JPS617607A - Method of producing small-sized electric part - Google Patents

Method of producing small-sized electric part

Info

Publication number
JPS617607A
JPS617607A JP59128480A JP12848084A JPS617607A JP S617607 A JPS617607 A JP S617607A JP 59128480 A JP59128480 A JP 59128480A JP 12848084 A JP12848084 A JP 12848084A JP S617607 A JPS617607 A JP S617607A
Authority
JP
Japan
Prior art keywords
strip
circuit
plate material
shaped plate
bodies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59128480A
Other languages
Japanese (ja)
Other versions
JPH0326523B2 (en
Inventor
宮本 隆博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP59128480A priority Critical patent/JPS617607A/en
Priority to KR1019840007595A priority patent/KR900002414B1/en
Publication of JPS617607A publication Critical patent/JPS617607A/en
Publication of JPH0326523B2 publication Critical patent/JPH0326523B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adjustable Resistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Manufacture Of Switches (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔技術分野〕 本発明は、半固定可変抵抗器、スライド式可変抵抗器あ
るいはスイ・ソチなどを複数個連続して製造する小型電
気部品の製造方法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for manufacturing small electrical components in which a plurality of semi-fixed variable resistors, sliding variable resistors, or Swiss-type variable resistors are manufactured in succession.

〔技術的背景ならびに従来技術の問題点〕各種電子機器
のプリント基板などに実装される可変抵抗器やスイッチ
などの小型電気部品は、構造の単純化と量産性の向上に
より低コストにて製造されることが要求されている。
[Technical background and problems with conventional technology] Small electrical components such as variable resistors and switches mounted on printed circuit boards of various electronic devices can be manufactured at low cost due to simplified structures and improved mass productivity. It is required that

小型電気部品の一例として小型化と低コスト化が望まれ
ているものに半固定可変抵抗器がある。
A semi-fixed variable resistor is an example of a small electric component that is desired to be made smaller and lower in cost.

従来、この半固定可変抵抗器を製造する工程としては、
樹脂積層板やセラミックなどによる基板を所定の形状に
加工し、この基板ヒに抵抗体と電極などの回路体を印刷
によって形成し、その後抵抗体に摺接する接触子や操作
体などを組付けている。
Conventionally, the process of manufacturing this semi-fixed variable resistor is as follows:
A board made of a resin laminate or ceramic is processed into a predetermined shape, a circuit body such as a resistor and electrodes is formed on this board by printing, and then contacts and operating bodies that come into sliding contact with the resistor are assembled. There is.

しかし、この製造方法では、組立て作業を一個ずつ行わ
なくてはならないため、製造工程が煩雑でまた人手がか
かり製造コストが高くなる。
However, in this manufacturing method, the assembly work must be performed one by one, making the manufacturing process complicated and labor-intensive, resulting in high manufacturing costs.

また、最近では、金属製の帯状板材に接触子や端子など
を打ち抜き加工によって連続的に形成し、この接触子や
端子に対して樹脂をアウトサート成型して操作体を形成
し、その後にこの操作体などを基板とに取付ける方向が
考えられている。
In addition, recently, contacts and terminals are continuously formed on a metal band-shaped plate material by punching, and resin is outsert molded onto the contacts and terminals to form an operating body. Consideration is being given to attaching the operating body and the like to the board.

この製造方法によれば、接触子、端子および操作体など
を帯状板材にて連続して供給することができ、製造工程
が簡素化される利点がある。ところが、この方法を採用
した場合であっても、絶縁基板は別個に製作し、また各
基板ごとに抵抗体などを印刷しなければならないことに
なる。この基板の個別的な製作はきわめて煩雑であり、
コストの増加に大きく影響を与えている。
According to this manufacturing method, contacts, terminals, operating bodies, and the like can be continuously supplied using a strip-like plate material, which has the advantage of simplifying the manufacturing process. However, even if this method is adopted, the insulating substrates must be manufactured separately, and resistors and the like must be printed on each substrate. The individual production of this board is extremely complicated;
This has a major impact on increasing costs.

〔本発明の目的〕[Object of the present invention]

本発明は上記従来の問題点に着目してなされたものであ
り、絶縁基板を連続工程によって形成して、基板の製造
工程と回路体の印刷工程の簡略化を実現し、低コストに
て小型電気部品を構成できるようにした小型電気部品の
製造方法を提供することを目的としている。
The present invention has been made by focusing on the above-mentioned conventional problems, and it forms an insulating substrate through a continuous process, simplifies the manufacturing process of the board and the printing process of the circuit body, and achieves a small size at low cost. It is an object of the present invention to provide a method for manufacturing small electrical components that can be configured into electrical components.

〔本発明の構成〕[Configuration of the present invention]

本発明による小型電気部品の製造方法は、絶縁材料製の
帯状板材の面に、回路体を一定の間隔を開けて複数組形
成し7、次に上記各回路体を囲み且つ回路体に接続され
た端子を保持する複数の樹脂製の筐体を、帯状体上に固
着させて形成し、次に、回路体に接触する接触子とこの
接触子の操作体などの各部材を、帯状板材の回路体形成
部分に各々組付け、さらに前記帯状板材から回路体が形
成されている部分を分離し、この分離された板材を基板
とする電気部品を独立させることを特徴としており、帯
状板材にて連続して形成されている基板に対し、筐体の
形成や各種部材の組付けを行うことによって、量産性の
向上を図ったものである。
The method of manufacturing a small electric component according to the present invention involves forming a plurality of circuit bodies at regular intervals on the surface of a strip-shaped plate made of an insulating material, and then forming a circuit body surrounding each of the circuit bodies and connecting the circuit bodies to the circuit body. A plurality of resin casings that hold the terminals are fixed onto the strip, and then each member, such as the contact that contacts the circuit body and the operating body of this contact, is attached to the strip. It is characterized by assembling each part to the circuit body forming part, further separating the part where the circuit body is formed from the strip plate material, and making the electrical components independent using the separated plate material as a board. The mass productivity is improved by forming the casing and assembling various parts onto the continuously formed substrates.

〔本発明の実施例〕[Example of the present invention]

以下、本発明の実施例を図面によって説明する。 Embodiments of the present invention will be described below with reference to the drawings.

図面は小型電気部品の一例として半固定可変抵抗器の製
造工程を順に示したものである。
The drawings sequentially show the manufacturing process of a semi-fixed variable resistor as an example of a small electric component.

第1図は帯状板材1の平面図であり、第2図はその側面
図である。
FIG. 1 is a plan view of the strip-shaped plate material 1, and FIG. 2 is a side view thereof.

この帯状板材1は、°合成樹脂などの絶縁材料によって
薄肉で、且つ帯状に形成されているものである。帯状板
材lの一側端には送り穴llが一定のピッチにて穿設さ
れている。この送り穴11によって帯状板材1が自動送
りできるようになっている。この帯状板材lには複数の
基板12が所定ピッチにて形成されている。基板12の
周囲には切欠き13a、13b、13cが形成されてお
り、この切欠き13a〜13cの境界部に形成された接
続片14aと14bとによって基板12が帯状板材lに
支持されていることになる。基板12の中央部には軸穴
12aが穿設されており、また基板12の端部には一対
の端子支持穴12bが穿設されている。さらに第2図に
示すように、基板lの裏面には、溝1aが形成されてい
る。この溝1aは各基板12の境界部に形成されており
、溝1a部分が薄肉に形成されて、帯状板材lが変形し
やすくなっており、帯状板材1の巻取りなどが容易にな
っている。なお、帯状板材1をフィルム状の薄い材料に
よって形成すれば、この溝1aは不要である。
The strip-shaped plate material 1 is made of an insulating material such as synthetic resin and is thin and strip-shaped. Feed holes 11 are bored at a constant pitch at one end of the strip-like plate material 1. This feed hole 11 allows the belt-shaped plate material 1 to be automatically fed. A plurality of substrates 12 are formed at a predetermined pitch on this strip-shaped plate material l. Cutouts 13a, 13b, and 13c are formed around the substrate 12, and the substrate 12 is supported by the strip-shaped plate l by connection pieces 14a and 14b formed at the boundaries of the cutouts 13a to 13c. It turns out. A shaft hole 12a is formed in the center of the board 12, and a pair of terminal support holes 12b are formed in the ends of the board 12. Furthermore, as shown in FIG. 2, a groove 1a is formed on the back surface of the substrate 1. This groove 1a is formed at the boundary between each substrate 12, and the groove 1a portion is formed thin so that the strip-shaped plate material 1 is easily deformed, and winding of the strip-shaped plate material 1 is facilitated. . Incidentally, if the band-shaped plate material 1 is formed of a thin film-like material, this groove 1a is unnecessary.

まず、最初の工程では、上記帯状板材lに形成された複
数の基板12の各々に回路体として抵抗体21と電極2
2を形成する。抵抗体21はカーボンなどによって印刷
成形されているものであり、軸穴12aを中心として半
円弧形状に形成されている。また電極22は銀ペースト
などによっ、て形成されているものであり、抵抗体21
の両端部に接続されている。なお、この回路体を形成す
る工程に際しては、送り穴11を利用して帯状板材1を
自動送りしながら印刷などを行う。以下の工程において
も同じである。
First, in the first step, a resistor 21 and an electrode 2 as a circuit body are mounted on each of the plurality of substrates 12 formed on the strip-shaped plate l.
form 2. The resistor 21 is printed and molded from carbon or the like, and is formed in a semicircular arc shape centered on the shaft hole 12a. Further, the electrode 22 is formed of silver paste or the like, and the resistor 21
is connected to both ends of the In addition, in the process of forming this circuit body, printing etc. are performed while automatically feeding the strip plate material 1 using the feed hole 11. The same applies to the following steps.

次に第3図の工程では、電極22に端子311接続する
。この端子31は電極22に対して半田付けあるいは導
電性接着剤などによって固着する。または端子支持穴1
2bに対してはとめなどを用いてかしめ固定してもよい
Next, in the step shown in FIG. 3, a terminal 311 is connected to the electrode 22. This terminal 31 is fixed to the electrode 22 by soldering or a conductive adhesive. or terminal support hole 1
2b may be fixed by caulking using a grommet or the like.

端子31を取付けた後に帯状板材1に対して樹脂を7ウ
トサートし、筐体40を帯状板材lと一体に成型する。
After attaching the terminal 31, resin is applied to the strip-shaped plate 1 seven times, and the casing 40 is molded integrally with the strip-shaped plate l.

この工程は第4図(平面図)ならびに第5図(V矢視図
)、第6図(Vl−VI断面図)に図示する。このとき
、樹脂は切欠き13a、13b、13c内を通って帯状
板材1の裏側にまで延びる6そして、筐体40の下部は
帯状板材1を上下から挟持する保持部41になり、F部
は抵抗体21を囲む筒状ケース42になる。同時に保持
部41の中央部に穴41aが形成される(第6図参照)
。この穴41aは基板12の軸穴12aと連続している
。また端子31の基部は保持部41によって固定され、
且つ端子31の先端部は筐体40の外方へ突出する。
This process is illustrated in FIG. 4 (plan view), FIG. 5 (view in direction of arrow V), and FIG. 6 (cross-sectional view along Vl-VI). At this time, the resin passes through the notches 13a, 13b, and 13c and extends to the back side of the strip plate material 16, and the lower part of the casing 40 becomes a holding part 41 that holds the strip plate material 1 from above and below, and the F part is A cylindrical case 42 surrounds the resistor 21. At the same time, a hole 41a is formed in the center of the holding part 41 (see Fig. 6).
. This hole 41a is continuous with the shaft hole 12a of the substrate 12. Further, the base of the terminal 31 is fixed by a holding part 41,
In addition, the tip portion of the terminal 31 protrudes outward from the housing 40 .

次に、基板12上に各種部材を組付ける。組付は後の状
態は第7図(平面図)ならびに第8図(■矢視図)、第
9図(IX−IX断面図)に示す。
Next, various members are assembled onto the substrate 12. The state after assembly is shown in FIG. 7 (plan view), FIG. 8 (view from the ■ arrow), and FIG. 9 (IX-IX sectional view).

符号51は中間端子である。この中間端子51と一体の
金具51 aには軸52が挿通され、この軸52が筐体
40の穴42aに挿入され、その先端は基板12の軸穴
12aからE方へ突設される。
Reference numeral 51 is an intermediate terminal. A shaft 52 is inserted through the metal fitting 51 a integrated with the intermediate terminal 51 , and the shaft 52 is inserted into the hole 42 a of the casing 40 , with its tip protruding from the shaft hole 12 a of the board 12 in the E direction.

また帯状板材1の上側には操作体53が取付けられる。Further, an operating body 53 is attached to the upper side of the strip-shaped plate 1.

この操作体53は樹脂製であり、その下端には金属板5
4と接触子55とが固設されている(第9図参照)。こ
の操作体53はカバーを兼ねており、その周囲は筐体4
0の筒状ケース42を覆う状態に設置される。軸52の
先端52aは金属板54の中央部に挿入され、操作体5
3の穴53a内にてかしめられる。これにより操作体5
3は軸52および接触子55と共に回転自在となる。
This operating body 53 is made of resin, and has a metal plate 5 at its lower end.
4 and a contactor 55 are fixedly installed (see FIG. 9). This operating body 53 also serves as a cover, and the surrounding area is the housing 4.
It is installed to cover the cylindrical case 42 of No. 0. The tip 52a of the shaft 52 is inserted into the center of the metal plate 54, and the operating body 5
It is caulked in the hole 53a of No.3. As a result, the operating body 5
3 is rotatable together with the shaft 52 and the contact 55.

このTgにて半固定可変抵抗器が完成される。At this Tg, the semi-fixed variable resistor is completed.

操作体53の上面に形成された十字穴53bあるいは軸
52の下端の溝52bにドライバーなどを挿入して回転
させると、軸52ならびに操作体53と共に接触子55
が回転し抵抗体21 )、を摺動する。所定の回転位置
に設定すると、金属板54、軸52を介して接触子55
と導通されている中間端子51と、端子31との間に抵
抗値が設定される。
When a screwdriver or the like is inserted into the cross recess 53b formed on the top surface of the operating body 53 or the groove 52b at the lower end of the shaft 52 and rotated, the contact 55 is removed together with the shaft 52 and the operating body 53.
rotates and slides the resistor 21). When set to a predetermined rotational position, the contact 55 is connected via the metal plate 54 and the shaft 52.
A resistance value is set between the terminal 31 and the intermediate terminal 51 which is electrically connected to the terminal 31 .

なお、上記の半固定可変抵抗器をプリント基板などに実
装するときには、帯状板材1の接続片14aと14bを
切断し、各半固定可変抵抗器を帯状板材1から分離する
。この分離工程と、プリント基板への実装工程は自動機
を使用して連続して行なうこともできる。またこの半固
定可変抵抗器の出荷ならびにスト−/りは第7図の連結
状態にて行われる。あるいは第4図の状態にて出荷ある
いはストックし、実装工程の直前に接触子55などの各
部材を組込んでもよい。
In addition, when mounting the above semi-fixed variable resistor on a printed circuit board or the like, the connecting pieces 14a and 14b of the strip-shaped plate material 1 are cut, and each semi-fixed variable resistor is separated from the strip-shaped plate material 1. This separation process and the mounting process on a printed circuit board can also be performed continuously using an automatic machine. Further, this semi-fixed variable resistor is shipped and stored in the connected state shown in FIG. 7. Alternatively, it may be shipped or stocked in the state shown in FIG. 4, and each member such as the contactor 55 may be assembled immediately before the mounting process.

なお、図の実施例では小型電気部品の一実施例として半
固定可変抵抗器を示したが、他の実施例としては小型の
スイッチなどでもよい。この場合には回路体は電極にな
る。またスライド式可変抵抗器でもよい。この場合には
基板21と筐体40は角形状に形成される。
In the illustrated embodiment, a semi-fixed variable resistor is shown as an example of the small electric component, but a small switch or the like may be used as another example. In this case, the circuit body becomes an electrode. Alternatively, a sliding variable resistor may be used. In this case, the substrate 21 and the casing 40 are formed into a rectangular shape.

C本発明の効果〕 以Hのように本発明によれば、以下に列記する効果を奏
するようになる。
C. Effects of the present invention] As described in H below, according to the present invention, the following effects can be achieved.

(1)電気部品の基板を帯状板材によって連接して形成
し、またこの基板に抵抗体などの回路体を印刷などによ
って形成し、また帯状板材に対してアウトサート成型な
どを施して筐体を形成し、その後、帯状板材に対して接
触子や操作体などの部材を組付けているので、組立てが
最後まで連続工程にて行なえ、工程が削減できコストダ
ウンを図ることができる。
(1) Boards for electrical components are formed by connecting them with strip-shaped plates, circuit elements such as resistors are formed on these boards by printing, and the casing is formed by performing outsert molding on the strip-shaped plates. After that, members such as contacts and operating bodies are assembled to the strip-shaped plate material, so assembly can be performed in a continuous process until the end, reducing the number of processes and reducing costs.

(2)基板を帯状板材によって連接して形成し、この連
接状態のまま回路体の印刷などを行うことができるので
、従来のように基板を別個に形成して、各々に回路体を
印刷などしていた方法に比べ、基板の製作コストを大幅
に下げることができる。
(2) Since the circuit boards can be formed by connecting them using strip-shaped plate materials and printing circuit bodies can be carried out in this connected state, it is possible to form the circuit boards separately as in the past and print circuit bodies on each. Compared to the previous method, the manufacturing cost of the board can be significantly reduced.

【図面の簡単な説明】[Brief explanation of drawings]

図面は本発明の一実施例として半固定可変抵抗器の製造
方法を示すものであり、第1図は帯状板材の平面図、第
2図はその側面図、第3図は帯状板材に端子を接続した
状態を示す平面図、第4図は帯状板材に筐体を一体に形
成した状態を示す平面図、第5図はvJ4図のV矢視図
、第6図は第4図のVl−VI断面図、第7図は各種部
材を組込んだ状態を示す平面図、第8図は第7図の■矢
視図。 第9図は第7図のIX−IX断面図である。 l・・・帯状板材、21.22・・・回路体、31・・
・端子、40・・・筐体、51・・・中間端子、52・
・・軸、53・・・操作体、55・・・接触子。 出願人  アルプス電気株式会社 代理人  弁理士 野崎 照 夫 第1図 第3図
The drawings show a method of manufacturing a semi-fixed variable resistor as an embodiment of the present invention, in which Fig. 1 is a plan view of a band-shaped plate, Fig. 2 is a side view thereof, and Fig. 3 shows terminals attached to the band-shaped plate. FIG. 4 is a plan view showing the state in which the casing is integrally formed with the strip plate material, FIG. 5 is a view taken in the direction of the V arrow in FIG. VI sectional view, FIG. 7 is a plan view showing a state in which various members are assembled, and FIG. 8 is a view taken in the direction of the ■ arrow in FIG. 7. FIG. 9 is a sectional view taken along line IX-IX in FIG. 7. l...Strip plate material, 21.22...Circuit body, 31...
・Terminal, 40... Housing, 51... Intermediate terminal, 52.
...shaft, 53... operating body, 55... contactor. Applicant Alps Electric Co., Ltd. Agent Patent Attorney Teruo Nozaki Figure 1 Figure 3

Claims (1)

【特許請求の範囲】 絶縁材料製の帯状板材の面に、回路体を一定の間隔を開
けて複数組形成し、 上記各回路体を囲み且つ回路体に接続された端子を保持
する複数の樹脂製の筐体を帯状体上に固着させて形成し
、 次に、回路体に接触する接触子とこの接触子の操作体を
帯状板材の回路体形成部分に各々組付け、 前記帯状板材から回路体が形成されている部分を分離し
、この分離された板材を基板とする電気部品を独立させ
ることを特徴とする小型電気部品の製造方法。
[Claims] A plurality of sets of circuit bodies are formed at regular intervals on the surface of a strip plate made of an insulating material, and a plurality of resins surround each of the circuit bodies and hold terminals connected to the circuit bodies. A casing made of aluminum is fixed onto the strip-shaped body, and then a contact that contacts the circuit body and an operating body of this contact are respectively assembled to the circuit-body forming portion of the strip-shaped plate material, and a circuit is formed from the strip-shaped plate material. A method for manufacturing a small electrical component, which comprises separating a portion in which a body is formed and making an electrical component independent using the separated plate material as a substrate.
JP59128480A 1984-06-22 1984-06-22 Method of producing small-sized electric part Granted JPS617607A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP59128480A JPS617607A (en) 1984-06-22 1984-06-22 Method of producing small-sized electric part
KR1019840007595A KR900002414B1 (en) 1984-06-22 1984-12-01 Method of producing samll-sized electric part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59128480A JPS617607A (en) 1984-06-22 1984-06-22 Method of producing small-sized electric part

Publications (2)

Publication Number Publication Date
JPS617607A true JPS617607A (en) 1986-01-14
JPH0326523B2 JPH0326523B2 (en) 1991-04-11

Family

ID=14985775

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59128480A Granted JPS617607A (en) 1984-06-22 1984-06-22 Method of producing small-sized electric part

Country Status (2)

Country Link
JP (1) JPS617607A (en)
KR (1) KR900002414B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62190703A (en) * 1986-02-18 1987-08-20 松下電器産業株式会社 Manufacture of resistant substrate for variable resistor
JPS6390808A (en) * 1986-10-04 1988-04-21 株式会社村田製作所 Electronic component

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101457374B1 (en) * 2012-09-21 2014-11-04 고려대학교 산학협력단 C2H5OH Gas Sensors using Fe-doped Nickel Oxide nano-structures and fabrication method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5358657A (en) * 1976-11-06 1978-05-26 Murata Manufacturing Co Method of making electric parts having projected discclike substrate
JPS58135907U (en) * 1982-03-09 1983-09-13 アルプス電気株式会社 Rotating variable resistor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5358657A (en) * 1976-11-06 1978-05-26 Murata Manufacturing Co Method of making electric parts having projected discclike substrate
JPS58135907U (en) * 1982-03-09 1983-09-13 アルプス電気株式会社 Rotating variable resistor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62190703A (en) * 1986-02-18 1987-08-20 松下電器産業株式会社 Manufacture of resistant substrate for variable resistor
JPS6390808A (en) * 1986-10-04 1988-04-21 株式会社村田製作所 Electronic component
JPH054801B2 (en) * 1986-10-04 1993-01-20 Murata Manufacturing Co

Also Published As

Publication number Publication date
KR900002414B1 (en) 1990-04-14
JPH0326523B2 (en) 1991-04-11
KR860000790A (en) 1986-01-30

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