JP2006319141A - Rotary electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a rotary electronic component which can easily reduce welding of a material of a rotating body and a current collecting plate for mounting the rotating body to freely rotate, even when such material is welded even under a lower temperature due to mutual property. <P>SOLUTION: A resistor pattern 25 is exposed when it is provided via a flexible circuit board 20 on an insulated basic plate 10, and the current collecting plate 40 including a cylindrical projection 42 in its insulated basic plate 10 is mounted in the manner that the cylindrical projection 42 is projected toward the exposed surface side of the resistor pattern 25 at the center of the resistor pattern 25. Moreover, a rotating body 80 is mounted to freely rotate to the cylindrical projection 42 to realize that a sliding contact 85 provided to the rotating body 80 is caused to slide on the resistor pattern 25. The rotating body 80 is mounted to freely rotate under the condition that the flexible circuit board 20 is held with the cylindrical projection 42 of the current collecting plate 40. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a rotary electronic component used for a semi-fixed variable resistor or the like.

  Conventionally, as a chip-type semi-fixed variable resistor, an insulating base made of molded resin, a slider, and a current collector plate are provided, and the current collector plate is insert-molded in the insulating base, A slider, which is a rotating body, is arranged on the top surface. At that time, the cylindrical projection provided on the current collector plate is inserted into the opening provided on the slider, and the tip of the cylindrical projection is caulked to place the slider. There is one configured to be rotatably fixed on an insulating base (for example, Patent Document 1). Then, by rotating the slider, the sliding contact provided on the slider slides on the surface of the horseshoe-shaped resistor pattern provided on the insulating base, thereby providing the both ends of the resistor pattern. The resistance value between the terminal pattern and the current collector plate was changed.

  By the way, if the resistor pattern is, for example, a carbon pattern (a carbon paste obtained by kneading carbon powder in a urethane-based or phenol-based resin material dissolved in a solvent and screen-baked), the carbon pattern is soft. It is difficult to use stainless steel having a strong elastic force (high sliding pressure) as a material for the sliding contact with this because the carbon pattern is scraped. For this reason, it was necessary to use a soft material having a low elastic force, for example, a white-made slider. If a white and white slider is used, its sliding pressure is small relative to the carbon pattern, and therefore the carbon pattern is not scraped. On the other hand, the current collector plate is made of, for example, an iron plate (steel plate), and is usually plated with tin or the like for soldering to the substrate in a later step. The semi-fixed variable resistor is placed on the main board and reflowed, whereby the current collecting plate is soldered onto the terminal connection pattern on the main board. At this time, the current collector plate and the like are heated at a temperature (for example, 245 ° C.) equal to or higher than the melting temperature (232 ° C.) of the tin plating material.

However, the white constituting the slider has good weldability with the tin plating of the current collector plate, and the slider has a cylindrical shape by inserting the cylindrical protrusion of the current collector plate into the opening provided in the center thereof. Since they are fixed by crimping the tips of the protrusions, both (slider and current collector plate) are in direct contact. For this reason, the tin plating applied to the current collector plate and the slider are strongly welded by the heat at the time of the reflow, and this makes it impossible to rotate the slider after it is mounted on the main board. was there.
Japanese Examined Patent Publication No. 62-12642

  The present invention has been made in view of the above points, and its purpose is, for example, in the case where the material of the current collector plate to which the rotating body and the rotating body are rotatably attached is welded even at a low temperature due to their compatibility. Even if it exists, it is providing the rotary electronic component which can reduce or eliminate the welding easily.

  According to the first aspect of the present invention, a conductive pattern is provided on an insulating base directly or via another member, and a current collector plate having a cylindrical protrusion is provided on the insulating base. Is attached so that it protrudes toward the exposed surface side of the conductor pattern at the center portion of the conductor pattern, and a rotating member is rotatably attached to the cylindrical projection, and the sliding contact provided on the rotating member is In the rotary electronic component having a structure in sliding contact with the conductor pattern, the rotating body is rotatably attached in a state where a welding prevention member is sandwiched between the cylindrical protrusions of the current collector plate. There are in electronic parts.

  In the invention according to claim 2 of the present application, the welding prevention member is inserted between the outer peripheral side surface of the cylindrical projection of the current collector plate and the inner peripheral side surface of the opening of the rotating body into which the cylindrical projection is inserted. The rotary electronic component according to claim 1.

  According to a third aspect of the present invention, the other member is a circuit board attached to the insulating base, and the welding prevention member is the circuit board, and surrounds the cylindrical protrusion of the circuit board. 3. The rotary electronic component according to claim 1, wherein a peripheral portion is sandwiched between the rotating body and the current collector plate.

  According to a fourth aspect of the present invention, the welding preventing member is a sandwiched member inserted into the outer periphery of the cylindrical projection of the current collector plate, and the sandwiched member is sandwiched between the rotating body and the current collector plate. The rotary electronic component according to claim 1, wherein the rotary electronic component is provided.

  According to a fifth aspect of the present invention, the welding prevention member is the insulating base, and a sandwiched portion formed around the cylindrical projection of the insulating base is sandwiched between the rotating body and the current collector plate. The rotary electronic component according to claim 1, wherein the rotary electronic component is provided.

  According to the first aspect of the present invention, even when the materials of the rotating body and the current collector plate are welded even at a low temperature due to their compatibility, the welding can be easily reduced or eliminated.

  According to the second aspect of the present invention, the welding between the rotating body and the current collector plate can be reduced or eliminated more reliably.

  According to the invention described in claim 3, since the circuit board necessary for constituting the rotary electronic component is used as the welding prevention member, the number of components is not increased and the assembly process is not increased. The rotary electronic component according to the present invention can be configured easily and inexpensively.

  According to the fourth aspect of the present invention, since the sandwiched member such as a washer is used as the welding prevention member, the rotary electronic component according to the present invention can be easily obtained simply by inserting the sandwiched member into the cylindrical protrusion. Can be configured.

  According to the fifth aspect of the present invention, since the insulating base itself is used as the welding prevention member, the present invention is easily and inexpensively applied without increasing the number of parts and without increasing the assembly process. A rotary electronic component can be configured.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[First embodiment]
FIG. 1 is a view showing a rotary electronic component (hereinafter referred to as “rotary variable resistor”) 1-1 according to a first embodiment of the present invention, FIG. 1 (a) is a plan view, and FIG. 1 (b). FIG. 1A is a cross-sectional view taken along the line AA in FIG. 1A, and FIG. As shown in the figure, the rotary variable resistor 1-1 includes an insulating base 10 made of synthetic resin, a flexible circuit board 20 attached to the inside of the insulating base 10 by insert molding, and the inside of the insulating base 10. Current collector plate 40 having a second metal terminal 43 attached thereto and two metal terminals (hereinafter referred to as “first metal terminal”) 50, 50, and flexible circuit board 20 of insulating base 10. And a rotating body 80 that is rotatably installed on the side (lower surface side) on which is installed. In this embodiment, the integrated base 10, the flexible circuit board 20, the current collector plate 40, and the first metal terminals 50 and 50 are referred to as an electronic component board 60. Each component will be described below. In this embodiment, the flexible circuit board 20 is the “other member” as defined in claim 1, and the flexible circuit board 20 is also used as the “welding prevention member” as defined in claim 1.

  FIG. 2 is a view showing the electronic component substrate 60, FIG. 2 (a) is a plan view, FIG. 2 (b) is a sectional view taken on line BB of FIG. 2 (a), and FIG. It is. As shown in the figure, the insulating base 10 is a substantially rectangular and plate-shaped synthetic resin molded product. A concave rotating body housing portion 17 is provided on the lower surface, and a circular through hole 11 is provided in the center thereof. Yes. The insulating base 10 is made of a thermoplastic synthetic resin, such as nylon or polyphenylene sulfide (PPS).

  A portion of the flexible circuit board 20 that is covered with a terminal pattern 29, 29 (pressing portion 15 of the insulating base 10 of the terminal pattern 29) on a synthetic resin film (for example, a nylon film, a PPS film, or a polyimide film) is illustrated. And a conductor pattern (hereinafter referred to as “resistor pattern” in this embodiment) 25 on which the sliding contact 85 of the rotating body 80 described below is slidably contacted. In the center of the resistor pattern 25, a through hole 21 to be press-fitted into a cylindrical projection 42 of the current collector plate 40 described below is provided. In other words, the flexible circuit board 20 has an inner shape dimension (inner diameter dimension) substantially the same as the outer dimension (outer diameter dimension) of the cylindrical projection 42 of the current collector plate 40 described below of the synthetic resin film. A through hole 21 having a size and shape to be press-fitted is provided, a resistor pattern 25 is provided on the surface around the through hole 21 in a horseshoe shape, and terminal patterns 29 and 29 are connected to both ends of the resistor pattern 25, respectively. Provided. In this embodiment, the resistor pattern 25 is configured by printing and baking a carbon paste (one obtained by kneading carbon powder in a urethane-based or phenol-based resin material dissolved in a solvent). In this embodiment, the terminal patterns 29 and 29 are configured by printing and baking a silver paste (for example, a material in which silver powder is kneaded in a urethane-based or phenol-based resin material dissolved in a solvent). These patterns 25, 29, and 29 may be formed on the synthetic resin film by a transfer method (the same applies to the following embodiments).

  The current collector plate 40 is configured by providing a base 41 on one side of a flat and substantially rectangular metal plate and providing a metal terminal (hereinafter referred to as “second metal terminal”) 43 on the other side. The current collecting plate 40 is a metal plate (made of iron plate (steel plate) in this embodiment), and the entire surface thereof is coated with metal plating (tin plating in this embodiment, thickness 5 to 10 μm). I use it. The reason why the tin plating is applied is to facilitate welding by the solder 114 in the mounting process to the mounting substrate 110 shown in FIG. Here, the base 41 has a substantially circular shape (see FIG. 1A), and is configured such that a cylindrical protrusion 42 projects vertically from the center of the surface. On the other hand, in the vicinity of the other end portion of the metal plate, by providing a step portion 45 inclined obliquely from the flat plate surface of the base portion 41, it is parallel to the base portion 41 protruding from the flat plate surface of the base portion 41 toward the cylindrical protrusion 42. A flat plate-like second metal terminal 43 is provided. A surface on the lower surface side of the second metal terminal 43 serves as a connection surface 43a for connecting a connection pattern 113 of the mounting substrate 110 described below. The connection surface 43a is installed so as to be flush with the surface (the surface that contacts the mounting surface 112 of the mounting substrate 110 of the insulating base 10) facing the side on which the rotating body 80 of the insulating base 10 is attached. The step portion 45 is provided so as to be embedded in the insulating base 10, and a fixing portion 45 a that penetrates is provided in the step portion 45. Since the synthetic resin constituting the insulating base 10 enters the fixing portion 45a, the current collector plate 40 is reliably fixed in the insulating base 10. Further, by installing the stepped portion 45 inside the insulating base 10, at least a part of the connection surface 43a can be exposed so as to enter the inner side of the outer periphery of the surface of the insulating base 10, and accordingly the second portion. The protruding dimension of the metal terminal 43 protruding outward from the insulating base 10 can be shortened, and the rotary variable resistor 1-1 can be miniaturized. In this embodiment, the surface of the current collector plate 40 that protrudes from the cylindrical protrusion 42 is disposed so as to contact the surface of the flexible circuit board 20 on which the conductor pattern 25 is not provided. If comprised in this way, the thickness of the insulation base 10 formed in the part a1 of the opposite surface side which contact | abuts the flexible circuit board 20 of the current collection board 40 can be thickened, and the intensity | strength can be strengthened. In particular, as in this embodiment, when the thickness of the insulating base 10 is reduced by providing the rotating body storage portion 17, the effect is great.

  The first metal terminal 50 is constituted by a flat and substantially rectangular metal plate, one end side of which is connected to the terminal pattern 29, and the other end side protrudes outside the insulating base 10. This is a mounting board connecting portion 53. Similarly to the current collector plate 40, the first metal terminal 50 is also obtained by plating the entire surface of a metal plate (in this embodiment, an iron plate (steel plate)) (tin plating in this embodiment, thickness 5 to 10 μm). Yes. The surface of the terminal pattern connection portion 51 and the mounting substrate connection portion 53 are parallel, and a step portion 30 that is perpendicular to the flat surface of the terminal pattern connection portion 51 is provided between them. A surface on the lower surface side of the mounting board connecting portion 53 is a connection surface 53a for connecting a connection pattern 113 of the mounting board 110 described below. The connection surface 53a is installed so as to be flush with the surface of the insulating base 10 that faces the side on which the rotating body 80 is attached (the surface that contacts the mounting surface 112 of the mounting substrate 110 of the insulating base 10). The step portion 30 is provided so as to be embedded in the insulating base 10. In addition, by installing the stepped portion 30 inside the insulating base 10, at least a part of the connection surface 53a can be exposed so as to enter the inside of the outer periphery of the surface of the insulating base 10, and accordingly the first The protruding dimension of the metal terminal 50 protruding outward from the insulating base 10 can be shortened, and the rotary variable resistor 1-1 can be downsized.

  Returning to FIG. 1, the rotating body 80 is constituted by a single elastic metal plate (in this embodiment, a white and white plate), and an arc-shaped arm 83 is attached to the outer periphery of a mortar-shaped base 81. Is provided with a sliding contact 85 that is bent so as to protrude in the direction of the flexible circuit board 20 and is connected to a lower surface of the base 81 by a connecting portion 87 provided on a part of the outer periphery of the base 81 (described below). A portion rotated by an adjustment jig (hereinafter referred to as an “adjustment plate”) 89 is configured to overlap the lower surface of the base 81 by folding back the connecting portion 87. A circular opening 91 into which the cylindrical protrusion 42 of the current collector plate 40 is inserted is provided at the center of the base 81, and an adjustment jig made of a plus driver (or minus driver) is inserted into the adjustment plate 89. An adjustment groove 93 having a shape (may be another shape) is provided.

  A method of manufacturing the electronic component substrate 60 will be described. As shown in FIG. 4, the cylindrical protrusions 42 of the current collector plate 40 are press-fitted into the through-holes 21 of the flexible circuit board 20 in advance, and both are laminated. Accordingly, at this time, the peripheral portion of the cylindrical protrusion 42 is surrounded by the flexible circuit board 20. Then, the flexible circuit board 20 and the current collector plate 40 and the first metal terminals 50 and 50 are inserted into the molds 101 and 105. At this time, a cavity C1 having the same shape as that of the insulating base 10 is formed in the molds 101 and 105, but the flexible circuit board 20 has a surface on the side where the resistor pattern 25 is formed on the mold of the cavity C1. Abutting on the inner plane C11 (upper surface of the convex portion 103) on the mold 101 side, and simultaneously abutting the terminal pattern connection portions 51, 51 of the first metal terminals 50, 50 on the terminal patterns 29, 29 of the flexible circuit board 20, At the same time, the portion of the base 41 of the current collector plate 40, the portion of the second metal terminal 43 projecting out of the cavity C1, and the portion of the first metal terminals 50, 50 projecting out of the cavity C1. A part on the mounting board connecting portion 53 side is held between the molds 101 and 105. Note that the lower surfaces of the terminal pattern connection portions 51 and 51 where the terminal patterns 29 and 29 are in contact with the terminal pattern connection portions 51 and 51 are supported by the support protrusions 109 (the openings shown in FIG. 19 is formed). The portion of the base 41 is sandwiched between convex portions 103 and 107 (which form the through hole 11 of the insulating base 10 and the rotating body storage portion 17) provided on the molds 101 and 105.

  Then, a thermoplastic synthetic resin (nylon, PPS, etc.) heated and melted is injected into the cavity C1 from the resin injection port G1 provided in the mold 105 to fill the cavity C1. The flexible circuit board 20 is cooled and solidified while being pressed against the inner plane C11 and the terminal pattern connecting portions 51 and 51 of the first metal terminals 50 and 50 by the press-fitting pressure. When the molds 101 and 105 are removed, the electronic component substrate 60 shown in FIG. 2 is completed. At this time, the connection surface 43a of the second metal terminal 43 of the current collector plate 40 and the connection surfaces 53a and 53a of the first metal terminals 50 and 50 are flush with each other (that is, the second metal terminal 43 and the first metal). The terminals 50 and 50 are on the same surface), and these surfaces are exactly the same as the surface on the side of the insulating base 10 on which the rotating body 80 is mounted (the surface contacting the mounting surface 112 of the mounting substrate 110 of the insulating base 10). It matches. When the second metal terminal 43 of the current collector plate 40 and the first metal terminals 50 and 50 are accommodated in the molds 101 and 105, the second metal is accurately placed on the surface of the mold 101. This is because the connection surface 43a of the terminal 43 and the connection surfaces 53a and 53a of the first metal terminals 50 and 50 can be brought into close contact with each other. Further, the terminal pattern connection portions 51 and 51 of the insulating base 10 are insulated on the lower surface side (the surface side to which a rotating body 80 to be described later is attached) while the terminal pattern connection portions 51 and 51 are pressed against the terminal patterns 29 and 29. A presser portion 15 for fixing to the base 10 is provided. The pressing portion 15 protrudes toward the rotating body 80 from the surface of the insulating base 10 to which the rotating body 80 is attached, and protrudes from a tip surface 80a of the rotating body 80 described below.

  Then, as shown in FIG. 1, the rotating body 80 is stored in the rotating body storing portion 17 and placed on the surface of the flexible circuit board 20, and the current collector plate 40 is placed in the opening 91 provided in the rotating body 80 at that time. When the cylindrical protrusion 42 is rotatably inserted and the tip side (lower end side) of the cylindrical protrusion 42 is caulked, the rotary electronic component 1-1 is completed. At this time, the sliding contact 85 of the rotating body 80 is in elastic contact with the resistor pattern 25 of the flexible circuit board 20. At this time, the peripheral portion surrounding the cylindrical protrusion 42 of the flexible circuit board 20 is sandwiched between the rotating body 80 (its base portion 81) and the current collector plate 40 (its base portion 41). The rotating body 80 is housed in the rotating body housing portion 17, and the distal end surface 80 a of the rotating body 80 is positioned above the surface around the rotating body housing portion 17 of the insulating base 10 (inside the rotating body housing portion 17). Therefore, the rotating body 80 can be protected from the outside.

  FIG. 3 is a cross-sectional view illustrating a structure for attaching the rotary variable resistor 1-1 configured as described above to the mounting surface 112 of the mounting substrate 110. FIG. As shown in the figure, the mounting board 110 has an outer diameter dimension (most of the insulating base 10 at a position facing the insulating base 10 and the rotating body 80 of the rotary variable resistor 1-1 attached to the mounting board 110. A circular (not necessarily circular) opening (adjustment hole) 111 having an inner diameter smaller than the outer diameter of the long portion is provided, and the first metal is provided on the mounting surface 112 around the opening 111. Connection patterns 113 that face the terminals 50 and 50 and the second metal terminal 43 are provided.

  The rotary variable resistor 1-1 is placed with the surface on which the rotating body 80 is attached facing the mounting surface 112 of the mounting substrate 110. At this time, the rotating body 80 is exposed to the opening 111, and at the same time, One metal terminal 50, 50 and the second metal terminal 43 are brought into contact with the connection pattern 113 via the solder 114, and the solder 114 is melted and solidified by reflow or the like to electrically and mechanically connect the two. And attach. At this time, the surface on the mounting board 110 side of the rotary variable resistor 1-1 is in close contact with the mounting surface 112 of the mounting board 110. By the way, the reflow temperature at this time is a temperature at which the solder 114 is melted (for example, a temperature at which the peak temperature is 245 ° C.), which is a temperature at which the tin plating applied to the current collector plate 40 is melted. As explained in the technical section, if the opposed surfaces of the base 81 of the rotary body 80 made of white and the base 41 of the tin-plated current collector plate 40 are in direct contact with each other, the two will be welded together. . However, in this embodiment, as described above, it is flexible as a welding prevention member between the rotating body 80 (the base 81) and the current collector plate 40 (the base 41) (between the base 81 and the opposing surface of the base 41). Since the circuit board 20 is sandwiched, it is possible to prevent welding between the opposing surfaces of the base 81 and the base 41 due to the tin plating. That is, in the present embodiment, the rotating body 80 is rotatably attached to the cylindrical protrusion 42 of the current collector plate 40 in a state where the flexible circuit board 20 is sandwiched (intervened). 2 is sandwiched between the rotating body 80 (its base portion 81) and the current collector plate 40 (its base portion 41), and the rotating body 80 and the current collector plate 40 are fixed by plating. Can be prevented. In addition, the outer peripheral side surface of the cylindrical protrusion 42 and the inner peripheral side surface of the opening 91 of the rotating body 80 that is rotatably attached to the cylindrical protrusion 42 are in contact with each other. -Although conduction is ensured, at the same time, this portion is fixed by the plating during the heating. However, since the area to be fixed is small (the thickness of the metal plate constituting the rotating body 80 is actually considerably thinner than the illustrated thickness), the fixing is easily broken when the rotating body 80 is rotated. Does not occur.

  Then, the tip of an adjustment jig (not shown) (for example, a plus or minus driver) is inserted into the opening 111 from the surface opposite to the mounting surface 112 of the mounting substrate 110 and engaged with the adjustment groove 93 of the adjustment plate 89. When the rotating body 80 is rotated, the sliding contact 85 provided on the rotating body 80 slides on the resistor pattern 25 (see FIG. 2C) to contact the first metal terminals 50 and 50 and the second metal. The resistance value between the terminals 43 changes.

  As described above, in this embodiment, as in the invention described in claim 1, the resistor pattern 25 is exposed on the insulating base 10 via the flexible circuit board 20, which is another member, A current collector plate 40 having a cylindrical protrusion 42 is attached to the insulating base 10 so that the cylindrical protrusion 42 protrudes toward the exposed surface side of the resistor pattern 25 at the central portion of the resistor pattern 25, and In the rotary electronic component 1-1 having a structure in which a rotating body 80 is rotatably attached to the cylindrical protrusion 42 and a sliding contact 85 provided on the rotating body 80 is in sliding contact with the resistor pattern 25, the rotating body A configuration 80 is disclosed in which the flexible circuit board 20 as a welding prevention member is rotatably attached to the cylindrical protrusion 42 of the current collector plate 40. Further, in this embodiment, as in the invention described in claim 3, the other member is a flexible circuit board 20 attached to the insulating base 10, and the welding prevention member is the flexible circuit board 20. There is disclosed a configuration in which a peripheral portion a2 surrounding the cylindrical protrusion 42 of the flexible circuit board 20 is sandwiched between the rotating body 80 and the current collector plate 40.

[Second Embodiment]
FIG. 5 is a view showing a rotary electronic component (hereinafter referred to as “rotary variable resistor”) 1-2 according to the second embodiment of the present invention, FIG. 5 (a) is a plan view, and FIG. 5 (b). FIG. 5A is a cross-sectional view taken along the line CC of FIG. 5A, and FIG. In the rotary variable resistor 1-2 shown in the figure, the same or corresponding parts as those of the rotary variable resistor 1-1 according to the first embodiment are denoted by the same reference numerals. Note that matters other than those described below are the same as those in the first embodiment. Similarly to the first embodiment, the rotary variable resistor 1-2 shown in the figure also has an insulating base 10 made of synthetic resin, a flexible circuit board 20 attached to the inside of the insulating base 10 by insert molding, and an insulating base 10. A current collector plate 40 having a second metal terminal 43 attached to the inside of the base 10 by insert molding, two metal terminals (hereinafter referred to as “first metal terminals”) 50 and 50, and the insulating base 10 And a rotating body 80 that is rotatably installed on the side (upper surface side) on which the flexible circuit board 20 is installed. In this embodiment as well, a substrate in which the insulating base 10, the flexible circuit board 20, the current collector plate 40, and the first metal terminals 50 and 50 are integrated is referred to as an electronic component board 60. That is, in this embodiment, the main difference from the first embodiment is that the rotary variable resistor 1-1 is a back surface adjustment type in which the resistance value is adjusted from the back surface side (lower surface side). The rotary variable resistor 1-2 is a normal front adjustment type in which the resistance value is adjusted from the front side (upper surface side). Each component will be described below.

  6A and 6B are diagrams showing the electronic component substrate 60, in which FIG. 6A is a plan view and FIG. 6B is a sectional view taken along the line DD in FIG. 6A. As shown in the figure, the insulating base 10 is a synthetic resin molded product having a substantially rectangular shape and a plate shape, and a concave rotating body storage portion 17 is provided on the upper surface, and a circular through hole 11 is provided in the center thereof. Yes. The material of the insulating base 10 is the same as that of the first embodiment.

  The flexible circuit board 20 has terminal patterns 29 and 29 on the synthetic resin film (the material is the same as in the first embodiment) (the portion of the terminal pattern 29 covered by the pressing portion 15 of the insulating base 10 is not shown). And a conductor pattern (hereinafter referred to as “resistor pattern” in this embodiment) 25 in which a sliding contact 85 of the rotating body 80 described below is in sliding contact with the surface. In the center of the resistor pattern 25, a through hole 21 to be press-fitted into the cylindrical protrusion 42 of the current collector plate 40 is provided. In other words, the flexible circuit board 20 has an inner shape dimension (inner diameter dimension) substantially the same as the outer dimension (outer diameter dimension) of the cylindrical projection 42 of the current collector plate 40 described below of the synthetic resin film. A through hole 21 having a size and shape to be press-fitted is provided, a resistor pattern 25 is provided on the surface around the through hole 21 in a horseshoe shape, and terminal patterns 29 and 29 are connected to both ends of the resistor pattern 25, respectively. Provided. The formation method and material of the resistor pattern 25 and the terminal patterns 29 and 29 are the same as those in the first embodiment.

  The current collector plate 40 is configured by providing a base 41 on one side of a flat and substantially rectangular metal plate and providing a metal terminal (hereinafter referred to as “second metal terminal”) 43 on the other side. The current collecting plate 40 is a metal plate (made of iron plate (steel plate) in this embodiment), and the entire surface thereof is coated with metal plating (tin plating in this embodiment, thickness 5 to 10 μm). I use it. The base 41 is substantially circular and is configured to project a cylindrical protrusion 42 perpendicularly from the center of the surface. On the other hand, in the vicinity of the other end of the metal plate, a step portion inclined obliquely from the flat plate surface of the base 41. By providing 45, a flat plate-like second metal terminal 43 that is parallel to the base 41 is provided. A surface on the lower surface side of the second metal terminal 43 serves as a connection surface 43a for connecting a connection pattern 113 of the mounting substrate 110 described below. The connection surface 43a is installed so as to be flush with the surface facing the opposite side of the insulating base 10 to which the rotating body 80 is attached (the surface contacting the mounting surface 112 of the mounting substrate 110 of the insulating base 10). The step portion 45 is provided so as to be embedded in the insulating base 10, and a fixing portion 45 a that penetrates is provided in the step portion 45. In this embodiment, the surface of the current collector plate 40 that protrudes from the cylindrical protrusion 42 is disposed so as to contact the surface of the flexible circuit board 20 on which the resistor pattern 25 is not provided.

  The first metal terminal 50 is constituted by a flat and substantially rectangular metal plate, one end side of which is connected to the terminal pattern 29, and the other end side protrudes outside the insulating base 10. This is a mounting board connecting portion 53. Similarly to the current collector plate 40, the first metal terminal 50 is also obtained by plating the entire surface of a metal plate (in this embodiment, an iron plate (steel plate)) (tin plating in this embodiment, thickness 5 to 10 μm). Yes. The surface of the terminal pattern connection portion 51 and the mounting substrate connection portion 53 are parallel, and a step portion 30 that is perpendicular to the flat surface of the terminal pattern connection portion 51 is provided between them. A surface on the lower surface side of the mounting board connecting portion 53 is a connection surface 53a for connecting a connection pattern 113 of the mounting board 110 described below. The connection surface 53a is installed so as to be flush with the surface facing the opposite side of the insulating base 10 to which the rotating body 80 is attached (the surface contacting the mounting surface 112 of the mounting substrate 110 of the insulating base 10). Yes.

  In addition, the structure and structure of the rotary body 80 are the same as the rotary body 80 of 1st embodiment. The manufacturing method of the electronic component substrate 60 is the same as that of the first embodiment. That is, the cylindrical protrusion 42 of the current collector plate 40 is press-fitted into the through-hole 21 of the flexible circuit board 20 in advance and the two are laminated. Accordingly, at this time, the peripheral portion of the cylindrical protrusion 42 is surrounded by the flexible circuit board 20. Then, the flexible circuit board 20 and the current collector plate 40 and the first metal terminals 50 and 50 are inserted into a mold (not shown). At this time, a thermoplastic synthetic resin (nylon, PPS, etc.) heated and melted from a resin inlet provided in the mold is pressed into a cavity having the same shape as the insulating base 10 formed in the mold. When the cavity is filled and cooled and solidified, and the mold is removed, the electronic component substrate 60 shown in FIG. 6 is completed. At this time, as in the first embodiment, the connection surface 43a of the second metal terminal 43 of the current collector plate 40 and the connection surfaces 53a and 53a of the first metal terminals 50 and 50 are flush with each other (that is, the second surface). The metal terminals 43 and the first metal terminals 50, 50 are on the same surface), and these surfaces exactly coincide with the surface that contacts the mounting surface 112 of the mounting substrate 110 of the insulating base 10.

  Then, as shown in FIG. 5, the rotating body 80 is placed on the surface of the flexible circuit board 20, and the cylindrical protrusion 42 of the current collector plate 40 is rotatably inserted into the opening 91 provided in the rotating body 80 at that time. Then, if the front end side (upper end side) of the cylindrical protrusion 42 is caulked, the rotary electronic component 1-2 is completed. At this time, the sliding contact 85 of the rotating body 80 is in elastic contact with the resistor pattern 25 of the flexible circuit board 20. At this time, the peripheral portion surrounding the cylindrical protrusion 42 of the flexible circuit board 20 is sandwiched between the rotating body 80 (its base portion 81) and the current collector plate 40 (its base portion 41).

  FIG. 7 is a cross-sectional view showing a structure for attaching the rotary variable resistor 1-2 configured as described above to the mounting surface 112 of the mounting substrate 110. FIG. As shown in the figure, a connection pattern 113 is provided on the mounting surface 112 of the mounting substrate 110 so as to face the first metal terminals 50 and 50 and the second metal terminal 43, respectively. Then, the rotary variable resistor 1-2 is placed on the mounting surface 112 of the mounting substrate 110. At that time, the first metal terminals 50 and 50 and the second metal terminal 43 are respectively connected to the connection pattern 113 with the solder 114. The solder 114 is melted and solidified by reflow or the like, and both are electrically and mechanically connected and attached. The reflow temperature at this time is a temperature at which the solder 114 is melted (for example, a temperature at which the peak temperature is 245 ° C.). This temperature is a temperature at which the tin plating of the current collector plate 40 is melted. As explained, when the opposed surfaces of the base 81 of the rotary body 80 made of white and the base 41 of the tin-plated current collector plate 40 are in direct contact, both are welded. However, in this embodiment, as in the first embodiment, welding is performed between the rotating body 80 (its base portion 81) and the current collector plate 40 (its base portion 41) (between the base portion 81 and the opposing surface of the base portion 41). Since the flexible circuit board 20 is sandwiched as a preventing member, it is possible to prevent welding between the opposing surfaces of the base 81 and the base 41 due to the tin plating. That is, in the present embodiment, the rotating body 80 is rotatably attached to the cylindrical protrusion 42 of the current collector plate 40 in a state where the flexible circuit board 20 is sandwiched (intervened). A surrounding portion (a2 portion in FIG. 6) surrounding the rotating body 80 is sandwiched between the rotating body 80 (its base portion 81) and the current collector plate 40 (its base portion 41), and the rotating body 80 and the current collector plate 40 are fixed by plating. Can be prevented. In addition, the outer peripheral side surface of the cylindrical protrusion 42 and the inner peripheral side surface of the opening 91 of the rotating body 80 rotatably attached to the cylindrical protrusion 42 are in contact with each other, and electrical connection between the rotating body 80 and the current collector plate 40 is performed at this portion. -Although conduction is ensured, at the same time, this portion is also fixed by the plating during the heating. However, since the area to be fixed is small (the thickness of the metal plate constituting the rotating body 80 is actually considerably thinner than the illustrated thickness), the fixing is easily broken when the rotating body 80 is rotated. Does not occur.

  Then, when the rotating body 80 is rotated by engaging the tip of an adjusting jig (not shown) (for example, a plus or minus driver) with the adjusting groove 93 of the adjusting plate 89, the sliding contact 85 provided on the rotating body 80 becomes a resistor. The resistance value between the first metal terminals 50 and 50 and the second metal terminal 43 changes in sliding contact with the pattern 25 (see FIG. 6A).

[Third embodiment]
FIG. 8 is a sectional view showing a rotary electronic component (hereinafter referred to as “rotary variable resistor”) 1-3 according to the third embodiment of the present invention, and FIG. 9 is a sectional view of the electronic component substrate 60. In the rotary variable resistor 1-3 shown in the figure, the same or corresponding parts as those of the rotary variable resistor 1-1 according to the first embodiment are denoted by the same reference numerals. Note that matters other than those described below are the same as those in the first embodiment. Similarly to the first embodiment, the rotary variable resistor 1-3 shown in the same figure is insulated by an insulating base 10 made of synthetic resin, a flexible circuit board 20 attached to the inside of the insulating base 10 by insert molding, and insulation. A current collector plate 40 having a second metal terminal 43 attached to the inside of the base 10 by insert molding, two metal terminals (hereinafter referred to as “first metal terminals”) 50 and 50, and the insulating base 10 And a rotating body 80 rotatably installed on the side (lower surface side) on which the flexible circuit board 20 is installed. In this embodiment, the integrated base 10, the flexible circuit board 20, the current collector plate 40, and the first metal terminals 50 and 50 are referred to as an electronic component board 60. Also in this embodiment, the flexible circuit board 20 is the “other member” as defined in claim 1, and the flexible circuit board 20 is also used as the “welding prevention member” as defined in claim 1.

  The configuration of this embodiment is different from the configuration of the first embodiment in that the portion of the through hole 21 of the flexible circuit board 20 is along the outer peripheral side surface of the cylindrical projection 42 and on the tip side of the cylindrical projection 42. The side wall portion 21a formed in a cylindrical shape so as to face is provided, and the inner peripheral side surface of the opening 91 of the rotating body 80 is rotatably fitted to the outer periphery of the side wall portion 21a.

  Then, when this rotary variable resistor 1-3 is placed facing the mounting surface of the mounting board (not shown) as in the first embodiment and reflowed, the reflow temperature is the temperature at which the tin plating of the current collector plate 40 melts. When the opposed surface of the base 81 of the rotary body 80 made of white and white and the base 41 of the tin-plated current collector plate 40 are in direct contact with each other, they are welded together. As described above, the flexible circuit board 20 is sandwiched between the rotating body 80 (the base portion 81) and the current collector plate 40 (the base portion 41) (between the base portion 81 and the opposing surface of the base portion 41) as a welding prevention member. Therefore, it can prevent welding between the opposing surfaces of the base 81 and the base 41 by the said tin plating. That is, in the present embodiment, the rotating body 80 is rotatably attached to the cylindrical protrusion 42 of the current collector plate 40 in a state where the flexible circuit board 20 is sandwiched (intervened). The surrounding portion surrounding the rotating body 80 is sandwiched between the rotating body 80 (the base portion 81) and the current collector plate 40 (the base portion 41), and the rotating body 80 and the current collecting plate 40 can be prevented from being fixed by plating. Furthermore, in this embodiment, the flexible circuit board 20 (the side wall thereof) which is a welding prevention member is also provided between the outer peripheral side surface of the cylindrical protrusion 42 and the inner peripheral side surface of the opening 91 of the rotating body 80 rotatably attached to the cylindrical projection 42. Since the portion 21a) is interposed, it is possible to prevent welding between the two in this portion. In this case, electrical conduction between the rotating body 80 and the current collector plate 40 is performed by bringing the crimped tip portion of the cylindrical protrusion 42 into contact with the inner wall surface of the base 81 of the rotating body 80. This contact portion is also fixed by the plating during the heating, but since the fixed area is small, the fixing is easily broken when the rotating body 80 is rotated, and no problem occurs.

  In this embodiment, the side wall portion 21a of the flexible circuit board 20 is interposed as an adhesion preventing member interposed between the outer peripheral side surface of the cylindrical protrusion 42 and the inner peripheral side surface of the opening 91 of the rotating body 80. Instead, for example, the inner peripheral portion of the washer 200 of the fourth embodiment described below may be formed in a cylindrical shape so as to protrude in the protruding direction of the cylindrical protrusion 42, or the fifth embodiment described below. The inner peripheral portion of the sandwiched portion 18 provided on the insulating base 10 may be formed in a cylindrical shape so as to protrude toward the protruding direction of the cylindrical protrusion 42.

  As described above, in this embodiment, the invention according to claim 1 and claim 3 which is the same as that of the first embodiment is disclosed. In addition, a configuration is disclosed in which it is inserted between the outer peripheral side surface of the cylindrical projection 42 of the current collector plate 40 and the inner peripheral side surface of the opening 91 of the rotating body 80 into which the cylindrical projection 42 is inserted.

[Fourth embodiment]
FIG. 10 is a cross-sectional view showing a rotary electronic component (hereinafter referred to as “rotary variable resistor”) 1-4 according to the fourth embodiment of the present invention. In the rotary variable resistor 1-4 shown in the figure, the same or corresponding parts as those of the rotary variable resistor 1-1 according to the first embodiment are denoted by the same reference numerals. Note that matters other than those described below are the same as those in the first embodiment. Similarly to the first embodiment, the rotary variable resistor 1-4 shown in the figure also has an insulating base 10 made of synthetic resin, a flexible circuit board 20 attached to the inside of the insulating base 10 by insert molding, and an insulating base 10. A current collector plate 40 having a second metal terminal 43 attached to the inside of the base 10 by insert molding, two metal terminals (hereinafter referred to as “first metal terminals”) 50 and 50, and the insulating base 10 And a rotating body 80 rotatably installed on the side (lower surface side) on which the flexible circuit board 20 is installed. In this embodiment as well, a substrate in which the insulating base 10, the flexible circuit board 20, the current collector plate 40, and the first metal terminals 50 and 50 are integrated is referred to as an electronic component board 60. In this embodiment, the flexible circuit board 20 is the “other member” as defined in claim 1, and the sandwiched member 200 (hereinafter referred to as “washer” in this embodiment) 200 is the “welding” according to claim 1. Prevention member ".

  The configuration of this embodiment is different from the configuration of the first embodiment in that the inner diameter dimension of the through hole 21 of the flexible circuit board 20 is set to a predetermined dimension (the washer 200 described below is larger than the outer diameter dimension of the cylindrical protrusion 42). (A dimension that can be inserted between them), a point formed large, a point where the base 41 of the current collector plate 40 is placed in the insulating base 10 a little away from the surface of the flexible circuit board 20, and a rotating body 80 (the base 81). The washer 200 is sandwiched between the current collector plate 40 (its base portion 41) (between the base portion 81 and the opposing surface of the base portion 41) as a welding prevention member. In this embodiment, the base 41 of the current collector plate 40 may be configured to contact the surface of the flexible circuit board 20 as in the first embodiment.

  The washer 200 is formed by forming a molded resin plate into a flat ring shape, and is interposed between the rotating body 80 (the base portion 81) and the current collector plate 40 (the base portion 41). 81 and the base 41) are prevented from being in direct surface contact. An opening 201 is provided at the center of the washer 200, and the inner diameter of the opening 201 is formed substantially the same as the outer dimension of the cylindrical protrusion 42. In this embodiment, the washer 200 is made of molded resin. However, the washer 200 may be formed of various other materials such as synthetic resin film, metal, and ceramic. For example, nylon or PPS is used as the molding resin or synthetic resin film, and stainless steel is used as the metal. Stainless steel has poor wettability with plating of tin or the like under normal conditions, and is difficult to be welded by heating the tin plating at the reflow temperature. The shape of the washer 200 can be variously modified, and does not necessarily have to be a flat plate ring shape. Various shapes such as a C-shape, an E-shape, and a bar material bent into a C-shape, etc. Deformation is possible. In short, any shape and structure may be used as long as the member is sandwiched between the rotating body 80 and the current collector plate 40.

  Then, when this rotary variable resistor 1-4 is placed facing a mounting surface of a mounting board (not shown) and reflowed in the same manner as in the first embodiment, the reflow temperature melts the tin plating applied to the current collector plate 40. Because of the temperature, if the opposed surfaces of the base part 81 of the rotary body 80 made of white and the base part 41 of the tin-plated current collector plate 40 are in direct contact with each other, they will be welded, but in this embodiment As described above, the washer 200 is sandwiched between the rotating body 80 (the base portion 81) and the current collector plate 40 (the base portion 41) (between the base portion 81 and the opposing surface of the base portion 41) as a welding prevention member. Therefore, it can prevent welding between the opposing surfaces of the base 81 and the base 41 by the said tin plating. In addition, the outer peripheral side surface of the cylindrical protrusion 42 and the inner peripheral side surface of the opening 91 of the rotating body 80 rotatably attached to the cylindrical protrusion 42 are in contact with each other, and electrical connection between the rotating body 80 and the current collector plate 40 is performed at this portion. -Conductivity is ensured (if the washer 200 is made of metal, the washer 200 itself has conductivity), but at the same time, this portion is also fixed by the plating during the heating. However, as in the first embodiment, since the area to be fixed is small, the fixing is easily broken when the rotating body 80 is rotated, and no problem occurs.

  As described above, in this embodiment, in addition to the invention described in claim 1, as in the invention described in claim 4, the welding prevention member is formed of the cylindrical protrusion 42 of the current collector plate 40. A configuration is disclosed in which a sandwiched member (washer) 200 is inserted on the outer periphery, and the sandwiched member is sandwiched between the rotating body 80 and the current collector plate 40.

[Fifth embodiment]
FIG. 11 is a cross-sectional view showing a rotary electronic component (hereinafter referred to as “rotary variable resistor”) 1-5 according to a fifth embodiment of the present invention. In the rotary variable resistor 1-5 shown in the figure, the same or corresponding parts as those of the rotary variable resistor 1-1 according to the first embodiment are denoted by the same reference numerals. Note that matters other than those described below are the same as those in the first embodiment. Similarly to the first embodiment, the rotary variable resistor 1-5 shown in the figure is insulated from an insulating base 10 made of synthetic resin, a flexible circuit board 20 attached to the inside of the insulating base 10 by insert molding, A current collector plate 40 having a second metal terminal 43 attached to the inside of the base 10 by insert molding, two metal terminals (hereinafter referred to as “first metal terminals”) 50 and 50, and the insulating base 10 And a rotating body 80 rotatably installed on the side (lower surface side) on which the flexible circuit board 20 is installed. In this embodiment as well, a substrate in which the insulating base 10, the flexible circuit board 20, the current collector plate 40, and the first metal terminals 50 and 50 are integrated is referred to as an electronic component board 60. In this embodiment, the flexible circuit board 20 is the “other member” in claim 1, and the sandwiched portion 18 provided on the insulating base 10 described below is the “welding prevention member” in claim 1. is there.

  The difference between the configuration of this embodiment and the configuration of the first embodiment is that the inner diameter dimension of the through hole 21 of the flexible circuit board 20 is formed larger than the outer diameter dimension of the cylindrical protrusion 42 by a predetermined dimension, Between the point where the base 41 of the current collector plate 40 is placed in the insulating base 10 a little away from the surface of the flexible circuit board 20, and between the rotating body 80 (its base 81) and the current collector 40 (its base 41). This is that the sandwiched portion 18 that is a part of the insulating base 10 is sandwiched between the base 81 and the facing surface of the base 41 as a welding prevention member. In this embodiment, as in the first embodiment, the base 41 of the current collector plate 40 may be in contact with the surface of the flexible circuit board 20.

  The sandwiched portion 18 is formed by a thin plate-like collar portion projecting inward from the inner periphery of the through hole 11 of the insulating base 10. A cylindrical protrusion insertion hole 18a into which the cylindrical protrusion 42 is inserted is provided at the center of the sandwiched portion 18. That is, the sandwiched portion 18 is made of the same molding resin as the insulating base 10. Note that the shape of the sandwiched portion 18 does not necessarily have to be a flat ring shape, and various modifications are possible. In short, the sandwiched portion may be sandwiched between the rotating body 80 and the current collector plate 40. Any shape and structure may be used.

  When the rotary variable resistor 1-5 is placed on the mounting surface of the mounting board (not shown) and reflowed in the same manner as in the first embodiment, the reflow temperature is the temperature at which the tin plating applied to the current collector plate 40 melts. Therefore, when the opposing surfaces of the base portion 81 of the white rotor 80 and the base portion 41 of the tin-plated current collector plate 40 are in direct contact with each other, they are welded together. As described above, the sandwiched portion 18 is sandwiched between the rotating body 80 (its base portion 81) and the current collector plate 40 (its base portion 41) (between the opposing surfaces of the base portion 81 and the base portion 41) as a welding prevention member. Therefore, it can prevent welding between the opposing surfaces of the base 81 and the base 41 by the said tin plating. In this embodiment, as in the first embodiment, the outer peripheral side surface of the cylindrical protrusion 42 is in contact with the inner peripheral side surface of the opening 91 of the rotating body 80 that is rotatably attached to the cylindrical projection 42. Electrical connection / conduction between the rotating body 80 and the current collector plate 40 is ensured. At the same time, this portion is fixed by the plating during the heating, but there is no problem as in the first embodiment.

  As described above, in this embodiment, the invention described in claim 1 is disclosed, and, as in the invention described in claim 5, the welding prevention member is the insulating base 10, and this insulation is provided. The structure by which the to-be-clamped part 18 formed in the circumference | surroundings of the cylindrical protrusion 42 of the base 10 is clamped between the rotary body 80 and the current collecting plate 40 is disclosed.

[Sixth embodiment]
FIG. 12 is a view showing a rotary electronic component (hereinafter referred to as “rotary variable resistor”) 1-6 according to a sixth embodiment of the present invention. FIG. 12 (a) is a plan view, and FIG. 12 (b). FIG. 12A is a cross-sectional view taken along line EE in FIG. In the rotary variable resistor 1-6 shown in the figure, the same or corresponding parts as those of the rotary variable resistor 1-1 according to the first embodiment are denoted by the same reference numerals. Note that matters other than those described below are the same as those in the first embodiment. The rotary variable resistor 1-6 includes an insulating base 10 made of a synthetic resin, a current collector plate 40 including two metal terminals 43 attached to the inside of the insulating base 10 by insert molding, and two metals. Terminals (hereinafter referred to as “first metal terminals”) 50 and 50 and the side (upper surface side) of the insulating base 10 on which the conductor pattern (hereinafter referred to as “resistor pattern”) 25 is formed are freely rotatable. And a rotating body 80 installed in the main body. In this embodiment, the insulating base 10, the current collector plate 40, and the first metal terminals 50 and 50 are integrated into an electronic component substrate 60. That is, in this embodiment, the main differences from the first embodiment are that the flexible circuit board 20 is not used, and that the rotary variable resistor 1-1 adjusts the resistance value from the back side (lower surface side). The rotary variable resistor 1-6 is a normal front adjustment type in which the resistance value is adjusted from the front side (upper surface side), whereas the rotary variable resistor 1-6 is a back side adjustment type. This is a point using the sandwiched member 200 as in the fourth embodiment. Each component will be described below.

  The insulating base 10 is a substantially rectangular plate-shaped synthetic resin molded product, and a circular through hole 11 is provided at the center thereof. The material of the insulating base 10 is the same as that of the first embodiment. And on the upper surface of the insulating base 10, terminal patterns 29 and 29, and a conductor pattern (hereinafter referred to as "resistor pattern" in this embodiment) 25 in which a sliding contact 85 of a rotating body 80 described below is slidably contacted on the surface, Is provided. In other words, the resistor pattern 25 surrounding the through hole 11 provided in the insulating base 10 in a horseshoe shape is provided on the upper surface itself, and terminal patterns 29 and 29 are connected to both ends of the resistor pattern 25, respectively. Yes. In this embodiment, the resistor pattern 25 is constituted by printing and baking a carbon paste (one obtained by kneading carbon powder in a resin material such as urethane or phenol dissolved in a solvent). In the embodiment, a silver paste (for example, a material obtained by kneading silver powder in a urethane-based or phenol-based resin material dissolved in a solvent) is printed and fired. These patterns 25, 29, 29 may be formed by a transfer method.

  The current collector plate 40 is configured by providing a base 41 on one side of a flat and substantially rectangular metal plate and providing a metal terminal (hereinafter referred to as “second metal terminal”) 43 on the other side. The current collector plate 40 is a metal plate (in this embodiment, made of iron plate (steel plate)), and the entire surface thereof is coated with metal plating (in this embodiment, tin plating, thickness 5 to 10 μm). is doing. The reason why the tin plating is performed is that soldering is easily performed in the subsequent mounting process on the mounting substrate. A cylindrical projection 42 projects vertically from the center of the surface of the base 41. On the other hand, in the vicinity of the other end of the metal plate, a flat plate parallel to the base 41 is provided by providing a step 45 that is inclined obliquely from the flat surface of the base 41 toward the opposite direction in which the cylindrical protrusion 42 protrudes. A second metal terminal 43 is provided. The surface on the lower surface side of the second metal terminal 43 serves as a connection surface 43a for connecting the connection pattern of the mounting board. The connection surface 43a is installed so as to be flush with the surface facing the opposite side of the insulating base 10 to which the rotating body 80 is attached.

  The first metal terminal 50 is constituted by a flat and substantially rectangular metal plate, one end side of which is connected to the terminal pattern 29, and the other end side protrudes outside the insulating base 10. This is a mounting board connecting portion 53. Similarly to the current collector plate 40, the first metal terminal 50 is also obtained by plating the entire surface of a metal plate (in this embodiment, an iron plate (steel plate)) (tin plating in this embodiment, thickness 5 to 10 μm). Yes. The surface of the terminal pattern connection portion 51 and the mounting substrate connection portion 53 are parallel, and a step portion 30 that is perpendicular to the flat surface of the terminal pattern connection portion 51 is provided between them. The surface of the terminal pattern connecting portion 51 is exposed on the surface of the insulating base 10, and the terminal pattern 29 is printed and formed on the exposed surface to electrically connect them. The surface on the lower surface side of the mounting substrate connecting portion 53 is a connection surface 53a for connecting the connection pattern of the mounting substrate. The connection surface 53a is installed so as to be flush with the surface facing the opposite side of the insulating base 10 to which the rotating body 80 is attached.

  In addition, the structure and structure of the rotary body 80 are the same as the rotary body 80 of 1st embodiment. Moreover, the manufacturing method of the board | substrate 60 for electronic components inserts the current collecting plate 40 and the 1st metal terminals 50 and 50 in the metal mold | die which is not shown in figure. Then, a thermoplastic synthetic resin (nylon, PPS, etc.) heated and melted from a resin inlet provided in the mold is pressed into a cavity having the same shape as the insulating base 10 formed in the mold. Fill the cavity, cool and solidify, and remove the mold. If the resistor pattern 25 and the terminal patterns 29 and 29 are formed on the surface of the molded insulating base 10 by printing and baking, the electronic component substrate 60 is completed.

  Next, a sandwiched member (hereinafter referred to as “washer” in this embodiment) 200 as a welding prevention member is inserted into the cylindrical protrusion 42 of the electronic component substrate 60. An opening 201 is provided at the center of the washer 200, and the inner diameter of the opening 201 is formed substantially the same as the outer dimension of the cylindrical protrusion 42. The washer 200 is formed by forming a molded resin plate into a flat ring shape, and is interposed between the rotating body 80 (the base portion 81) and the current collector plate 40 (the base portion 41). 81 and the base 41) are prevented from being in direct surface contact. As the material of the washer 200, a molded resin is used in this embodiment, but it may be formed of various other materials such as a synthetic resin film, metal, ceramic and the like as in the fourth embodiment. The shape of the washer 200 can be variously modified as in the fourth embodiment. In short, any shape can be used as long as it is a member to be sandwiched between the rotating body 80 and the current collector plate 40. -It may be of a structure.

  Next, the rotating body 80 is placed on the insulating base 10, and the cylindrical protrusion 42 of the current collector plate 40 is rotatably inserted into the opening 91 provided in the rotating body 80 at that time, and then the cylindrical protrusion 42. If the leading edge (upper edge) is crimped, the rotary electronic component 1-6 is completed. At this time, the sliding contact 85 of the rotating body 80 is in elastic contact with the resistor pattern 25 of the insulating base 10. At this time, the washer 200 is sandwiched between the rotating body 80 (its base portion 81) and the current collector plate 40 (its base portion 41).

  When the rotary variable resistor 1-6 is placed facing the mounting surface of the mounting board (not shown) as in the first embodiment and reflowed, the base 81 of the white rotating body 80 and the tin-plated collector are collected. When the surface facing the base 41 of the electric plate 40 is in direct contact, both are welded. In this embodiment, as described above, the rotating body 80 (its base 81) and the current collecting plate 40 ( Since the washer 200 is sandwiched between the base portion 41) (between the base portion 81 and the opposing surface of the base portion 41) as a welding prevention member, the opposing surfaces of the base portion 81 and the base portion 41 are welded by the tin plating. Can be prevented. In addition, the outer peripheral side surface of the cylindrical protrusion 42 and the inner peripheral side surface of the opening 91 of the rotating body 80 rotatably attached to the cylindrical protrusion 42 are in contact with each other, and electrical connection between the rotating body 80 and the current collector plate 40 is performed at this portion. Conduction is ensured (in addition, when the washer 200 is made of metal, the washer 200 itself has conductivity). At the same time, this portion is also fixed by the plating during the heating, but no problem occurs as in the first embodiment.

  Then, when the rotating body 80 is rotated by engaging the tip of the adjusting jig (not shown) with the adjusting groove 93 of the adjusting plate 89, the sliding contact 85 provided on the rotating body 80 slides on the resistor pattern 25. The resistance value between the first metal terminals 50 and 50 and the second metal terminal 43 changes.

  As described above, in this embodiment, as in the first aspect of the present invention, the resistor pattern 25 is directly exposed on the insulating base 10, and the cylindrical protrusion 42 is provided on the insulating base 10. The current collector plate 40 is attached so that the cylindrical protrusion 42 protrudes toward the exposed surface side of the resistor pattern 25 at the center portion of the resistor pattern 25, and the rotating body 80 is rotatably attached to the cylindrical protrusion 42. In the rotary electronic component 1-6 having a structure in which the sliding contact 85 provided on the rotary body 80 is slidably contacted with the resistor pattern 25, the rotary body 80 is attached to the cylindrical protrusion 42 of the current collector plate 40. A configuration is disclosed in which the washer 200 is attached so as to be rotatable. In this embodiment, as in the invention described in claim 4, the welding prevention member is a sandwiched member (washer) 200 inserted into the outer periphery of the cylindrical protrusion 42 of the current collector plate 40, and The structure by which the clamping member 200 is clamped between the rotary body 80 and the current collecting plate 40 is disclosed.

[Seventh embodiment]
FIG. 13 is a cross-sectional view showing a rotary electronic component (hereinafter referred to as “rotary variable resistor”) 1-7 according to a seventh embodiment of the present invention. In the rotary variable resistor 1-7 shown in the figure, the same or corresponding parts as those of the rotary variable resistors 1-1 and 1-6 according to the first and sixth embodiments are denoted by the same reference numerals. Items other than those described below are the same as those in the first and sixth embodiments. Similarly to the sixth embodiment, the rotary variable resistor 1-7 shown in the figure includes an insulating base 10 made of synthetic resin and a second metal terminal 43 attached to the inside of the insulating base 10 by insert molding. A current collector plate 40 and two metal terminals (hereinafter referred to as “first metal terminals”) 50 and 50 and a side (upper surface side) of the insulating base 10 on which the resistor pattern 25 is provided (upper surface side). And a rotating body 80 to be installed. In this embodiment, the insulating base 10, the current collector plate 40, and the first metal terminals 50 and 50 are integrated into an electronic component substrate 60. In this embodiment, the sandwiched portion 18 provided on the insulating base 10 described below is a “welding prevention member” in claim 1.

  The configuration of this embodiment is different from the configuration of the sixth embodiment in that the sandwiched member (washer) 200 is not used, but between the rotating body 80 (its base portion 81) and the current collector plate 40 (its base portion 41). This is that the sandwiched portion 18 that is a part of the insulating base 10 is sandwiched between the base 81 and the facing surface of the base 41 as a welding prevention member. The sandwiched portion 18 is formed by a thin plate-like collar portion projecting inward from the inner periphery of the through hole 11 of the insulating base 10. A cylindrical protrusion insertion hole 18a into which the cylindrical protrusion 42 is inserted is provided at the center of the sandwiched portion 18. That is, the sandwiched portion 18 is made of the same molding resin as the insulating base 10. It should be noted that the shape of the sandwiched portion 18 can be variously modified and does not necessarily have to be a flat ring shape. In short, the sandwiched portion may be sandwiched between the rotating body 80 and the current collector plate 40. Any shape and structure may be used.

  Then, when this rotary variable resistor 1-7 is placed on a mounting surface of a mounting board (not shown) and reflowed in the same manner as in the first embodiment, the base 81 of the rotary body 80 made of white and the tin-plated current collector If the surface facing the base 41 of the plate 40 is in direct contact with each other, they are welded together. In this embodiment, as described above, the rotating body 80 (its base 81) and the current collector plate 40 (its) Since the sandwiched portion 18 is sandwiched as a welding prevention member between the base portion 41) (between the base portion 81 and the opposing surface of the base portion 41), the opposing surfaces of the base portion 81 and the base portion 41 are welded by the tin plating. Can be prevented. In this embodiment, as in the first embodiment, the outer peripheral side surface of the cylindrical protrusion 42 is in contact with the inner peripheral side surface of the opening 91 of the rotating body 80 that is rotatably attached to the cylindrical projection 42. Electrical connection / conduction between the rotating body 80 and the current collector plate 40 is ensured. At the same time, this portion is fixed by the plating during the heating, but there is no problem as in the first embodiment.

  As described above, in this embodiment, the invention described in claim 1 is disclosed, and, as in the invention described in claim 5, the welding prevention member is the insulating base 10, and this insulation is provided. The structure by which the to-be-clamped part 18 formed in the circumference | surroundings of the cylindrical protrusion 42 of the base material 10 is clamped between the rotary body 80 and the current collecting plate 40 is disclosed.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea described in the claims and the specification and drawings. Is possible. It should be noted that any shape, structure, and material not directly described in the specification and drawings are within the scope of the technical idea of the present invention as long as the effects and advantages of the present invention are exhibited. For example, in each of the above embodiments, the resistor pattern is used as the conductor pattern, but other various patterns such as a switch pattern may be used. When the switch pattern is provided, the switch pattern and the terminal pattern may be made of the same material and formed in the same process. In the above embodiment, the flexible circuit board is used as the circuit board. However, other various circuit boards such as a hard circuit board may be used. Further, any member of any shape, structure, or material may be used as long as it is a member other than the circuit board, that is, various members that can form a conductor pattern on the surface thereof and can be attached to the insulating base.

  Further, as described above, according to each embodiment of the present application, welding due to heat during reflow between the rotating body 80 and the current collector plate 40 can be reliably prevented, but there are various materials for the rotating body 80 and the current collector plate 40. It goes without saying that changes are possible. That is, the present invention can be applied no matter what material the two are made of and what kind of plating is applied. At this time, the heat applied to the rotary electronic component is not necessarily limited to the heat applied during reflow, and any heat can be applied if there is a risk of welding due to various types of heat applied for other purposes. However, the present invention can be applied. In addition, as the elastic metal material that constitutes the rotating body 80 that is easily welded by heat at the time of reflow, for example, phosphor bronze, beryllium copper (BeCu), parina (a product name of Dentsu Plyceramco Co., Ltd.) In this case, the present invention may be applied to these materials, such as an alloy containing 10% gold, 10% platinum, and 35% palladium. Although stainless steel (SUS) is a material that does not weld under normal reflow conditions, the present invention may be applied because it may be welded depending on conditions. In addition, even if the elastic metal material which comprises the rotary body 80 is a thing of various materials other than these, this invention may be applied. On the other hand, as a plating material for the conductive plate (which is not limited to the iron plate but may be other various conductive plates such as phosphor bronze plate) constituting the current collector plate 40 that is easily welded by heat during reflow, on the other hand, (Sn) or tin alloy [Sn-Cu alloy (Cu is about 2% by weight), Sn-Ag alloy (Ag is about 3% by weight), Sn-Bi alloy (Bi is about 3% by weight) %) Etc.], the present invention may be applied to these materials. These tin or tin alloy is a low melting point metal of about 230 ° C., is inexpensive, has low surface oxidation, is easily peeled off with a solder flux or the like, and is suitable for soldering. Also, the plating materials that are not fused under normal reflow conditions are expensive, but there are silver (Ag), gold (Au), platinum (Pt), palladium (Pd), etc. These plating materials are also welded depending on the conditions. Therefore, the present invention may be applied, and the present invention may be applied to various plating materials other than those described above. Further, even when the rotating body 80 is plated and the current collector plate 40 is not plated, or both the rotating body 80 and the current collector plate 40 are plated, or both are not plated, both of them are predetermined. The present invention may be applied when there is a risk of being fixed by heat.

It is a figure which shows the rotary electronic component 1-1, FIG. 1 (a) is a top view, FIG.1 (b) is AA sectional drawing of Fig.1 (a), FIG.1 (c) is a back view. . It is a figure which shows the board | substrate 60 for electronic components, Fig.2 (a) is a top view, FIG.2 (b) is BB sectional drawing of Fig.2 (a), FIG.2 (c) is a back view. It is sectional drawing which shows the attachment structure to the mounting board | substrate 110 of the rotary variable resistor 1-1. It is explanatory drawing of the manufacturing method of the board | substrate 60 for electronic components. It is a figure which shows the rotary electronic component 1-2, Fig.5 (a) is a top view, FIG.5 (b) is CC sectional drawing of Fig.5 (a), FIG.5 (c) is a back view. . It is a figure which shows the board | substrate 60 for electronic components, Fig.2 (a) is a top view, FIG.2 (b) is DD sectional drawing of Fig.2 (a). It is sectional drawing which shows the attachment structure to the mounting board | substrate 110 of the rotary variable resistor 1-2. It is sectional drawing of the rotary electronic component 1-3. It is sectional drawing of the board | substrate 60 for electronic components. It is sectional drawing which shows the rotary electronic component 1-4. It is sectional drawing which shows the rotary electronic component 1-5. It is a figure which shows the rotary electronic component 1-6, Fig.12 (a) is a top view, FIG.12 (b) is EE sectional drawing of Fig.12 (a), FIG.12 (c) is a back view. . It is sectional drawing which shows the rotary electronic component 1-7.

Explanation of symbols

1-1 Rotary variable resistor (Rotary electronic component)
1-2 Rotary variable resistor (Rotary electronic component)
1-3 Rotary variable resistor (Rotary electronic component)
1-4 Rotary variable resistor (Rotary electronic component)
1-5 Rotary variable resistors (rotary electronic components)
1-6 Rotary variable resistor (Rotary electronic component)
1-7 Rotary variable resistor (Rotary electronic component)
10 Insulation base 18 Clamping part 20 Flexible circuit board (circuit board)
a2 Surrounding part 21a Side wall part 25 Resistor pattern (conductor pattern)
29 terminal pattern 40 current collecting plate 41 base 42 cylindrical projection 43 second metal terminal 50 first metal terminal 60 electronic component substrate 80 rotating body 85 sliding contact 91 opening 200 sandwiched member (washer)

Claims (5)

A conductive pattern is exposed on the insulating base directly or via another member, and a current collector plate having a cylindrical protrusion is provided on the insulating base, and the cylindrical protrusion is the central portion of the conductive pattern. Rotation of a structure that is mounted so as to protrude toward the exposed surface side of the pattern, and further, a rotating body is rotatably attached to the cylindrical protrusion, and a sliding contact provided on the rotating body is slidably contacted with the conductor pattern In electronic components,
The rotary electronic component, wherein the rotating body is rotatably attached in a state where a welding prevention member is sandwiched between cylindrical protrusions of the current collector plate.   The said welding prevention member is inserted between the outer peripheral side surface of the cylindrical protrusion of a current collector plate, and the inner peripheral side surface of the opening of the rotary body which inserts the said cylindrical protrusion. Rotary electronic component. The other member is a circuit board attached to the insulating base,
The welding prevention member is the circuit board, and a peripheral portion surrounding the cylindrical projection of the circuit board is sandwiched between the rotating body and the current collector plate. Rotary electronic components.   The welding prevention member is a sandwiched member that is inserted into an outer periphery of a cylindrical projection of the current collector plate, and the sandwiched member is sandwiched between the rotating body and the current collector plate. The rotary electronic component according to 1 or 2.   The welding prevention member is the insulating base, and a sandwiched portion formed around the cylindrical protrusion of the insulating base is sandwiched between the rotating body and a current collector plate. The rotary electronic component according to 1 or 2.

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