JP2004087709A - Method for forming terminal fixing part to substrate - Google Patents

Method for forming terminal fixing part to substrate Download PDF

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Publication number
JP2004087709A
JP2004087709A JP2002245516A JP2002245516A JP2004087709A JP 2004087709 A JP2004087709 A JP 2004087709A JP 2002245516 A JP2002245516 A JP 2002245516A JP 2002245516 A JP2002245516 A JP 2002245516A JP 2004087709 A JP2004087709 A JP 2004087709A
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Japan
Prior art keywords
terminal
substrate
terminal fixing
mold
fixing
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JP2002245516A
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Japanese (ja)
Inventor
Shigeaki Kinoshita
木下 茂明
Daisuke Makino
牧野 大介
Mitsuru Hosokawa
細川 充
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Teikoku Tsushin Kogyo Co Ltd
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Teikoku Tsushin Kogyo Co Ltd
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Priority to JP2002245516A priority Critical patent/JP2004087709A/en
Publication of JP2004087709A publication Critical patent/JP2004087709A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for forming a terminal fixing part for a substrate, which can surely bring each terminal into contact with each terminal connecting pattern even when a pitch interval is narrow and which can form the terminal fixing part without fault. <P>SOLUTION: The method for forming the terminal fixing part to the substrate includes the steps of housing a flexible substrate (substrate) 10 and a terminal 20 brought into contact with the terminal connecting pattern provided in parallel with the substrate 10 in molds (first and second molds) A1, A2 for molding the terminal fixing part, injecting a molten resin in cavities C1, C2 provided on the peripheries of the contact of the terminal 20 with the substrate 10 to mold the terminal fixing part 30. When the substrate 10 and the terminal 20 are housed in the molds A1, A2, a distal end of the terminal 20 and the substrate 10 are sandwiched from both sides between pressing parts 80, 100 provided at the molds A1, A2. The terminal 20 is positioned by a first positioning part 89 provided at an outer part of the cavity C1 of the mold A1. <P>COPYRIGHT: (C)2004,JPO

Description

【0001】
【発明の属する技術分野】
本発明は、フレキシブル基板等の基板の端子接続パターンに金属端子等の端子を当接してその周囲を樹脂製の端子固定部で固定するのに用いて好適な基板への端子固定部成形方法に関するものである。
【0002】
【従来の技術】
従来、フレキシブル基板に金属板製の端子を取り付けることが行なわれている。図12はこの種の端子接続部分300の一例を示す図であり、図12(a)は上側から見た斜視図、図12(b)は下側から見た斜視図、図13はその平面図、図14は図13のa−a断面図である。これらの図に示すようにフレキシブル基板310と端子320は両者の当接部分の周囲を端子固定部330で覆うことで構成されている。ここで図15,図16,図17はフレキシブル基板310と端子320とを端子固定部330によって固定する方法を示す図である。なお図17は前記図14と同一部分の断面図である。フレキシブル基板310と端子320とを端子固定部330によって固定するには、まず図15に示すように、端辺に複数の端子接続パターン311を並列に引き出したフレキシブル基板310と、前記各端子接続パターン311と同一ピッチに配列され連結部315によって連結された複数本の金属板製の端子320とを用意する。次に図16に示すようにフレキシブル基板310の各端子接続パターン311上にそれぞれ端子320の一端を当接する。次に図17に示すように前記フレキシブル基板310と端子320の当接部分の上下を第一,第二金型a1,a2で挟持し、第一,第二金型a1,a2によって形成されるキャビティーc1,c2内にピンゲートpから溶融モールド樹脂を充填して満たす。そしてモールド樹脂が固化した後に第一,第二金型a1,a2を取り外せば、図12乃至図14に示すようなフレキシブル基板310と端子320とが端子固定部330によって固定された端子接続部分300が構成される。なお最終的には図13に示すe−e線の部分で連結部315を切り離す。
【0003】
ところでフレキシブル基板310と端子320とを接合した部分を第一,第二金型a1,a2によって挟持した際、図17に示すように、端子320の先端部321とフレキシブル基板310との接合部分は、第一,第二金型a1,a2にそれぞれ設けた押圧部380,400によって挟持される。これは端子320とフレキシブル基板310との接合部分の間に成形時のモールド樹脂が入り込まないように、端子320とフレキシブル基板310との接合部分を強固に圧接しておくためである。そして端子320先端に当接してこれを押圧する押圧部380の下面(押圧面)は並列に並ぶ複数本の端子320の先端部全体を同時に押圧するようにフレキシブル基板310の幅方向(図17の紙面手前奥方向)に平面状で長尺に設けられている。
【0004】
しかしながら、端子固定部330の小型化によって各端子接続パターン311間のピッチとこれらに当接する各端子320間のピッチとが狭くなると、各端子接続パターン311に各端子320を当接して第一,第二金型a1,a2内に収納する際に、各端子320が少しでも曲がると隣の端子接続パターン311に当接してしまい、不良品になってしまう恐れがあった。また第一,第二金型a1,a2内で各端子320が正確に対向する各端子接続パターン311に当接していても、押圧部380,400による挟持力だけでは端子320が溶融樹脂の注入圧力によって移動させられ、同様の問題が生じる恐れもあった。これらの問題は前記ピッチが狭くなればなるほど大きくなる。
【0005】
【発明が解決しようとする課題】
本発明は上述の点に鑑みてなされたものでありその目的は、たとえピッチ間隔が狭くても、各端子接続パターンに各端子を確実に当接させることができて不良品なく端子固定部を成形することができる基板への端子固定部成形方法を提供することにある。
【0006】
【課題を解決するための手段】
上記問題点を解決するため本発明にかかる基板への端子固定部成形方法は、基板と、この基板に並列に設けた端子接続パターン上に当接した端子とを端子固定部成形金型内に収納し、前記端子と端子接続パターンとの当接部分の周囲に設けた前記端子固定部成形金型のキャビティー内に溶融樹脂を注入することで前記当接部分の周囲に端子固定部を成形する基板への端子固定部成形方法において、前記端子固定部成形金型内に基板と端子とを収納した際に、前記端子固定部成形金型に設けた押圧部によって前記端子の先端部分と基板間をその両側から挟持するとともに、端子固定部成形金型のキャビティーの外部に設けた第一位置決め部によって端子を位置決めすることを特徴とする。
【0007】
また本発明は、前記端子固定部成形金型内に基板と端子とを収納した際に、前記端子固定部成形金型の押圧部の前記端子が当接する部分に設けた第二位置決め部によって端子の先端部分を位置決めすることを特徴とする。
【0008】
また本発明は、基板と、この基板に並列に設けた端子接続パターン上に当接した端子とを端子固定部成形金型内に収納し、前記端子と端子接続パターンとの当接部分の周囲に設けた前記端子固定部成形金型のキャビティー内に溶融樹脂を注入することで前記当接部分の周囲に端子固定部を成形する基板への端子固定部成形方法において、前記端子は連結部の対向する両側辺から二組突出するように設けられ、一方前記基板を二組用意し、さらに前記端子固定部成形金型には二組のキャビティーを設け、二組の端子の先端を二組の基板のそれぞれの端子接続パターン上に当接したものを前記端子固定部成形金型内に収納し、これら両当接部分の周囲に設けた前記端子固定部成形金型のキャビティー内に溶融樹脂を注入することで前記両当接部分の周囲にそれぞれ端子固定部を成形することを特徴とする。
【0009】
また本発明は、前記端子の端子固定部から突出している部分に設けられる屈曲部が、前記端子固定部を成形する前の平板状の端子に予め設けられることを特徴とする。
【0010】
【発明の実施の形態】
以下、本発明の実施の形態を図面を参照して詳細に説明する。
図1は本発明に用いる端子固定部成形金型(以下「第一,第二金型」という)A1,A2によって製造されたフレキシブル基板10の端子接続部分1を示す図であり、図1(a)は上側から見た斜視図、図1(b)は下側から見た斜視図である。また図2はその平面図、図3は図2のA−A断面図である。これらの図に示すように端子接続部分1は、フレキシブル基板10と端子20の当接部分の周囲を樹脂製の端子固定部30で覆う構造に構成されている。
【0011】
ここで図4,図5,図6は端子接続部分1の製造方法を示す図である。端子接続部分1を製造するには、まず図4に示すように、一端辺に複数の端子接続パターン13を並列に引き出したフレキシブル基板10と、前記各端子接続パターン13と同一ピッチに配列され連結部25によって連結された複数本の金属板製の硬質の端子20とを用意する。フレキシブル基板10は回路パターン15の先端に前記各端子接続パターン13を設けているが、回路パターン15の部分は絶縁層17によって覆われている。またフレキシブル基板10の端子接続パターン13の間の部分には五つの貫通孔19が設けられ、さらにその両側には二つの貫通孔21が設けられている。一方連結部25には位置決め孔27が設けられている。
【0012】
そして図5に示すように、フレキシブル基板10の各端子接続パターン13上にそれぞれ端子20の一端を当接する。次に図6に示すようにフレキシブル基板10と端子20の当接部分の上下を第一,第二金型A1,A2で挟持する。そして第一,第二金型A1,A2によって形成されるキャビティーC1,C2内にピンゲートPから溶融モールド樹脂を充填して満たし、モールド樹脂が固化した後に第一,第二金型A1,A2を取り外す。なおフレキシブル基板10と端子20の間に成形時のモールド樹脂が入り込まないようにするため、第一,第二金型A1,A2にそれぞれ設けた押圧部80,100が、フレキシブル基板10と端子20の先端部との間を挟持している。
【0013】
これによって図1乃至図3に示すようなフレキシブル基板10と端子20の当接部分の周囲を端子固定部30で覆った構造の端子接続部分1が完成する。なお最終的には図2に示すE−E線の部分で連結部25を切り離す。
【0014】
以上のようにして製造された端子固定部30は、図2に示すように端子接続パターン13と端子20の先端との各当接部分間を仕切り部31によって仕切っている。仕切り部31を設けるのは端子接続パターン13と端子20先端との当接部分近傍において露出する端子接続パターン13同士間でマイグレーションが生じるのを防止するためと、端子固定部30によるフレキシブル基板10と端子20間の固定強度を補強するためとである。なお仕切り部31の先端には各仕切り部31を連結する連結部33が設けられ、この連結部33と各仕切り部31によって仕切られた部分が凹部35となっている。
【0015】
一方図1(b)に示すように、端子固定部30の下面側の前記仕切り部31に対向する位置にも仕切り部41が設けられ、さらに仕切り部41の先端から少し内側部分には各仕切り部41を連結する連結部43が設けられ、これによって凹部45が形成されている。なお図4に示す五つの貫通孔19は端子固定部30を構成するモールド樹脂をフレキシブル基板10の上下で連結するためのものであり、また図4に示す貫通孔21,21は、図1に示す端子固定部30に設けた貫通する取付孔37,37になるものである。
【0016】
次に前記図6に示した第一,第二金型A1,A2の構造について詳しく説明する。図7は前記図6に示す第一金型A1をその下面を上に向けて示す分解斜視図である。同図に示すように第一金型A1は、二つの金型部A1−1,A1−2を接合することで構成される。一方の金型部A1−1は、その上面に前記図6に示すキャビティーC1を設け、キャビティーC1内には一列に前記図6に示す押圧部80が設けられている。並列に設置された各押圧部80の間にはそれぞれ凹状の隙間82が設けられ、この隙間82が前記図1に示す仕切り部31を形成する。そして各押圧部80の上面(端子当接面)には、それぞれ端子30の先端部分を載置する凹状の段部84が設けられている。
【0017】
さらにキャビティーC1内の前記一列に配置した押圧部80の両側には、前記フレキシブル基板10の貫通孔21,21(図5参照)を挿入する突起87,87が設けられ、またキャビティーC1の外部の面上には各端子30の根元側(連結部25側)の部分を位置決めする直線状の溝からなる第一位置決め部89と、端子30の位置決め孔27(図5参照)に挿入される位置決め突起91とが設けられている。
【0018】
一方金型部A1−2は、前記金型部A1−1の押圧部80を設けた側の側面に接合する形状を有し、その上面にはフレキシブル基板10挿入用の凹状の挿入部93が設けられている。なお金型部A1−1に金型部A1−2を接合した際、金型部A1−1の押圧部80の側面と金型部A1−2のこれに対向する側面の間には、前記図1に示す連結部33を形成するためのキャビティー(隙間)C1´(図6参照)が形成される。
【0019】
次に図8は前記図6に示す第二金型A2を示す分解斜視図である。同図に示すように第二金型A2は、二つの金型部A2−1,A2−2を接合することで構成される。一方の金型部A2−1は、その上面に前記図6に示すキャビティーC2を設け、キャビティーC2内には一列に前記図6に示す押圧部100が設けられている。並列に設置された各押圧部100の間にはそれぞれ凹状の隙間102が設けられ、この隙間102が前記図1に示す仕切り部41を形成する。また各押圧部100の上面には横方向に横切る溝104が設けられ、この溝104が前記図1に示す連結部43を形成する。
【0020】
さらにキャビティーC2内の前記一列に配置した押圧部100の両側には、前記図7に示す第一金型A1の突起87,87を挿入する穴107,107が設けられ、またキャビティーC2の外部の面上には前記第一金型A1の位置決め突起91を挿入する位置決め穴109が設けられている。
【0021】
一方金型部A2−2は、前記金型部A2−1の押圧部100を設けた側の側面に接合する形状を有している。
【0022】
そして図9に示すように、図7に示す金型部A1−1と金型部A1−2を接合して第一金型A1を構成した上で、図10に示すように第一金型A1上に端子20を載置する。その際各端子20の先端部分を押圧部80上面に設けた各段部84(図7参照)に載置する。またこのとき各端子20の根元側部分は第一金型A1上に設けた各第一位置決め部89に挿入されるので、各端子20は第一金型A1上の定位置に正確に配置され、また以後の工程でモールド樹脂を成形する際もモールド樹脂の圧力によってその位置が曲げられることもない。また連結部25に設けた位置決め孔27には位置決め突起91が挿入されるので、各端子20全体の位置が正確に位置決めされる。
【0023】
次に図11に示すように前記第一金型A1の挿入部93内にフレキシブル基板10を端子接続パターン13を下面にして載置する。このときフレキシブル基板10の貫通孔21,21には第一金型A1の突起87,87が挿入される。
【0024】
そして図11に示すようにこの第一金型A1の上面に、図8に示す金型部A2−1と金型部A2−2とを接合して裏返したものを載置する。このとき突起87は穴107に係合し、位置決め突起91は位置決め穴109に係合する。これによって図6に示すように第一,第二金型A1,A2によってフレキシブル基板10と端子20とが挟持され、前述の方法によって端子固定部30が成形されるのである。
【0025】
図18は本発明に用いる他の構造の第一金型A1´(A1−1´,A1−2´)の分解斜視図である。この第一金型A1´において前記図7に示す第一金型A1と相違する点は、図7に示す金型部A1−1の押圧部80の上面に設けた段部84の代わりに、端子30の先端部分を載置する凹状の溝からなる第二位置決め部83を設けた点と、各端子20を押圧する各押圧部80をそれぞれ分離独立して棒状に設け、それぞれ分離独立に形成された押圧部80を全て接合一体化したものを金型部A1−1内に組み込んだ点のみである。
【0026】
そしてこの第一金型A1´上に端子20を載置すると、図19に示すように各端子20の先端部分が各第二位置決め部83内に係止され、同時に前述のように第一位置決め部89によってキャビティーC1の外部において各端子20が位置決めされるので、さらに各端子20の位置決めが確実になり、好適である。
【0027】
ここでこの第一金型A1´において押圧部80を複数の押圧部80に分離独立させたのは以下の理由による。即ち各押圧部80の間の隙間82は各端子30のピッチ間隔が小さくなるとかなり狭くなるので、もし前記複数の押圧部80を1つの金属の塊を加工することで形成すると、その加工が極めて困難になるからである。またもし各押圧部80を1つの金属の塊を加工することで形成すると、その一部だけに破損などの不都合が生じた場合でも再びその全体を作りなおさなければならないが、本実施形態の場合は破損した一つの押圧部80のみの取り換えだけで済むからである。この理由から同様に図20に示すように、第二金型A2´(A2−1´,A2−2´)の押圧部100も前記押圧部80と同様に押圧する各端子20にそれぞれ対応して棒状に分離独立して設け、それぞれ分離独立に形成された押圧部100を全て接合一体化したものを金型部A2−1内に組み込むことで構成してもよい。
【0028】
なおこの実施形態では第一,第二金型A1,A2の両者の押圧部80,100を、何れも複数の押圧部80,100に分離独立に形成したが、何れか一方の金型A1又はA2の押圧部80又は100のみを複数に分離独立に形成してもよい。特に各金属端子20の先端部分に当接する側の押圧部80を複数の押圧部80に分離独立に形成すれば、これら押圧部80には端子20の先端部分を係止する第二位置決め部83が設けられているので破損の恐れが大きく、取り換えなどのことを考慮すると好適である。
【0029】
図21は本発明のさらに他の実施形態にかかる端子接続部分1″の製造方法の説明図である。この実施形態においては、端子20″,20″は連結部28″の対向する両側辺から二組突出するように設けられ、一方フレキシブル基板10″,10″を二組用意し、さらに端子固定部成形金型を構成する第一金型A1″には二組のキャビティーC1″,C1″を設け、二組の端子20″,20″の先端を二組のフレキシブル基板10″,10″の下面に設けたそれぞれの端子接続パターン上に当接したものを第一金型A1″内に収納し、図示はしないがこの第一金型A1″に対応する第二金型を第一金型A1″上に載置して前記二組のフレキシブル基板10″,10″と端子20″,20″とを第一,第二金型内に挟持・収納し、前記二組のフレキシブル基板10″,10″と端子20″,20″の当接部分の周囲に設けたキャビティー内に溶融樹脂を注入し、溶融樹脂が硬化した後に、第一,第二金型を取り外すことで、図22に示すように、二組のフレキシブル基板10″,10″と端子20″,20″の当接部分へそれぞれ端子固定部30″,30″を成形したものが得られる。そして最終的には図22に示す矢印E,E部分で端子20″,20″をカットする。
【0030】
この実施形態によって製造される端子接続部分1″,1″の場合、端子20″,20″の端子固定部30″,30″から突出している部分を端子固定部30″,30″の一方の面とほぼ同一面に位置するように屈曲する屈曲部29″,29″を具備している。そしてこの実施形態において端子20″,20″の端子固定部30″,30″から突出している部分に設けられる屈曲部29″,29″は、前記端子固定部30″,30″を成形する前の平板状の端子20″,20″の状態のときに予め設けられている。屈曲部29″,29″を平板状の端子20″,20″の状態のときに予め設けたのは、端子20″を端子固定部30″に取り付けた後に屈曲させるよりも、端子20″のみのときに屈曲させたものに端子固定部30″を成形した方が容易に屈曲部29″を形成できるからである。またこの実施形態のように二組の端子固定部30″,30″を同時に成形しようとする場合は、対向する二組の端子20″,20″に予め屈曲部29″,29″を設けることで、両者の間隔を狭め、これによって第一,第二金型の小型化を図れるからでもある。
【0031】
以上本発明の実施形態を説明したが、本発明は上記実施形態に限定されるものではなく、特許請求の範囲、及び明細書と図面に記載された技術的思想の範囲内において種々の変形が可能である。なお直接明細書及び図面に記載がない何れの形状や構造や材質であっても、本願発明の作用・効果を奏する以上、本願発明の技術的思想の範囲内である。例えば上記実施形態では基板としてフレキシブル基板10を用いたが、硬質基板を用いてもよい。また基板は各種パターンを形成した基板であればどのような用途に用いる基板でもよく、例えば基板に形成されるパターンが回路パターンでなく、スイッチパターンや可変抵抗器用パターン等であり、これらパターンから引き出した端子接続パターンに端子を固定する部分にも本発明を適用できる。
【0032】
【発明の効果】
以上詳細に説明したように本発明によれば以下のような優れた効果を有する。
▲1▼端子固定部成形金型に設けた第一位置決め部によってキャビティーの外部において端子を位置決めするように構成したので、各端子接続パターンに各端子を確実に当接させることができて不良品なく端子固定部を成形することができる。
【0033】
▲2▼第二位置決め部によって端子の先端部分を係止するように構成すれば、さらに各端子接続パターンに各端子を確実に当接させることができる。
【0034】
▲3▼連結部の対向する両側辺から突出する二組の端子の先端を二組の基板のそれぞれの端子接続パターン上に当接したものを端子固定部成形金型内に収納して両当接部分の周囲にそれぞれ端子固定部を成形したので、製造効率が向上する。
【0035】
▲4▼端子の端子固定部から突出している部分に設けられる屈曲部を、端子固定部を成形する前の平板状の端子に予め設けたので、端子固定部を成形した後に屈曲部を設ける場合に比べて容易に屈曲部を形成でき、また金型を小型化できる。
【図面の簡単な説明】
【図1】本発明によって製造されたフレキシブル基板10の端子接続部分1を示す図であり、図1(a)は上側から見た斜視図、図1(b)は下側から見た斜視図である。
【図2】端子接続部分1の平面図である。
【図3】図2のA−A断面図である。
【図4】端子接続部分1の製造方法を示す図である。
【図5】端子接続部分1の製造方法を示す図である。
【図6】端子接続部分1の製造方法を示す図である。
【図7】第一金型A1の分解斜視図である。
【図8】第二金型A2の分解斜視図である。
【図9】端子接続部分1の製造方法を示す図である。
【図10】端子接続部分1の製造方法を示す図である。
【図11】端子接続部分1の製造方法を示す図である。
【図12】従来の端子接続部分300の一例を示す図であり、図12(a)は上側から見た斜視図、図12(b)は下側から見た斜視図である。
【図13】従来の端子接続部分300の一例を示す平面図である。
【図14】図13のa−a断面図である。
【図15】端子接続部分300の製造方法を示す図である。
【図16】端子接続部分300の製造方法を示す図である。
【図17】端子接続部分300の製造方法を示す図である。
【図18】本発明に用いる他の構造の第一金型A1´(A1−1´,A1−2´)の分解斜視図である。
【図19】第一金型A1´に端子20を収納した状態を示す図である。
【図20】本発明に用いる他の構造の第二金型A2´(A2−1´,A2−2´)の分解斜視図である。
【図21】本発明のさらに他の実施形態を用いて端子接続部分1″を製造する方法を示す図である。
【図22】端子接続部分1″を製造する方法を示す図である。
【符号の説明】
1 端子接続部分
10 フレキシブル基板(基板)
13 端子接続パターン
15 回路パターン
17 絶縁層
20 端子
30 端子固定部
31 仕切り部
33 連結部
41 仕切り部
43 連結部
A1 第一金型(端子固定部成形金型)
C1 キャビティー
A1−1 金型部
80 押圧部
82 隙間
84 段部
89 第一位置決め部
A1−2 金型部
A2 第二金型(端子固定部成形金型)
C2 キャビティー
A2−1 金型部
100 押圧部
102 隙間
104 溝
P ピンゲート
A2−2 金型部
A1´ 第一金型
A1−1´,A1−2´ 金型部
83 第二位置決め部
A2´ 第二金型
A2−1´,A2−2´ 金型部
10″ フレキシブル基板
20″ 端子
28″ 連結部
29″ 屈曲部
A1″ 第一金型
C1″ キャビティー
30″ 端子固定部
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for forming a terminal fixing portion on a board suitable for use in contacting a terminal such as a metal terminal with a terminal connecting pattern of a substrate such as a flexible substrate and fixing the periphery thereof with a resin terminal fixing portion. Things.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, terminals made of a metal plate are attached to a flexible substrate. FIG. 12 is a view showing an example of this type of terminal connection portion 300, FIG. 12 (a) is a perspective view seen from above, FIG. 12 (b) is a perspective view seen from below, and FIG. FIG. 14 is a sectional view taken along line aa of FIG. As shown in these figures, the flexible substrate 310 and the terminal 320 are configured by covering the periphery of the contact portion between them with the terminal fixing portion 330. Here, FIGS. 15, 16 and 17 are views showing a method of fixing the flexible substrate 310 and the terminal 320 by the terminal fixing portion 330. FIG. FIG. 17 is a sectional view of the same portion as FIG. In order to fix the flexible substrate 310 and the terminal 320 by the terminal fixing part 330, first, as shown in FIG. A plurality of metal plate terminals 320 arranged at the same pitch as 311 and connected by the connecting portion 315 are prepared. Next, as shown in FIG. 16, one end of each terminal 320 is brought into contact with each terminal connection pattern 311 of the flexible substrate 310. Next, as shown in FIG. 17, the upper and lower portions of the contact portion between the flexible substrate 310 and the terminal 320 are sandwiched between the first and second molds a1 and a2, and are formed by the first and second molds a1 and a2. The cavities c1 and c2 are filled with molten mold resin from the pin gate p. If the first and second molds a1 and a2 are removed after the molding resin has solidified, the terminal connection portion 300 where the flexible substrate 310 and the terminal 320 are fixed by the terminal fixing portion 330 as shown in FIGS. Is configured. Finally, the connecting portion 315 is cut off at the line ee shown in FIG.
[0003]
By the way, when the portion where the flexible substrate 310 and the terminal 320 are bonded is sandwiched between the first and second molds a1 and a2, as shown in FIG. , Are held by pressing portions 380 and 400 provided on the first and second molds a1 and a2, respectively. This is for firmly pressing the joint between the terminal 320 and the flexible substrate 310 so that the molding resin during molding does not enter between the joint between the terminal 320 and the flexible substrate 310. The lower surface (pressing surface) of the pressing portion 380 which abuts on the tip of the terminal 320 and presses the same is pressed in the width direction of the flexible substrate 310 (see FIG. 17) so as to simultaneously press the entire tip of the plurality of terminals 320 arranged in parallel. It is provided in a flat shape and long in the front and rear direction of the drawing).
[0004]
However, when the pitch between the terminal connection patterns 311 and the pitch between the terminals 320 that come into contact with the terminal connection patterns 311 become narrow due to the miniaturization of the terminal fixing portion 330, the terminals 320 come into contact with the terminal connection patterns 311 and become first and second. When the terminals 320 are slightly bent at the time of being housed in the second molds a1 and a2, the terminals 320 come into contact with the adjacent terminal connection patterns 311 and may be defective. Also, even if each terminal 320 is in contact with each of the terminal connection patterns 311 that accurately face each other in the first and second molds a1 and a2, the terminal 320 can be injected with molten resin only by the holding force of the pressing portions 380 and 400. It could be moved by pressure, causing the same problem. These problems are exacerbated as the pitch becomes narrower.
[0005]
[Problems to be solved by the invention]
The present invention has been made in view of the above points, and its object is to make it possible to securely contact each terminal with each terminal connection pattern even if the pitch interval is small, and to provide a terminal fixing portion without defective products. An object of the present invention is to provide a method for forming a terminal fixing portion on a substrate that can be formed.
[0006]
[Means for Solving the Problems]
In order to solve the above problems, a method for forming a terminal fixing portion on a substrate according to the present invention comprises: placing a substrate and a terminal abutting on a terminal connection pattern provided in parallel with the substrate in a terminal fixing portion forming die. The terminal fixing portion is formed around the contact portion by injecting a molten resin into the cavity of the terminal fixing portion forming mold provided around the contact portion between the terminal and the terminal connection pattern. In the method for forming a terminal fixing portion on a substrate to be formed, when the substrate and the terminal are housed in the terminal fixing portion forming die, a tip portion of the terminal and the substrate are pressed by a pressing portion provided in the terminal fixing portion forming die. The terminal is sandwiched from both sides thereof, and the terminal is positioned by a first positioning portion provided outside the cavity of the terminal fixing portion molding die.
[0007]
Further, the present invention provides a terminal fixing part forming die, wherein when the substrate and the terminal are accommodated in the terminal fixing part forming die, the terminal of the pressing part of the terminal fixing part forming die is provided by a second positioning part provided in a portion where the terminal abuts. Is characterized in that the tip portion of the is positioned.
[0008]
Further, according to the present invention, a substrate and a terminal abutting on a terminal connection pattern provided in parallel with the substrate are housed in a terminal fixing part molding die, and a periphery of the contact portion between the terminal and the terminal connection pattern is provided. In a method for forming a terminal fixing portion on a substrate, the terminal fixing portion is formed around the abutting portion by injecting a molten resin into a cavity of the terminal fixing portion forming mold provided in the terminal fixing portion. Are provided so as to protrude from two opposing sides of the terminal, while two sets of the substrates are prepared, two sets of cavities are provided in the terminal fixing part molding die, and the tips of the two sets of terminals are connected to each other. The parts of the set of substrates that abut on the respective terminal connection patterns are housed in the terminal fixing part molding die, and are placed in the cavities of the terminal fixing part molding dies provided around these contact parts. By injecting molten resin, the two contact parts Characterized by each molding the terminal fixing portion around.
[0009]
Further, the present invention is characterized in that a bent portion provided at a portion protruding from the terminal fixing portion of the terminal is provided in advance on a flat terminal before the terminal fixing portion is formed.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a view showing a terminal connection portion 1 of a flexible substrate 10 manufactured by terminal fixing portion forming dies (hereinafter, referred to as “first and second dies”) A1 and A2 used in the present invention. 1A is a perspective view as viewed from above, and FIG. 1B is a perspective view as viewed from below. 2 is a plan view thereof, and FIG. 3 is a sectional view taken along line AA of FIG. As shown in these drawings, the terminal connection portion 1 is configured to cover the periphery of the contact portion between the flexible substrate 10 and the terminal 20 with a terminal fixing portion 30 made of resin.
[0011]
Here, FIGS. 4, 5, and 6 are views showing a method of manufacturing the terminal connection portion 1. FIG. In order to manufacture the terminal connection portions 1, first, as shown in FIG. 4, a flexible substrate 10 having a plurality of terminal connection patterns 13 drawn out in parallel at one end side is connected to the flexible substrate 10 at the same pitch as the terminal connection patterns 13. A plurality of metal plate hard terminals 20 connected by the unit 25 are prepared. The flexible substrate 10 has the terminal connection patterns 13 provided at the tip of the circuit pattern 15, and the portion of the circuit pattern 15 is covered with an insulating layer 17. Further, five through holes 19 are provided in a portion between the terminal connection patterns 13 of the flexible substrate 10, and two through holes 21 are provided on both sides thereof. On the other hand, a positioning hole 27 is provided in the connecting portion 25.
[0012]
Then, as shown in FIG. 5, one end of each terminal 20 abuts on each terminal connection pattern 13 of the flexible substrate 10. Next, as shown in FIG. 6, the upper and lower portions of the contact portion between the flexible substrate 10 and the terminal 20 are held between the first and second molds A1 and A2. Then, the cavities C1, C2 formed by the first and second molds A1, A2 are filled and filled with the molten mold resin from the pin gate P, and after the mold resin is solidified, the first and second molds A1, A2. Remove. In order to prevent molding resin from entering between the flexible substrate 10 and the terminal 20, the pressing portions 80 and 100 provided on the first and second molds A1 and A2 respectively correspond to the flexible substrate 10 and the terminal 20. Between the front end of the body.
[0013]
As a result, the terminal connection portion 1 having the structure in which the periphery of the contact portion between the flexible substrate 10 and the terminal 20 is covered with the terminal fixing portion 30 as shown in FIGS. 1 to 3 is completed. Finally, the connecting portion 25 is cut off along the line EE shown in FIG.
[0014]
As shown in FIG. 2, the terminal fixing portion 30 manufactured as described above partitions the contact portion between the terminal connection pattern 13 and the tip of the terminal 20 by the partition portion 31. The partition 31 is provided to prevent migration between the terminal connection patterns 13 exposed in the vicinity of the contact portion between the terminal connection pattern 13 and the distal end of the terminal 20 and to prevent the flexible board 10 from being fixed by the terminal fixing portion 30. This is for reinforcing the fixing strength between the terminals 20. A connecting portion 33 for connecting the partition portions 31 is provided at the tip of the partition portion 31, and a portion partitioned by the connecting portion 33 and each partition portion 31 is a concave portion 35.
[0015]
On the other hand, as shown in FIG. 1B, a partition 41 is also provided at a position facing the partition 31 on the lower surface side of the terminal fixing portion 30, and each partition is provided at a portion slightly inside from the tip of the partition 41. A connecting portion 43 for connecting the portions 41 is provided, whereby a concave portion 45 is formed. The five through holes 19 shown in FIG. 4 are for connecting the molding resin constituting the terminal fixing portion 30 to the upper and lower sides of the flexible substrate 10, and the through holes 21 and 21 shown in FIG. The mounting holes 37 are provided in the terminal fixing portion 30 as shown.
[0016]
Next, the structure of the first and second molds A1 and A2 shown in FIG. 6 will be described in detail. FIG. 7 is an exploded perspective view showing the first mold A1 shown in FIG. 6 with its lower surface facing upward. As shown in the figure, the first mold A1 is configured by joining two mold parts A1-1 and A1-2. One mold part A1-1 is provided with a cavity C1 shown in FIG. 6 on an upper surface thereof, and the pressing parts 80 shown in FIG. 6 are provided in a row in the cavity C1. A concave gap 82 is provided between the pressing parts 80 installed in parallel, and the gap 82 forms the partition part 31 shown in FIG. On the upper surface (terminal contact surface) of each pressing portion 80, a concave step portion 84 on which the tip portion of the terminal 30 is placed is provided.
[0017]
Further, projections 87, 87 for inserting through holes 21, 21 (see FIG. 5) of the flexible substrate 10 are provided on both sides of the pressing portions 80 arranged in a row in the cavity C1, and the projections 87, 87 of the cavity C1 are provided. On the external surface, a first positioning portion 89 formed of a linear groove for positioning a portion on the base side (connection portion 25 side) of each terminal 30 and a positioning hole 27 (see FIG. 5) of the terminal 30 are inserted. Positioning projections 91 are provided.
[0018]
On the other hand, the mold portion A1-2 has a shape to be joined to the side surface of the mold portion A1-1 on the side where the pressing portion 80 is provided, and a concave insertion portion 93 for inserting the flexible substrate 10 is provided on the upper surface thereof. Is provided. In addition, when the mold part A1-2 is joined to the mold part A1-1, the side surface of the pressing part 80 of the mold part A1-1 and the side surface of the mold part A1-2 opposed to the pressing part 80 are the aforementioned. A cavity (gap) C1 '(see FIG. 6) for forming the connecting portion 33 shown in FIG. 1 is formed.
[0019]
Next, FIG. 8 is an exploded perspective view showing the second mold A2 shown in FIG. As shown in the figure, the second mold A2 is configured by joining two mold parts A2-1 and A2-2. One mold part A2-1 is provided with a cavity C2 shown in FIG. 6 on its upper surface, and the pressing part 100 shown in FIG. 6 is provided in a row in the cavity C2. A concave gap 102 is provided between each of the pressing sections 100 installed in parallel, and this gap 102 forms the partition section 41 shown in FIG. A groove 104 is provided on the upper surface of each pressing portion 100 so as to cross in the horizontal direction, and the groove 104 forms the connecting portion 43 shown in FIG.
[0020]
Further, holes 107, 107 for inserting the projections 87, 87 of the first mold A1 shown in FIG. 7 are provided on both sides of the pressing portions 100 arranged in a row in the cavity C2. A positioning hole 109 for inserting the positioning protrusion 91 of the first mold A1 is provided on the outer surface.
[0021]
On the other hand, the mold part A2-2 has a shape to be joined to the side surface of the mold part A2-1 on the side where the pressing part 100 is provided.
[0022]
Then, as shown in FIG. 9, the first mold A1 is formed by joining the mold part A1-1 and the mold part A1-2 shown in FIG. 7, and then, as shown in FIG. The terminal 20 is placed on A1. At this time, the tip portion of each terminal 20 is placed on each step portion 84 (see FIG. 7) provided on the upper surface of the pressing portion 80. Also, at this time, the base side portion of each terminal 20 is inserted into each first positioning portion 89 provided on the first mold A1, so that each terminal 20 is accurately arranged at a fixed position on the first mold A1. Also, when molding the molding resin in the subsequent steps, the position is not bent by the pressure of the molding resin. Further, since the positioning projections 91 are inserted into the positioning holes 27 provided in the connecting portion 25, the entire position of each terminal 20 is accurately positioned.
[0023]
Next, as shown in FIG. 11, the flexible substrate 10 is placed in the insertion portion 93 of the first mold A1 with the terminal connection pattern 13 facing downward. At this time, the projections 87, 87 of the first mold A1 are inserted into the through holes 21, 21 of the flexible substrate 10.
[0024]
Then, as shown in FIG. 11, on the upper surface of the first mold A1, the mold part A2-1 and the mold part A2-2 shown in FIG. At this time, the projection 87 engages with the hole 107, and the positioning projection 91 engages with the positioning hole 109. Thereby, as shown in FIG. 6, the flexible substrate 10 and the terminal 20 are sandwiched by the first and second molds A1 and A2, and the terminal fixing portion 30 is formed by the above-described method.
[0025]
FIG. 18 is an exploded perspective view of a first mold A1 ′ (A1-1 ′, A1-2 ′) having another structure used in the present invention. This first mold A1 'is different from the first mold A1 shown in FIG. 7 in that a step 84 provided on the upper surface of the pressing portion 80 of the mold A1-1 shown in FIG. The point where the second positioning part 83 consisting of a concave groove in which the tip part of the terminal 30 is placed is provided, and each pressing part 80 which presses each terminal 20 is separately and independently provided in a rod shape, and is formed separately and independently. The only difference is that a part obtained by joining and integrating all the pressed parts 80 is incorporated into the mold part A1-1.
[0026]
When the terminals 20 are placed on the first mold A1 ', the tips of the terminals 20 are locked in the second positioning portions 83 as shown in FIG. 19, and at the same time, the first positioning is performed as described above. Since each terminal 20 is positioned outside the cavity C1 by the portion 89, the positioning of each terminal 20 is further ensured, which is preferable.
[0027]
Here, in the first mold A1 ', the pressing portion 80 is separated into a plurality of pressing portions 80 to be independent from each other for the following reason. That is, the gap 82 between the pressing portions 80 becomes considerably narrower as the pitch interval between the terminals 30 becomes smaller. If the plurality of pressing portions 80 are formed by processing one metal lump, the processing becomes extremely difficult. Because it becomes difficult. If each pressing portion 80 is formed by processing one metal lump, even if inconvenience such as breakage occurs only in a part thereof, the whole must be re-created again. This is because it is only necessary to replace one damaged pressing portion 80. For this reason, similarly, as shown in FIG. 20, the pressing portions 100 of the second mold A2 '(A2-1', A2-2 ') also correspond to the respective terminals 20 pressing similarly to the pressing portions 80. The pressing portion 100 formed separately and independently in a bar shape may be joined and integrated into the mold portion A2-1.
[0028]
In this embodiment, the pressing portions 80 and 100 of both the first and second molds A1 and A2 are formed separately and independently of the plurality of pressing portions 80 and 100. However, either one of the molds A1 or A2 is formed. Only the pressing portion 80 or 100 of A2 may be formed separately and independently. In particular, if the pressing portions 80 on the side that comes into contact with the distal end portions of the metal terminals 20 are formed separately and independently of the plurality of pressing portions 80, the second positioning portions 83 that lock the distal end portions of the terminals 20 are formed on these pressing portions 80. Is provided so that the possibility of breakage is large, and it is preferable to consider replacement or the like.
[0029]
FIG. 21 is an explanatory view of a method of manufacturing a terminal connecting portion 1 "according to still another embodiment of the present invention. In this embodiment, the terminals 20", 20 "are connected from opposite sides of the connecting portion 28". Two sets of flexible substrates 10 "and 10" are provided so as to protrude, and two sets of cavities C1 "and C1 are provided in a first mold A1" which forms a terminal fixing part forming mold. The two sets of terminals 20 ", 20", and the ends of which abut on the respective terminal connection patterns provided on the lower surfaces of the two sets of flexible substrates 10 ", 10" are placed in the first mold A1 ". Although not shown, a second mold corresponding to the first mold A1 "is placed on the first mold A1", and the two sets of flexible substrates 10 ", 10" and the terminal 20 "are placed. , 20 "in the first and second molds, and the two sets of Injecting a molten resin into a cavity provided around a contact portion between the kibble substrates 10 ", 10" and the terminals 20 ", 20", and removing the first and second molds after the molten resin is cured. Thus, as shown in FIG. 22, the terminal fixing portions 30 "and 30" are formed on the contact portions between the two sets of flexible substrates 10 "and 10" and the terminals 20 "and 20", respectively. Finally, the terminals 20 "and 20" are cut at the portions indicated by arrows E and E shown in FIG.
[0030]
In the case of the terminal connection portions 1 ", 1" manufactured according to this embodiment, the portions of the terminals 20 ", 20" protruding from the terminal fixing portions 30 ", 30" are connected to one of the terminal fixing portions 30 ", 30". Bending portions 29 "and 29" are provided so as to bend so as to be located substantially on the same plane as the surface. In this embodiment, the bent portions 29 "and 29" provided at portions of the terminals 20 "and 20" protruding from the terminal fixing portions 30 "and 30" are formed before forming the terminal fixing portions 30 "and 30". Are provided in advance in the state of the flat terminals 20 ", 20". When the bent portions 29 "and 29" are provided in the state of the flat terminals 20 "and 20", only the terminal 20 "is bent rather than bent after the terminal 20" is attached to the terminal fixing portion 30 ". This is because the bent portion 29 "can be easily formed by forming the terminal fixing portion 30" on the bent portion at the time of (1). Also, as in this embodiment, two sets of terminal fixing portions 30 "and 30" are formed. When molding is to be performed at the same time, the interval between the two sets of terminals 20 "and 20" is narrowed by providing bent portions 29 "and 29" in advance, thereby reducing the size of the first and second molds. It is because it can be planned.
[0031]
Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications may be made within the scope of the claims and the technical idea described in the specification and the drawings. It is possible. Note that any shape, structure, or material not directly described in the specification and drawings is within the scope of the technical idea of the present invention as long as the effects and effects of the present invention are exhibited. For example, in the above embodiment, the flexible substrate 10 is used as the substrate, but a hard substrate may be used. The substrate may be a substrate on which various patterns are formed, and may be a substrate used for any purpose. For example, the pattern formed on the substrate is not a circuit pattern but a switch pattern or a pattern for a variable resistor. The present invention can be applied to a portion for fixing the terminal to the terminal connection pattern.
[0032]
【The invention's effect】
As described above in detail, the present invention has the following excellent effects.
{Circle around (1)} Since the terminals are positioned outside the cavity by the first positioning portion provided in the terminal fixing part molding die, each terminal can be reliably brought into contact with each terminal connection pattern, which is not possible. The terminal fixing portion can be molded without quality.
[0033]
{Circle over (2)} When the tip portion of the terminal is locked by the second positioning portion, each terminal can be further securely brought into contact with each terminal connection pattern.
[0034]
{Circle around (3)} The two sets of terminals protruding from the opposite side sides of the connecting part are abutted on the respective terminal connection patterns of the two sets of substrates, and are housed in the terminal-fixing part molding die to be used as both ends. Since the terminal fixing portions are formed around the contact portions, manufacturing efficiency is improved.
[0035]
(4) Since the bent portion provided in the portion of the terminal projecting from the terminal fixing portion is provided in advance on the flat terminal before forming the terminal fixing portion, the bent portion is formed after the terminal fixing portion is formed. Thus, the bent portion can be easily formed, and the size of the mold can be reduced.
[Brief description of the drawings]
FIG. 1 is a diagram showing a terminal connection portion 1 of a flexible substrate 10 manufactured according to the present invention, wherein FIG. 1 (a) is a perspective view seen from above, and FIG. 1 (b) is a perspective view seen from below. It is.
FIG. 2 is a plan view of a terminal connection portion 1;
FIG. 3 is a sectional view taken along line AA of FIG. 2;
FIG. 4 is a diagram illustrating a method of manufacturing the terminal connection portion 1;
FIG. 5 is a diagram illustrating a method of manufacturing the terminal connection portion 1;
FIG. 6 is a diagram showing a method of manufacturing the terminal connection part 1;
FIG. 7 is an exploded perspective view of the first mold A1.
FIG. 8 is an exploded perspective view of a second mold A2.
FIG. 9 is a diagram illustrating a method of manufacturing the terminal connection portion 1;
FIG. 10 is a view showing a method of manufacturing the terminal connection portion 1;
FIG. 11 is a diagram showing a method of manufacturing the terminal connection part 1;
FIG. 12 is a view showing an example of a conventional terminal connection portion 300, wherein FIG. 12 (a) is a perspective view seen from above, and FIG. 12 (b) is a perspective view seen from below.
FIG. 13 is a plan view showing an example of a conventional terminal connection portion 300.
FIG. 14 is a sectional view taken along line aa of FIG.
FIG. 15 is a diagram illustrating a method of manufacturing the terminal connection portion 300.
FIG. 16 is a diagram illustrating a method of manufacturing the terminal connection portion 300.
FIG. 17 is a diagram illustrating a method of manufacturing the terminal connection portion 300.
FIG. 18 is an exploded perspective view of a first mold A1 ′ (A1-1 ′, A1-2 ′) having another structure used in the present invention.
FIG. 19 is a view showing a state where the terminal 20 is housed in the first mold A1 ′.
FIG. 20 is an exploded perspective view of a second mold A2 ′ (A2-1 ′, A2-2 ′) having another structure used in the present invention.
FIG. 21 is a view showing a method of manufacturing a terminal connection portion 1 ″ using still another embodiment of the present invention.
FIG. 22 is a diagram illustrating a method of manufacturing the terminal connection portion 1 ″.
[Explanation of symbols]
1 terminal connection part 10 flexible substrate (substrate)
13 Terminal connection pattern 15 Circuit pattern 17 Insulating layer 20 Terminal 30 Terminal fixing part 31 Partition part 33 Connection part 41 Partition part 43 Connection part A1 First die (terminal fixing part forming die)
C1 Cavity A1-1 Mold part 80 Pressing part 82 Gap 84 Stepped part 89 First positioning part A1-2 Mold part A2 Second mold (terminal fixing part molding die)
C2 Cavity A2-1 Mold part 100 Pressing part 102 Gap 104 Groove P Pin gate A2-2 Mold part A1 'First mold A1-1', A1-2 'Mold part 83 Second positioning part A2' Two molds A2-1 ', A2-2' Mold part 10 "Flexible board 20" Terminal 28 "Connection part 29" Bent part A1 "First mold C1" Cavity 30 "Terminal fixing part

Claims (4)

基板と、この基板に並列に設けた端子接続パターン上に当接した端子とを端子固定部成形金型内に収納し、前記端子と端子接続パターンとの当接部分の周囲に設けた前記端子固定部成形金型のキャビティー内に溶融樹脂を注入することで前記当接部分の周囲に端子固定部を成形する基板への端子固定部成形方法において、
前記端子固定部成形金型内に基板と端子とを収納した際に、前記端子固定部成形金型に設けた押圧部によって前記端子の先端部分と基板間をその両側から挟持するとともに、端子固定部成形金型のキャビティーの外部に設けた第一位置決め部によって端子を位置決めすることを特徴とする基板への端子固定部成形方法。
A substrate and a terminal abutting on a terminal connection pattern provided in parallel with the substrate are housed in a terminal fixing part forming die, and the terminal provided around a contact portion between the terminal and the terminal connection pattern. In a method for molding a terminal fixing portion to a substrate, which forms a terminal fixing portion around the contact portion by injecting a molten resin into a cavity of the fixing portion forming mold,
When the substrate and the terminal are accommodated in the terminal-fixing-part molding die, the pressing portion provided on the terminal-fixing-portion molding mold sandwiches the distal end portion of the terminal and the substrate from both sides thereof, and fixes the terminal. A method for forming a terminal fixing portion on a substrate, wherein a terminal is positioned by a first positioning portion provided outside a cavity of a part forming die.
前記端子固定部成形金型内に基板と端子とを収納した際に、前記端子固定部成形金型の押圧部の前記端子が当接する部分に設けた第二位置決め部によって端子の先端部分を位置決めすることを特徴とする請求項1に記載の基板への端子固定部成形方法。When the substrate and the terminal are housed in the terminal fixing part molding die, the tip end portion of the terminal is positioned by the second positioning part provided at the portion where the terminal contacts the pressing part of the terminal fixing part molding die. The method for forming a terminal fixing portion on a substrate according to claim 1, wherein: 基板と、この基板に並列に設けた端子接続パターン上に当接した端子とを端子固定部成形金型内に収納し、前記端子と端子接続パターンとの当接部分の周囲に設けた前記端子固定部成形金型のキャビティー内に溶融樹脂を注入することで前記当接部分の周囲に端子固定部を成形する基板への端子固定部成形方法において、
前記端子は連結部の対向する両側辺から二組突出するように設けられ、一方前記基板を二組用意し、さらに前記端子固定部成形金型には二組のキャビティーを設け、
二組の端子の先端を二組の基板のそれぞれの端子接続パターン上に当接したものを前記端子固定部成形金型内に収納し、これら両当接部分の周囲に設けた前記端子固定部成形金型のキャビティー内に溶融樹脂を注入することで前記両当接部分の周囲にそれぞれ端子固定部を成形することを特徴とする基板への端子固定部成形方法。
A substrate and a terminal abutting on a terminal connection pattern provided in parallel with the substrate are housed in a terminal fixing part forming die, and the terminal provided around a contact portion between the terminal and the terminal connection pattern. In a method for molding a terminal fixing portion to a substrate, which forms a terminal fixing portion around the contact portion by injecting a molten resin into a cavity of the fixing portion forming mold,
The terminal is provided so as to protrude two sets from opposite side sides of the connecting portion, while preparing two sets of the substrate, further providing two sets of cavities in the terminal fixing part molding die,
The two sets of terminals having the tips abutting on the respective terminal connection patterns of the two sets of substrates are housed in the terminal fixing part forming mold, and the terminal fixing parts provided around these two contacting parts are provided. A method for forming a terminal fixing portion on a substrate, wherein a terminal fixing portion is formed around each of the contact portions by injecting a molten resin into a cavity of a molding die.
前記端子の端子固定部から突出している部分に設けられる屈曲部が、前記端子固定部を成形する前の平板状の端子に予め設けられることを特徴とする請求項3に記載の基板への端子固定部成形方法。4. The terminal according to claim 3, wherein a bent portion provided at a portion protruding from the terminal fixing portion of the terminal is provided in advance on a flat terminal before forming the terminal fixing portion. 5. Fixed part molding method.
JP2002245516A 2002-08-26 2002-08-26 Method for forming terminal fixing part to substrate Pending JP2004087709A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007273785A (en) * 2006-03-31 2007-10-18 Teikoku Tsushin Kogyo Co Ltd Connection structure and connection method of circuit substrates
JP2019216221A (en) * 2018-06-14 2019-12-19 帝国通信工業株式会社 Connection structure between hard circuit board and flexible circuit board
JP2020107851A (en) * 2018-12-28 2020-07-09 帝国通信工業株式会社 Circuit board connection structure and connection method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007273785A (en) * 2006-03-31 2007-10-18 Teikoku Tsushin Kogyo Co Ltd Connection structure and connection method of circuit substrates
JP2019216221A (en) * 2018-06-14 2019-12-19 帝国通信工業株式会社 Connection structure between hard circuit board and flexible circuit board
JP2020107851A (en) * 2018-12-28 2020-07-09 帝国通信工業株式会社 Circuit board connection structure and connection method
JP7252596B2 (en) 2018-12-28 2023-04-05 帝国通信工業株式会社 Circuit board connection structure and connection method

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