JP4519007B2

JP4519007B2 - Manufacturing method of substrate for electronic parts

Info

Publication number: JP4519007B2
Application number: JP2005169872A
Authority: JP
Inventors: 幸三森田; 大介牧野
Original assignee: 帝国通信工業株式会社
Priority date: 2005-06-09
Filing date: 2005-06-09
Publication date: 2010-08-04
Anticipated expiration: 2025-06-09
Also published as: JP2006344819A

Description

本発明は、少なくとも回路基板を成形樹脂製の基体内にインサート成形してなる電子部品用基体を容易に且つ効率良く製造することができる電子部品用基体の製造方法に関するものである。 The present invention relates to a method for manufacturing an electronic component substrate, which can easily and efficiently manufacture an electronic component substrate formed by insert molding at least a circuit board into a molded resin substrate.

従来、合成樹脂製の基体（ケース）に抵抗体パターンを形成したフレキシブル回路基板をその抵抗体パターンが露出するようにインサート成形してなる電子部品用基体（電子部品用ケース）が開発されている（例えば特許文献１）。そして特許文献１の電子部品用基体においては、さらに基体内に金属板製の端子もインサート成形し、その際端子の一端をフレキシブル回路基板の抵抗体パターンに接続して設けた端子パターン上に当接している。そしてこの種の電子部品用基体の製造方法は、端子とフレキシブル回路基板とを金型内に装着し、前記金型によって形成される基体成型用のキャビティー内に溶融成形樹脂を満たして固化し、金型を取り外しすことによって行われていた。 2. Description of the Related Art Conventionally, an electronic component base (electronic component case) has been developed in which a flexible circuit board in which a resistor pattern is formed on a synthetic resin base (case) is insert-molded so that the resistor pattern is exposed. (For example, patent document 1). In the electronic component substrate of Patent Document 1, a metal plate terminal is further insert-molded in the substrate, and one end of the terminal is connected to the resistor pattern of the flexible circuit board on the terminal pattern. It touches. In this type of electronic component substrate manufacturing method, a terminal and a flexible circuit board are mounted in a mold, and a substrate molding cavity formed by the mold is filled with a molten molding resin and solidified. Was done by removing the mold.

しかしながら上記従来の製造方法では、フレキシブル回路基板を一枚ずつ金型内に装着していたため、その製造作業が煩雑であったばかりか、近年電子部品用基体が小型化されているので、小さな寸法のフレキシブル回路基板を一枚ずつ金型内に正確に装着することが困難となっていた。特にフレキシブル回路基板は薄くて軽くてしかも容易に撓むので、これが小型化されると金型への装着が困難となる。前記問題は特に電子部品用基体にインサートしようとする部品の数が多くなればなるほど大きくなる。
特開２００３−１７３９０２号公報 However, in the above-described conventional manufacturing method, the flexible circuit boards are mounted one by one in the mold, so that the manufacturing work is not only complicated, but the electronic component base has been downsized in recent years. It has been difficult to accurately mount the flexible circuit boards one by one in the mold. In particular, the flexible circuit board is thin, light, and easily bends. Therefore, when the flexible circuit board is miniaturized, it is difficult to mount the flexible circuit board on the mold. In particular, the problem increases as the number of components to be inserted into the electronic component base increases.
JP 2003-173902 A

本発明は上述の点に鑑みてなされたものでありその目的は、たとえ小型化されても電子部品用基体を容易且つ効率良く製造することができる電子部品用基体の製造方法を提供することにある。 The present invention has been made in view of the above points, and an object of the present invention is to provide a method for manufacturing an electronic component substrate that can easily and efficiently manufacture an electronic component substrate even if it is downsized. is there.

本願請求項１に記載の発明は、回路基板と取付部材とを成形樹脂製の基体内にインサート成形してなる電子部品用基体の製造方法において、前記回路基板を回路基板連結部によって連結してなる回路基板形成部材と、取付部材を取付部材連結部によって連結してなる取付部材形成部材とを用意し、前記回路基板と前記取付部材を金型内に装着する金型装着工程と、前記金型に形成される基体成型用のキャビティー内に溶融成形樹脂を満たしてこの溶融成形樹脂が固化した後に前記金型を取り外して連結部付き電子部品用基体を形成する成形工程と、前記連結部付き電子部品用基体の外部に突出している回路基板連結部と取付部材連結部とを電子部品用基体から切り離す切り離し工程とを有して電子部品用基体を製造し、さらに前記金型装着工程の前に用意する取付部材形成部材の取付部材には電子部品用基体上に設置する回転体の開口に回動自在に挿入される突起が設けられ、一方前記金型装着工程の前に用意する回路基板形成部材の回路基板の前記突起に対向する位置には前記突起を位置決めする寸法形状の突起挿入孔が設けられ、前記金型装着工程では、取付部材の突起を回路基板の突起挿入孔に挿入して取付部材と回路基板とを一体化した状態でこれら回路基板と取付部材を金型内に装着することを特徴とする電子部品用基体の製造方法が開示されている。 The invention according to claim 1 of the present invention is a method of manufacturing a base for an electronic component in which a circuit board and a mounting member are insert-molded in a base made of molded resin, wherein the circuit board is connected by a circuit board connecting portion. a circuit board forming member made, and the mounting member to prepare an attachment member forming member formed by connecting the mounting member connecting portion, the circuit board and the mold mounting member is attached to the mold loading process, the gold A molding step of filling a melt molding resin into a base molding cavity formed in a mold and solidifying the melt molding resin to form a base for an electronic component with a coupling portion by removing the mold; and the coupling portion the circuit board connecting part which protrudes outside the electronic component substrate attached with the attachment member connecting portion to produce an electronic component substrate and a disconnecting process of disconnecting from the electronic component substrate, further the mold mounting Engineering The mounting member of the mounting member forming member prepared before is provided with a protrusion that is rotatably inserted into the opening of the rotating body installed on the electronic component base, while being prepared before the mold mounting step. The circuit board forming member is provided with a protrusion insertion hole having a dimension to position the protrusion at a position facing the protrusion on the circuit board. In the mold mounting step, the protrusion of the mounting member is used as the protrusion insertion hole of the circuit board. There is disclosed a method for manufacturing a substrate for electronic parts, wherein the circuit board and the mounting member are mounted in a mold in a state where the mounting member and the circuit board are integrated by insertion .

本願請求項２に記載の発明は、前記金型装着工程の前に、前記回路基板形成部材及び取付部材形成部材とともに、前記回路基板に設けた端子パターン上に当接される端子パターン接続部を有する端子を端子連結部によって連結してなる端子形成部材を用意しておき、前記金型装着工程の際に前記回路基板及び取付部材と共に前記端子も金型内に装着し、前記切り離し工程の際に連結部付き電子部品用基体の外部に突出している回路基板連結部と取付部材連結部と端子連結部とを電子部品用基体から切り離すことを特徴とする請求項１に記載の電子部品用基体の製造方法が開示されている。 According to the second aspect of the present invention, a terminal pattern connecting portion that is brought into contact with a terminal pattern provided on the circuit board together with the circuit board forming member and the mounting member forming member before the mold mounting step is provided. A terminal forming member formed by connecting terminals having a terminal connection portion is prepared, and the terminal is mounted in the mold together with the circuit board and the mounting member in the mold mounting process, and in the disconnecting process. 2. The electronic component base according to claim 1 , wherein the circuit board connecting portion, the mounting member connecting portion, and the terminal connecting portion projecting outside the electronic component base with the connecting portion are separated from the electronic component base. A manufacturing method is disclosed.

請求項１に記載の発明によれば、回路基板を回路基板形成部材に連結した状態のまま金型内に装着するので、例え回路基板が小型化しても、回路基板形成部材の回路基板連結部によって容易に回路基板を金型内へ位置決めして装着することができる。特に回路基板としてフレキシブル回路基板を用いた場合は、可撓性を有し、また薄くて軽いので、これが小型化すると単品では金型内への装着が困難となるが、回路基板形成部材の回路基板連結部を用いることによってその装着が容易になり、特に効果的である。 According to the first aspect of the present invention, since the circuit board is mounted in the mold while being connected to the circuit board forming member, even if the circuit board is downsized, the circuit board connecting portion of the circuit board forming member Thus, the circuit board can be easily positioned and mounted in the mold. In particular, when a flexible circuit board is used as a circuit board, it is flexible and thin and light. Therefore, if it is reduced in size, it will be difficult to mount it in a mold by itself. The use of the board connecting portion facilitates the mounting and is particularly effective.

請求項１に記載の発明によれば、回路基板と取付部材とを何れも回路基板形成部材と取付部材形成部材とに連結した状態のまま金型内に装着するので、例え回路基板や取付部材が小型化しても、回路基板形成部材の回路基板連結部や取付部材形成部材の取付部材連結部によって容易に回路基板や取付部材を金型内へ位置決めして装着することができる。 According to the first aspect of the present invention, the circuit board and the mounting member are both mounted in the mold while being connected to the circuit board forming member and the mounting member forming member. Even when the circuit board is downsized, the circuit board and the mounting member can be easily positioned and mounted in the mold by the circuit board connecting portion of the circuit board forming member and the mounting member connecting portion of the mounting member forming member.

請求項２に記載の発明によれば、回路基板と取付部材と端子とを何れも回路基板形成部材と取付部材形成部材と端子形成部材とに連結した状態のまま金型内に装着するので、例え回路基板や取付部材や端子が小型化しても、回路基板形成部材の回路基板連結部や取付部材形成部材の取付部材連結部や端子形成部材の端子連結部によって容易に回路基板や取付部材や端子を金型内へ位置決めして装着することができる。 According to the invention of claim 2 , since the circuit board, the mounting member, and the terminal are all mounted in the mold while being connected to the circuit board forming member, the mounting member forming member, and the terminal forming member, Even if the circuit board, the mounting member, and the terminal are downsized, the circuit board connecting member, the mounting member connecting part of the mounting member forming member, and the terminal connecting part of the terminal forming member can be easily The terminal can be positioned and mounted in the mold.

請求項１に記載の発明によれば、一体化した取付部材と回路基板とを金型内に装着できるので、取付部材と回路基板とは同時に一度の工程で金型に装着して位置決めでき、従って金型への各部材の装着時間を短くでき、その分電子部品用基体を連続して製造していく際のサイクルタイムを短くでき、製造効率の向上が図れる。 According to the invention of claim 1 , since the integrated mounting member and the circuit board can be mounted in the mold, the mounting member and the circuit board can be mounted and positioned in the mold at the same time in one step, Therefore, the mounting time of each member to the mold can be shortened, and accordingly, the cycle time when the electronic component base is continuously manufactured can be shortened, and the manufacturing efficiency can be improved.

以下、本発明の実施形態を図面に基づいて詳細に説明する。
〔第１実施形態〕
ここでまず本実施形態を用いて製造する電子部品用基体６０の構造について説明しておく。図１は電子部品用基体６０を示す図であり、図１（ａ）は平面図、図１（ｂ）は図１（ａ）のＡ−Ａ断面図、図１（ｃ）は裏面図である。同図に示すように電子部品用基体６０は、回路基板（以下この実施形態では「フレキシブル回路基板」という）２０と、このフレキシブル回路基板２０に取り付ける取付部材（以下この実施形態では「集電板」という）４０と、端子（以下この実施形態では「第一の金属端子」という）５０，５０とを、成形樹脂製の基体１０にインサート成形して構成されている。以下各構成部品について説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[First Embodiment]
Here, the structure of the electronic component base 60 manufactured using the present embodiment will be described first. FIG. 1 is a view showing an electronic component substrate 60, FIG. 1 (a) is a plan view, FIG. 1 (b) is an AA cross-sectional view of FIG. 1 (a), and FIG. is there. As shown in the figure, the electronic component base 60 includes a circuit board (hereinafter referred to as “flexible circuit board” in this embodiment) 20 and an attachment member (hereinafter referred to as “current collector plate” in this embodiment) attached to the flexible circuit board 20. ) 40 and terminals (hereinafter referred to as “first metal terminals” in this embodiment) 50 and 50 are formed by insert molding on a base 10 made of molded resin. Each component will be described below.

図１に示すように基体１０は略矩形状で板状の合成樹脂成形品であり、下面に凹状の回転体収納部１７を設けるとともにその中央には円形の貫通孔１１が設けられている。この基体１０は熱可塑性の合成樹脂、例えばナイロンやポリフェニレンスルフイド（ＰＰＳ）等によって構成されている。 As shown in FIG. 1, the base 10 is a substantially rectangular and plate-shaped synthetic resin molded product. A concave rotating body storage portion 17 is provided on the lower surface, and a circular through hole 11 is provided at the center thereof. The substrate 10 is made of a thermoplastic synthetic resin, such as nylon or polyphenylene sulfide (PPS).

フレキシブル回路基板２０は合成樹脂フイルム（例えばナイロンフイルム又はＰＰＳフイルム又はポリイミドフイルム等）上に端子パターン２９，２９と、その表面に下記する回転体８０の摺動接点８５が摺接する摺接パターン（以下この実施形態では「抵抗体パターン」という）２５とを設けて構成されている。抵抗体パターン２５の中央には下記する集電板４０の突起（以下この実施形態では「筒状突起」という）４２に挿入される突起挿入孔２１が設けられている。言い換えればフレキシブル回路基板２０は合成樹脂フイルムの下記する集電板４０の筒状突起４２の外形寸法（外径寸法）と略同一の内形寸法（内径寸法）であってこの筒状突起４２に両者がガタつきなく係合するように挿入される寸法形状の突起挿入孔２１を設け（具体的には、〔円形の突起挿入孔２１の内径寸法〕≦〔円形の筒状突起４２の外径寸法〕）、突起挿入孔２１周囲の表面にこれを馬蹄形状に囲む抵抗体パターン２５を設け、さらに抵抗体パターン２５の両端にそれぞれ端子パターン２９，２９を接続して設けている。抵抗体パターン２５はこの実施形態では、カーボンペースト（溶剤に溶かしたウレタン系又はフェノール系等の樹脂材にカーボン粉を混練したもの）を印刷焼成することで構成されている。端子パターン２９，２９はこの実施形態では銀ペースト（例えば溶剤に溶かしたウレタン系又はフェノール系等の樹脂材に銀粉を混練したもの）を印刷焼成することで構成されている。なおこれらパターン２５，２９，２９は転写方式等の他の方法によって前記合成樹脂フイルム上に形成しても良い。 The flexible circuit board 20 has a terminal pattern 29, 29 on a synthetic resin film (for example, a nylon film, a PPS film, a polyimide film, etc.) and a sliding contact pattern (hereinafter referred to as a sliding contact pattern 85) of the rotating body 80 described below on the surface. In this embodiment, a resistor pattern 25) is provided. At the center of the resistor pattern 25 is provided a projection insertion hole 21 to be inserted into a projection (hereinafter referred to as “cylindrical projection” in this embodiment) 42 of the current collector plate 40 described below. In other words, the flexible circuit board 20 has an inner shape dimension (inner diameter dimension) substantially the same as the outer dimension (outer diameter dimension) of the cylindrical projection 42 of the current collector plate 40 described below of the synthetic resin film. Protrusion insertion hole 21 having a dimension and shape that is inserted so that both engage with each other without backlash is provided (specifically, [inner diameter dimension of circular protrusion insertion hole 21] ≦ [outer diameter of circular cylindrical protrusion 42) Dimensions]), a resistor pattern 25 surrounding the protrusion insertion hole 21 in a horseshoe shape is provided on the surface, and terminal patterns 29 and 29 are connected to both ends of the resistor pattern 25, respectively. In this embodiment, the resistor pattern 25 is configured by printing and baking a carbon paste (one obtained by kneading carbon powder in a urethane-based or phenol-based resin material dissolved in a solvent). In this embodiment, the terminal patterns 29 and 29 are configured by printing and baking a silver paste (for example, a material in which silver powder is kneaded in a urethane-based or phenol-based resin material dissolved in a solvent). The patterns 25, 29 and 29 may be formed on the synthetic resin film by other methods such as a transfer method.

集電板４０は、平板状で略長方形状の金属板の一方に基部４１を設け、他方に金属端子（以下「第二の金属端子」という）４３を設けて構成されている。この集電板４０は、金属板（この実施形態では鉄板（鋼板）製）であって、その表面全体に金属メッキが被覆されているものを使用している。基部４１は略円形であって（図１（ａ）参照）その面の中央から垂直に筒状突起４２を突出して構成されている。一方金属板のもう一方の端部近傍には、基部４１の平板面から斜めに傾斜する段部４５を設けることにより、基部４１の平板面から筒状突起４２側に突出する基部４１と平行となる平板状の第二の金属端子４３を設けている。第二の金属端子４３の下面側の表面は、下記する実装基板１１０の接続パターン１１３を接続する接続面４３ａとしている。段部４５は基体１０の内部に埋設するように設けられており、その内部には貫通する固定部４５ａが設けられている。またこの実施形態においては、集電板４０の筒状突起４２を突出する側の面は、フレキシブル回路基板２０の抵抗体パターン２５を設けていない側の面に当接するように設置されている。このように構成すれば、集電板４０のフレキシブル回路基板２０を当接する反対面側の部分ａ１に形成される基体１０の厚みを厚くできてその強度を強くできる。特にこの実施形態のように、回転体収納部１７を設ける等して基体１０の厚みが薄くなっている場合については、その効果が大きい。 The current collector plate 40 is configured by providing a base 41 on one side of a flat and substantially rectangular metal plate and providing a metal terminal (hereinafter referred to as “second metal terminal”) 43 on the other side. The current collector plate 40 is a metal plate (made of an iron plate (steel plate) in this embodiment), and the entire surface of which is coated with metal plating. The base 41 is substantially circular (see FIG. 1A), and is configured to project a cylindrical protrusion 42 vertically from the center of the surface. On the other hand, in the vicinity of the other end portion of the metal plate, by providing a step portion 45 inclined obliquely from the flat plate surface of the base portion 41, it is parallel to the base portion 41 protruding from the flat plate surface of the base portion 41 toward the cylindrical protrusion 42. A flat plate-like second metal terminal 43 is provided. A surface on the lower surface side of the second metal terminal 43 serves as a connection surface 43a for connecting a connection pattern 113 of the mounting substrate 110 described below. The step portion 45 is provided so as to be embedded in the base body 10, and a fixing portion 45 a penetrating therethrough is provided therein. In this embodiment, the surface of the current collector plate 40 that protrudes from the cylindrical protrusion 42 is disposed so as to contact the surface of the flexible circuit board 20 on which the resistor pattern 25 is not provided. If comprised in this way, the thickness of the base | substrate 10 formed in the part a1 of the other surface side which contact | connects the flexible circuit board 20 of the current collecting plate 40 can be thickened, and the intensity | strength can be strengthened. In particular, as in this embodiment, when the thickness of the base 10 is reduced by providing the rotating body storage portion 17 or the like, the effect is great.

第一の金属端子５０は、平板状で略矩形状の金属板であって、その表面全体に金属メッキが被覆されており、その一端側が前記端子パターン２９に接続される端子パターン接続部５１、他端側が基体１０の外部に突出される実装基板接続部５３となっている。端子パターン接続部５１と実装基板接続部５３の面は平行で、両者の間には端子パターン接続部５１の平板面に垂直となる段部３０が設けられている。実装基板接続部５３の下面側の表面は、下記する実装基板１１０の接続パターン１１３を接続する接続面５３ａとしている。段部３０は基体１０の内部に埋設するように設けられている。 The first metal terminal 50 is a flat and substantially rectangular metal plate, the entire surface of which is coated with metal plating, and one end side of which is connected to the terminal pattern 29, a terminal pattern connection portion 51, The other end side is a mounting board connecting portion 53 protruding outside the base body 10. The surface of the terminal pattern connection portion 51 and the mounting substrate connection portion 53 are parallel, and a step portion 30 that is perpendicular to the flat surface of the terminal pattern connection portion 51 is provided between them. A surface on the lower surface side of the mounting board connecting portion 53 is a connection surface 53a for connecting a connection pattern 113 of the mounting board 110 described below. The step portion 30 is provided so as to be embedded in the base body 10.

図２は上記電子部品用基体６０を用いて構成される回転式電子部品（以下「回転式可変抵抗器」という）１を示す断面図（図１（ｂ）に相当する部分の断面図）である。同図に示すように回転式可変抵抗器１は、前記電子部品用基体６０の基体１０のフレキシブル回路基板２０を設置した側（下面側）から突出する筒状突起４２を回転体８０に設けた開口９１に回動自在に挿入し、筒状突起４２の先端をカシメることで構成されている。ここで回転体８０は、一枚の弾性金属板によって構成され、すり鉢状の基部８１の外周に円弧状のアーム８３を取り付け、アーム８３の中央にフレキシブル回路基板２０方向に突出するように屈曲する摺動接点８５を設け、また基部８１の下面に基部８１の外周の一部に設けた連結部８７によって連結される調整部（下記する調整治具によって回動される部分。以下「調整板」という）８９を、連結部８７を折り返すことで基部８１の下面に重ね合せて構成されている。基部８１の中央には前記集電板４０の筒状突起４２を挿入する円形の開口９１が設けられ、また調整板８９にはプラスドライバ（又はマイナスドライバ等）からなる調整治具を挿入するプラス形状（他の形状でも良い）の調整用溝９３が設けられている。このとき回転体８０の摺動接点８５はフレキシブル回路基板２０の抵抗体パターン２５上に弾接している。 FIG. 2 is a cross-sectional view (a cross-sectional view of a portion corresponding to FIG. 1B) showing a rotary electronic component (hereinafter referred to as “rotary variable resistor”) 1 configured using the electronic component base 60. is there. As shown in the figure, the rotary variable resistor 1 is provided with a cylindrical projection 42 on the rotating body 80 that protrudes from the side (lower surface side) of the base 10 of the electronic component base 60 on which the flexible circuit board 20 is installed. It is configured to be inserted into the opening 91 so as to be rotatable and to squeeze the tip of the cylindrical protrusion 42. Here, the rotating body 80 is constituted by a single elastic metal plate, and an arc-shaped arm 83 is attached to the outer periphery of the mortar-shaped base 81, and is bent so as to protrude toward the flexible circuit board 20 in the center of the arm 83. An adjusting portion (a portion rotated by an adjusting jig described below; hereinafter referred to as “adjusting plate”) provided with a sliding contact 85 and connected to a lower surface of the base 81 by a connecting portion 87 provided on a part of the outer periphery of the base 81. 89) is overlapped on the lower surface of the base 81 by folding back the connecting portion 87. A circular opening 91 into which the cylindrical protrusion 42 of the current collector plate 40 is inserted is provided at the center of the base 81, and an adjustment jig made of a plus driver (or minus driver) is inserted into the adjustment plate 89. An adjustment groove 93 having a shape (may be another shape) is provided. At this time, the sliding contact 85 of the rotating body 80 is in elastic contact with the resistor pattern 25 of the flexible circuit board 20.

図３は以上のようにして構成された回転式可変抵抗器１の実装基板１１０の実装面１１２への取付構造を示す断面図である。同図に示すように実装基板１１０には開口部（調整孔）１１１を設け、この開口部１１１の周囲の実装面１１２には前記第一の金属端子５０，５０と第二の金属端子４３とにそれぞれ対向する接続パターン１１３を設けている。そして回転式可変抵抗器１は回転体８０を取り付けた側の面を実装基板１１０の実装面１１２に対向して載置し、その際回転体８０を開口部１１１に露出し、同時に第一の金属端子５０，５０と第二の金属端子４３とをそれぞれ接続パターン１１３に半田１１４を介して当接し、半田１１４をリフロー等によって溶融・固化して両者を電気的・機械的に接続して取り付ける。そして実装基板１１０の実装面１１２の反対側の面からその開口部１１１内に図示しない調整治具（例えばプラス又はマイナスドライバ）の先端を挿入し、調整板８９の調整用溝９３に係合して回転体８０を回転すれば、回転体８０に設けた摺動接点８５が抵抗体パターン２５（図１（ｃ）参照）上を摺接して第一の金属端子５０，５０と第二の金属端子４３間の抵抗値が変化する。 FIG. 3 is a cross-sectional view showing a structure for attaching the rotary variable resistor 1 configured as described above to the mounting surface 112 of the mounting substrate 110. As shown in the figure, an opening (adjustment hole) 111 is provided in the mounting substrate 110, and the first metal terminals 50 and 50 and the second metal terminal 43 are provided on the mounting surface 112 around the opening 111. The connection patterns 113 that face each other are provided. The rotary variable resistor 1 is placed with the surface on which the rotating body 80 is mounted facing the mounting surface 112 of the mounting substrate 110, and the rotating body 80 is exposed to the opening 111 at the same time, and the first The metal terminals 50 and 50 and the second metal terminal 43 are respectively brought into contact with the connection pattern 113 via the solder 114, and the solder 114 is melted and solidified by reflow or the like, and both are electrically and mechanically connected and attached. . Then, the tip of an adjustment jig (not shown) (for example, a plus or minus driver) is inserted into the opening 111 from the surface opposite to the mounting surface 112 of the mounting substrate 110 and engaged with the adjustment groove 93 of the adjustment plate 89. When the rotating body 80 is rotated, the sliding contact 85 provided on the rotating body 80 slides on the resistor pattern 25 (see FIG. 1C) to contact the first metal terminals 50 and 50 and the second metal. The resistance value between the terminals 43 changes.

次に本実施形態にかかる上記電子部品用基体６０の製造方法を説明する。図４乃至図９は本実施形態にかかる電子部品用基体６０の製造方法説明図である。即ちまず図４に示す取付部材形成部材（以下この実施形態では「集電板形成部材」という）２１０及び回路基板形成部材２３０と、図６に示す端子形成部材２５０とを用意する。集電板形成部材２１０は図４に示すように帯状の金属板からなる取付部材連結部（以下この実施形態では「集電板連結部」という）２１１の一辺から垂直に一本ずつ所定間隔毎に連続して略直線状の前記集電板４０を突出して構成されている。集電板連結部２１１には円形の開口からなるピン挿入口２１３が所定間隔毎に設けられている。集電板４０の先端には前述のように基部４１が設けられ、根元側には金属端子（以下「第二の金属端子」という）４３が設けられ、さらに基部４１の中央には筒状突起４２が設けられている。回路基板形成部材２３０は合成樹脂フイルム製であり、帯状の回路基板連結部２３１の途中に連続して所定間隔毎（前記集電板４０の設置間隔と同一間隔毎）に前記フレキシブル回路基板２０を形成して構成されている。フレキシブル回路基板２０には前述のように突起挿入孔２１が設けられ、その周囲の表面には抵抗体パターン２５と端子パターン２９，２９とが形成されている。端子形成部材２５０は図６に示すように帯状の金属板からなる端子連結部２５１の一辺から垂直に一対ずつ所定間隔毎（前記集電板４０の設置間隔と同一間隔毎）に連続して略直線状の前記第１の金属端子５０，５０を突出して構成されている。端子連結部２５１には円形の開口からなるピン挿入口２５３が所定間隔毎に設けられている。第１の金属端子５０は前述のようにその先端は端子パターン接続部５１であり、段部３０を介してその根元側は実装基板接続部５３となっている。 Next, a method for manufacturing the electronic component substrate 60 according to the present embodiment will be described. 4 to 9 are explanatory views of a method for manufacturing the electronic component substrate 60 according to the present embodiment. That is, first, an attachment member forming member (hereinafter referred to as “current collector plate forming member”) 210 and a circuit board forming member 230 shown in FIG. 4 and a terminal forming member 250 shown in FIG. 6 are prepared. As shown in FIG. 4, the current collector plate forming member 210 is perpendicular to one side of a mounting member connecting portion (hereinafter referred to as “current collector plate connecting portion” in this embodiment) 211 made of a band-shaped metal plate, at predetermined intervals. The current collecting plate 40 is formed so as to protrude from the substantially straight line. The current collector plate connecting portion 211 is provided with pin insertion ports 213 each having a circular opening at predetermined intervals. As described above, the base 41 is provided at the tip of the current collector plate 40, a metal terminal (hereinafter referred to as “second metal terminal”) 43 is provided at the base side, and a cylindrical protrusion is provided at the center of the base 41. 42 is provided. The circuit board forming member 230 is made of a synthetic resin film, and the flexible circuit board 20 is provided at predetermined intervals (same intervals as the current collector plate 40 is installed) continuously in the middle of the belt-like circuit board connecting portion 231. Formed and configured. The flexible circuit board 20 is provided with the protrusion insertion hole 21 as described above, and the resistor pattern 25 and the terminal patterns 29 and 29 are formed on the peripheral surface thereof. As shown in FIG. 6, the terminal forming member 250 is substantially continuous continuously at predetermined intervals (every the same interval as the installation interval of the current collector plate 40) in pairs vertically from one side of the terminal connecting portion 251 made of a band-shaped metal plate. The linear first metal terminals 50 and 50 are formed so as to protrude. The terminal connecting portion 251 is provided with pin insertion ports 253 each having a circular opening at predetermined intervals. As described above, the tip of the first metal terminal 50 is the terminal pattern connection portion 51, and the base side of the first metal terminal 50 is the mounting substrate connection portion 53 through the step portion 30.

そしてまず図５に示すように、回路基板形成部材２３０の各フレキシブル回路基板２０の抵抗体パターン２５等を形成していない面（紙面の裏面側の面）に集電板形成部材２１０の各集電板４０の基部４１を設置し、その際各フレキシブル回路基板２０の突起挿入孔２１に集電板４０の筒状突起４２を挿入しておく。即ち突起挿入孔２１に筒状突起４２を挿入するが、筒状突起４２と突起挿入孔２１とは両者がガタつきなく係合する寸法形状に形成されているので、集電板形成部材２１０と回路基板形成部材２３０とはガタつきなく一体化される。ここで回路基板形成部材２３０は各フレキシブル回路基板２０の外周の突起挿入孔２１を中心とした略１８０°対向する位置に接続される回路基板連結部２３１によって直線状に連結されているので、回路基板形成部材２３０を回路基板連結部２３１によって連結されている方向に向かって引っ張るだけで容易に各フレキシブル回路基板２０は一列に張られた状態で位置決めされ、従ってたとえフレキシブル回路基板２０に可撓性があって薄くて軽くて小型化されても、容易にその突起挿入孔２１に筒状突起４２を挿入することができ、また一体化された集電板形成部材２１０と回路基板形成部材２３０とを下記する第１金型３１０に装着する装着作業が容易となる。 First, as shown in FIG. 5, each collector of the current collector plate forming member 210 is formed on the surface of the flexible circuit board 20 on which the resistor pattern 25 or the like is not formed (the surface on the back side of the paper). The base 41 of the electric plate 40 is installed, and the cylindrical protrusion 42 of the current collector plate 40 is inserted into the protrusion insertion hole 21 of each flexible circuit board 20 at that time. That is, the cylindrical protrusion 42 is inserted into the protrusion insertion hole 21. Since the cylindrical protrusion 42 and the protrusion insertion hole 21 are formed in dimensions that allow both to engage with each other without backlash, The circuit board forming member 230 is integrated without rattling. Here, the circuit board forming member 230 is linearly connected by a circuit board connecting portion 231 connected to a position facing the substantially 180 ° centering on the protrusion insertion hole 21 on the outer periphery of each flexible circuit board 20. Each flexible circuit board 20 is easily positioned in a row by simply pulling the board forming member 230 in the direction connected by the circuit board connecting portion 231. Even if it is thin, light, and downsized, the cylindrical protrusion 42 can be easily inserted into the protrusion insertion hole 21, and the integrated current collector plate forming member 210 and circuit board forming member 230 Can be easily attached to the first mold 310 described below.

次に図６に示すように、端子形成部材２５０を第１金型３１０内に装着する。図６に示す点線は、第１金型３１０の概略の外形を示す仮想線である。第１金型３１０は図６において端子形成部材２５０の紙面手前側に位置する。このとき端子形成部材２５０のピン挿入口２５３には第１金型３１０側から突出する図示しないピンが挿入され、位置決めされる。次に図７に示すように、前記一体化された図５に示す集電板形成部材２１０及び回路基板形成部材２３０を、第１金型３１０内に挿入する。集電板形成部材２１０及び回路基板形成部材２３０は紙面の奥側から装着され、その際フレキシブル回路基板２０の各端子パターン２９，２９上に第１の金属端子５０の端子パターン接続部５１，５１が当接し、同時に集電板形成部材２１０のピン挿入口２１３には第１金型３１０側から突出する図示しないピンが挿入され、位置決めされる。 Next, as shown in FIG. 6, the terminal forming member 250 is mounted in the first mold 310. A dotted line shown in FIG. 6 is an imaginary line showing the outline of the first mold 310. The first mold 310 is located on the front side of the paper surface of the terminal forming member 250 in FIG. At this time, a pin (not shown) protruding from the first mold 310 side is inserted into the pin insertion port 253 of the terminal forming member 250 and positioned. Next, as shown in FIG. 7, the integrated current collector plate forming member 210 and circuit board forming member 230 shown in FIG. 5 are inserted into the first mold 310. The current collector plate forming member 210 and the circuit board forming member 230 are mounted from the back side of the drawing, and at this time, the terminal pattern connecting portions 51 and 51 of the first metal terminal 50 are placed on the terminal patterns 29 and 29 of the flexible circuit board 20. At the same time, a pin (not shown) protruding from the first mold 310 side is inserted into the pin insertion port 213 of the current collector plate forming member 210 and positioned.

そして第１金型３１０の前記集電板形成部材２１０等を装着した側の面（紙面の裏面側の面）上に第２金型３３０を載置する。図７に示す点線は、第１金型３１０及び第２金型３３０の概略の外形を示している。図８は第１，第２金型３１０，３３０によって挟持されて形成された１つのキャビティーＣ１（１枚のフレキシブル回路基板２０等を収納している部分）の要部断面図（図７のＤ−Ｄ部分の断面図）である。同図に示すように第１，第２金型３１０，３３０内には前記基体１０成形用（即ち基体１０と同一形状）のキャビティーＣ１が形成される。同時にフレキシブル回路基板２０はその抵抗体パターン２５を形成した側の面をキャビティーＣ１の金型３１０側の内平面Ｃ１１（凸部３１３の上面）に当接し、同時にフレキシブル回路基板２０の端子パターン２９，２９に第一の金属端子５０，５０の端子パターン接続部５１，５１を当接し、さらに同時に集電板４０の基部４１の部分と、キャビティーＣ１の外部に突出している第二の金属端子４３側の部分と、第一の金属端子５０，５０のキャビティーＣ１の外部に突出している実装基板接続部５３側の部分とを金型３１０，３３０によって挟持している。なお端子パターン２９，２９と端子パターン接続部５１，５１が当接している部分の端子パターン接続部５１，５１側の下面は支持突起３１５によって支持されている（支持突起３１５によって図１（ｃ）に示す開口部１９が形成される）。基部４１の部分は金型３１０，３３０に設けた凸部３１３，３３３（基体１０の貫通孔１１と回転体収納部１７を形成するもの）によって挟持されている。以上のように集電板形成部材２１０と回路基板形成部材２３０と端子形成部材２５０とを第１，第２金型３１０，３３０内に装着する工程を金型装着工程という。 And the 2nd metal mold | die 330 is mounted on the surface (surface of the back surface side of a paper surface) by which the said current collection board formation member 210 grade | etc., Of the 1st metal mold | die 310 was mounted | worn. The dotted line shown in FIG. 7 shows the outline of the first mold 310 and the second mold 330. FIG. 8 is a cross-sectional view of the main part of one cavity C1 (portion containing one flexible circuit board 20 or the like) formed by being sandwiched between the first and second molds 310 and 330 (FIG. 7). It is sectional drawing of DD part). As shown in the figure, a cavity C1 for forming the base 10 (that is, the same shape as the base 10) is formed in the first and second molds 310 and 330. At the same time, the surface of the flexible circuit board 20 on which the resistor pattern 25 is formed abuts against the inner plane C11 (the upper surface of the convex portion 313) of the cavity C1 on the mold 310 side, and at the same time, the terminal pattern 29 of the flexible circuit board 20 , 29 abut the terminal pattern connecting portions 51, 51 of the first metal terminals 50, 50, and at the same time, the second metal terminal projecting to the outside of the cavity C1 and the portion of the base 41 of the current collector plate 40 A portion on the 43 side and a portion on the mounting board connecting portion 53 side protruding outside the cavity C 1 of the first metal terminals 50 and 50 are sandwiched by the molds 310 and 330. Note that the lower surfaces of the terminal pattern connection portions 51 and 51 side where the terminal patterns 29 and 29 are in contact with the terminal pattern connection portions 51 and 51 are supported by the support protrusions 315 (FIG. 1C by the support protrusions 315). Is formed). A portion of the base 41 is sandwiched between convex portions 313 and 333 provided on the molds 310 and 330 (which form the through hole 11 of the base body 10 and the rotating body storage portion 17). The process of mounting the current collector plate forming member 210, the circuit board forming member 230, and the terminal forming member 250 in the first and second molds 310 and 330 as described above is referred to as a mold mounting process.

そして金型３３０に設けた樹脂注入口Ｇ１からキャビティーＣ１内に加熱・溶融した熱可塑性の合成樹脂（ナイロン、ＰＰＳ等）を圧入してキャビティーＣ１内を満たす。そしてこの圧入圧力によりフレキシブル回路基板２０は内平面Ｃ１１と第一の金属端子５０，５０の端子パターン接続部５１，５１とに押し付けられた状態のまま冷却・固化される。そして金型３１０，３３０を取り外せば、図９に示すように、各フレキシブル回路基板２０及び集電板４０及び第１の金属端子５０を成形樹脂製の基体１０にインサート成形してなる集電板連結部２１１と回路基板連結部２３１と端子連結部２５１とを伴なった連結部付きの電子部品用基板６０´が形成される。ここでこの第１，第２金型３１０，３３０のキャビティーＣ１内に溶融成形樹脂を満たして固化した後に第１，第２金型３１０，３３０を取り外して連結部付き電子部品用基体６０´を形成する工程を成形工程という。 And the thermoplastic synthetic resin (nylon, PPS, etc.) heated and fuse | melted in the cavity C1 from the resin injection port G1 provided in the metal mold | die 330 is press-fitted, and the cavity C1 is filled. The flexible circuit board 20 is cooled and solidified while being pressed against the inner plane C11 and the terminal pattern connecting portions 51 and 51 of the first metal terminals 50 and 50 by the press-fitting pressure. Then, when the molds 310 and 330 are removed, as shown in FIG. 9, current collector plates formed by insert-molding the flexible circuit boards 20, the current collector plates 40, and the first metal terminals 50 on the base 10 made of molded resin. An electronic component board 60 ′ with a connecting portion accompanied by the connecting portion 211, the circuit board connecting portion 231, and the terminal connecting portion 251 is formed. Here, after the cavity C1 of the first and second molds 310 and 330 is filled with a melt-molded resin and solidified, the first and second molds 310 and 330 are removed, and the electronic component base body 60 ′ with a connecting portion is removed. The process of forming is called a molding process.

そして連結部付き電子部品用基体６０´からフレキシブル回路基板２０の両側の回路基板連結部２３１と、集電板４０の第二の金属端子４３の先端部と、第１の金属端子５０の先端部とを切断して切り離し、電子部品用基体６０を各連結部２１１，２３１，２５１から取り出す。この工程を切り離し工程という。その後図１に示すように基体１０から突出する第１の金属端子５０の先端を上方向に折り曲げれば、個品化された電子部品用基体６０が完成する。 Then, the circuit board connecting portion 231 on both sides of the flexible circuit board 20 from the electronic component base body 60 ′ with the connecting portion, the tip end portion of the second metal terminal 43 of the current collector plate 40, and the tip end portion of the first metal terminal 50. And the electronic component base 60 is taken out from each of the connecting portions 211, 231, and 251. This process is called a separation process. Thereafter, as shown in FIG. 1, when the tip of the first metal terminal 50 protruding from the base 10 is bent upward, the individualized electronic component base 60 is completed.

以上のようにこの実施形態には、フレキシブル回路基板２０を回路基板連結部２３１によって連結してなる回路基板形成部材２３０と、集電板４０を集電板連結部２１１によって連結してなる集電板形成部材２１０と、前記フレキシブル回路基板２０に設けた端子パターン２９上に当接される端子パターン接続部５１を有する第１の金属端子５０を端子連結部２５１によって連結してなる端子形成部材２５０とを用意し、フレキシブル回路基板２０と集電板４０と第１の金属端子５０とを第１，第２金型３１０，３３０内に装着する金型装着工程と、前記第１，第２金型３１０，３３０に形成される基体成型用のキャビティーＣ１内に溶融成形樹脂を満たしてこの溶融成形樹脂が固化した後に前記第１，第２金型３１０，３３０を取り外して連結部付き電子部品用基体６０´を形成する成形工程と、前記連結部付き電子部品用基体６０´の外部に突出している回路基板連結部２３１と集電板連結部２１１と端子連結部２５１とを電子部品用基体６０から切り離す切り離し工程とによって、電子部品用基体６０を製造する構成が開示されている。本実施形態によれば、フレキシブル回路基板２０と集電板４０と端子５０とを何れも回路基板形成部材２３０と集電板形成部材２１０と端子形成部材２５０とに連結した状態のまま第１，第２金型３１０，３３０内に装着するので、例えフレキシブル回路基板２０や集電板４０や端子５０が小型化しても、回路基板形成部材２３０の回路基板連結部２３１や集電板形成部材２１０の集電板連結部２１１や端子形成部材２５０の端子連結部２５１によって容易にフレキシブル回路基板２０や集電板４０や端子５０を第１，第２金型３１０，３３０内へ位置決めして装着することができる。特にフレキシブル回路基板２０は可撓性を有し、また薄くて軽いので、これが小型化すると単品では第１，第２金型３１０，３３０内への装着が困難となるが、回路基板形成部材２３０の回路基板連結部２３１を用いることによってその装着が容易になり、特に効果的である。 As described above, in this embodiment, the circuit board forming member 230 formed by connecting the flexible circuit board 20 by the circuit board connecting portion 231 and the current collector formed by connecting the current collecting plate 40 by the current collecting plate connecting portion 211. A terminal forming member 250 formed by connecting a plate forming member 210 and a first metal terminal 50 having a terminal pattern connecting portion 51 abutted on a terminal pattern 29 provided on the flexible circuit board 20 by a terminal connecting portion 251. A mold mounting step of mounting the flexible circuit board 20, the current collector plate 40, and the first metal terminal 50 in the first and second molds 310 and 330, and the first and second molds. After the base molding cavity C1 formed in the molds 310 and 330 is filled with the melt molding resin and the melt molding resin is solidified, the first and second molds 310 and 330 are removed. A forming step of forming the electronic component base 60 'with a connection portion, a circuit board connecting portion 231, a current collector connecting portion 211, and a terminal connecting portion 251 protruding outside the electronic component base 60' with the connecting portion; The structure which manufactures the base 60 for electronic components by the isolation | separation process which isolate | separates from the base 60 for electronic components is disclosed. According to the present embodiment, the flexible circuit board 20, the current collector plate 40, and the terminal 50 are all connected to the circuit board forming member 230, the current collector plate forming member 210, and the terminal forming member 250. Since they are mounted in the second molds 310 and 330, even if the flexible circuit board 20, the current collector plate 40, and the terminals 50 are downsized, the circuit board connecting portion 231 and the current collector plate forming member 210 of the circuit board forming member 230 are used. The flexible circuit board 20, the current collector plate 40, and the terminal 50 are easily positioned and mounted in the first and second molds 310 and 330 by the current collector plate connecting portion 211 and the terminal connecting portion 251 of the terminal forming member 250. be able to. In particular, since the flexible circuit board 20 is flexible and thin and light, if it is reduced in size, it is difficult to mount the circuit board 20 in the first and second molds 310 and 330 by itself. By using the circuit board connecting portion 231, the mounting becomes easy, which is particularly effective.

またこの実施形態では、前記金型装着工程の前に用意する集電板形成部材２１０の集電板４０に筒状突起４２を設け、一方前記金型装着工程の前に用意する回路基板形成部材２３０のフレキシブル回路基板２０の前記筒状突起４２に対向する位置に筒状突起４２を位置決めする寸法形状の突起挿入孔２１を設け、前記金型装着工程では、集電板４０の筒状突起４２をフレキシブル回路基板２０の突起挿入孔２１に挿入して集電板４０とフレキシブル回路基板２０とを一体化した状態でこれら集電板４０とフレキシブル回路基板２０を第１，第２金型３１０，３３０内に装着する構成が開示されている。即ち金型装着工程の前に一体化した集電板４０とフレキシブル回路基板２０を第１，第２金型３１０，３３０内に装着できるので、集電板４０とフレキシブル回路基板２０とは同時に一度の工程で第１，第２金型３１０，３３０に装着して位置決めでき、従って集電板４０とフレキシブル回路基板２０の第１，第２金型３１０，３３０への装着及び位置決め作業を別々に行う必要がなくなり、第１，第２金型３１０，３３０への各部材の装着時間を短くでき、その分電子部品用基体６０を連続して製造していく際のサイクルタイムを短くでき、製造効率の向上が図れる。また回路基板形成部材２３０には位置決め用のピン挿入口等の位置決め手段を設ける必要がない（集電板形成部材２１０のピン挿入口２１３がこれを兼用する）ので、その分隣接するフレキシブル回路基板２０間の間隔を短くでき、その分隣接する第１の金属端子５０間の間隔と隣接する集電板４０間の間隔も短くでき、その分各部材の材料費の削減が図れる。また一つの電子部品用基体６０を製造するのに必要な金型面積を小さくでき、金型の小型化が図れる（同一の金型面積であれば一度に成形できる電子部品用基体６０の数が増加する）。 In this embodiment, the cylindrical projection 42 is provided on the current collector plate 40 of the current collector plate forming member 210 prepared before the mold mounting step, while the circuit board forming member prepared before the mold mounting step. In the mold mounting step, the cylindrical projection 42 of the current collector plate 40 is provided with a projection insertion hole 21 having a dimension to position the cylindrical projection 42 at a position facing the cylindrical projection 42 of the flexible circuit board 20. Is inserted into the protrusion insertion hole 21 of the flexible circuit board 20, and the current collector plate 40 and the flexible circuit board 20 are integrated into the first and second molds 310, A configuration for mounting within 330 is disclosed. That is, since the current collector plate 40 and the flexible circuit board 20 integrated before the mold mounting step can be mounted in the first and second molds 310 and 330, the current collector plate 40 and the flexible circuit board 20 are once at the same time. In this process, the first and second molds 310 and 330 can be mounted and positioned. Accordingly, the current collector plate 40 and the flexible circuit board 20 can be mounted and positioned on the first and second molds 310 and 330 separately. This eliminates the need to perform the process, shortens the mounting time of each member on the first and second molds 310 and 330, and accordingly shortens the cycle time when the electronic component base 60 is continuously manufactured. Efficiency can be improved. Further, since there is no need to provide positioning means such as a pin insertion port for positioning on the circuit board forming member 230 (the pin insertion port 213 of the current collector plate forming member 210 also serves as this), the adjacent flexible circuit board is accordingly provided. Therefore, the distance between the adjacent first metal terminals 50 and the distance between the adjacent current collector plates 40 can be shortened, and the material cost of each member can be reduced accordingly. In addition, the mold area required to manufacture one electronic component base 60 can be reduced, and the mold can be miniaturized (the number of electronic component bases 60 that can be molded at one time is the same if the mold area is the same). To increase).

〔第１参考例〕
図１０乃至図１３は本発明の第１参考例にかかる電子部品用基体６０−２の製造方法説明図である。この参考例によって製造される電子部品用基体６０−２は、実装基板の上面側から調整する通常の正面調整用の回転式電子部品に用いる電子部品用基体である。
この電子部品用基体６０−２を製造するには、まず図１０に示すように端子形成部材６５０を用意し、点線で示す第１金型（紙面手前側、即ち端子形成部材６５０の手前側にある）６８０内に装着する。端子形成部材６５０は帯状の金属板からなる端子連結部６５１の一辺から一対ずつ連続して略直線状の端子（以下この実施形態では「第一の金属端子」という）５５０を等間隔に突出するように設けて構成されている。端子連結部６５１には第１金型６８０側から立てている図示しない位置決めピンを挿入する円形の開口からなるピン挿入口６５３が等間隔に設けられ、第１金型６８０内に設置する際の位置決めに利用される。各第１の金属端子５５０の先端は端子パターン接続部５５１となっている。 [ First Reference Example ]
10 to 13 are explanatory views of a method for manufacturing the electronic component substrate 60-2 according to the first reference example of the present invention. Electronic component substrate 60-2 made by this reference example is an electronic component substrate for use in conventional rotary electronic components for adjusting the front to adjust the upper surface of the mounting substrate.
In order to manufacture the electronic component base 60-2, first, a terminal forming member 650 is prepared as shown in FIG. 10, and a first mold (on the front side of the paper surface, that is, on the front side of the terminal forming member 650) indicated by a dotted line. It is installed in 680). The terminal forming member 650 projects a pair of substantially linear terminals (hereinafter referred to as “first metal terminals” in this embodiment) 550 at equal intervals continuously from one side of the terminal connecting portion 651 made of a band-shaped metal plate. It is provided and configured as described above. The terminal connecting portion 651 is provided with pin insertion ports 653 each having a circular opening for inserting a positioning pin (not shown) standing from the first mold 680 side at equal intervals, and is installed in the first mold 680. Used for positioning. The tip of each first metal terminal 550 is a terminal pattern connection portion 551.

次に図１１に示すように紙面の奥側から第１金型６８０内に回路基板形成部材６３０を装着する。回路基板形成部材６３０は合成樹脂フイルム製であり、帯状の回路基板連結部６３１の途中に連続してフレキシブル回路基板５２０を形成して構成されている。言い換えれば、回路基板形成部材６３０は回路基板５２０を回路基板連結部６３１によって連結して構成されている。各フレキシブル回路基板５２０は中央に円形の突起挿入孔５２１を有し、その周囲に馬蹄形状の抵抗体パターン５２５を形成し、抵抗体パターン５２５の両端に端子パターン５２９を形成して構成されている。両端子パターン５２９は第１の金属端子５５０の端子パターン接続部５５１に当接している。また回路基板連結部６３１のフレキシブル回路基板５２０とフレキシブル回路基板５２０の間には、それぞれ第１金型６８０側から立てている図示しない位置決めピンを挿入する円形の開口からなるピン挿入口６３３が設けられ、第１金型６８０内に設置する際の位置決めに利用される。ここで回路基板形成部材６３０は各フレキシブル回路基板５２０の外周の突起挿入口５２１を中心とした略１８０°対向する位置に接続される回路基板連結部６３１によって直線状に連結されているので、回路基板形成部材６３０を回路基板連結部６３１によって連結されている方向に向かって引っ張るだけで容易に各フレキシブル回路基板５２０は一列に張られた状態で位置決めされ、従ってたとえフレキシブル回路基板５２０に可撓性があって薄くて軽くて小型化されても、第１金型６８０や第１の金属端子５５０に対して容易に位置決めでき、第１金型６８０への装着作業が容易に行える。 Next, as shown in FIG. 11, a circuit board forming member 630 is mounted in the first mold 680 from the back side of the drawing. The circuit board forming member 630 is made of a synthetic resin film, and is formed by forming a flexible circuit board 520 continuously in the middle of the belt-like circuit board connecting portion 631. In other words, the circuit board forming member 630 is configured by connecting the circuit board 520 by the circuit board connecting portion 631. Each flexible circuit board 520 has a circular protrusion insertion hole 521 at the center, a horseshoe-shaped resistor pattern 525 is formed around the hole, and terminal patterns 529 are formed at both ends of the resistor pattern 525. . Both terminal patterns 529 are in contact with the terminal pattern connection portion 551 of the first metal terminal 550. Further, a pin insertion port 633 comprising a circular opening for inserting a positioning pin (not shown) standing from the first mold 680 side is provided between the flexible circuit board 520 and the flexible circuit board 520 of the circuit board connecting portion 631. And is used for positioning when installing in the first mold 680. Here, the circuit board forming member 630 is linearly connected by a circuit board connecting portion 631 connected to a position facing substantially 180 ° with the protrusion insertion port 521 on the outer periphery of each flexible circuit board 520 as a center. Each flexible circuit board 520 can be easily positioned in a row by simply pulling the board forming member 630 in the direction connected by the circuit board connecting portion 631, and therefore, the flexible circuit board 520 is flexible. Even if it is thin, light, and downsized, it can be easily positioned with respect to the first mold 680 and the first metal terminal 550 and can be easily mounted on the first mold 680.

次に図１２に示すように紙面の奥側から第１金型６８０内に取付部材形成部材（以下この実施形態では「集電板形成部材」という）６１０を装着する。集電板成形部材６１０は帯状の金属板からなる取付部材連結部（以下この実施形態では「集電板連結部」という）６１１の一辺から一本ずつ連続して略直線状の取付部材（以下この実施形態では「集電板」という）５４０を等間隔に突出して構成されている。集電板５４０の先端には略円形の基部５４１が設けられ、その中央から紙面手前側に向かって突起（以下この実施形態では「筒状突起」という）５４２が突出して設けられ、一方集電板５４０の根元側には金属端子（以下「第二の金属端子」という）５４３が設けられている。そして基部５４１はフレキシブル回路基板５２０の裏面側（紙面奥側）に位置し、また筒状突起５４２は開口５２１内を貫通して表面側（紙面手前側）に突出している。この参考例の場合、開口５２１の内径寸法は筒状突起５４２の外径寸法よりも大きく、従って両者間は位置決めされないが、その代りにフレキシブル回路基板５２０はその回路基板連結部６３１に設けたピン挿入口６３３に第１金型６８０側から立てている図示しない位置決めピンを挿入することよって位置決めされ、また集電板５４０はその集電板連結部６１１に設けた円形の開口からなるピン挿入孔６１３に第１金型６８０側から立てている図示しない位置決めピンを挿入することによって位置決めされる。 Next, as shown in FIG. 12, an attachment member forming member (hereinafter referred to as “current collector plate forming member”) 610 is mounted in the first mold 680 from the back side of the drawing. The current collector plate forming member 610 is a substantially linear attachment member (hereinafter, referred to as “current collector plate connection portion” in this embodiment) 611 one by one continuously from one side. In this embodiment, it is configured to project 540 (referred to as “current collector plate”) at equal intervals. A substantially circular base portion 541 is provided at the tip of the current collector plate 540, and a protrusion (hereinafter referred to as a “cylindrical protrusion” in this embodiment) 542 protrudes from the center toward the front side of the paper surface. A metal terminal (hereinafter referred to as “second metal terminal”) 543 is provided on the base side of the plate 540. The base 541 is located on the back side (the back side of the paper) of the flexible circuit board 520, and the cylindrical protrusion 542 penetrates through the opening 521 and protrudes to the front side (the front side of the paper). In the case of this reference example , the inner diameter dimension of the opening 521 is larger than the outer diameter dimension of the cylindrical projection 542, and therefore, they are not positioned, but instead, the flexible circuit board 520 is a pin provided on the circuit board connecting portion 631. The current collector plate 540 is positioned by inserting a positioning pin (not shown) standing from the first mold 680 side into the insertion port 633, and the current collector plate 540 is a pin insertion hole comprising a circular opening provided in the current collector connection portion 611. Positioning is performed by inserting a positioning pin (not shown) standing from the first mold 680 side into 613.

そして紙面奥側から第２金型（第１金型６８０と同じ位置）６９０を載置し、これによって前記端子形成部材６５０と回路基板形成部材６３０と集電板形成部材６１０とを第１，第２金型６８０，６９０で挟持し、その際フレキシブル回路基板５２０の周囲に形成される基体成型用のキャビティー内に溶融成形樹脂を圧入し、冷却固化後に第１，第２金型６８０，６９０を取り外せば、図１３に示すように、第１の金属端子５５０とフレキシブル回路基板５２０と集電板５４０とを一体に基体５１０内にインサート成形してなる連結部付き電子部品用基体６０´−２が完成する。そして図１３に示す状態の連結部付き電子部品用基体６０´−２から端子連結部６５１と回路基板連結部６３１と集電板連結部６１１とをそれぞれ切断して切り離せば、個品化された電子部品用基体６０−２が取り出せる。 Then, a second mold (same position as the first mold 680) 690 is placed from the back side of the page, whereby the terminal forming member 650, the circuit board forming member 630, and the current collecting plate forming member 610 are connected to the first and second terminals. The mold is sandwiched between the second molds 680 and 690, and at that time, a molten molding resin is press-fitted into a base molding cavity formed around the flexible circuit board 520, and after cooling and solidification, the first and second molds 680, If 690 is removed, as shown in FIG. 13, the base 60 'for the electronic part with a connecting portion formed by insert-molding the first metal terminal 550, the flexible circuit board 520, and the current collector plate 540 into the base 510 integrally. -2 is completed. Then, the terminal connecting portion 651, the circuit board connecting portion 631, and the current collector connecting portion 611 are cut and separated from the electronic component base body 60'-2 in the state shown in FIG. The electronic component base 60-2 can be taken out.

以上のようにこの参考例によれば、第１実施形態と同様に、フレキシブル回路基板５２０と集電板５４０と端子５５０とを何れも回路基板形成部材６３０と集電板形成部材６１０と端子形成部材６５０に連結した状態のまま第１，第２金型６８０，６９０内に装着するので、例えフレキシブル回路基板５２０や集電板５４０や端子５５０が小型化しても、回路基板形成部材６３０の回路基板連結部６３１や集電板形成部材６１０の集電板連結部６１１や端子形成部材６５０の端子連結部６５１によって容易にフレキシブル回路基板５２０や集電板５４０や端子５５０を第１，第２金型６８０，６９０内へ位置決めして装着することができる。特にフレキシブル回路基板５２０は可撓性を有し、また薄くて軽いので、これが小型化すると単品では第１，第２金型６８０，６９０内への装着が困難となるが、回路基板形成部材６３０の回路基板連結部６３１を用いることによってその装着が容易になり、特に効果的である。 As described above, according to the reference example , as in the first embodiment, the flexible circuit board 520, the current collector plate 540, and the terminal 550 are all formed of the circuit board forming member 630, the current collector plate forming member 610, and the terminal formation. Since it is mounted in the first and second molds 680 and 690 while being connected to the member 650, even if the flexible circuit board 520, the current collector plate 540 and the terminal 550 are downsized, the circuit of the circuit board forming member 630 The flexible circuit board 520, the current collector plate 540, and the terminal 550 can be easily connected to the first and second gold by the substrate connecting portion 631, the current collector plate connecting portion 611 of the current collector plate forming member 610, and the terminal connecting portion 651 of the terminal forming member 650. The molds 680 and 690 can be positioned and mounted. In particular, since the flexible circuit board 520 is flexible and thin and light, if it is reduced in size, it is difficult to mount it in the first and second molds 680 and 690 by itself. By using the circuit board connecting portion 631, the mounting becomes easy, which is particularly effective.

〔第２参考例〕
図１４，図１５は本発明の第２参考例にかかる電子部品用基体６０−３の製造方法説明図である。この参考例によって製造される電子部品用基体６０−３は、実装基板の上面側から調整する通常の正面調整用の回転式電子部品に用いる電子部品用基体であり、且つ第１実施形態のように集電板や第１の金属端子を取り付けず、基体７１０内に回路基板（以下この参考例では「フレキシブル回路基板」という）７２０のみをインサート成形してなる電子部品用基体６０−３である。 [ Second Reference Example ]
14 and 15 are explanatory views of a method for manufacturing the electronic component substrate 60-3 according to the second reference example of the present invention. Electronic component substrate 60-3 made by this reference example is an electronic component substrate for use in conventional rotary electronic components for adjusting the front to adjust the upper surface of the mounting substrate, and the first implementation embodiment In this way, the electronic component base 60-3 is formed by insert-molding only the circuit board (hereinafter referred to as "flexible circuit board" in this reference example ) 720 in the base 710 without attaching the current collector plate or the first metal terminal. is there.

この電子部品用基体６０−３を製造するには、まず図１４に示すように回路基板形成部材７３０を用意し、点線で示す第１金型（紙面手前側、即ちフレキシブル回路基板７２０の手前側にある）７８０内に装着する。回路基板形成部材７３０は合成樹脂フイルム製であり、帯状の回路基板連結部７３１の途中に連続してフレキシブル回路基板７２０を形成して構成されている。各フレキシブル回路基板７２０は中央に円形の孔７２１を有し、その周囲に円形の集電パターン７２４を形成し、さらにその周囲に馬蹄形状の抵抗体パターン７２５を形成し、集電パターン７２４の外周と抵抗体パターン７２５の両端からそれぞれ端子パターン７２９を引き出して形成されている。各端子パターン７２９は下記する基体７１０の外部に突出するようにフレキシブル回路基板７２０の下部から舌片状に引き出した引出部７２２（引き出し方向は回路基板連結部７３１を接続している方向に直交する方向）上に形成されている。回路基板連結部７３１のフレキシブル回路基板７２０とフレキシブル回路基板７２０の間には、それぞれ第１金型７８０から立てている図示しない位置決めピンを挿入する円形の開口からなるピン挿入口７３３が設けられ、第１金型７８０内に設置する際の位置決めに利用される。ここで回路基板形成部材７３０は各フレキシブル回路基板７２０の外周の１８０°対向する位置に接続される回路基板連結部７３１によって連結されているので、回路基板形成部材７３０を回路基板連結部７３１によって連結されている方向に向かって引っ張るだけで容易に各フレキシブル回路基板７２０は一列に張られた状態で位置決めされ、従ってたとえフレキシブル回路基板７２０に可撓性があっても、第１金型７８０に対して容易に位置決めでき、第１金型７８０への装着作業が容易に行えるようになる。 In order to manufacture the electronic component base 60-3, first, a circuit board forming member 730 is prepared as shown in FIG. 14, and the first mold shown on the dotted line (the front side of the paper surface, that is, the front side of the flexible circuit board 720). In 780). The circuit board forming member 730 is made of a synthetic resin film, and is configured by forming a flexible circuit board 720 continuously in the middle of the belt-like circuit board connecting portion 731. Each flexible circuit board 720 has a circular hole 721 in the center, a circular current collecting pattern 724 is formed around the hole 721, and a horseshoe-shaped resistor pattern 725 is formed around the circular current collecting pattern 724. The terminal pattern 729 is drawn from both ends of the resistor pattern 725, respectively. Each terminal pattern 729 is drawn out in the form of a tongue piece from the lower part of the flexible circuit board 720 so as to protrude to the outside of the base 710 described below (the drawing direction is orthogonal to the direction in which the circuit board connecting part 731 is connected). Direction). Between the flexible circuit board 720 and the flexible circuit board 720 of the circuit board connecting portion 731, there are provided pin insertion ports 733 each having a circular opening for inserting a positioning pin (not shown) standing from the first mold 780. It is used for positioning when installing in the first mold 780. Here, since the circuit board forming member 730 is connected by the circuit board connecting part 731 connected to the position of the outer periphery of each flexible circuit board 720 facing 180 °, the circuit board forming member 730 is connected by the circuit board connecting part 731. Each flexible circuit board 720 is easily positioned in a single line simply by pulling it in the direction in which it is applied, so even if the flexible circuit board 720 is flexible, Therefore, the mounting operation to the first mold 780 can be easily performed.

そして紙面奥側から第２金型（第１金型７８０と同じ位置）７９０を載置し、これによって前記回路基板形成部材７３０を第１，第２金型７８０，７９０で挟持し、その際フレキシブル回路基板７２０の周囲に形成される基体成型用のキャビティー内に溶融成形樹脂を圧入し、冷却固化後に第１，第２金型７８０，７９０を取り外せば、図１５に示すように、フレキシブル回路基板７２０を一体に基体７１０内にインサート成形してなる連結部付き電子部品用基体６０´−３が完成する。そして図１５に示す状態の連結部付き電子部品用基体６０´−３から回路基板連結部７３１を切断して切り離せば、電子部品用基体６０−３が個品化されて取り出せる。この電子部品用基体６０−３はフレキシブル回路基板７２０をその摺接パターンである集電パターン７２４と抵抗体パターン７２５とを露出した状態で基体７１０にインサート成形した構造であり、端子パターン７２９を設けた引出部７２２を基体７１０の外部に引き出し、またその中央にフレキシブル回路基板７２０の孔７２１とその下側に設けた基体７６０の孔７６１とによって貫通孔を形成して構成されている。 Then, a second mold (same position as the first mold 780) 790 is placed from the back side of the page, and thereby the circuit board forming member 730 is sandwiched between the first and second molds 780, 790, As shown in FIG. 15, if the molten molding resin is press-fitted into a base molding cavity formed around the flexible circuit board 720 and the first and second molds 780 and 790 are removed after cooling and solidification, An electronic component base 60'-3 with a connecting portion, which is formed by insert-molding the circuit board 720 into the base 710, is completed. Then, by cutting and separating the circuit board connecting portion 731 from the electronic component base 60′-3 with the connecting portion in the state shown in FIG. 15, the electronic component base 60-3 can be made into an individual product and taken out. The electronic component base 60-3 has a structure in which the flexible circuit board 720 is insert-molded on the base 710 in a state where the current collection pattern 724 and the resistor pattern 725 as the sliding contact patterns are exposed, and a terminal pattern 729 is provided. The lead-out portion 722 is drawn out of the base 710, and a through-hole is formed in the center thereof by a hole 721 of the flexible circuit board 720 and a hole 761 of the base 760 provided therebelow.

以上のようにこの参考例によれば、フレキシブル回路基板７２０を回路基板形成部材７３０に連結した状態のまま第１，第２金型７８０，７９０内に装着するので、例えフレキシブル回路基板７２０が小型化しても、回路基板形成部材７３０の回路基板連結部７３１によって容易にフレキシブル回路基板７２０の第１，第２金型７８０，７９０内への位置決め・装着が行えるようになる。特にフレキシブル回路基板７２０は可撓性を有し、また薄くて軽いので、これが小型化すると単品では第１，第２金型７８０，７９０内への装着が困難となるが、回路基板形成部材７３０の回路基板連結部７３１を用いることによってその装着が容易になり、特に効果的である。 As described above, according to this reference example , since the flexible circuit board 720 is mounted in the first and second molds 780 and 790 while being connected to the circuit board forming member 730, the flexible circuit board 720 is small. Even if the circuit board is formed, the circuit board connecting portion 731 of the circuit board forming member 730 can easily position and mount the flexible circuit board 720 in the first and second molds 780 and 790. In particular, since the flexible circuit board 720 has flexibility and is thin and light, if it is reduced in size, it is difficult to mount it in the first and second molds 780 and 790 by itself. By using the circuit board connecting portion 731, the mounting becomes easy, which is particularly effective.

〔第３参考例〕
図１６，図１７は本発明の第３参考例にかかる電子部品用基体６０−４の製造方法説明図である。この参考例によって製造される電子部品用基体６０−４は、実装基板の上面側から調整する通常の正面調整用の回転式電子部品に用いる電子部品用基体であり、且つ第１実施形態のように集電板を取り付けず、基体８１０内に回路基板（以下この参考例では「フレキシブル回路基板」という）８２０と端子（以下この参考例では「金属端子」という）８５０とをインサート成形してなる電子部品用基体である。 [ Third reference example ]
16 and 17 are explanatory views of a method for manufacturing the electronic component substrate 60-4 according to the third reference example of the present invention. Electronic component substrate 60-4 made by this reference example is an electronic component substrate for use in conventional rotary electronic components for adjusting the front to adjust the upper surface of the mounting substrate, and the first implementation embodiment In this way, a circuit board (hereinafter referred to as “flexible circuit board” in this reference example ) 820 and a terminal (hereinafter referred to as “metal terminal” in this reference example ) 850 are insert-molded in the base 810 without attaching a current collector plate. This is a substrate for electronic parts.

この電子部品用基体６０−４を製造するには、図１６に示すように端子形成部材９５０と回路基板形成部材９３０とを用意し、点線で示す第１金型（紙面手前側、即ち端子８５０の手前側にある）９８０内に装着する。端子形成部材９５０は帯状の金属板からなる端子連結部９５１の一辺から三本ずつ連続して略直線状の金属端子８５０を等間隔に突出するように設けて構成されている。端子連結部９５１には第１金型９８０側から立てている図示しない位置決めピンを挿入する円形の開口からなるピン挿入口９５３が等間隔に設けられ、第１金型９８０内に設置する際の位置決めに利用される。一方回路基板形成部材９３０は合成樹脂フイルム製であり、帯状の回路基板連結部９３１の途中に連続してフレキシブル回路基板８２０を形成して構成されている。各フレキシブル回路基板８２０は中央に円形の孔８２１を有し、その周囲に円形の集電パターン８２４を形成し、さらにその周囲に馬蹄形状の抵抗体パターン８２５を形成し、集電パターン８２４の外周と抵抗体パターン８２５の両端からそれぞれ端子パターン８２９を引き出して形成されている。回路基板連結部９３１のフレキシブル回路基板８２０とフレキシブル回路基板８２０の間には、それぞれ第１金型９８０側から立てている図示しない位置決めピンを挿入する円形の開口からなるピン挿入口９３５が設けられ、第１金型９８０内に設置する際の位置決めに利用される。ここで回路基板形成部材９３０は各フレキシブル回路基板８２０の外周の１８０°対向する位置に接続される回路基板連結部９３１によって連結されているので、回路基板形成部材９３０を回路基板連結部９３１によって連結されている方向に向かって引っ張るだけで容易に各フレキシブル回路基板８２０は一列に張られた状態で位置決めされ、従ってたとえフレキシブル回路基板８２０に可撓性があっても、第１金型９８０に対して容易に位置決めでき、第１金型９８０への装着作業が容易に行える。 In order to manufacture the electronic component base 60-4, as shown in FIG. 16, a terminal forming member 950 and a circuit board forming member 930 are prepared, and a first mold (front side of the paper surface, that is, a terminal 850) indicated by a dotted line is prepared. In 980). The terminal forming member 950 is configured such that approximately three linear metal terminals 850 are continuously projected from the one side of the terminal connecting portion 951 made of a strip-shaped metal plate at regular intervals. The terminal connecting portion 951 is provided with pin insertion ports 953 each having a circular opening for inserting a positioning pin (not shown) standing from the first mold 980 side at equal intervals. Used for positioning. On the other hand, the circuit board forming member 930 is made of a synthetic resin film, and is formed by forming a flexible circuit board 820 continuously in the middle of the belt-like circuit board connecting portion 931. Each flexible circuit board 820 has a circular hole 821 in the center, a circular current collecting pattern 824 is formed around the hole 821, and a horseshoe-shaped resistor pattern 825 is formed around the circular current collecting pattern 824. The terminal pattern 829 is drawn from both ends of the resistor pattern 825, respectively. Between the flexible circuit board 820 and the flexible circuit board 820 of the circuit board connecting portion 931, there is provided a pin insertion port 935 having a circular opening for inserting a positioning pin (not shown) standing from the first mold 980 side. It is used for positioning when installing in the first mold 980. Here, since the circuit board forming member 930 is connected by the circuit board connecting part 931 connected to the outer periphery of each flexible circuit board 820 at a position opposed to 180 °, the circuit board forming member 930 is connected by the circuit board connecting part 931. Each flexible circuit board 820 is easily positioned in a single line simply by pulling in the direction in which the flexible circuit board 820 is stretched. Therefore, even if the flexible circuit board 820 is flexible, the flexible circuit board 820 is positioned relative to the first mold 980. Positioning can be easily performed, and the mounting operation to the first mold 980 can be easily performed.

そして紙面奥側から第２金型（第１金型９８０と同じ位置）９９０を載置し、これによって前記端子形成部材９５０と回路基板形成部材９３０を第１，第２金型９８０，９９０で挟持し、その際フレキシブル回路基板８２０の周囲に形成される基体成型用のキャビティー内に溶融成形樹脂を圧入し、冷却固化後に第１，第２金型９８０，９９０を取り外せば、図１７に示すように、金属端子８５０とフレキシブル回路基板８２０とを一体に基体８６０内にインサート成形してなる連結部付き電子部品用基体６０´−４が完成する。そして図１７に示す状態の連結部付き電子部品用基体６０´−４から端子連結部９５１と回路基板連結部９３１とを切断して切り離せば、個品化された電子部品用基体６０−４が取り出せる。この電子部品用基体６０−４の中央にはフレキシブル回路基板８２０の孔８２１とその下面側に設けた基体８６０の孔８６１とによって貫通孔が形成されている。 Then, a second mold (the same position as the first mold 980) 990 is placed from the back side of the paper surface, whereby the terminal forming member 950 and the circuit board forming member 930 are moved by the first and second molds 980 and 990. FIG. 17 shows a case where the molten mold resin is press-fitted into a base molding cavity formed around the flexible circuit board 820 and the first and second molds 980 and 990 are removed after cooling and solidification. As shown, an electronic component base 60'-4 with a connecting portion is formed by insert-molding a metal terminal 850 and a flexible circuit board 820 into a base 860 integrally. When the terminal connecting portion 951 and the circuit board connecting portion 931 are cut and separated from the electronic component base 60'-4 with the connecting portion in the state shown in FIG. 17, the individualized electronic component base 60-4 is obtained. I can take it out. A through hole is formed in the center of the electronic component base 60-4 by a hole 821 of the flexible circuit board 820 and a hole 861 of the base 860 provided on the lower surface side thereof.

以上のようにこの参考例によれば、フレキシブル回路基板８２０と金属端子８５０を何れも回路基板形成部材９３０と端子形成部材９５０に連結した状態のまま第１，第２金型９８０，９９０内に装着するので、例えフレキシブル回路基板８２０や金属端子８５０が小型化しても、回路基板形成部材９３０の回路基板連結部９３１や端子形成部材９５０の端子連結部９５１によって容易にフレキシブル回路基板８２０や金属端子８５０を第１，第２金型９８０，９９０内へ位置決めして装着できるようになる。特にフレキシブル回路基板８２０は可撓性を有し、また薄くて軽いので、これが小型化すると単品では第１，第２金型９８０，９９０内への装着が困難となるが、回路基板形成部材９３０の回路基板連結部９３１を用いることによってその装着が容易になり、特に効果的である。 As described above, according to this reference example , the flexible circuit board 820 and the metal terminal 850 are both connected to the circuit board forming member 930 and the terminal forming member 950 in the first and second molds 980 and 990. Even if the flexible circuit board 820 and the metal terminal 850 are downsized, the flexible circuit board 820 and the metal terminal can be easily formed by the circuit board connecting portion 931 of the circuit board forming member 930 and the terminal connecting portion 951 of the terminal forming member 950 even if the size is reduced. The 850 can be positioned and mounted in the first and second molds 980 and 990. In particular, since the flexible circuit board 820 is flexible and thin and light, if it is reduced in size, it is difficult to mount it in the first and second molds 980 and 990 by itself. By using the circuit board connecting portion 931, the mounting becomes easy, which is particularly effective.

本発明は、回路基板と取付部材を基体内にインサート成形してなる電子部品用基体にも適用できる。即ち例えば第２参考例においてフレキシブル回路基板７２０と共に第１実施形態に示す集電板を基体にインサート成形してもよい。 The present invention can also be applied to a base for electronic parts formed by insert-molding a circuit board and a mounting member in the base. That is, for example, in the second reference example , the current collector plate shown in the first embodiment together with the flexible circuit board 720 may be insert-molded on the base.

以上本発明の実施形態を説明したが、本発明は上記実施形態に限定されるものではなく、特許請求の範囲、及び明細書と図面に記載された技術的思想の範囲内において種々の変形が可能である。なお直接明細書及び図面に記載のない何れの形状・構造・材質であっても、本願発明の作用・効果を奏する以上、本願発明の技術的思想の範囲内である。例えば上記実施形態では集電板４０をフレキシブル回路基板２０に取り付けたが、回路基板に取り付けるのは集電板４０以外の各種取付部材であっても良い。即ち例えば取付部材として、フレキシブル回路基板２０の下面（抵抗体パターン等の摺接パターンを設けていない側の面）に載置する平板状の金属板等からなる補強部材（この場合、補強部材は上記各実施形態の第２の金属端子の機能を有さない）であってもよい。その場合も補強部材の所定位置に筒状突起のような突起を設け、これをフレキシブル回路基板２０に設けた突起挿入孔に挿入してフレキシブル回路基板２０の上面側に突出させ、この突起を摺動子の回動自在な固定に利用しても良い。 Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea described in the claims and the specification and drawings. Is possible. It should be noted that any shape, structure, and material not directly described in the specification and drawings are within the scope of the technical idea of the present invention as long as the effects and advantages of the present invention are exhibited. For example, although the current collector plate 40 is attached to the flexible circuit board 20 in the above embodiment, various attachment members other than the current collector board 40 may be attached to the circuit board. That is, for example, as a mounting member, a reinforcing member made of a flat metal plate or the like placed on the lower surface of the flexible circuit board 20 (the surface on which the sliding pattern such as the resistor pattern is not provided) (in this case, the reinforcing member is (It does not have the function of the second metal terminal of each of the above embodiments). Also in this case, a projection such as a cylindrical projection is provided at a predetermined position of the reinforcing member, and this projection is inserted into a projection insertion hole provided in the flexible circuit board 20 so as to project to the upper surface side of the flexible circuit board 20, and the projection is slid. It may also be used for rotating the moving element.

また上記実施形態においては、回路基板としてフレキシブル回路基板２０を用いたが、硬質の回路基板であっても良い。また上記実施形態では集電板４０に設けた筒状突起を回路基板の端子挿入孔に挿入した例を示したが、筒状突起は筒状でない棒状の突起等、他の各種構造の突起であっても良く、さらに取付部材はピンのような取付部材の略全体形状が突起のみを構成する部材であっても良い。また上記実施形態では摺接パターンとして抵抗体パターンや集電パターンを用いたが、摺接パターンはスイッチパターン等の他の各種摺接パターンでも良い。さらにこの実施形態では回路基板として回転式電子部品用の摺接パターンを有する回路基板を用いたが、本発明は他の各種電子部品用として用いることができ、回路基板に必ずしも摺接パターンのないものであっても良く、要は基板上に回路を形成した回路基板であればどのような構造のものであっても良い。 Moreover, in the said embodiment, although the flexible circuit board 20 was used as a circuit board, a rigid circuit board may be sufficient. In the above embodiment, the cylindrical projection provided on the current collector plate 40 is inserted into the terminal insertion hole of the circuit board. However, the cylindrical projection is a projection of various other structures such as a rod-shaped projection that is not cylindrical. Further, the attachment member may be a member in which the substantially entire shape of the attachment member such as a pin constitutes only a projection. In the above embodiment, the resistor pattern and the current collection pattern are used as the sliding contact pattern. However, the sliding contact pattern may be other various sliding contact patterns such as a switch pattern. Further, in this embodiment, a circuit board having a sliding contact pattern for a rotary electronic component is used as the circuit board. However, the present invention can be used for various other electronic components, and the circuit board does not necessarily have a sliding contact pattern. In short, the circuit board may have any structure as long as the circuit board is formed on the board.

電子部品用基体６０を示す図であり、図１（ａ）は平面図、図１（ｂ）は図１（ａ）のＡ−Ａ断面図、図１（ｃ）は裏面図である。FIG. 1A is a plan view, FIG. 1B is a cross-sectional view taken along line AA of FIG. 1A, and FIG. 1C is a back view. 電子部品用基体６０を用いた回転式可変抵抗器１を示す断面図である。It is sectional drawing which shows the rotary variable resistor 1 using the base | substrate 60 for electronic components. 回転式可変抵抗器１の実装基板１１０への取付構造を示す断面図である。It is sectional drawing which shows the attachment structure to the mounting board | substrate 110 of the rotary variable resistor 1. FIG. 電子部品用基体６０の製造方法説明図である。It is explanatory drawing of the manufacturing method of the base | substrate 60 for electronic components. 電子部品用基体６０の製造方法説明図である。It is explanatory drawing of the manufacturing method of the base | substrate 60 for electronic components. 電子部品用基体６０の製造方法説明図である。It is explanatory drawing of the manufacturing method of the base | substrate 60 for electronic components. 電子部品用基体６０の製造方法説明図である。It is explanatory drawing of the manufacturing method of the base | substrate 60 for electronic components. 電子部品用基体６０の製造方法説明図である。It is explanatory drawing of the manufacturing method of the base | substrate 60 for electronic components. 電子部品用基体６０の製造方法説明図である。It is explanatory drawing of the manufacturing method of the base | substrate 60 for electronic components. 電子部品用基体６０−２の製造方法説明図である。It is explanatory drawing of the manufacturing method of the base | substrate 60-2 for electronic components. 電子部品用基体６０−２の製造方法説明図である。It is explanatory drawing of the manufacturing method of the base | substrate 60-2 for electronic components. 電子部品用基体６０−２の製造方法説明図である。It is explanatory drawing of the manufacturing method of the base | substrate 60-2 for electronic components. 電子部品用基体６０−２の製造方法説明図である。It is explanatory drawing of the manufacturing method of the base | substrate 60-2 for electronic components. 電子部品用基体６０−３の製造方法説明図である。It is manufacturing method explanatory drawing of the base | substrate 60-3 for electronic components. 電子部品用基体６０−３の製造方法説明図である。It is manufacturing method explanatory drawing of the base | substrate 60-3 for electronic components. 電子部品用基体６０−４の製造方法説明図である。It is explanatory drawing of the manufacturing method of the base | substrate 60-4 for electronic components. 電子部品用基体６０−４の製造方法説明図である。It is explanatory drawing of the manufacturing method of the base | substrate 60-4 for electronic components.

Explanation of symbols

１０基体
２０フレキシブル回路基板（回路基板）
２１突起挿入孔
２５抵抗体パターン（摺接パターン）
２９端子パターン
４０集電板（取付部材）
４２筒状突起（集電板）
５０第一の金属端子（端子）
５１端子パターン接続部
６０電子部品用基体
６０´ 連結部付きの電子部品用基板
８０回転体
２１０集電板形成部材（取付部材形成部材）
２１１集電板連結部（取付部材連結部）
２３０回路基板形成部材
２３１回路基板連結部
２５０端子形成部材
２５１端子連結部
３１０第１金型（金型）
３３０第２金型（金型）
Ｃ１キャビティー 10 substrate 20 flexible circuit board (circuit board)
21 Protrusion insertion hole 25 Resistor pattern (sliding contact pattern)
29 Terminal pattern 40 Current collector plate (Mounting member)
42 Cylindrical protrusion (collector plate)
50 First metal terminal (terminal)
51 Terminal Pattern Connection Unit 60 Electronic Component Base 60 ′ Electronic Component Substrate 80 with Connecting Portion Rotating Body 210 Current Collector Forming Member (Mounting Member Forming Member)
211 Current collector connecting part (mounting member connecting part)
230 Circuit board forming member 231 Circuit board connecting part 250 Terminal forming member 251 Terminal connecting part 310 First mold (mold)
330 Second mold (mold)
C1 cavity

Claims

In a method for manufacturing a substrate for electronic components, in which a circuit board and a mounting member are insert-molded in a molded resin substrate,
Preparing a circuit board forming member formed by connecting the circuit boards by a circuit board connecting portion, and an attachment member forming member formed by connecting the mounting member by an attaching member connecting portion ;
A mold mounting step of mounting the circuit board and the mounting member in a mold;
A molding step for filling a melt molding resin in a base molding cavity formed in the mold and solidifying the melt molding resin to form a base for an electronic component with a connecting part after removing the mold,
A step of separating the circuit board connecting portion protruding from the electronic component base with the connecting portion and the attachment member connecting portion from the electronic component base, and manufacturing the electronic component base .
Further, the mounting member of the mounting member forming member prepared before the mold mounting step is provided with a protrusion that is rotatably inserted into an opening of a rotating body installed on the electronic component base, while the mold mounting A protrusion insertion hole having a dimension for positioning the protrusion is provided at a position facing the protrusion of the circuit board of the circuit board forming member prepared before the process,
In the mold mounting step, the protrusion of the mounting member is inserted into the protrusion insertion hole of the circuit board, and the circuit board and the mounting member are mounted in the mold in a state where the mounting member and the circuit board are integrated. A manufacturing method of a substrate for electronic parts.

Before the mold mounting step, together with the circuit board forming member and the mounting member forming member, a terminal having a terminal pattern connecting portion that is brought into contact with a terminal pattern provided on the circuit board is connected by a terminal connecting portion. Prepare a terminal forming member
The terminal is also mounted in the mold together with the circuit board and the mounting member during the mold mounting step,
Claim 1, characterized in that disconnecting said disconnecting circuit board connecting part which protrudes to the outside of the connecting portion with an electronic component substrate during the process and the mounting member coupling portion and the terminal connecting portion from the electronic component substrate Of manufacturing a substrate for electronic parts.