formed, so that a large number of flexible conductors having a conductor pattern at the same time. The circuit board can be manufactured, and mass production can be easily performed as compared with the case where the conductor patterns are directly formed on the insulating base one by one.

  According to the invention described in claim 7, since the flexible circuit board is insert-molded on the insulating base, the manufacturing is easy, the material cost can be reduced as compared with the ceramic substrate, and the thickness can be easily reduced. Can be done inexpensively.

  According to the invention described in claim 8, the rotating body can be rotated / adjusted from the back side of the mounting surface to which the rotating electronic component of the mounting board is attached. Therefore, even if it is not possible to adjust the resistance value etc. of the rotary electronic component mounted on the mounting board from the mounting surface side of the mounting board depending on the installation location of the mounting board, the adjustment can be performed easily. In addition, unlike the adjustment pin shown in Patent Document 2, the number of parts does not increase separately, and the structure is not complicated.

  According to the ninth aspect of the present invention, it is possible to reduce the thickness of the mounting substrate and the entire rotary electronic component mounted on the mounting substrate.

  According to the invention described in claim 10, it is possible to reduce the thickness of the mounting substrate and the entire rotary electronic component mounted on the mounting substrate.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[First embodiment]
FIG. 1 is a view showing a rotary electronic component (hereinafter referred to as “rotary variable resistor”) 1-1 according to a first embodiment of the present invention, FIG. 1 (a) is a plan view, and FIG. 1 (b). FIG. 1A is a cross-sectional view taken along the line AA in FIG. 1A, and FIG. As shown in the figure, the rotary variable resistor 1-1 includes an insulating base 10 made of synthetic resin, a flexible circuit board 20 that is attached to one surface (lower surface) of the insulating base 10 by insert molding, A current collector plate 40 having a second metal terminal 43 attached to the inside of the insulating base 10 by insert molding, two metal terminals (hereinafter referred to as “first metal terminal”) 50, 50, and an insulating base; The rotating body 80 is rotatably provided on the side (lower surface side) on which the 10 flexible circuit boards 20 are installed. In this embodiment, the integrated base 10, the flexible circuit board 20, the current collector plate 40, and the first metal terminals 50 and 50 are referred to as an electronic component board 60. Each component will be described below.

  FIG. 2 is a view showing the electronic component substrate 60, FIG. 2 (a) is a plan view, FIG. 2 (b) is a sectional view taken on line BB of FIG. 2 (a), and FIG. It is. As shown in the figure, the insulating base 10 is a substantially rectangular plate-shaped synthetic resin molded product, and a circular through hole 11 is provided at the center. The insulating base 10 is made of a thermoplastic synthetic resin, such as nylon or polyphenylene sulfide (PPS).

  The flexible circuit board 20 is composed of a terminal pattern 29, 29 on a synthetic resin film (for example, a PPS film or a polyimide film), and a conductor pattern (hereinafter referred to as “ 25) (referred to as “resistor pattern”). That is, the flexible circuit board 20 is provided with a through hole 21 having the same inner diameter at a position corresponding to the through hole 11 of the synthetic resin film, and a resistor pattern 25 surrounding the through hole 21 in a horseshoe shape on the surface. Furthermore, terminal patterns 29 and 29 are connected to both ends of the resistor pattern 25, respectively.

Here, the resistor pattern 25 is made of a metal thin film formed by physical vapor deposition (PVD) or chemical vapor deposition (CVD). As a method of physical vapor deposition, vacuum vapor deposition, sputtering, ion beam vapor deposition, or the like is used. As a chemical vapor deposition method, a thermal CVD method, a plasma CVD method, a photo CVD method or the like is used. As the material of the resistor pattern 25 to be deposited, a nickel-based material such as a nickel-chromium alloy, a cermet-based material made of a chromium silicate-based compound (Cr—SiO ₂ ), or a tantalum-based material such as tantalum nitride is used. . Since the chromium silicate compound can easily realize a large specific resistance of 2000 μΩ · cm or more, it is suitable for downsizing the electronic component substrate 60. According to the resistor pattern 25 by this type of metal vapor deposition, it is needless to say that the entire resistor pattern 25 can be formed in a uniform and uniform thickness. Further, the resistor pattern 25 is obtained by printing and baking a paste in which conductive powder is mixed in a resin. Thus, since the resin is not included in the interior, the resistance value is unlikely to change due to heat or temperature. For example, in the case of a resistor pattern obtained by printing and baking a carbon paste, the resistance temperature coefficient is 500 ppm / ° C., whereas the resistance temperature coefficient in the case of the metal thin film using the vacuum deposition is 100 ppm / ° C. This is a good temperature characteristic equivalent to that when a resistor pattern is baked on a ceramic substrate at a high temperature.

  Next, the terminal patterns 29 and 29 are configured by sequentially forming a copper layer and a gold layer on a nichrome base by vapor deposition. Since the terminal patterns 29 and 29 do not directly affect the change in resistance value, they may be formed by other means such as printing and baking of a conductive paste.

  The current collector plate 40 is configured by providing a base 41 on one side of a flat and substantially rectangular metal plate and providing a metal terminal (hereinafter referred to as “second metal terminal”) 43 on the other side. Here, the base portion 41 has a rectangular shape, and is configured such that a cylindrical protrusion 42 projects vertically from the center of the surface. On the other hand, in the vicinity of the other end facing the base 41 of the metal plate, by providing a step 45 that is perpendicular to the flat surface of the base 41, the base that protrudes from the flat surface of the base 41 toward the cylindrical protrusion 42 side. A flat plate-like second metal terminal 43 that is parallel to 41 is provided. A surface on the lower surface side of the second metal terminal 43 serves as a connection surface 43a for connecting a connection pattern 113 of the mounting substrate 110 described below.

  The first metal terminal 50 is constituted by a flat and rectangular metal plate, one end side of which is connected to the terminal pattern 29, and the other end side of the first metal terminal 50 protrudes outside the insulating base 10. A mounting board connecting portion 53 is provided. A surface on the lower surface side of the mounting board connecting portion 53 is a connection surface 53a for connecting a connection pattern 113 of the mounting board 110 described below.

  Returning to FIG. 1, the rotating body 80 is constituted by a single elastic metal plate, and an arc-shaped arm 83 is attached to the outer periphery of the mortar-shaped base 81, and protrudes toward the flexible circuit board 20 in the center of the arm 83. And an adjustment portion (a portion rotated by an adjustment jig described below, which is connected to a lower surface of the base portion 81 by a connecting portion 87 provided on a part of the outer periphery of the base portion 81. 89 ”(referred to as“ adjustment plate ”) is configured to overlap the lower surface of the base 81 by folding back the connecting portion 87. A circular opening 91 into which the cylindrical protrusion 42 of the current collector plate 40 is inserted is provided at the center of the base 81, and an adjustment jig made of a plus driver (or minus driver) is inserted into the adjustment plate 89. An adjustment groove 93 having a shape (may be another shape) is provided.

  First, a method for manufacturing the electronic component substrate 60 will be described. As shown in FIG. 3, the flexible circuit board 20, the current collector plate 40, and the first metal terminals 50 and 50 are placed in the molds 101 and 105. Insert into. At this time, a cavity C1 having the same shape as that of the insulating base 10 is formed in the molds 101 and 105, but the flexible circuit board 20 has a surface on the side where the resistor pattern 25 is formed on the mold of the cavity C1. Contact the inner plane C11 on the mold 101 side, simultaneously contact the terminal patterns 29, 29 of the flexible circuit board 20 with the terminal pattern connection portions 51, 51 of the first metal terminals 50, 50, and at the same time, The portion of the base 41, the portion of the second metal terminal 43 projecting out of the cavity C1, and the side of the mounting substrate connecting portion 53 projecting out of the cavity C1 of the first metal terminals 50, 50 Is held between the molds 101 and 105. A portion of the base 41 is sandwiched between convex portions 103 and 107 (which form the through holes 11 of the insulating base 10) provided on the molds 101 and 105.

  A thermoplastic synthetic resin (nylon, PPS, etc.) heated and melted into the cavity C1 from a gate (not shown) is press-fitted to fill the cavity C1. The flexible circuit board 20 is cooled and solidified while being pressed against the inner plane C11 and the terminal pattern connecting portions 51 and 51 of the first metal terminals 50 and 50 by the press-fitting pressure. When the molds 101 and 105 are removed, the electronic component substrate 60 shown in FIG. 2 is completed. At this time, the connection surface 43a of the second metal terminal 43 of the current collector plate 40 and the connection surfaces 53a and 53a of the first metal terminals 50 and 50 are flush with each other (that is, the second metal terminal 43 and the first metal). The terminals 50 and 50 are on the same surface), and these surfaces substantially coincide with the surface to which the rotating body 80 of the insulating base 10 is attached. Further, the terminal pattern connection portions 51 and 51 of the insulating base 10 are insulated on the lower surface side (the surface side to which a rotating body 80 to be described later is attached) while the terminal pattern connection portions 51 and 51 are pressed against the terminal patterns 29 and 29. A presser portion 15 for fixing to the base 10 is provided. The pressing portion 15 has a convex shape that protrudes toward the rotating body 80 from the surface of the insulating base 10 to which the rotating body 80 is attached. However, it does not protrude from the tip surface 80a of the rotating body 80 described below.

  As shown in FIG. 1, the rotating body 80 is placed on the surface of the electronic component board 60 on the side where the flexible circuit board 20 is attached, and the cylinder of the current collector plate 40 is placed in the opening 91 provided in the rotating body 80 at that time. When the tip protrusion (bottom edge) of the cylindrical protrusion 42 is caulked after the cylindrical protrusion 42 is rotatably inserted, the rotary electronic component 1-1 is completed. At this time, the sliding contact 85 of the rotating body 80 is in elastic contact with the resistor pattern 25 of the flexible circuit board 20.

  FIG. 4 is a cross-sectional view showing a mounting structure of the rotary variable resistor 1-1 configured as described above on the mounting surface 112 of the mounting substrate 110. As shown in FIG. As shown in the figure, the mounting substrate 110 includes an outer portion of the insulating base 10 and the rotating body 80 at positions facing the insulating base 10 and the rotating body 80 of the rotary variable resistor 1-1 attached to the mounting substrate 110. A circular opening (adjustment hole) 111 having an inner diameter larger than the diameter is provided, and the first metal terminals 50 and 50 and the second metal terminal 43 are formed on the mounting surface 112 around the opening 111. Connection patterns 113 that face each other are provided.

  The rotary variable resistor 1-1 is placed with the surface on which the rotating body 80 is mounted facing the mounting surface 112 of the mounting substrate 110. At that time, the rotating body 80 is inserted into the opening 111, and at the same time. The first metal terminals 50 and 50 and the second metal terminal 43 are respectively brought into contact with the connection pattern 113 via the solder 114, and the solder 114 is melted and solidified by reflow or the like to electrically and mechanically connect the two. And attach. At this time, the rotating body 80 and a part of the insulating base 10 (the part of the presser part 15) are inserted into the opening 111.

  Then, the tip of an adjustment jig (not shown) (for example, a plus or minus driver) is inserted into the opening 111 from the surface opposite to the mounting surface 112 of the mounting substrate 110 and engaged with the adjustment groove 93 of the adjustment plate 89. When the rotating body 80 is rotated, the sliding contact 85 provided on the rotating body 80 slides on the resistor pattern 25 (see FIG. 2C) to contact the first metal terminals 50 and 50 and the second metal. The resistance value between the terminals 43 changes.

  As described above, in this embodiment, as in the first aspect of the present invention, the sliding contact 85 of the rotating body 80 rotatably mounted on the insulating base 10 is provided on the insulating base 10. In the structure for attaching the rotary electronic component 1-1 having the structure in sliding contact with the conductor pattern 25 to the mounting surface 112 of the mounting substrate 110 to the mounting substrate 110, the insulating base 10 Metal terminals made of synthetic resin and provided with metal terminals (first and second metal terminals) 50, 50, 43 protruding outward from the outer periphery thereof (or electrically connected to the conductor pattern 25) 50, 50, 43 are exposed from the inside of the insulating base 10 to the outside), and the insulating base 10 of the rotary electronic component 1-1 is located inside or above the opening 111 provided in the mounting substrate 110. In the state, the metal terminals 50, 50 43 attached by connecting to a connection pattern 113 provided on the mounting surface 112 around the opening 111 of the mounting substrate 110 arrangement is disclosed. And if the mounting structure to the mounting board | substrate 110 of the rotary electronic component 1-1 is comprised in this way, since the insulation base 10 was comprised with the synthetic resin, thickness reduction can be achieved compared with the conventional ceramic substrate, Manufacture is also easy and cost reduction can be achieved, whereby the thickness of the mounting substrate 110 and the entire rotary electronic component 1-1 mounted on the mounting substrate 110 can be reduced. Further, since the metal terminals 50, 50, 43 projecting from the outer periphery of the insulating base 10 are connected to the connection pattern 113 of the mounting substrate 110, the mounting of the rotary electronic component 1-1 is performed as compared with the case where the substrates are connected to each other. Attachment to the substrate 110 is facilitated.

  In this embodiment, as in the invention described in claim 3, the metal terminal protrudes outward from the outer periphery of the insulating base 10 in a state of being electrically connected to the conductor pattern 25 ( Or a first metal terminal 50 (exposed to the outside of the insulating base 10) and a cylindrical protrusion 42 to which the rotating body 80 is rotatably attached, and is attached to the insulating base 10 by insert molding. It is provided integrally with the plate 40 and protrudes outward from the outer periphery of the insulating base 10 (or is exposed to the outside of the insulating base 10 and is electrically connected to the conductor pattern 25 via the rotating body 80. And the second metal terminal 43 is disclosed. This eliminates the need for an assembly work for attaching the current collector plate 40 to the insulating base 10 separately, facilitates the manufacture of the insulating base 10 with the current collector plate 40, and reduces the material cost compared to the ceramic substrate. Therefore, the thickness can be reduced easily and inexpensively.

  In this embodiment, as in the invention described in claim 6, the other member attached on the insulating base 10 is the flexible circuit board 20, and the conductor pattern 25 is formed on the flexible circuit board 20. The provided configuration is disclosed. As a result, by dividing a large flexible circuit board on which the same many conductor patterns 25 are formed, a large number of flexible circuit boards 20 having the conductor patterns 25 can be manufactured at the same time. Compared with the case where the pattern 25 is formed, mass production can be easily performed.

  Moreover, this embodiment discloses that the flexible circuit board 20 is insert-molded on the insulating base 10 as in the invention described in claim 7. As a result, the manufacturing is easy, the material cost can be reduced as compared with the ceramic substrate, and the thickness can be reduced easily and inexpensively.

  Further, in this embodiment, as in the invention described in claim 8, the mounting surface of the mounting substrate 110 is such that the surface of the rotary electronic component 1-1 on which the rotating body 80 is attached faces the mounting substrate 110. A configuration is disclosed in which an adjustment portion 89 of a rotating body 80 attached to 112 and rotated by an adjustment jig is exposed to the opening 111 of the mounting substrate 110. Accordingly, the rotating body 80 can be rotated and adjusted from the back surface side of the mounting surface 112 of the mounting substrate 110. Therefore, even if the adjustment of the resistance value or the like of the rotary electronic component 1-1 mounted on the mounting substrate 110 cannot be performed from the mounting surface 112 side of the mounting substrate 110 depending on the installation location of the mounting substrate 110 or the like. In this case, unlike the adjustment pin shown in Patent Document 2, the number of parts does not increase and the structure is not complicated.

  In this embodiment, as in the invention described in claim 9, at least a part of the rotating body 80 of the rotary electronic component 1-1 is inserted into the opening 111 of the mounting substrate 110. It is disclosed. Accordingly, the thickness of the mounting substrate 110 and the entire rotary electronic component 1-1 mounted on the mounting substrate 110 can be reduced.

  In this embodiment, as in the invention described in claim 10, at least a part of the insulating base 10 of the rotary electronic component 1-1 (in this embodiment, only the holding portion 15) is mounted on the mounting board. The structure inserted in the opening part 111 of 110 is disclosed. This also makes it possible to reduce the thickness of the entire mounting substrate 110 and the rotary electronic component 1-1.

[Second Embodiment]
FIG. 5 is a cross-sectional view showing a mounting structure of the rotary electronic component (hereinafter referred to as “rotary variable resistor”) 1-2 according to the second embodiment of the present invention to the mounting surface 112 of the mounting substrate 110. In this embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. This embodiment is different from the first embodiment only in the shapes of the first metal terminals 50 and 50 and the second metal terminal 43. That is, the first metal terminals 50, 50 in this embodiment are provided with a step portion 30 that is perpendicular to the flat surface of the terminal pattern connection portion 51 at a portion protruding from the insulating base 10, thereby providing a terminal pattern. A flat mounting board connecting portion 53 that is parallel to the terminal pattern connecting portion 51 is provided from the flat surface of the connecting portion 51 to the side opposite to the side on which the rotating body 80 is attached. On the other hand, the second metal terminal 43 is not provided with the step 45 as in the first embodiment, but has a flat shape. The connection surface 43a of the second metal terminal 43 and the connection surface 53a of the first metal terminals 50 and 50 are the same surface, and these surfaces are located approximately in the middle of the thickness of the insulating base 10. Yes.

  If comprised in this way, since the whole rotary body 80 and about half the thickness of the insulation base 10 are inserted in the opening part 111 of the mounting board 110, compared with 1st embodiment, the mounting board 110 and further The thickness of the entire rotary electronic component 1-2 can be reduced.

[Third embodiment]
FIG. 6 is a cross-sectional view showing a structure for attaching a rotary electronic component (hereinafter referred to as “rotary variable resistor”) 1-3 according to the third embodiment of the present invention to the mounting surface 112 of the mounting substrate 110. In this embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. This embodiment is different from the first embodiment only in the shapes of the first metal terminals 50 and 50 and the second metal terminal 43. In other words, the first metal terminals 50 and 50 in this embodiment are provided with the stepped portion 30 that is perpendicular to the flat surface of the terminal pattern connecting portion 51 at the portion protruding from the insulating base 10 of the metal plate. A flat mounting board connecting portion 53 is provided in parallel to the terminal pattern connecting portion 51, which faces the side opposite to the side where the rotating body 80 is attached from the flat surface of the pattern connecting portion 51. On the other hand, the current collector plate 40 is also provided with a step 45a perpendicular to the flat surface of the base 41 in the insulating base 10 at a portion protruding from the insulating base 10, so that a cylindrical protrusion is formed from the flat surface of the base 41. A flat second metal terminal 43 facing the opposite side of 42 and parallel to the base 41 is provided. Also in this embodiment, the connection surface 43 a of the second metal terminal 43 and the connection surfaces 53 a and 53 a of the first metal terminals 50 and 50 are the same surface, and these surfaces are substantially the same as the insulating base 10. It is located on the upper surface (the surface opposite to the surface on which the rotating body 80 is attached).

  With this configuration, the entire thickness of the rotator 80 and the insulating base 10 is inserted into the opening 111 of the mounting substrate 110. Therefore, the mounting substrate 110 and the mounting substrate 110 are further compared to the first and second embodiments. The thickness of the entire rotary electronic component 1-3 can be reduced.

  In the first, second, and third embodiments, the rotating body 80 inserted into the opening 111 is configured such that the front end surface 80a does not protrude from the surface opposite to the mounting surface 112 of the mounting substrate 110. (Each embodiment is such). With such a configuration, even when the mounting substrate 110 is disposed and mounted on another member, a failure such as the rotating body 80 of the rotary electronic components 1-1, 2 and 3 coming into contact with the other member occurs. Absent.

  Of course, if necessary, the front end surface 80a of the rotating body 80 may protrude from the surface opposite to the mounting surface 112 of the mounting substrate 110. Conversely, as shown in the following fourth embodiment, in some cases, the distal end surface 80a of the rotating body 80 may not be inserted into the opening 111.

[Fourth embodiment]
FIG. 7 is a cross-sectional view showing a structure for attaching a rotary electronic component (hereinafter referred to as “rotary variable resistor”) 1-4 according to the fourth embodiment of the present invention to the mounting surface 112 of the mounting substrate 110. In this embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. This embodiment is different from the first embodiment only in the shapes of the first metal terminals 50 and 50 and the second metal terminal 43. In other words, the first metal terminals 50 and 50 in this embodiment are provided with the stepped portion 30 that is perpendicular to the flat surface of the terminal pattern connecting portion 51 at the portion protruding from the insulating base 10 of the metal plate. A flat mounting board connecting portion 53 that is parallel to the terminal pattern connecting portion 51 is provided from the flat surface of the pattern connecting portion 51 to the side where the rotating body 80 is attached. On the other hand, by providing a step 45 b perpendicular to the flat surface of the base 41 in the insulating base 10 at a portion protruding from the insulating base 10 on the current collector plate 40, a cylindrical projection from the flat surface of the base 41 is provided. A flat plate-like second metal terminal 43 facing the 42 side and parallel to the base 41 is provided. Also in this embodiment, the connection surface 43 a of the second metal terminal 43 and the connection surfaces 53 a and 53 a of the first metal terminals 50 and 50 are the same surface, and these surfaces are the front end surfaces of the rotating body 80. It is located slightly below 80a (on the mounting board 110 side).

  With this configuration, the entire rotary electronic component 1-4 does not enter the opening 111 of the mounting substrate 110. However, since the insulating base 10 is made of synthetic resin, the thickness of the insulating base 10 itself. Can be made thinner than the ceramic substrate, which can reduce the overall thickness of the mounting substrate 110 and the rotary electronic component 1-1. Further, since the rotating body 80 can be rotated / adjusted from the side opposite to the mounting surface 112 of the mounting substrate 110, the adjustment of the resistance value and the like of the rotary electronic component 1-3 mounted on the mounting substrate 110 can be adjusted. Even if it cannot be performed from the mounting surface 112 side, the adjustment can be easily performed, and at that time, like the adjustment pin shown in Patent Document 2, the number of parts does not increase separately. This is the same as in the first embodiment.

[Fifth embodiment]
FIG. 8 is a view showing a rotary electronic component (hereinafter referred to as “rotary variable resistor”) 1-5 according to a fifth embodiment of the present invention, FIG. 8 (a) is a plan view, and FIG. 8 (b). FIG. 8A is a cross-sectional view taken along the line CC in FIG. 8A, and FIG. In this rotary variable resistor 1-5, the same parts as those of the rotary variable resistor 1-1 are denoted by the same reference numerals, and detailed description thereof is omitted. That is, in the case of the rotary variable resistor 1-5, the current collecting plate 40 used in the rotary variable resistor 1-1 is not used, and one of the insulating base 10 and the insulating base 10 is made of synthetic resin. A flexible circuit board 20 attached to the surface (lower surface) by insert molding, and three metal terminals (hereinafter referred to as “first metal terminals”) 50, 50, 55 attached to the inside of the insulating base 10 by insert molding. And a (dummy) metal terminal (hereinafter referred to as “third metal terminal”) 57 that is not connected to an electric circuit attached to the inside of the insulating base 10 by insert molding, and a flexible circuit board 20 of the insulating base 10. The rotating body 80 is rotatably installed on the side (the lower surface side) on which the shaft is installed, and the shaft support member 90 is attached to the insulating base 10 so as to be rotatable. There. In this embodiment, the insulating base 10, the flexible circuit board 20, and the first and third metal terminals 50, 50, 55, and 57 are referred to as an electronic component board 60.

  The electronic component substrate 60 has the flexible circuit board 20 attached to one surface (lower surface) of the insulating base 10 by insert molding, and the first and third metal terminals extending outward from the outer periphery by insert molding. 50, 50, 55, and 57 are attached so as to protrude. The insulating base 10 is a substantially rectangular plate-shaped synthetic resin molded product, and a circular through hole 11 is provided inside. The material of the insulating base 10 is the same as that in each of the above embodiments. As shown in FIGS. 8A and 8B, the upper surface side of the through hole 11 is a ring-shaped shaft support member housing recess 11a by increasing its inner diameter.

  Here, FIG. 9 is a back view of the flexible circuit board 20. As shown in the figure, the flexible circuit board 20 is composed of two terminal patterns 29, 29 on a synthetic resin film (for example, polyimide film), one terminal pattern 31 provided between them, and a rotating body described below on the surface. The conductive pattern 25 in which the 80 sliding contacts 85 are in sliding contact and the ring-shaped common pattern 33 formed concentrically inside the conductive pattern 25 are provided. That is, the flexible circuit board 20 is provided with a through hole 21 having the same inner diameter at a position corresponding to the through hole 11 inside the synthetic resin film, and a concentric pattern surrounding the through hole 21 on the surface thereof in a concentric manner. 33 and a conductor pattern (hereinafter referred to as “resistor pattern” in this embodiment) 25, which is enclosed in a horseshoe shape, and is connected to the common pattern 33 and is connected to the common pattern 33 at both ends of the terminal pattern 31 and the resistor pattern 25. Terminal patterns 29 and 29 to be connected are provided. The material of the resistor pattern 25 is the same as that described in the first embodiment. Similarly to the conductor pattern 25, the common pattern 33 is also composed of a metal thin film by physical vapor deposition or chemical vapor deposition. Of course, since the common pattern 33 does not require a resistor like the resistor pattern 25, the material used specifically is different from the material used for the resistor pattern 25. The terminal patterns 29, 29 and 31 are also made of the same material as that of the first embodiment.

  Next, as shown in FIG. 8, the shaft support member 90 is a cylindrical metal, and the outer diameter thereof is formed substantially the same as the inner diameter of the through holes 11 and 21.

  Similar to the rotating body 80 of the first embodiment, the rotating body 80 is constituted by a single elastic metal plate, and an arc-shaped arm 83 is attached to the outer periphery of a mortar-shaped base 81, and a flexible circuit board is provided at the center of the arm 83. A sliding contact 85 that is bent so as to protrude in 20 directions is provided, and an adjustment plate 89 that is connected to a lower surface of the base 81 by a connecting part 87 provided on a part of the outer periphery of the base 81 is folded back. It is configured to overlap with the lower surface of the base 81. A circular opening 91 into which the shaft support member 90 is inserted is provided in the center of the base 81, and a plus-shaped adjustment groove 93 into which a plus driver is inserted is provided in the adjustment plate 89.

  The first metal terminals 50, 50, 55 are all the same shape and, like the first metal terminal 50 of the first embodiment, are configured by a flat and rectangular metal plate, one end of which is the terminal pattern. 29, 29, and 31 are terminal pattern connection portions 51, and the other end side is a mounting substrate connection portion 53 protruding from the outside of the insulating base 10. The surface on the lower surface side of the mounting board connecting portion 53 is a connecting surface 53a.

  Further, the third metal terminal 57 is formed of a rectangular metal plate, and a stepped portion 58 that is perpendicular to the flat surface of the portion in the insulating base 10 is provided in a portion protruding from the insulating base 10 of the metal plate. Thus, a flat mounting board connecting portion 53 that is parallel to the flat plate surface in the insulating base 10 is provided from the flat surface in the insulating base 10 to the side where the rotating body 80 is attached. The surface on the lower surface side of the mounting board connecting portion 53 is also a connecting surface 53a. In addition, the connection surface 53a of the mounting board connection part 53 of the first metal terminals 50, 50, and 55 and the connection surface 53a of the mounting board connection part 53 of the third metal terminal 57 are on the same plane. It substantially coincides with the surface to which the rotating body 80 of the insulating base 10 is attached.

  Then, as shown in FIG. 8, the rotating body 80 is installed on the surface of the electronic component board 60 on the side where the flexible circuit board 20 is attached, while the pivot support member 90 is connected to the through holes 11 and 21 of the electronic component board 60. The rotary body 80 is rotatably attached to the electronic component substrate 60 by being inserted into the opening 91 of the rotary body 80 and caulking the upper and lower ends thereof. Thereby, the rotary variable resistor 1-5 is completed. At this time, the sliding contact 85 of the rotating body 80 is in elastic contact with the resistor pattern 25 of the flexible circuit board 20, and the base 81 of the rotating body 80 is in contact with the common pattern 33.

  FIG. 10 is a cross-sectional view showing a structure for attaching the rotary variable resistor 1-5 configured as described above to the mounting surface 112 of the mounting substrate 110. FIG. As shown in the figure, the mounting substrate 110 has outer diameters of the insulating base 10 and the rotating body 80 at positions facing the insulating base 10 and the rotating body 80 of the rotary variable resistor 1-5 attached to the mounting substrate 110. An opening (adjustment hole) 111 having an inner diameter larger than the dimension is provided, and the first metal terminals 50, 50, 55 and the third metal terminal 57 of the rotary variable resistor 1-5 on the mounting surface 112 are provided. A connection pattern 113 is provided at each facing position.

  The rotary variable resistor 1-5 is placed with the surface on which the rotating body 80 is attached facing the mounting surface 112 of the mounting substrate 110. At that time, the rotating body 80 is inserted into the opening 111, and at the same time. The first metal terminals 50, 50, 55 and the third metal terminal 57 are brought into contact with the connection pattern 113 via the solder 114, respectively, and the solder 114 is melted and solidified by reflow or the like to make the both electrically and mechanically. To fix. At this time, the rotating body 80 and a part of the insulating base 10 (the part of the presser part 15) are inserted into the opening 111. The pressing portion 15 has a convex shape that protrudes toward the rotating body 80 from the surface of the insulating base 10 to which the rotating body 80 is attached, but does not protrude from the tip surface 80 a of the rotating body 80.

  Then, the tip of an adjustment jig (not shown) is inserted into the opening 111 from the surface opposite to the mounting surface 112 of the mounting substrate 110 and engaged with the adjustment groove 93 of the adjustment plate 89 to rotate the rotating body 80. For example, the sliding contact 85 provided on the rotating body 80 slides on the resistor pattern 25 to change the resistance value between the first metal terminals 50, 50, 55.

  As described above, in this embodiment, as in the first aspect of the present invention, the sliding contact 85 of the rotating body 80 rotatably mounted on the insulating base 10 is provided on the insulating base 10. In the structure for attaching the rotary electronic component 1-5 having the structure to be brought into sliding contact with the conductor pattern 25 to the mounting surface 112 of the mounting substrate 110 to the mounting substrate 110, the insulating base 10 includes: A metal made of synthetic resin and provided with metal terminals (first and third metal terminals) 50, 50, 55, 57 projecting outward from the outer periphery thereof (or a metal electrically connected to the conductor pattern 25) The terminals 50, 50, 55 are exposed from the inside of the insulating base 10 to the outside), and the insulating base 10 of the rotary electronic component 1-5 is positioned inside or above the opening 111 provided in the mounting substrate 110. In this state, the metal terminals 50 and 5 The configuration for mounting and connecting to a connection pattern 113 having a 55 and 57 on the mounting surface 112 around the opening 111 of the mounting substrate 110 is disclosed. And if the mounting structure to the mounting substrate 110 of the rotary electronic component 1-5 is configured in this way, the insulating base 10 is composed of a synthetic resin, so that the thickness can be reduced compared to the conventional ceramic substrate, Manufacture is also easy and cost reduction can be achieved, whereby the thickness of the mounting substrate 110 and the entire rotary electronic component 1-5 mounted on the mounting substrate 110 can be reduced. Further, since the metal terminals 50, 50, 55, 57 protruding from the outer periphery of the insulating base 10 and the connection pattern 113 of the mounting substrate 110 are connected, the rotary electronic component 1- is compared with the case where the substrates are directly connected. 5 is easily attached to the mounting substrate 110.

  In this embodiment, as in the invention described in claim 6, the other member mounted on the insulating base 10 is the flexible circuit board 20, and the conductor pattern 25 is placed on the flexible circuit board 20. The provided configuration is disclosed. As a result, the flexible circuit board 20 having the conductor patterns 25 can be manufactured at the same time by dividing the large flexible circuit board on which the same many conductor patterns 25 are formed, and the conductor patterns 25 are directly formed on the insulating base 10 one by one. Compared with the case of providing a mass production, mass production can be easily performed.

  Moreover, this embodiment discloses that the flexible circuit board 20 is insert-molded on the insulating base 10 as in the invention described in claim 7. As a result, the manufacturing is easy, the material cost can be reduced as compared with the ceramic substrate, and the thickness can be reduced easily and inexpensively.

  Further, in this embodiment, as in the invention described in claim 8, the rotary electronic component 1-5 has the mounting surface of the mounting substrate 110 such that the surface on which the rotating body 80 is attached faces the mounting substrate 110. A configuration is disclosed in which an adjustment portion 89 of a rotating body 80 attached to 112 and rotated by an adjustment jig is exposed to the opening 111 of the mounting substrate 110. Accordingly, the rotating body 80 can be rotated and adjusted from the back surface side of the mounting surface 112 of the mounting substrate 110. Therefore, even if the adjustment of the resistance value or the like of the rotary electronic component 1-5 mounted on the mounting substrate 110 cannot be performed from the mounting surface 112 side of the mounting substrate 110 depending on the installation location of the mounting substrate 110, the adjustment is performed. In this case, unlike the adjustment pin shown in Patent Document 2, the number of parts does not increase and the structure is not complicated.

  In this embodiment, as in the invention described in claim 9, at least a part of the rotating body 80 of the rotary electronic component 1-5 is inserted into the opening 111 of the mounting substrate 110. It is disclosed. Accordingly, the thickness of the mounting substrate 110 and the entire rotary electronic component 1-5 mounted on the mounting substrate 110 can be reduced.

  In this embodiment, as in the invention described in claim 10, at least a part of the insulating base 10 of the rotary electronic component 1-5 (in this embodiment, only the holding portion 15) is mounted on the mounting board. The structure inserted in the opening part 111 of 110 is disclosed. This also makes it possible to reduce the thickness of the entire mounting substrate 110 and the rotary electronic component 1-5.

[Sixth embodiment]
FIG. 11 is a cross-sectional view showing a structure for attaching a rotary electronic component (hereinafter referred to as “rotary variable resistor”) 1-6 according to the sixth embodiment of the present invention to the mounting surface 112 of the mounting substrate 110. The rotary electronic component 1-6 used in this embodiment has the same structure as the rotary electronic component 1-2 used in the second embodiment. In this embodiment, the same parts as those of the second embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. In this embodiment, the point different from the second embodiment is that the rotary electronic component 1-6 is in a state where the surface opposite to the side to which the rotating body 80 is attached faces the mounting surface 112 of the mounting substrate 110. This is a point placed on the mounting substrate 110. At that time, a part of the insulating base 10 is inserted into the opening 111, and at the same time, the first metal terminals 50 and 50 and the second metal terminal 43 are brought into contact with the connection pattern 113 via the solder 114, respectively. 114 is melted and solidified by reflow or the like to fix both electrically and mechanically. As a result, a part of the insulating base 10 is inserted into the opening 111.

  In the case of this embodiment, the tip of an adjustment jig (not shown) (for example, a plus or minus driver) is inserted into the adjustment groove 93 of the rotating body 80 exposed on the mounting surface 112 side of the mounting substrate 110, and the rotating body By rotating 80, the sliding contact 85 provided on the rotating body 80 slides on the resistor pattern 25 to change the resistance value between the first and second metal terminals 50, 50, 43. That is, in this embodiment, adjustment of the electrical output of the rotary electronic component 1-6 is performed from the mounting surface 112 side of the mounting substrate 110, but the insulating base 10 is made of synthetic resin and can be thinned. Furthermore, since a part of the insulating base 10 can be inserted into the opening 111, the thickness can be further reduced.

  As described above, in this embodiment, as in the first aspect of the present invention, the sliding contact 85 of the rotating body 80 rotatably mounted on the insulating base 10 is provided on the insulating base 10. In the structure for attaching the rotary electronic component 1-6 to the mounting surface 110 of the mounting substrate 110 to the mounting surface 112 of the rotating electronic component 1-6 having a structure to be brought into sliding contact with the conductor pattern 25, the insulating base 10 includes: A metal terminal 50 made of synthetic resin and provided with metal terminals (first and second metal terminals) 50, 50, 43 projecting outward from the outer periphery thereof (or electrically connected to the conductor pattern 25). , 50, 43 are exposed from the inside of the insulating base 10 to the outside), and the insulating base 10 of the rotary electronic component 1-6 is located inside or above the opening 111 provided in the mounting substrate 110 The metal terminals 50, 50, 4 Structure for mounting and connection is disclosed in the connection pattern 113 provided on the mounting surface 112 around the opening 111 of the mounting substrate 110. If the structure for mounting the rotary electronic component 1-6 to the mounting substrate 110 is configured in this way, the insulating base 10 is made of synthetic resin, so that the thickness can be reduced compared to the conventional ceramic substrate. Manufacture is also easy and cost reduction can be achieved, whereby the thickness of the mounting substrate 110 and the entire rotary electronic component 1-6 mounted on the mounting substrate 110 can be reduced. Further, since the metal terminals 50, 50, 43 protruding from the outer periphery of the insulating base 10 are connected to the connection pattern 113 of the mounting substrate 110, the rotary electronic component 1-6 is compared with the case where the substrates are directly connected to each other. Attachment to the mounting substrate 110 becomes easy.

  In this embodiment, as in the invention described in claim 3, the metal terminal protrudes outward from the outer periphery of the insulating base 10 in a state of being electrically connected to the conductor pattern 25 ( Or a first metal terminal 50 (exposed to the outside of the insulating base 10) and a cylindrical protrusion 42 to which the rotating body 80 is rotatably attached, and is attached to the insulating base 10 by insert molding. It is provided integrally with the plate 40 and protrudes outward from the outer periphery of the insulating base 10 (or exposed to the outside of the insulating base 10 and electrically connected to the conductor pattern 25 via the rotating body 80). The second metal terminal 43 is disclosed to be configured. This eliminates the need for an assembly work for attaching the current collector plate 40 to the insulating base 10 separately, facilitates the manufacture of the insulating base 10 with the current collector plate 40, and reduces the material cost compared to the ceramic substrate. Therefore, the thickness can be reduced easily and inexpensively.

  In this embodiment, as in the invention described in claim 6, the other member attached on the insulating base 10 is the flexible circuit board 20, and the conductor pattern 25 is formed on the flexible circuit board 20. The provided configuration is disclosed. As a result, by dividing a large flexible circuit board on which the same many conductor patterns 25 are formed, a large number of flexible circuit boards 20 having the conductor patterns 25 can be manufactured at the same time. Compared with the case where the pattern 25 is formed, mass production can be easily performed.

  Moreover, this embodiment discloses that the flexible circuit board 20 is insert-molded on the insulating base 10 as in the invention described in claim 7. As a result, the manufacturing is easy, the material cost can be reduced as compared with the ceramic substrate, and the thickness can be reduced easily and inexpensively.

  In this embodiment, as in the invention described in claim 10, at least a part of the insulating base 10 of the rotary electronic component 1-6 (in this embodiment, the rotating body 80 of the insulating base 10 is provided). A configuration is disclosed in which a predetermined thickness on the non-attached surface side is inserted into the opening 111 of the mounting substrate 110. This also makes it possible to reduce the thickness of the entire mounting substrate 110 and the rotary electronic component 1-6.

[Seventh embodiment]
FIG. 12 is a cross-sectional view showing a structure for mounting a rotary electronic component (hereinafter referred to as “rotary variable resistor”) 1-7 on the mounting surface 112 of the mounting substrate 110 according to the seventh embodiment of the present invention. The rotary electronic component 1-7 used in this embodiment has the same structure as the rotary electronic component 1-3 used in the third embodiment. In this embodiment, the same parts as those in the third embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. In this embodiment, the difference from the third embodiment is that the rotary electronic component 1-7 is in a state in which the surface opposite to the side on which the rotating body 80 is attached faces the mounting surface 112 of the mounting substrate 110. This is a point placed on the mounting substrate 110. At that time, the insulating base 10 is inserted into the opening 111, and the first metal terminals 50 and 50 and the second metal terminal 43 are simultaneously brought into contact with the connection pattern 113 via the solder 114, and the solder 114 is reflowed. It is melted and solidified by the method to fix them both electrically and mechanically. As a result, the insulating base 10 is inserted into the opening 111.

  In this embodiment, the insulating base 10 inserted into the opening 111 is configured such that the surface on which the rotating body 80 is not attached does not protrude from the surface opposite to the mounting surface 112 of the mounting substrate 110. Is preferred (this embodiment is so). If comprised in this way, even when the mounting board | substrate 110 is arrange | positioned and attached on another member, obstacles, such as the insulation base 110 of the rotary variable resistor 1-7 contact | abutting another member, will not arise.

  In the case of this embodiment, the tip of an adjustment jig (not shown) (for example, a plus or minus driver) is inserted into the adjustment groove 93 of the rotating body 80 exposed on the mounting surface 112 side of the mounting substrate 110, and the rotating body By rotating 80, the sliding contact 85 provided on the rotating body 80 slides on the resistor pattern 25 to change the resistance value between the first and second metal terminals 50, 50, 43. That is, in the case of this embodiment, the electrical output of the rotary electronic component 1-7 is adjusted from the mounting surface 112 side of the mounting substrate 110, but the insulating base 10 is made of synthetic resin and can be thinned. In addition, since the insulating base 10 can be inserted into the opening 111, the thickness thereof can be reduced.

[Eighth embodiment]
FIG. 13 is a view showing a rotary electronic component (hereinafter referred to as “rotary variable resistor”) 1-8 according to an eighth embodiment of the present invention. FIG. 13 (a) is a plan view and FIG. 13 (b). FIG. 13A is a cross-sectional view taken along the line DD in FIG. 13A, and FIG. In this rotary variable resistor 1-8, the same parts as those of the rotary variable resistor 1-1 are denoted by the same reference numerals. Note that matters other than those described below are the same as those in the first embodiment. As shown in the figure, the rotary variable resistor 1-8 includes an insulating base 10 made of synthetic resin and one surface (lower surface) of the insulating base 10 (more specifically, one side of the insulating base 10). A flexible circuit board 20 attached by insert molding on the bottom surface of the concave rotating body storage portion 17 provided on the surface of the substrate and a second metal terminal 43 attached by insert molding inside the insulating base 10. An electric plate 40 and two metal terminals (hereinafter referred to as “first metal terminals”) 50 and 50 and a side of the insulating base 10 on which the flexible circuit board 20 is installed (lower surface side) are rotatably installed. And a rotating body 80. In this embodiment as well, a substrate in which the insulating base 10, the flexible circuit board 20, the current collector plate 40, and the first metal terminals 50 and 50 are integrated is referred to as an electronic component board 60. Each component will be described below.

  14A and 14B are views showing the electronic component substrate 60. FIG. 14A is a plan view, FIG. 14B is a cross-sectional view taken along line EE of FIG. 14A, and FIG. It is. As shown in the figure, the insulating base 10 is a substantially rectangular and plate-shaped synthetic resin molded product. A concave rotating body housing portion 17 is provided on the lower surface, and a circular through hole 11 is provided in the center thereof. Yes. The material of the insulating base 10 is the same as in the other embodiments.

  Since the flexible circuit board 20 is covered with the terminal pattern 29, 29 (the portion where the terminal pattern 29 is exposed) on the synthetic resin film (the material is the same as that of the other embodiments) by the pressing portion 15 of the insulating base 10. 2 (c), and a conductor pattern 25 (hereinafter referred to as a “resistor pattern” in this embodiment) in which a sliding contact 85 of a rotating body 80 described below is in sliding contact with the surface thereof. It is provided and configured. In other words, the flexible circuit board 20 has an inner shape dimension (inner diameter dimension) substantially the same as the outer dimension (outer diameter dimension) of the cylindrical projection 42 of the current collector plate 40 described below of the synthetic resin film. A through hole 21 having a size and shape that is press-fitted into the hole is provided, a resistor pattern 25 that surrounds the through hole 21 in a horseshoe shape is provided, and terminal patterns 29 and 29 are connected to both ends of the resistor pattern 25, respectively. Provided. In this embodiment, the resistor pattern 25 is formed by printing and baking a carbon paste (a material obtained by kneading carbon powder in a urethane or phenol resin dissolved in a solvent). Of course, you may comprise by the metal thin film by the same physical vapor deposition or chemical vapor deposition as demonstrated in 1st embodiment.

  Next, in this embodiment, the terminal patterns 29 and 29 are formed by printing and baking a silver paste (for example, a material obtained by kneading silver powder in a urethane-based or phenol-based resin material dissolved in a solvent). Of course, as in the first embodiment, a copper layer and a gold layer may be sequentially formed on the nichrome base by vapor deposition.

  The current collector plate 40 is configured by providing a base 41 on one side of a flat and substantially rectangular metal plate and providing a metal terminal (hereinafter referred to as “second metal terminal”) 43 on the other side. Here, the base 41 is substantially circular, and is configured to project a cylindrical protrusion 42 vertically from the center of the surface. On the other hand, in the vicinity of the other end facing the base 41 of the metal plate, a step 45 inclined obliquely from the flat surface of the base 41 is provided so as to protrude from the flat surface of the base 41 toward the cylindrical protrusion 42. A flat plate-like second metal terminal 43 that is parallel to the base 41 is provided. A surface on the lower surface side of the second metal terminal 43 serves as a connection surface 43a for connecting a connection pattern 113 of the mounting substrate 110 described below. The connection surface 43a is installed so as to be flush with the surface (the surface that contacts the mounting surface 112 of the mounting substrate 110 of the insulating base 10) facing the side on which the rotating body 80 of the insulating base 10 is attached. The step portion 45 is provided so as to be embedded in the insulating base 10, and a fixing portion 45 a that penetrates is provided in the step portion 45. Since the synthetic resin constituting the insulating base 10 enters the fixing portion 45a, the current collector plate 40 is reliably fixed in the insulating base 10. Further, by installing the stepped portion 45 inside the insulating base 10, at least a part of the connection surface 43a can be exposed so as to enter the inner side of the outer periphery of the surface of the insulating base 10, and accordingly the second portion. The protruding dimension of the metal terminal 43 protruding outward from the insulating base 10 can be shortened, and the rotary variable resistor 1-5 can be downsized. In this embodiment, the surface of the current collector plate 40 that protrudes from the cylindrical protrusion 42 is disposed so as to contact the surface of the flexible circuit board 20 on which the conductor pattern 25 is not provided. If comprised in this way, the thickness of the insulation base 10 formed in the part a1 of the opposite surface side which contact | abuts the flexible circuit board 20 of the current collection board 40 can be thickened, and the intensity | strength can be strengthened. In particular, as in this embodiment, when the thickness of the insulating base 10 is reduced by providing the rotating body storage portion 17, the effect is great.

  The first metal terminal 50 is constituted by a flat and substantially rectangular metal plate, one end side of which is connected to the terminal pattern 29, and the other end side protrudes outside the insulating base 10. This is a mounting board connecting portion 53. The surface of the terminal pattern connection portion 51 and the mounting substrate connection portion 53 are parallel, and a step portion 30 that is perpendicular to the flat surface of the terminal pattern connection portion 51 is provided between them. A surface on the lower surface side of the mounting board connecting portion 53 is a connection surface 53a for connecting a connection pattern 113 of the mounting board 110 described below. The connection surface 53a is installed so as to be flush with the surface of the insulating base 10 that faces the side on which the rotating body 80 is attached (the surface that contacts the mounting surface 112 of the mounting substrate 110 of the insulating base 10). The step portion 30 is provided so as to be embedded in the insulating base 10. In addition, by installing the stepped portion 30 inside the insulating base 10, at least a part of the connection surface 53a can be exposed so as to enter the inside of the outer periphery of the surface of the insulating base 10, and accordingly the first The protruding dimension of the metal terminal 50 protruding outward from the insulating base 10 can be shortened, and the rotary variable resistor 1-5 can be downsized.

  The step 45 is formed so as to be inclined from the flat plate surface of the base 41 (at an angle smaller than 90 °) for the following reason. FIG. 15 is a view showing a state in which the current collector plate 40 connected to the second metal terminal 43 and the first metal terminals 50, 50 are punched out by a press die in a band-shaped metal plate 500. In this drawing, as can be seen by extending the step 45 and the step 30 in a flat plate shape, the tip of the base 41 and the tip of the first metal terminals 50 and 50 are substantially in contact as shown by the dotted line in FIG. Come on. In other words, if the step 45 is formed so as to be bent at a right angle, the current collector plate 40 and the metal terminals 50 and 50 cannot be simultaneously formed in one flat metal plate 500 by one press working. End up. Therefore, in this embodiment, the stepped portion 45 is inclined obliquely. This configuration becomes more effective as the rotary variable resistor 1-8 is downsized and the distance between the current collector plate 40 and the first metal terminals 50, 50 is reduced. Therefore, depending on the case, the stepped portion 30 may be similarly formed obliquely.

  Returning to FIG. 13, the rotating body 80 is constituted by a single elastic metal plate, and an arc-shaped arm 83 is attached to the outer periphery of the mortar-shaped base 81, and protrudes toward the flexible circuit board 20 in the center of the arm 83. An adjustment portion (hereinafter referred to as an “adjustment plate”) 89 connected to a lower surface of the base portion 81 by a connection portion 87 provided on a part of the outer periphery of the base portion 81. It is configured to be overlapped with the lower surface of the base 81 by folding back. A circular opening 91 into which the cylindrical protrusion 42 of the current collector plate 40 is inserted is provided at the center of the base 81, and an adjustment jig made of a plus driver (or minus driver) is inserted into the adjustment plate 89. An adjustment groove 93 having a shape (may be another shape) is provided.

  The manufacturing method of the electronic component substrate 60 will be described. As shown in FIG. 17, the cylindrical protrusions 42 of the current collector plate 40 are press-fitted into the through-holes 21 of the flexible circuit board 20 in advance, and both are laminated. The flexible circuit board 20 and the current collector plate 40 and the first metal terminals 50 and 50 are inserted into the molds 101 and 105. At this time, a cavity C1 having the same shape as that of the insulating base 10 is formed in the molds 101 and 105, but the flexible circuit board 20 has a surface on the side where the resistor pattern 25 is formed on the mold of the cavity C1. Abutting on the inner plane C11 (upper surface of the convex portion 103) on the mold 101 side, and simultaneously abutting the terminal pattern connection portions 51, 51 of the first metal terminals 50, 50 on the terminal patterns 29, 29 of the flexible circuit board 20, At the same time, the portion of the base 41 of the current collector plate 40, the portion of the second metal terminal 43 projecting out of the cavity C1, and the portion of the first metal terminals 50, 50 projecting out of the cavity C1. A part on the mounting board connecting portion 53 side is held between the molds 101 and 105. Note that the lower surfaces of the terminal pattern connection portions 51 and 51 side where the terminal patterns 29 and 29 are in contact with the terminal pattern connection portions 51 and 51 are supported by the support protrusions 109 (the opening portions shown in FIG. 19 is formed). The portion of the base 41 is sandwiched between convex portions 103 and 107 (which form the through hole 11 of the insulating base 10 and the rotating body storage portion 17) provided on the molds 101 and 105.

  Then, a thermoplastic synthetic resin (nylon, PPS, etc.) heated and melted is injected into the cavity C1 from the gate G1 provided in the mold 105 to fill the cavity C1. The flexible circuit board 20 is cooled and solidified while being pressed against the inner plane C11 and the terminal pattern connecting portions 51 and 51 of the first metal terminals 50 and 50 by the press-fitting pressure. When the molds 101 and 105 are removed, the electronic component substrate 60 shown in FIG. 14 is completed. At this time, the connection surface 43a of the second metal terminal 43 of the current collector plate 40 and the connection surfaces 53a and 53a of the first metal terminals 50 and 50 are flush with each other (that is, the second metal terminal 43 and the first metal). The terminals 50 and 50 are on the same surface), and these surfaces are exactly the same as the surface on the side of the insulating base 10 on which the rotating body 80 is mounted (the surface contacting the mounting surface 112 of the mounting substrate 110 of the insulating base 10). It matches. When the second metal terminal 43 of the current collector plate 40 and the first metal terminals 50 and 50 are accommodated in the molds 101 and 105, the second metal is accurately placed on the surface of the mold 101. This is because the connection surface 43a of the terminal 43 and the connection surfaces 53a and 53a of the first metal terminals 50 and 50 can be brought into close contact with each other. Further, the terminal pattern connection portions 51 and 51 of the insulating base 10 are insulated on the lower surface side (the surface side to which a rotating body 80 to be described later is attached) while the terminal pattern connection portions 51 and 51 are pressed against the terminal patterns 29 and 29. A presser portion 15 for fixing to the base 10 is provided. The pressing portion 15 protrudes toward the rotating body 80 from the surface of the insulating base 10 to which the rotating body 80 is attached, and protrudes from a tip surface 80a of the rotating body 80 described below.

  Then, as shown in FIG. 13, the rotating body 80 is stored in the rotating body storage portion 17 and placed on the surface of the electronic component substrate 60 on which the flexible circuit board 20 is attached. When the cylindrical protrusion 42 of the current collector plate 40 is rotatably inserted into the opening 91 and the tip side (lower end side) of the cylindrical protrusion 42 is caulked, the rotary electronic component 1-8 is completed. At this time, the sliding contact 85 of the rotating body 80 is in elastic contact with the resistor pattern 25 of the flexible circuit board 20. The rotating body 80 is housed in the rotating body housing portion 17, and the distal end surface 80 a of the rotating body 80 is located above the surface around the rotating body housing portion 17 of the insulating base 10 (inside the rotating body housing portion 17). Therefore, the rotating body 80 can be protected from the outside.

  FIG. 16 is a cross-sectional view showing a structure for attaching the rotary variable resistor 1-8 configured as described above to the mounting surface 112 of the mounting substrate 110. FIG. As shown in the figure, the mounting board 110 has an outer diameter dimension (most of the insulating base 10 at a position facing the insulating base 10 and the rotary body 80 of the rotary variable resistor 1-8 attached to the mounting board 110). A circular opening (adjustment hole) 111 having an inner diameter smaller than the outer diameter of the long portion is provided, and the first metal terminals 50, 50 and the second metal terminals 50, 50 are provided on the mounting surface 112 around the opening 111. Connection patterns 113 facing the metal terminals 43 are provided.

  The rotary variable resistor 1-8 is placed with the surface on which the rotating body 80 is mounted facing the mounting surface 112 of the mounting substrate 110, and the rotating body 80 is exposed to the opening 111 at the same time. One metal terminal 50, 50 and the second metal terminal 43 are brought into contact with the connection pattern 113 via the solder 114, and the solder 114 is melted and solidified by reflow or the like to electrically and mechanically connect the two. And attach. At this time, the surface of the rotary variable resistor 1-8 on the mounting substrate 110 side is in close contact with the mounting surface 112 of the mounting substrate 110. Therefore, the thickness of the entire mounting structure is a thickness obtained by adding the thickness of the mounting substrate 110 and the thickness of the rotary electronic component 1-8, so that the thickness can be reduced.

  Then, the tip of an adjustment jig (not shown) (for example, a plus or minus driver) is inserted into the opening 111 from the surface opposite to the mounting surface 112 of the mounting substrate 110 and engaged with the adjustment groove 93 of the adjustment plate 89. When the rotating body 80 is rotated, the sliding contact 85 provided on the rotating body 80 is slidably contacted on the resistor pattern 25 (see FIG. 14C) and the first metal terminals 50, 50 and the second metal The resistance value between the terminals 43 changes. By the way, in this embodiment, the flexible circuit board 20 is sandwiched between the current collector plate 40 and the rotary body 80 at a portion where the rotary body 80 is rotatably attached to the cylindrical protrusion 42 of the current collector plate 40. It is configured. The reason is as follows. That is, for example, when the rotating body 80 is made of iron white and the current collector plate 40 is tin-plated phosphor phosphor bronze, by heating such as reflow when the rotary variable resistor 1-8 is attached to the mounting substrate 110, the above-mentioned There is a possibility that the rotating body 80 is fixed to the cylindrical protrusion 42 due to melting of the plating. Therefore, in this embodiment, by interposing the flexible circuit board 20 between them, the surface of the rotating body 80 on the side of the current collector plate 40 and the surface around the outer side of the cylindrical protrusion 42 of the current collector plate 40 are not brought into direct contact. In this way, both were prevented from being fixed by plating. In addition, the outer peripheral side surface of the cylindrical protrusion 42 and the inner peripheral side surface of the opening 91 of the rotating body 80 that is rotatably attached to the cylindrical protrusion 42 are in contact with each other. However, at the same time, this portion is also fixed by the plating during the heating. However, since the area to be fixed is small, the fixing is easily broken when the rotating body 80 is rotated, and no problem occurs.

  As described above, in this embodiment, as in the first aspect of the present invention, the sliding contact 85 of the rotating body 80 rotatably mounted on the insulating base 10 is provided on the insulating base 10. In the structure for attaching the rotary electronic component 1-8 having the structure to be in sliding contact with the conductive pattern 25 to the mounting surface 112 of the mounting substrate 110 to the mounting surface 110, the insulating base 10 Metal terminals made of synthetic resin and provided with metal terminals (first and second metal terminals) 50, 50, 43 protruding outward from the outer periphery thereof (or electrically connected to the conductor pattern 25) 50, 50, and 43 are exposed from the inside of the insulating base 10 to the outside), and the insulating base 10 of the rotary electronic component 1-8 is positioned above the opening 111 provided in the mounting substrate 110. , The metal terminals 50, 50, 43 Structure mounting connected to the connection pattern 113 provided on the mounting surface 112 around the opening 111 of the serial mounting board 110 is disclosed. If the structure for mounting the rotary electronic component 1-8 to the mounting board 110 is configured in this way, the insulating base 10 is made of synthetic resin, so that the thickness can be reduced compared to the conventional ceramic board, Manufacture is also easy and cost reduction can be achieved, and thereby the thickness of the entire rotating electronic component 1-8 mounted on the mounting substrate 110 and the mounting substrate 110 can be reduced. Further, since the metal terminals 50, 50, 43 exposed to the outside of the insulating base 10 are connected to the connection pattern 113 of the mounting substrate 110, the mounting of the rotary electronic component 1-8 is performed compared to the case where the substrates are connected to each other. Attachment to the substrate 110 is facilitated.

  In this embodiment, the connection surfaces 50a, 50a, 43a of the metal terminals 50, 50, 43 to the connection pattern 113 are attached to the rotating body 80 of the insulating base 10, as in the invention described in claim 2. In other words, a configuration is disclosed in which it is disposed so as to be flush with the surface facing the opposite side (the surface contacting the mounting surface 112 of the mounting substrate 110 of the insulating base 10). Thus, when the rotary electronic component 1-8 is attached to the mounting surface 112 of the mounting substrate 110, the surface of the rotating electronic component 1-8 on the mounting substrate 110 side is positioned substantially flush with the mounting surface 112 of the mounting substrate 110. Therefore, the entire thickness of the mounting substrate 110 and the rotary electronic component 1-8 mounted on the mounting substrate 110 can be reduced.

  In this embodiment, as in the invention described in claim 3, the metal terminal protrudes outward from the outer periphery of the insulating base 10 in a state of being electrically connected to the conductor pattern 25 ( Or a first metal terminal 50 (exposed to the outside of the insulating base 10) and a cylindrical protrusion 42 to which the rotating body 80 is rotatably attached, and is attached to the insulating base 10 by insert molding. It is provided integrally with the plate 40 and protrudes outward from the outer periphery of the insulating base 10 (or is exposed to the outside of the insulating base 10 and is electrically connected to the conductor pattern 25 via the rotating body 80. And the second metal terminal 43 is disclosed. This eliminates the need for an assembly work for attaching the current collector plate 40 to the insulating base 10 separately, facilitates the manufacture of the insulating base 10 with the current collector plate 40, and reduces the material cost compared to the ceramic substrate. Therefore, the thickness can be reduced easily and inexpensively.

  In this embodiment, as in the invention described in claim 4, the other member attached on the insulating base 10 is the flexible circuit board 20, and the conductor pattern 25 is formed on the flexible circuit board 20. It is disclosed that at least a part of the surface of the current collector plate 40 is provided so as to be in contact with the surface of the flexible circuit board 20 on which the conductor pattern 25 is not provided. As a result, the thickness of the insulating substrate 10 formed on the portion a1 on the opposite side of the current collector plate 40 that contacts the flexible circuit board 20 can be increased, and the strength thereof can be increased.

  In this embodiment, as in the invention described in claim 5, the flexible circuit board 20 has a current collector at a portion where the rotating body 80 is rotatably attached to the cylindrical protrusion 42 of the current collector plate 40. It is disclosed that it is configured to be sandwiched between the plate 40 and the rotating body 80. Accordingly, for example, when the current collector plate 40 is plated, even if the rotary electronic component 1-8 is attached to the mounting substrate 110 and heated by reflow or the like, the gap between the rotor 80 and the current collector plate 40 is not reduced. It can prevent being fixed by plating.

  In this embodiment, as in the invention described in claim 6, the other member attached on the insulating base 10 is the flexible circuit board 20, and the conductor pattern 25 is formed on the flexible circuit board 20. The provided configuration is disclosed. As a result, by dividing a large flexible circuit board on which the same many conductor patterns 25 are formed, a large number of flexible circuit boards 20 having the conductor patterns 25 can be manufactured at the same time. Compared with the case where the pattern 25 is formed, mass production can be easily performed.

  Moreover, this embodiment discloses that the flexible circuit board 20 is insert-molded on the insulating base 10 as in the invention described in claim 7. As a result, the manufacturing is easy, the material cost can be reduced as compared with the ceramic substrate, and the thickness can be reduced easily and inexpensively.

  Further, in this embodiment, as in the invention described in claim 8, the rotary electronic component 1-8 has the mounting surface of the mounting substrate 110 so that the surface on which the rotating body 80 is attached faces the mounting substrate 110. A configuration is disclosed in which an adjustment portion 89 of a rotating body 80 attached to 112 and rotated by an adjustment jig is exposed to the opening 111 of the mounting substrate 110. Accordingly, the rotating body 80 can be rotated and adjusted from the back surface side of the mounting surface 112 of the mounting substrate 110. Therefore, even if the adjustment of the resistance value or the like of the rotary electronic component 1-8 mounted on the mounting substrate 110 cannot be performed from the mounting surface 112 side of the mounting substrate 110 depending on the installation location of the mounting substrate 110, the adjustment is performed. In this case, unlike the adjustment pin shown in Patent Document 2, the number of parts does not increase and the structure is not complicated.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea described in the claims and the specification and drawings. Is possible. It should be noted that any shape, structure, and material not directly described in the specification and drawings are within the scope of the technical idea of the present invention as long as the effects and advantages of the present invention are exhibited. For example, although the resistor pattern is used as the conductor pattern in the above embodiment, other various patterns such as a switch pattern may be used. The rotating body 80 according to each of the above embodiments is configured by superimposing an adjustment plate 89 connected by a connecting portion 87 on the upper surface of a mortar-shaped base portion 81 having an arm 83 and a sliding contact 85. The rotating body is not limited to the rotating body of this structure. For example, the adjusting plate 89 may be omitted by providing an adjusting groove for engaging an adjusting jig such as a plus driver in the mortar-shaped base 81 itself. Various adjustments are possible, such as an adjustment part (including non-plate-like ones) made of different parts may be attached to the upper surface of the base 81, and an arm and a sliding contact may be provided on the adjustment plate 89. .

  In each of the above embodiments, the conductor pattern 25 and the common pattern 33 are formed of a metal thin film by physical vapor deposition or chemical vapor deposition. You may comprise by other various methods, such as printing and baking of carbon paste, and etching of copper foil. Similarly, the terminal patterns 29 and 31 may be formed by various other methods such as printing and baking a silver paste made of a conductive paste formed by kneading silver powder into a cermet material or a synthetic resin. good.

  In each of the above embodiments, the flexible circuit board 20 is insert-molded on the insulating base 10. However, the present invention is not limited to this. For example, the flexible circuit board 20 is separately bonded on the insulating base 10 or other mechanical fixing means. The flexible circuit board 20 may be simply mounted on the insulating base 10.

  Further, in each of the above embodiments, the flexible circuit board 20 is attached to the insulating base 10, but the flexible circuit board 20 is omitted and the conductor pattern 25, the common pattern 33, and the terminal patterns 29, 31 are formed directly on the insulating base 10. You may do it. In this case, for example, a pattern of a resistor or the like may be transferred to the surface of the insulating base 10 made of synthetic resin, or may be directly baked by screen printing with a conductive paint. In the above embodiments, the metal terminals 50 and 50 are connected to the terminal patterns 29 and 29. However, the metal terminals 50 and 50 may be directly connected to the conductor pattern 25 without the terminal patterns 29 and 29.

It is a figure which shows the rotary variable resistor 1-1, FIG. 1 (a) is a top view, FIG.1 (b) is AA sectional drawing of Fig.1 (a), FIG.1 (c) is a back view. is there. It is a figure which shows the board | substrate 60 for electronic components, Fig.2 (a) is a top view, FIG.2 (b) is BB sectional drawing of Fig.2 (a), FIG.2 (c) is a back view. It is explanatory drawing of the manufacturing method of the board | substrate 60 for electronic components. It is sectional drawing which shows the attachment structure to the mounting board | substrate 110 of the rotary variable resistor 1-1. It is sectional drawing which shows the attachment structure to the mounting board | substrate 110 of the rotary variable resistor 1-2. It is sectional drawing which shows the attachment structure to the mounting board | substrate 110 of the rotary variable resistor 1-3. It is sectional drawing which shows the attachment structure to the mounting board | substrate 110 of the rotary variable resistor 1-4. It is a figure which shows the rotary variable resistor 1-5, Fig.8 (a) is a top view, FIG.8 (b) is CC sectional drawing of Fig.8 (a), FIG.8 (c) is a back view. is there. 4 is a back view of the flexible circuit board 20. FIG. It is sectional drawing which shows the attachment structure to the mounting board | substrate 110 of the rotary variable resistor 1-5. It is sectional drawing which shows the attachment structure to the mounting board | substrate 110 of the rotary variable resistor 1-6. It is sectional drawing which shows the attachment structure to the mounting board | substrate 110 of the rotary variable resistor 1-7. It is a figure which shows the rotary variable resistor 1-8, FIG. 13 (a) is a top view, FIG.13 (b) is DD sectional drawing of Fig.13 (a), FIG.13 (c) is a back view. is there. It is a figure which shows the board | substrate 60 for electronic components, Fig.14 (a) is a top view, FIG.14 (b) is EE sectional drawing of Fig.14 (a), FIG.14 (c) is a back view. It is a figure which shows the state which stamped the current collecting plate 40 and the 1st metal terminals 50 and 50 from the metal plate 500, FIG.15 (a) is FF sectional drawing of FIG.15 (b), FIG.15 (b). Is a back view. It is sectional drawing which shows the attachment structure to the mounting board | substrate 110 of the rotary variable resistor 1-8. It is explanatory drawing of the manufacturing method of the board | substrate 60 for electronic components.

Explanation of symbols

1-1 Rotary variable resistor (Rotary electronic component)
10 Insulation base 20 Flexible circuit board 25 Resistor pattern (conductor pattern)
40 Current collector plate 42 Cylindrical protrusion 43 Second metal terminal (metal terminal)
50 First metal terminal (metal terminal)
60 Electronic Component Board 80 Rotating Body 85 Sliding Contact 89 Adjustment Plate (Adjustment Section)
DESCRIPTION OF SYMBOLS 110 Mounting substrate 111 Opening part 112 Mounting surface 113 Connection pattern 1-2 Rotary variable resistor (Rotary electronic component)
1-3 Rotary variable resistor (Rotary electronic component)
1-4 Rotary variable resistor (Rotary electronic component)
1-5 Rotary variable resistors (rotary electronic components)
31 Terminal pattern 33 Common pattern 55 First metal terminal (metal terminal)
57 Third metal terminal (metal terminal)
90 Shaft support member 1-6 Rotary variable resistor (Rotary electronic component)
1-8 Rotary variable resistor (Rotary electronic component)

Claims (10)

A rotary electronic component having a structure in which a sliding contact of a rotating body rotatably mounted on an insulating base is slidably contacted with a conductor pattern provided directly or via another member on the insulating base is mounted on the mounting board. In the mounting structure to the mounting board of the rotary electronic component to be mounted on the mounting surface,
The insulating base is made of synthetic resin and the metal terminals that are electrically connected to the conductor pattern are exposed from the inside of the insulating base to the outside,
The metal terminal is connected to a connection pattern provided on a mounting surface around the opening of the mounting board in a state where the insulating base of the rotary electronic component is located inside or above the opening provided in the mounting board. A mounting structure for mounting a rotary electronic component on a mounting board.   2. The rotary type according to claim 1, wherein a connection surface of the metal terminal to the connection pattern is disposed so as to be flush with a surface of the insulating base facing the side on which the rotating body is attached. Mounting structure of electronic components to the mounting board. The metal terminal is a first metal terminal exposed to the outside of the insulating base while being electrically connected to the conductor pattern;
A cylindrical projection having a cylindrical protrusion for rotatably mounting the rotating body is provided integrally with a current collector plate that is attached to the insulating base by insert molding, and is exposed to the outside of the insulating base and is interposed through the rotating body. 3. The structure for mounting a rotary electronic component to a mounting board according to claim 1, wherein the second metal terminal is electrically connected to the conductor pattern.   The other member attached on the insulating base is a flexible circuit board, the conductor pattern is provided on the flexible circuit board, and at least a part of the current collecting plate is formed on the flexible circuit board. 4. The structure for mounting a rotary electronic component to a mounting board according to claim 3, wherein the structure is installed so as to abut on a surface on which the conductive pattern is not provided.   5. The flexible circuit board is sandwiched between a current collector plate and a rotating body at a portion where the rotating body is rotatably attached to a cylindrical protrusion of the current collector plate. A structure for mounting the rotary electronic component described in the above to a mounting board.   4. The rotation according to claim 1, wherein the other member mounted on the insulating base is a flexible circuit board, and the conductor pattern is provided on the flexible circuit board. Structure for mounting electronic components on mounting boards.   7. The structure for mounting a rotary electronic component to a mounting board according to claim 6, wherein the flexible circuit board is insert-molded on the insulating base. The rotary electronic component is attached to the mounting surface of the mounting substrate such that the surface on which the rotating body is attached faces the mounting substrate,
8. The rotary electronic component according to claim 1, wherein an adjustment portion of the rotating body rotated by an adjustment jig is exposed to an opening of the mounting board. 9. Mounting structure to mounting board.   9. The structure for mounting a rotary electronic component to a mounting board according to claim 8, wherein at least a part of the rotating body of the rotary electronic component is inserted into an opening of the mounting board.   2. The structure for mounting a rotary electronic component to a mounting board according to claim 1, wherein at least a part of the insulating base of the rotary electronic component is inserted into an opening of the mounting board.

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