JP2004055342A - Terminal connection part of board and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a terminal connection part of a board without causing migration between terminal connection patterns adjacent to each other even if the terminal connection patterns are exposed to the surface of the board, and to provide its manufacturing method. <P>SOLUTION: This terminal connection part 10 is so structured that terminals 20 are brought into contact with the terminal connection patterns 13 formed in parallel with one another on the surface of a flexible board 11, and the flexible board 11 and the terminals 20 are integrated together by molding a fixing part 30 for covering the circumference of the contact part between the flexible board 11 and the terminals 20 with the connection patterns 13 partially exposed. Partitions 31 are formed between the connection patterns 13 exposed from the fixing part 30 to prevent migration from occurring between exposed parts D of the connection patterns 13 adjacent to each other. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a terminal connection portion to a substrate configured by abutting a terminal such as a metal terminal on a terminal connection pattern of a substrate such as a flexible substrate and fixing the periphery thereof with a resin fixing portion, and a method of manufacturing the terminal connection portion. Things.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a terminal connecting portion is configured by attaching a terminal made of a metal plate to a flexible substrate. FIG. 14 is a perspective view of an essential part showing an example of this type of terminal connection part 300, FIG. 15 is a plan view thereof, and FIG. 16 is a sectional view taken along aa of FIG. As shown in these figures, the terminal connection part 300 is configured by covering the periphery of the contact portion between the flexible substrate 310 and the terminal 320 with the fixing part 330. Here, FIG. 17, FIG. 18, and FIG. 19 are views showing a method of manufacturing the terminal connection portion 300. FIG. 19 is a sectional view of the same portion as FIG. 16 with the molds a1 and a2. In order to manufacture the terminal connection portion 300, first, as shown in FIG. 17, a flexible substrate 310 in which a plurality of terminal connection patterns 311 exposed on the edges are provided in parallel, and are arranged at the same pitch as the terminal connection patterns 311. Then, a plurality of metal plate terminals 320 connected to the connection portion 315 are prepared. Next, as shown in FIG. 18, one end of each terminal 320 is brought into contact with each terminal connection pattern 311 of the flexible substrate 310. Next, as shown in FIG. 19, the upper and lower portions of the contact portion between the flexible substrate 310 and the terminal 320 are sandwiched between first and second molds a1 and a2, and are formed by the first and second molds a1 and a2. The cavity c is filled with the molten mold resin from the pin gate p. Then, if the first and second molds a1 and a2 are removed after the molding resin is solidified, the terminal connection portion 300 having the structure shown in FIGS. 14 to 16 is completed. Finally, the connecting portion 315 is cut off at the line ee shown in FIG.
[0003]
As shown in FIG. 17, each terminal connection pattern 311 is provided at an end of a circuit pattern 313 provided on the flexible substrate 310, and the portion of the circuit pattern 313 is covered with a resist layer 315. As shown in FIG. 15, the tip of the terminal 320 protrudes outside from the fixing part 330, and the root d (the part on the resist layer 315 side) d of the terminal connection pattern 311 is also exposed to the outside from the fixing part 330. (Exposed portion d). Note that the exposed portion d refers to the entire portion of the terminal connection pattern 311 exposed from the fixing portion 330, and the surface where the distal end of the terminal 320 protruding from the fixing portion 330 to the outside is in contact with the terminal connection pattern 311. Including. As shown in FIG. 19, the tip of the terminal 320 protrudes outside the fixing portion 330 because the joint between the tip of the terminal 320 and the flexible substrate 310 is provided on the first and second molds a1 and a2. This is for preventing the molding resin at the time of molding from being inserted between the joining portions by being sandwiched by the pressing portions a11 and a21.
[0004]
However, in FIG. 15, when the pitch between the terminal connection patterns 311 (that is, the pitch between the exposed portions d) is narrowed by downsizing the terminal connection portion 300, silver constituting the terminal connection patterns 311 migrates between the exposed portions d. Causing a short circuit in the worst case. No migration occurs between the portion of the terminal connection pattern 311 covered by the fixing portion 330 and the portion of the circuit pattern 313 covered by the resist layer 315.
[0005]
[Problems to be solved by the invention]
The present invention has been made in view of the above points, and an object of the present invention is to provide a terminal connecting portion of a substrate which does not cause migration between adjacent terminal connecting patterns even if the terminal connecting pattern is exposed on the substrate surface. And a method for manufacturing the same.
[0006]
[Means for Solving the Problems]
In order to solve the above-described problems, the present invention provides a method in which terminals are respectively brought into contact with terminal connection patterns provided in parallel on the surface of a substrate, and a part of the terminal connection pattern is exposed around a contact portion between the substrate and the terminals. In the terminal connection portion of the substrate configured by molding a fixed portion to be covered in a state and integrating the substrate and the terminal, a partition portion is formed between the terminal connection patterns exposed from the fixed portion.
[0007]
Further, the present invention provides a fixing portion in which a terminal is brought into contact with a terminal connection pattern provided in parallel on the surface of a substrate, and covers a periphery of a contact portion between the substrate and the terminal in a state where a part of the terminal connection pattern is exposed. A slit is provided between the terminal connection patterns exposed from the fixed portion of the substrate at a terminal connection portion of the substrate formed by molding and integrating the terminal with the terminal.
[0008]
Further, the present invention is characterized in that a partition portion for partitioning between the terminal connection patterns exposed from the fixing portion is formed through the slit.
[0009]
Further, the present invention is characterized in that the substrate is formed of a flexible substrate, and a portion of the flexible substrate forming the partition portion is curved and deformed.
[0010]
Further, the present invention is characterized in that the substrate is formed of a flexible substrate, and an end of a terminal exposed from the fixing portion abuts on the terminal connection pattern exposed from the fixing portion. .
[0011]
Further, according to the present invention, the terminals in contact with the terminal connection patterns provided in parallel on the surface of the flexible substrate are sandwiched and stored in the upper and lower molds for molding the terminal fixing portion, and the terminal connection patterns and the terminals are connected to each other. After the molten resin is injected into the cavity provided around the contact portion and the molten mold resin is hardened, the terminal fixing portion molding die is removed to remove the terminal fixing portion around the contact portion between the flexible substrate and the terminal. In the method for manufacturing a terminal connection portion of a substrate for molding, a pressing portion for an upper mold provided in a cavity of the upper and lower molds for molding the terminal fixing portion is brought into contact with an upper surface of each of the terminal connection patterns. By contacting the lower mold pressing portion also on the back side of the surface, the exposed portion of the terminal connection pattern is provided at the portion where the upper mold pressing portion was in contact with, and simultaneously exposed at the exposed portion. Terminal For the upper mold partition cavity and the lower mold partition formed between the upper mold pressing sections and between the lower mold pressing sections for forming the partition sections separating the continuous patterns. A flexible substrate facing the cavities for both partitioning portions is provided by providing a cavity, and at an inflow pressure of the molding resin when the molten molding resin for molding the terminal fixing portion flows into the upper and lower molds. The partition is formed by filling the cavity for the partition with the mold resin while being pierced.
[0012]
Further, the invention is characterized in that a half-cut portion is provided on the flexible substrate facing the cavity for both partition portions.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a perspective view of an essential part showing an example of a terminal connecting portion 10 according to an embodiment of the present invention, FIG. 2 is a plan view thereof, and FIG. 3 is a sectional view taken along line AA of FIG. As shown in these drawings, the terminal connection portion 10 is configured by covering the periphery of the contact portion between the flexible substrate 11 and the terminal 20 with a resin fixing portion 30.
[0014]
Here, FIGS. 4, 5, and 6 are views showing a method of manufacturing the terminal connection portion 10. FIG. In order to manufacture the terminal connection portions 10, first, as shown in FIG. 4, a plurality of terminal connection patterns 13 are exposed at one end side and are drawn out in parallel with a flexible substrate 11 having the same pitch as each of the terminal connection patterns 13. A plurality of metal plate hard terminals 20 arranged and connected to the connecting portion 25 are prepared. The flexible substrate 11 has the terminal connection patterns 13 provided at the end of the circuit pattern 15, and the portion of the circuit pattern 15 is covered with a resist layer 17. Further, five through holes 19 are provided in a portion between the terminal connection patterns 13 of the flexible substrate 11, and two through holes 21 are provided on both sides thereof. The circuit pattern 15 is formed by printing silver paste, and the terminal connection pattern 13 is formed by printing silver paste in the same manner as the circuit pattern 15 and separately kneading silver powder in a resin having rubber elasticity such as urethane resin. It is composed of multiple layers. However, the terminal connection pattern 13 and the circuit pattern 15 may be constituted by other various materials, manufacturing methods, and structures.
[0015]
Then, as shown in FIG. 5, one end of each terminal 20 abuts on each terminal connection pattern 13 of the flexible substrate 11.
[0016]
Next, as shown in FIG. 6, the upper and lower portions of the contact portion between the flexible substrate 11 and the terminal 20 are formed by the upper and lower dies for molding the terminal fixing portion (the upper and lower portions do not indicate the positional relationship between the upper and lower portions. (Referred to as "first and second molds" hereinafter) A1 and A2, and a pin gate is formed in a cavity C formed by the first and second molds A1 and A2. The first and second molds A1 and A2 are removed after the molten resin is filled and filled from P and the mold resin is solidified. As a result, the terminal connection portion 10 having a structure in which the periphery of the contact portion between the flexible substrate 11 and the terminal 20 as shown in FIGS. Finally, the connecting portion 25 is cut off along the line EE shown in FIG.
[0017]
The fixing portion 30 manufactured as described above covers the periphery of the contact portion between the flexible substrate 11 and the terminal 20 with a part of the terminal connection pattern 13 exposed as shown in FIG. (Exposed part D). The end of the terminal 20 exposed from the inside of the fixed portion 30 is in contact with a part of the exposed portion D. In the present invention, a partition 31 is provided in parallel with the terminal connection pattern 13 on the flexible substrate 11 on which the terminal connection pattern 13 is not provided between the exposed portions D of the terminal connection pattern 13, and a space between the exposed portions D is provided. Partitioning. The partition portion 31 is formed from the surface of the fixed portion 30 exposing the end of the terminal 20 to a position reaching the resist layer 17. Further, a connecting portion 33 for connecting the partition portions 31 is provided at a tip end of the partition portion 31, whereby a portion partitioned by the partition portions 31 is a concave portion 35. In order to form the partition portion 31, as shown in FIG. 6, first and second gold are sandwiched between the flexible substrate 11 and the tip of the terminal 20 so as to prevent molding resin from entering between the two. This is performed by providing at least the pressing portions A11 of the upper and lower mold pressing portions (hereinafter referred to as “pressing portions”) A11 and A21 provided on the dies A1 and A2 independently and in parallel for each terminal 20 (FIG. 9). That is, the depressions 35 are formed by the pressing portions A11 provided independently and in parallel, and the partitioning portions 31 are formed by the resin that has entered the cavity C1 for the upper die partitioning portion (see FIG. 9) between the pressing portions A11. Is done. A depression 45 (see FIG. 7) is formed by each of the pressing portions A21 provided independently and in parallel, and the resin that has entered the lower mold partitioning cavity C2 (see FIG. 9) between the pressing portions A21 is used. A partition 41 (see FIG. 7) is formed.
[0018]
As described above, in the present embodiment, the exposed portions D of the respective terminal connection patterns 13 exposed in the recessed portions 35 of the fixing portion 30 are each partitioned by the partition portions 31, so that even if the adjacent terminal connection patterns 13 Even if the pitch between the exposed portions D is narrowed, migration caused by applying a potential difference between the terminal connection patterns 13 can be effectively prevented.
[0019]
Further, since the partition portion 31 is provided between the exposed portions D, the strength with which the fixing portion 30 fixes the flexible substrate 11 and the terminal 20 is reinforced. Further, in this embodiment, since the connecting portion 33 is provided, the reinforcement is further strengthened. Note that the five through holes 19 shown in FIG. 4 are for connecting the mold resin constituting the fixing portion 30 above and below the flexible substrate 11. Also, the through holes 21 and 21 shown in FIG. 4 are the through holes 37 and 37 provided in the fixing portion 30 shown in FIG.
[0020]
FIG. 7 is a sectional view taken along line FF of FIG. FIG. 8 is an enlarged view of a portion H in FIG. As shown in both figures, a partition portion 31 is provided between each exposed portion D of the terminal connection pattern 13 of the flexible substrate 11, thereby preventing migration between adjacent exposed portions D. In (2), the part where the partition part 31 of the flexible substrate 11 is formed is a curved part 14 that is curved and deformed, so that the substantial separation distance (creep distance) between adjacent exposed parts D is increased. This effectively prevents migration between adjacent exposed portions D.
[0021]
The curved portion 14 can be formed for the following reason. FIG. 9 is a diagram showing a method of manufacturing the terminal connecting portion 10, and FIG. 9 shows a state where the flexible substrate 11 and the terminal 20 are sandwiched between the first and second molds A1 and A2 as shown in FIG. It is a figure which shows the same cutting part. As shown in the figure, pressing portions A11 and A21 are provided by the number of terminals 20 to sandwich the flexible substrate 11 and each terminal 20, and upper and lower mold partitioning portions are provided between the pressing portions A11 and A21. Cavities C1 and C2 are formed. The cavity C1 for the upper mold partition between the pressing portions A11 becomes the partition 31 shown in FIG. As described above, since the molten mold resin is press-fitted from the pin gate P provided on the second mold A2 side, the cavity C on the lower surface side of the flexible substrate 11 is first filled with the molten resin, and then the upper surface of the flexible substrate 11 The cavity C on the side is also filled. For this reason, the flexible substrate 11 is filled with the molten metal filled in the lower mold partition cavity C2 below the upper mold partition cavity C1 until the molten mold resin is filled in the upper mold partition cavity C1 on the upper surface side of the flexible substrate 11. The resin is pressed upward by the mold resin, and the heat and pressure form the curved portion 14 shown in FIGS. 7 and 8. In this embodiment, the curved portion 14 is formed so as to be convex in the upward direction of the flexible substrate 11 (in the direction of the terminal connection pattern 13 forming surface). The curved portion 14 may be formed so as to be convex in the opposite direction.
[0022]
FIG. 10 is a perspective view showing another flexible substrate 11-2 used in the present invention. This flexible substrate 11-2 is different from the flexible substrate 11 in that slits 133 penetrating the flexible substrate 11 are provided between the respective terminal connection patterns 13, which are exposed portions D (see FIG. 2). When the terminal connection portion 10 is formed by using the flexible substrate 11-2, the partition portion 31 is formed through the slit 133. With this configuration, the exposed portions D of the terminal connection patterns 13 are not only separated by the partition portions 31 but also separated by the slits 133, so that the migration between the exposed portions D of the adjacent terminal connection patterns 13 is further reduced. Can be prevented. In the case where the slit 133 is provided, it is not always necessary to form the partition part 31, and the migration between the exposed portions D of the adjacent terminal connection patterns 13 can be prevented by using the slit 133 alone. Needless to say, if the partition portion 31 is provided as in this embodiment, migration can be more effectively prevented.
[0023]
FIG. 11 is a perspective view showing still another flexible substrate 11-3 used in the present invention. The difference between the flexible substrate 11-3 and the flexible substrate 11-2 is that a half-cut portion 135 is provided between the terminal connection patterns 13 serving as exposed portions D (see FIG. 2) instead of the slits 133. Only. The half cut portion 135 is formed by a linear narrow groove, and does not extend from the upper surface to the lower surface of the flexible substrate 11-3 and does not penetrate (see FIG. 13A). Then, as shown in FIG. 12, the flexible substrate 11-3 and the terminal 20 (not shown) are sandwiched between the first and second molds A1 and A2. The first and second molds A1 and A2 are exactly the same as the first and second molds A1 and A2 shown in FIG. 9, and a detailed description thereof will be omitted.
[0024]
Then, when the molten molding resin is press-fitted from the pin gate P provided on the second mold A2 side, the cavity C on the lower surface side of the flexible substrate 11-3 is first filled with the molten resin, and then the upper surface side of the flexible substrate 11-3 Of the cavity C. Then, as shown in FIG. 13A, the flexible substrate 11-3 is a lower metal mold until the cavity mold C1 for the upper mold partitioning portion on the upper surface side of the flexible substrate 11-3 is filled with the molten mold resin. As a result, the half cut portion 135 is cut and pierced by the molten mold resin filled in the mold partitioning cavity C2 as shown in FIG. Thus, the same function as the slit 133 shown in FIG. 10 is exerted. The reason why the slit 133 shown in FIG. 10 is not provided in advance in the flexible board 11-3 is that the strength of the end of the flexible board 11-2 becomes weak when the slit 133 is provided, so that the flexible board 11-3 may be inserted into a mold. Since there is a possibility that the flexible substrate 11-2 may be bent and cause problems such as being unable to be properly stored in the mold, the flexible substrate 11-3 can be reliably inserted into the mold while maintaining the strength of the flexible substrate 11-3 until the mold is inserted. That is to ensure. In this embodiment, the case where the molten mold resin is filled in the lower mold partition cavity C2 before the upper mold partition cavity C1 has been described. When the molten mold resin is filled in the cavity C1 for the upper mold partitioning portion before the cavity C2, the half cut portion 135 is pierced in the opposite direction.
[0025]
Depending on the material and thickness of the flexible substrate 11-3, the inflow pressure of the molten mold resin, and the like, the cavities C1 and C2 for the two partitions can be formed only by the inflow pressure of the molten mold resin without providing the half-cut portion 135. The slits can be provided by piercing the flexible substrate 11-3 facing the substrate, and the cavities C1 and C2 for both partitions can be filled with the mold resin.
[0026]
Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications may be made within the scope of the claims and the technical idea described in the specification and the drawings. It is possible. Note that any shape, structure, or material not directly described in the specification and drawings is within the scope of the technical idea of the present invention as long as the effects and effects of the present invention are exhibited. For example, in the above embodiment, the flexible substrate 11 is used as the substrate, but a hard substrate may be used. Further, the substrate may be a substrate used for any purpose as long as it is a substrate on which various patterns are formed.For example, the pattern formed on the substrate is a switch pattern, a pattern for a variable resistor, or the like. The present invention can be applied to a portion for fixing a terminal.
[0027]
【The invention's effect】
As described above in detail, according to the present invention, since the partition portion is formed between the exposed terminal connection patterns, migration occurring between adjacent terminal connection patterns can be effectively prevented. In addition, since the partition portion is provided between the exposed terminal connection patterns, the strength of the fixing portion fixing the substrate and the terminal can be reinforced.
[0028]
Even if a slit is provided between the exposed terminal connection patterns of the substrate, migration occurring between adjacent terminal connection patterns can be effectively prevented. Further, if a partition portion is formed through the slit, migration can be more effectively prevented.
[Brief description of the drawings]
FIG. 1 is a perspective view of an essential part showing an example of a terminal connecting portion 10 according to an embodiment of the present invention.
FIG. 2 is a plan view showing an example of a terminal connection unit 10 according to one embodiment of the present invention.
FIG. 3 is a sectional view taken along line AA of FIG. 2;
FIG. 4 is a diagram illustrating a method of manufacturing the terminal connection unit 10;
FIG. 5 is a diagram illustrating a method of manufacturing the terminal connection unit 10;
FIG. 6 is a diagram illustrating a method of manufacturing the terminal connection unit 10;
FIG. 7 is a sectional view taken along line FF of FIG. 2;
FIG. 8 is an enlarged view of a portion H in FIG. 7;
FIG. 9 is a diagram illustrating a method of manufacturing the terminal connection unit 10;
FIG. 10 is a perspective view showing another flexible substrate 11-2 used in the present invention.
FIG. 11 is a perspective view showing still another flexible substrate 11-3 used in the present invention.
FIG. 12 is a diagram illustrating a method of manufacturing the terminal connection unit 10;
FIG. 13 is a diagram illustrating a state of the half cut portion 135 when the terminal connection portion 10 is manufactured.
FIG. 14 is a perspective view of a main part showing a conventional terminal connection part 300.
FIG. 15 is a plan view showing a conventional terminal connection section 300.
FIG. 16 is a sectional view taken along line aa of FIG.
17 is a diagram illustrating a method of manufacturing the terminal connection section 300. FIG.
FIG. 18 is a diagram illustrating a method of manufacturing the terminal connection section 300.
FIG. 19 is a diagram illustrating a method of manufacturing the terminal connection section 300.
[Explanation of symbols]
10 Terminal connection part 11 Flexible board (board)
13 terminal connection pattern D exposed portion 15 circuit pattern 17 resist layer 19 through hole 20 terminal 21 through hole 25 connecting plate 30 fixing portion 31 partitioning portion 33 connecting portion 35 recess A1 first mold (upper mold for molding terminal fixing portion)
A2 Second mold (lower mold for molding terminal fixing part)
A11 Pressing part (Pressing part for upper mold)
A21 Pressing part (Pressing part for lower mold)
C cavity P Pin gate 11-2 Flexible board 133 Slit

Claims (7)

A terminal is brought into contact with each of the terminal connection patterns provided in parallel on the surface of the substrate, and a fixed portion that covers the periphery of the contact portion between the substrate and the terminal while exposing a part of the terminal connection pattern is formed. In the terminal connection part of the board configured by integrating the terminals,
A terminal connection portion of a substrate, wherein a partition portion is formed between the terminal connection patterns exposed from the fixing portion. A terminal is brought into contact with each of the terminal connection patterns provided in parallel on the surface of the substrate, and a fixed portion that covers the periphery of the contact portion between the substrate and the terminal while exposing a part of the terminal connection pattern is formed. In the terminal connection part of the board configured by integrating the terminals,
A terminal connection portion of a substrate, wherein a slit is provided between terminal connection patterns exposed from a fixing portion of the substrate. The terminal connection part of a board | substrate of Claim 2 which forms the partition part which partitions between the terminal connection patterns exposed from the fixing part through the said slit. 2. The terminal connection part of a board according to claim 1, wherein the board is formed of a flexible board, and a portion of the flexible board forming the partition portion is curved and deformed. 3. The substrate according to claim 1, wherein the substrate is formed of a flexible substrate, and an end of a terminal exposed from the fixing portion is brought into contact with the terminal connection pattern exposed from the fixing portion. Or a terminal connection part of the substrate according to 3 or 4. Those in which the terminals are in contact with the terminal connection patterns provided in parallel on the surface of the flexible substrate are sandwiched and housed in the upper and lower molds for molding the terminal fixing portion, and the periphery of the contact portion between the terminal connection patterns and the terminals is accommodated. After the molten resin is injected into the provided cavity and the molten mold resin is cured, the terminal fixing part molding die is removed to form a terminal fixing part around the contact portion between the flexible substrate and the terminal. In the method of manufacturing the terminal connection portion,
The upper mold pressing portions provided in the cavities of the upper and lower molds for forming the terminal fixing portion are brought into contact with the upper surfaces of the respective terminal connection patterns, and the lower mold pressing is also performed on the back surface of the contacted surface. By contacting the portions, an exposed portion of the terminal connection pattern is provided in a portion where the upper mold pressing portion has been in contact, and at the same time, a partition portion that partitions between the terminal connection patterns exposed by the exposed portion is formed. Provide a cavity for the upper mold partition and a cavity for the lower mold partition formed between each upper mold pressing part and between each lower mold pressing part for performing,
With the inflow pressure of the mold resin when the molten mold resin for molding the terminal fixing portion flows into the upper and lower molds, while the flexible substrate facing the cavity for both partition portions is pierced, A method for manufacturing a terminal connection part of a board, wherein the partition part is formed by filling the cavity for both partition parts with a mold resin. 7. The method according to claim 6, wherein a half-cut portion is provided on the flexible substrate facing the two cavity portions.

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