JPH0326523B2 - - Google Patents
Info
- Publication number
- JPH0326523B2 JPH0326523B2 JP59128480A JP12848084A JPH0326523B2 JP H0326523 B2 JPH0326523 B2 JP H0326523B2 JP 59128480 A JP59128480 A JP 59128480A JP 12848084 A JP12848084 A JP 12848084A JP H0326523 B2 JPH0326523 B2 JP H0326523B2
- Authority
- JP
- Japan
- Prior art keywords
- plate material
- strip
- shaped plate
- circuit body
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 40
- 239000000758 substrate Substances 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 239000011810 insulating material Substances 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000007639 printing Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000010924 continuous production Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adjustable Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Manufacture Of Switches (AREA)
Description
【発明の詳細な説明】
〔技術分野〕
本発明は、半固定可変抵抗器、スライド式可変
抵抗器あるいはスイツチなどを複数個連続して製
造する小型電気部品の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for manufacturing small electrical components in which a plurality of semi-fixed variable resistors, sliding variable resistors, switches, etc. are manufactured in succession.
各種電子機器のプリント基板などに実装される
可変抵抗器やスイツチなどの小型電気部品は、構
造の単純化と量産性の向上により低コストにて製
造されることが要求されている。
Small electrical components such as variable resistors and switches mounted on printed circuit boards of various electronic devices are required to be manufactured at low cost by simplifying the structure and improving mass productivity.
小型電気部品の一例として小型化と低コスト化
が望まれているものに半固定可変抵抗器がある。
従来、この半固定可変抵抗器を製造する工程とし
ては、樹脂積層板やセラミツクなどによる基板を
所定の形状に加工し、この基板上に抵抗体と電極
などの回路体を印刷によつて形成し、その後抵抗
体に摺接する接触子や操作体などを組付けてい
る。 A semi-fixed variable resistor is an example of a small electric component that is desired to be made smaller and lower in cost.
Conventionally, the process of manufacturing semi-fixed variable resistors involves processing a substrate made of resin laminate or ceramic into a predetermined shape, and then forming circuit elements such as resistors and electrodes on this substrate by printing. Then, the contacts and operating body that slide into contact with the resistor are assembled.
しかし、この製造方法では、組立て作業を一個
ずつ行わなくてはならないため、製造工程が煩雑
でまた人手がかかり製造コストが高くなる。 However, in this manufacturing method, the assembly work must be performed one by one, making the manufacturing process complicated and labor-intensive, resulting in high manufacturing costs.
また、最近では、金属製の帯状板材に接触子や
端子などを打ち抜き加工によつて連続的に形成
し、この接触子や端子に対して樹脂をアウトサー
ト成型して操作体を形成し、その後にこの操作体
などを基板に取付ける方向が考えられている。 In addition, recently, contacts and terminals are continuously formed on a metal band-shaped plate material by punching, and resin is outsert molded onto the contacts and terminals to form an operating body. Attempts are being made to attach the operating body to the board.
この製造方法によれば、接触子、端子および操
作体などを帯状板材にて連続して供給することが
でき、製造工程が簡素化される利点がある。とこ
ろが、この方法を採用した場合であつても、絶縁
基板は別個に製作し、また各基板ごとに抵抗体な
どを印刷しなければならないことになる。この基
板の個別的な製作はきわめて煩雑であり、コスト
の増加に大きく影響を与えている。 According to this manufacturing method, contacts, terminals, operating bodies, and the like can be continuously supplied using a strip-like plate material, which has the advantage of simplifying the manufacturing process. However, even if this method is adopted, the insulating substrates must be manufactured separately, and resistors and the like must be printed on each substrate. The individual manufacturing of these substrates is extremely complicated and has a large effect on increasing costs.
〔本発明の目的〕
本発明は上記従来の問題点に着目してなされた
ものであり、絶縁基板を連続工程によつて形成し
て、基板の製造工程と回路体の印刷工程の簡略化
を実現し、低コストにて小型電気部品を構成でき
るようにした小型電気部品の製造方法を提供する
ことを目的としている。[Object of the present invention] The present invention has been made by focusing on the above-mentioned conventional problems, and it is an object of the present invention to simplify the manufacturing process of the board and the printing process of the circuit body by forming an insulating substrate through a continuous process. The object of the present invention is to provide a method for manufacturing small electrical components that enables the construction of small electrical components at low cost.
本発明による小型電気部品の製造方法は、自動
送りのための穴を有する絶縁材料製の帯状板材の
面に、回路体を一定の間隔を開けて複数組形成す
るとともに、それぞれの回路体が形成されている
部分の周囲に位置する切欠きならびにこの切欠き
の縁となる接続片を形成し、上記切欠きを介して
帯状板材の両面に延びて各回路体を囲み且つ回路
体に接続された端子を保持する複数の樹脂製の筐
体を帯状板材に固着させて形成し、次に、回路体
に接触する接触子とこの接触子の操作体を帯状板
材の回路体形成部分に各々組付け、前記接続片を
切断して帯状板材から回路体が形成されている部
分を分離し、この分離された板材を基板とする電
気部品を独立させることを特徴としており、帯状
板材にて連続して形成されている基板に対し、筐
体の形成や各種部材の組付けを行うことによつ
て、量産性の向上を図つたものである。
The method for manufacturing small electric components according to the present invention involves forming a plurality of sets of circuit bodies at regular intervals on the surface of a strip plate made of insulating material having holes for automatic feeding, and forming each circuit body. A notch is located around the area where the cutout is located, and a connecting piece is formed as the edge of this notch, extending to both sides of the strip plate material through the notch, surrounding each circuit body, and being connected to the circuit body. A plurality of resin casings that hold the terminals are fixed to a band-shaped plate material, and then a contact that contacts the circuit body and an operating body of this contact are respectively assembled to the circuit body forming part of the band-shaped plate material. , the connection piece is cut to separate the part where the circuit body is formed from the strip-shaped plate material, and the electric component using the separated plate material as a board is made independent, and the strip-shaped plate material is connected continuously. The mass productivity is improved by forming a casing and assembling various parts onto the formed substrate.
以下、本発明の実施例を図面によつて説明す
る。
Embodiments of the present invention will be described below with reference to the drawings.
図面は小型電気部品の一例として半固定可変抵
抗器の製造工程を順に示したものである。 The drawings sequentially show the manufacturing process of a semi-fixed variable resistor as an example of a small electric component.
第１図は帯状板材１の平面図であり、第２図は
その側面図である。 FIG. 1 is a plan view of the strip-shaped plate material 1, and FIG. 2 is a side view thereof.
この帯状板材１は、合成樹脂などの絶縁材料に
よつて薄肉で、且つ帯状に形成されているもので
ある。帯状板材１の一側端には送り穴１１が一定
のピツチにて穿設されている。この送り穴１１に
よつて帯状板材１が自動送りできるようになつて
いる。この帯状板材１には複数の基板１２が所定
ピツチにて形成されている。基板１２の周囲には
切欠き１３ａ，１３ｂ，１３ｃが形成されてお
り、この切欠き１３ａ〜１３ｃの境界部に形成さ
れた接続片１４ａと１４ｂとによつて基板１２が
帯状板材１に支持されていることになる。基板１
２の中央部には軸穴１２ａが穿設されており、ま
た基板１２の端子には一対の端子支持穴１２ｂが
穿設されている。さらに第２図に示すように、基
板１の裏面には、溝１ａが形成されている。この
溝１ａは各基板１２の境界部に形成されており、
溝１ａ部分が薄肉に形成されて、帯状板材１が変
形しやすくなつており、帯状板材１の巻取りなど
が容易になつている。なお、帯状板材１をフイル
ム状の薄い材料によつて形成すれば、この溝１ａ
は不要である。 The strip-shaped plate material 1 is made of an insulating material such as synthetic resin and is thin and strip-shaped. Feed holes 11 are bored at one end of the strip-shaped plate 1 at a constant pitch. The feed hole 11 allows the belt-shaped plate material 1 to be automatically fed. A plurality of substrates 12 are formed on this strip-shaped plate material 1 at a predetermined pitch. Cutouts 13a, 13b, and 13c are formed around the substrate 12, and the substrate 12 is supported by the strip-like plate material 1 by connecting pieces 14a and 14b formed at the boundaries of the cutouts 13a to 13c. This means that Board 1
A shaft hole 12a is formed in the center of the board 12, and a pair of terminal support holes 12b are formed in the terminals of the board 12. Furthermore, as shown in FIG. 2, a groove 1a is formed on the back surface of the substrate 1. This groove 1a is formed at the boundary between each substrate 12,
The groove 1a portion is formed thin so that the strip-shaped plate material 1 is easily deformed, and winding of the strip-shaped plate material 1 is facilitated. Note that if the band-shaped plate material 1 is formed of a thin film-like material, this groove 1a
is not necessary.
まず、最初の工程では、上記帯状板材１に形成
された複数の基板１２の各々に回路体として抵抗
体２１と電極２２を形成する。抵抗体２１はカー
ボンなどによつて印刷成形されているものであ
り、軸穴１２ａを中心として半円孤形状に形成さ
れている。また電極２２は銀ペーストなどによつ
て形成されているものであり、抵抗体２１の両端
部に接続されている。なお、この回路体を形成す
る工程に際しては、送り穴１１を利用して帯状板
材１を自動送りしながら印刷などを行う。以下の
工程においても同じである。 First, in the first step, a resistor 21 and an electrode 22 are formed as a circuit body on each of the plurality of substrates 12 formed on the strip-shaped plate material 1. The resistor 21 is printed and molded from carbon or the like, and is formed in the shape of a semicircular arc centered on the shaft hole 12a. Further, the electrodes 22 are formed of silver paste or the like, and are connected to both ends of the resistor 21. In addition, in the process of forming this circuit body, printing etc. are performed while automatically feeding the strip-shaped plate material 1 using the feed hole 11. The same applies to the following steps.
次に第３図の工程では、電極２２に端子３１を
接続する。この端子３１は電極２２に対して半田
付けあるいは導電性接着剤などによつて固着す
る。または端子支持穴１２ｂに対してはとめなど
を用いてかしめ固定してもよい。 Next, in the step shown in FIG. 3, the terminal 31 is connected to the electrode 22. This terminal 31 is fixed to the electrode 22 by soldering or a conductive adhesive. Alternatively, it may be fixed to the terminal support hole 12b by caulking using a grommet or the like.
端子３１を取付けた後に帯状板材１に対して樹
脂をアウトサートし、筐体４０を帯状板材１と一
体に成型する。この工程は第４図（平面図）なら
びに第５図（矢視図）、第６図（−断面図）
に図示する。このとき、樹脂は切欠き１３ａ，１
３ｂ，１３ｃ内を通つて帯状板材１の裏側にまで
延びる。そして、筐体４０の下部は帯状板材１を
上下から挟持する保持部４１になり、上部は抵抗
体２１を囲む筒状ケース４２になる。同時に保持
部４１の中央部に穴４１ａが形成される（第６図
参照）。この穴４１ａは基板１２の軸穴１２ａと
連続している。また端子３１の基部は保持部４１
によつて固定され、且つ端子３１の先端部は筐体
４０の外方へ突出する。 After the terminals 31 are attached, resin is outsert to the strip-shaped plate material 1, and the casing 40 is integrally molded with the strip-shaped plate material 1. This process is shown in Figure 4 (top view), Figure 5 (arrow view), and Figure 6 (-cross-sectional view).
Illustrated in At this time, the resin has notches 13a, 1
3b, 13c and extends to the back side of the strip plate material 1. The lower part of the housing 40 becomes a holding part 41 that holds the strip plate material 1 from above and below, and the upper part becomes a cylindrical case 42 that surrounds the resistor 21. At the same time, a hole 41a is formed in the center of the holding part 41 (see FIG. 6). This hole 41a is continuous with the shaft hole 12a of the substrate 12. Further, the base of the terminal 31 is connected to the holding portion 41.
, and the tip of the terminal 31 protrudes outward from the housing 40 .
次に、基板１２上に各種部材を組付ける。組付
け後の状態は第７図（平面図）ならびに第８図
（矢視図）、第９図（−断面図）に示す。符
号５１は中間端子である。この中間端子５１と一
体の金具５１ａには軸５２が挿通され、この軸５
２が筐体４０の穴４２ａに挿入され、その先端は
基板１２の軸穴１２ａから上方へ突設される。ま
た帯状板材１の上側には操作体５３が取付けられ
る。この操作体５３は樹脂製であり、その下端に
は金属板５４と接触子５５とが固設されている
（第９図参照）。この操作体５３はカバーを兼ねて
おり、その周囲は筐体４０の筒状ケース４２を覆
う状態に設置される。軸５２の先端５２ａは金属
板５４の中央部に挿入され、操作体５３の穴５３
ａ内にてかしめられる。これにより操作体５３は
軸５２および接触子５５と共に回転自在となる。 Next, various members are assembled onto the substrate 12. The state after assembly is shown in FIG. 7 (plan view), FIG. 8 (arrow view), and FIG. 9 (-cross-sectional view). Reference numeral 51 is an intermediate terminal. A shaft 52 is inserted through the metal fitting 51a that is integrated with the intermediate terminal 51.
2 is inserted into the hole 42a of the housing 40, and its tip is provided to protrude upward from the shaft hole 12a of the board 12. Further, an operating body 53 is attached to the upper side of the strip-shaped plate 1. The operating body 53 is made of resin, and has a metal plate 54 and a contact 55 fixedly attached to its lower end (see FIG. 9). This operating body 53 also serves as a cover, and its periphery is installed to cover the cylindrical case 42 of the housing 40. The tip 52a of the shaft 52 is inserted into the center of the metal plate 54, and is inserted into the hole 53 of the operating body 53.
It is caulked within a. Thereby, the operating body 53 becomes rotatable together with the shaft 52 and the contactor 55.
この工程にて半固定可変抵抗器が完成される。
操作体５３の上面に形成された十字穴５３ｂある
いは軸５２の下端の溝５２ｂにドライバーなどを
挿入して回転させると、軸５２ならびに操作体５
３と共に接触子５５が回転し抵抗体２１上を摺動
する。所定の回転位置に設定すると、金属板５
４、軸５２を介して接触子５５と導通されている
中間端子５１と、端子３１との間に抵抗値が設定
される。 A semi-fixed variable resistor is completed in this step.
When a screwdriver or the like is inserted into the cross recess 53b formed on the top surface of the operating body 53 or the groove 52b at the lower end of the shaft 52 and rotated, the shaft 52 and the operating body 5 are rotated.
3, the contactor 55 rotates and slides on the resistor 21. When set to a predetermined rotational position, the metal plate 5
4. A resistance value is set between the terminal 31 and the intermediate terminal 51 which is electrically connected to the contactor 55 via the shaft 52.
なお、上記の半固定可変抵抗器をプリント基板
などに実装するときには、帯状板材１の接続片１
４ａと１４ｂを切断し、各半固定可変抵抗器を帯
状板材１から分離する。この分離工程と、プリン
ト基板への実装工程は自動機を使用して連続して
行なうこともできる。またこの半固定可変抵抗器
の出荷ならびにストツクは第７図の連結状態にて
行われる。あるいは第４図の状態にて出荷あるい
はストツクし、実装工程の直前に接触子５５など
の各部材を組込んでもよい。 In addition, when mounting the above-mentioned semi-fixed variable resistor on a printed circuit board etc., the connecting piece 1 of the strip plate material 1
4a and 14b are cut to separate each semi-fixed variable resistor from the strip plate material 1. This separation process and the mounting process on a printed circuit board can also be performed continuously using an automatic machine. Further, this semi-fixed variable resistor is shipped and stocked in the connected state shown in FIG. Alternatively, the device may be shipped or stored in the state shown in FIG. 4, and each member such as the contact 55 may be assembled immediately before the mounting process.
なお、図の実施例では小型電気部品の一実施例
として半固定可変抵抗器を示したが、他の実施例
としては小型のスイツチなどでもよい。この場合
には回路体は電極になる。またスライド式可変抵
抗器でもよい。この場合には基板２１と筐体４０
は角形状に形成される。 In the illustrated embodiment, a semi-fixed variable resistor is shown as an example of the small electric component, but a small switch or the like may be used as another example. In this case, the circuit body becomes an electrode. Alternatively, a sliding variable resistor may be used. In this case, the board 21 and the housing 40
is formed into a square shape.
以上のように本発明によれば、以下に列記する
効果を奏するようになる。
As described above, according to the present invention, the following effects can be achieved.
(1) 電気部品の基板を帯状板材によつて連接して
形成し、またこの基板に抵抗体などの回路体を
印刷などによつて形成し、また帯状板材に対し
てアウトサート成型などを施して筐体を形成
し、その後、帯状板材に対して接触子や操作体
などの部材を組付けているので、組立てが最後
まで連続工程にて行なえ、工程が削減できコス
トダウンを図ることができる。(1) Boards for electrical components are formed by connecting them with strip-shaped plates, and circuit elements such as resistors are formed on these boards by printing, and outsert molding is performed on the strip-shaped plates. Since the casing is formed using the casing, and then components such as contacts and operating bodies are assembled to the strip-shaped plate material, assembly can be performed in a continuous process until the end, reducing the number of processes and reducing costs. .
(2) 基板を帯状板材によつて連接して形成し、こ
の連接状態のまま回路体の印刷などを行うこと
ができるので、従来のように基板を別個に形成
して、各々に回路体を印刷などしていた方法に
比べ、基板の製作コストを大幅に下げることが
できる。(2) The circuit boards can be formed by connecting them using strip-shaped plate materials, and circuit bodies can be printed while remaining in this connected state, so it is not possible to form the circuit boards separately and print the circuit bodies on each one as in the past. Compared to conventional methods such as printing, the manufacturing cost of the board can be significantly lowered.
(3) 本発明では、帯状板材に設けられた切欠きを
介して樹脂が板材の両面に延びているため、筐
体を成形する際に板材の両面への樹脂の回りが
よく、樹脂が均一に注入されて筐体が形成さ
れ、この筐体と帯状板材とが確実に固着され
る。また電気部品を個々に独立させるときに
は、上記切欠きの縁となる接続片を切断すれば
よいので、切断抵抗がなく、分離作業が容易で
ある。(3) In the present invention, since the resin extends to both sides of the plate material through the notches provided in the band-shaped plate material, the resin can be distributed evenly to both sides of the plate material when molding the casing, and the resin can be distributed evenly. A casing is formed by injecting the metal into the material, and the casing and the strip plate material are reliably fixed to each other. Further, when separating the electric components individually, it is only necessary to cut the connection piece forming the edge of the notch, so there is no cutting resistance and the separation operation is easy.
図面は本発明の一実施例として半固定可変抵抗
器の製造方法を示すものであり、第１図は帯状板
材の平面図、第２図はその側面図、第３図は帯状
板材に端子を接続した状態を示す平面図、第４図
は帯状板材に筐体を一体に形成した状態を示す平
面図、第５図は第４図の矢視図、第６図は第４
図の−断面図、第７図は各種部材を組込んだ
状態を示す平面図、第８図は第７図の矢視図、
第９図は第７図の−断面図である。
１……帯状板材、２１，２２……回路体、３１
……端子、４０……筐体、５１……中間端子、５
２……軸、５３……操作体、５５……接触子。
The drawings show a method of manufacturing a semi-fixed variable resistor as an embodiment of the present invention, in which Fig. 1 is a plan view of a band-shaped plate, Fig. 2 is a side view thereof, and Fig. 3 shows terminals attached to the band-shaped plate. FIG. 4 is a plan view showing a state in which the housing is integrally formed with the band-shaped plate material, FIG. 5 is a view taken in the direction of the arrow in FIG. 4, and FIG.
Fig. 7 is a plan view showing a state in which various members are assembled, Fig. 8 is a view taken in the direction of the arrow in Fig. 7,
FIG. 9 is a cross-sectional view of FIG. 1... Strip plate material, 21, 22... Circuit body, 31
...terminal, 40...casing, 51...intermediate terminal, 5
2... shaft, 53... operating body, 55... contact.
Claims (1)
状板材の面に、回路体を一定の間隔を開けて複数
組形成するとともに、それぞれの回路体が形成さ
れている部分の周囲に位置する切欠きならびにこ
の切欠きの縁となる接続片を形成し、 上記切欠きを介して帯状板材の両面に延びて各
回路体を囲み且つ回路体に接続された端子を保持
する複数の樹脂製の筐体を帯状板材に固着させて
形成し、 次に、回路体に接触する接触子とこの接触子の
操作体を帯状板材の回路体形成部分に各々組付
け、 前記接続片を切断して帯状板材から回路体が形
成されている部分を分離し、この分離された板材
を基板とする電気部品を独立させることを特徴と
する小型電気部品の製造方法。[Scope of Claims] 1. A plurality of sets of circuit bodies are formed at regular intervals on the surface of a strip plate made of insulating material having holes for automatic feeding, and a portion where each circuit body is formed. A notch located around the periphery of the notch and a connection piece forming the edge of this notch are formed, and extend to both sides of the strip plate material through the notch to surround each circuit body and hold a terminal connected to the circuit body. A plurality of resin casings are fixed to a band-shaped plate material, and then a contact that contacts the circuit body and an operating body of this contact are respectively assembled to the circuit body forming portion of the band-shaped plate material, and the connection piece is formed. 1. A method for manufacturing a small electrical component, which comprises: separating a portion where a circuit body is formed from a strip-shaped plate material by cutting the strip material, and making the electrical component using the separated plate material as a substrate independent.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59128480A JPS617607A (en) | 1984-06-22 | 1984-06-22 | Method of producing small-sized electric part |
| KR1019840007595A KR900002414B1 (en) | 1984-06-22 | 1984-12-01 | Method of producing samll-sized electric part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59128480A JPS617607A (en) | 1984-06-22 | 1984-06-22 | Method of producing small-sized electric part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS617607A JPS617607A (en) | 1986-01-14 |
| JPH0326523B2 true JPH0326523B2 (en) | 1991-04-11 |
Family
ID=14985775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59128480A Granted JPS617607A (en) | 1984-06-22 | 1984-06-22 | Method of producing small-sized electric part |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS617607A (en) |
| KR (1) | KR900002414B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101457374B1 (en) * | 2012-09-21 | 2014-11-04 | 고려대학교 산학협력단 | C2H5OH Gas Sensors using Fe-doped Nickel Oxide nano-structures and fabrication method thereof |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0770376B2 (en) * | 1986-02-18 | 1995-07-31 | 松下電器産業株式会社 | Method of manufacturing resistance substrate for variable resistor |
| JPS6390808A (en) * | 1986-10-04 | 1988-04-21 | 株式会社村田製作所 | Electronic component |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5358657A (en) * | 1976-11-06 | 1978-05-26 | Murata Manufacturing Co | Method of making electric parts having projected discclike substrate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58135907U (en) * | 1982-03-09 | 1983-09-13 | アルプス電気株式会社 | Rotating variable resistor |
-
1984
- 1984-06-22 JP JP59128480A patent/JPS617607A/en active Granted
- 1984-12-01 KR KR1019840007595A patent/KR900002414B1/en not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5358657A (en) * | 1976-11-06 | 1978-05-26 | Murata Manufacturing Co | Method of making electric parts having projected discclike substrate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101457374B1 (en) * | 2012-09-21 | 2014-11-04 | 고려대학교 산학협력단 | C2H5OH Gas Sensors using Fe-doped Nickel Oxide nano-structures and fabrication method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS617607A (en) | 1986-01-14 |
| KR900002414B1 (en) | 1990-04-14 |
| KR860000790A (en) | 1986-01-30 |
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