JPH01241850A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPH01241850A JPH01241850A JP7023588A JP7023588A JPH01241850A JP H01241850 A JPH01241850 A JP H01241850A JP 7023588 A JP7023588 A JP 7023588A JP 7023588 A JP7023588 A JP 7023588A JP H01241850 A JPH01241850 A JP H01241850A
- Authority
- JP
- Japan
- Prior art keywords
- leads
- resin
- lead frame
- resist
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims abstract description 31
- 229920005989 resin Polymers 0.000 claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000007789 sealing Methods 0.000 abstract description 12
- 238000005530 etching Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- OWNRRUFOJXFKCU-UHFFFAOYSA-N Bromadiolone Chemical compound C=1C=C(C=2C=CC(Br)=CC=2)C=CC=1C(O)CC(C=1C(OC2=CC=CC=C2C=1O)=O)C1=CC=CC=C1 OWNRRUFOJXFKCU-UHFFFAOYSA-N 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910003271 Ni-Fe Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、リードフレームの構造に関するものである
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of a lead frame.
第３図は従来のリードフレームを表わす図であり、第３
図（ａ）は全体平面図、第３図（ｂ）は第１図（ａ）の
部分拡大図である。第４図は、従来のリードフレームの
タイバーを取り除いたリードフレームを表わす図であり
、第４図（ａ）は全体平面図、第４図（ｂ）は第４図（
ａ）の部分拡大図である。図において−（１）はリード
フレーム−（２）はリードフレームに設けられた位置決
めピン用の穴、（３）はダイパッド、（４）はリード−
（４−ａ）はインナーリード、 （４−ｂ）はアウター
リード、（６）はタイバーである。Figure 3 is a diagram showing a conventional lead frame.
FIG. 3(a) is an overall plan view, and FIG. 3(b) is a partially enlarged view of FIG. 1(a). FIG. 4 is a diagram showing a conventional lead frame from which the tie bars have been removed. FIG. 4(a) is an overall plan view, and FIG.
It is a partially enlarged view of a). In the figure, (1) is the lead frame, (2) is the hole for the positioning pin provided in the lead frame, (3) is the die pad, and (4) is the lead.
(4-a) is an inner lead, (4-b) is an outer lead, and (6) is a tie bar.
次に動作について説明する。先ずＩＣを製造するプロセ
スの説明を行う。通常のＩＣは− リードフレーム（１
）のダイパッド（３）（こＩＣチップを接着した後、Ａ
ｕ線−Ａｌ線等によって、ＩＣチップとインナーリード
（４−ａ）を電気的番こ接続し、封止樹脂で封止し、し
かる後にタイバー（６）を切断、各リード（４）を電気
的に切り離し−アウターリード（４−ｂ）の周辺部を切
り離し−アウターリード（４−ｂ）を成形して完成する
。Next, the operation will be explained. First, the process of manufacturing an IC will be explained. A typical IC is - lead frame (1
) die pad (3) (after gluing this IC chip,
The IC chip and the inner leads (4-a) are electrically connected using U-wires and Al wires, etc., and sealed with sealing resin. After that, the tie bars (6) are cut, and each lead (4) is electrically connected. The peripheral part of the outer lead (4-b) is separated and the outer lead (4-b) is formed and completed.
以上のように、リードフレーム（１）のうち、タイバー
（６）は、完成品においては必要でない部位であり、イ
ンナーリード（４−ａ ）の位置ズレ防止、及び封止時
の樹脂の流れ出し防止の目的で設けられている。As mentioned above, the tie bar (6) of the lead frame (1) is a part that is not necessary in the finished product, and is used to prevent the inner lead (4-a) from shifting its position and to prevent the resin from flowing out during sealing. It is established for the purpose of
従来のリードフレームは以上のように構成されているの
で、ＩＣの多ピン化に伴ってリード間のピッチが狭くな
り、タイバーを封止後に切断することが難しくなってき
た。Since conventional lead frames are constructed as described above, the pitch between the leads has become narrower as ICs have increased the number of pins, making it difficult to cut the tie bars after sealing.
また、従来のリードフレームのタイバーを単に第４図に
示すようになくした場合−インナーリードの位置精度が
悪くなるばかりでなく、封止時に樹脂バリが出易く、製
作が困難であるという課題があった。Furthermore, if the tie bars of the conventional lead frame are simply eliminated as shown in Figure 4, there are problems in that not only the positional accuracy of the inner leads deteriorates, but also resin burrs are likely to appear during sealing, making manufacturing difficult. there were.
この発明は上記のような課題を解消するためになされた
もので一タイバーをなくし、かつインナーリードの位置
ズレを防ぎ−また封止時の樹脂バリの発生を防ぐリード
フレームを得ることを目的とする。This invention was made to solve the above-mentioned problems, and aims to provide a lead frame that eliminates tie bars, prevents inner leads from shifting, and prevents resin burrs from forming during sealing. do.
［課題を解決するための手段］
この発明に係るリードフレームは、リードフレームのタ
イバーをなくし、リード間の一部で後に金型で封止する
際に樹脂がアウターリードに流れ込むのを防ぐために金
型で挾む部分の周囲より内側のリード間を樹脂で埋め込
んだものである。[Means for Solving the Problems] The lead frame according to the present invention eliminates the tie bar of the lead frame, and includes a metal part between the leads in order to prevent resin from flowing into the outer leads when later sealed with a mold. The area between the leads on the inner side of the area sandwiched between the molds is filled with resin.
この発明におけるリード間に埋め込んだ樹脂は一インナ
ーリード間の位置を固定し、位置ズレを防ぐと共（こ、
インナーリード間のすき間をなくすため、封止の際に封
止樹脂が流れ出して樹脂バリができるのを防ぐ。In this invention, the resin embedded between the leads fixes the position between one inner lead and prevents misalignment.
Eliminating gaps between inner leads prevents resin burrs from flowing out during sealing.
以下−この発明の一実施例を図について説明する。第１
図はリードフレームの部分を示す平面図、第２図は第１
図に示したリードフレームの製造工程を示す図で一層１
図に示すＸ−Ｘにおける断面図である。図において、（
１）〜（６）は第３図の従来例で述べたものと同等であ
るので説明を省略する。In the following - one embodiment of the invention will be described with reference to the figures. 1st
The figure is a plan view showing the lead frame part, and the second figure is the first one.
Figure 1 shows the manufacturing process of the lead frame shown in the figure.
It is a sectional view taken along line XX shown in the figure. In the figure, (
1) to (6) are the same as those described in the conventional example shown in FIG. 3, so their explanation will be omitted.
（７）は樹脂−（８）はリードフレームをエツチングに
よって作成する際エツチングされない部分を保護するレ
ジスト、（９）はリードフレーム材で−例えば、リン青
銅板、４２％Ｎｉ −Ｆｅ板である。(7) is a resin; (8) is a resist that protects the portions that are not etched when the lead frame is created by etching; (9) is a lead frame material; for example, a phosphor bronze plate or a 42% Ni-Fe plate.
次に作用について説明する。この発明によるリードフレ
ームの作成方法を第２図を用いて説明する。従来−リー
ドフレームのリードパターン成形は、金型で抜くパンチ
ング方式と、エツチング方式の２つがあり、特に、多ピ
ンのフレームでは、エツチング方式が主流である。第２
図もエツチング方式で製作するものである。Next, the effect will be explained. A method for producing a lead frame according to the present invention will be explained with reference to FIG. Conventionally, there are two methods for forming lead patterns in lead frames: a punching method in which the lead frame is punched out using a mold, and an etching method.Especially, the etching method is the mainstream for frames with a large number of pins. Second
The figures are also produced using the etching method.
先ず■リードフレーム材（９）にレジスト（８）を塗布
−硬化させる（第２図（ａ））。■リードフレーム（１
）のうち、リード（４）間に樹脂を埋める部分（第１図
に示す幅Ｗの部分）のパターンを露光し、パターンを形
成する（第２図（ｂ））。■リード（４）間のレジスト
（８）を除去しエツチングする（第２図（Ｃ））。■リ
ード（４）間に樹脂（７）を埋める（硬化等も行う）（
第２図（ｄ））。■レジスト（８）塗布、硬化し、リー
ドフレーム（１）の残りの部分のパターンを露光し、パ
ターンを形成する（第２図（ｅ）。） ■リード（４）
間のレジスト（８）を除去しエツチングする（第２図（
ｆ））。First, (2) a resist (8) is applied to the lead frame material (9) and cured (FIG. 2(a)). ■Lead frame (1
), a pattern is formed by exposing a portion (width W shown in FIG. 1) where the resin is filled between the leads (4) to form a pattern (FIG. 2(b)). (2) Remove and etch the resist (8) between the leads (4) (FIG. 2(C)). ■Fill the resin (7) between the leads (4) (also perform curing, etc.) (
Figure 2(d)). ■Resist (8) is applied and cured, and the remaining part of the lead frame (1) is exposed to form a pattern (Fig. 2 (e)). ■Lead (4)
The resist (8) in between is removed and etched (see Figure 2 (
f)).
■レジスト（８）を除去し完成する（第２図（ｇ））。■Remove the resist (8) and complete (Fig. 2 (g)).
上記の方法によって製作されたリードフレーム（１）の
グイパッド（３）に従来のＩＣ製造プロセスと同様の方
法でＩＣチップを接着し、ＩＣチップとリード（４）を
Ａｕ線又はＡ１線等で接続する。封止は金型を用いて行
なわれるが、金型を締める部分はリード（４）の間が樹
脂（７）で埋まっているため、封止樹脂が洩れ、樹脂バ
リを生ずることなく、ＩＣチップが封止される。封止後
はタイバーを切断することなく、アウターリード（４−
ｂ）を成形し完成する。An IC chip is adhered to the pad (3) of the lead frame (1) manufactured by the above method using a method similar to the conventional IC manufacturing process, and the IC chip and the lead (4) are connected using Au wire or A1 wire, etc. do. Sealing is carried out using a mold, but since the spaces between the leads (4) at the part where the mold is tightened are filled with resin (7), the IC chip is sealed without the sealing resin leaking or causing resin burrs. is sealed. After sealing, connect the outer lead (4-
b) is completed by molding.
なお、上記実施例では、樹脂はリード間のみを埋めたが
、樹脂はリード表面、裏面を覆っていても良い。また、
樹脂がリード表面、裏面を覆っている場合、樹脂は可と
う性を有する樹脂の方が金型押え（こよる樹、脂割れ等
を抑えるうえで好ましいと思われる。In the above embodiment, the resin filled only the spaces between the leads, but the resin may cover the front and back surfaces of the leads. Also,
When a resin covers the front and back surfaces of the lead, it is preferable to use a flexible resin in order to prevent mold holding (resin leakage, fat cracking, etc.).
［発明の効果］
以上のように、この発明によれば、リードフレームのタ
イバーを省略したので、タイバーを切断する必要がなく
、また、樹脂により、リード間からの封止樹脂の流れ出
しを抑えることができる。[Effects of the Invention] As described above, according to the present invention, the tie bars of the lead frame are omitted, so there is no need to cut the tie bars, and the resin prevents the sealing resin from flowing out from between the leads. Can be done.
従って、ピン間の距離を狭くできるため、ＩＣのパッケ
ージサイズを一層小さくすることができ、高密度実装が
可能となる。Therefore, since the distance between the pins can be narrowed, the IC package size can be further reduced, and high-density packaging is possible.
第１図はこの発明の一実施例によるリードフレームの部
分を示す平面図、第２図（ａ）〜（ｇ）は第１図に示し
たリードフレームの製造工程を示す断面図、第３図は従
来のリードフレームを示す平面図、第４図は従来のリー
ドフレームのタイバーをなくした場合の平面図である。
図において、（１）はリードフレーム、（２）は穴−（
３）はダイパッド、（４）はり−ドー （４−ａ ）は
インナーリード、（４−ｂ）はアウターリード、（６）
はタイバー、（７）（ま樹弓旨、（８）はレジスト、（
９）はリードフレーム材である。
なお、図中、同一符号は同−又は相当部分を示す。FIG. 1 is a plan view showing a portion of a lead frame according to an embodiment of the present invention, FIGS. 2(a) to (g) are sectional views showing the manufacturing process of the lead frame shown in FIG. 1, and FIG. 4 is a plan view showing a conventional lead frame, and FIG. 4 is a plan view of the conventional lead frame without tie bars. In the figure, (1) is the lead frame, (2) is the hole (
3) is the die pad, (4) beam-do (4-a) is the inner lead, (4-b) is the outer lead, (6)
is tie bar, (7) (Maki Yumichi, (8) is resist, (
9) is a lead frame material. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
て、ＩＣを製造する際の樹脂バリを抑える目的で設けら
れたタイバー部をなくし、リード間の一部又はリード間
の一部とリード表面の一部をも覆う部分に樹脂を注入し
たことを特徴とするリードフレーム。In the lead frame, which is the backbone of IC manufacturing, the tie bar section, which is provided to suppress resin burrs during IC manufacturing, is eliminated, and a part between the leads or a part between the leads and a part of the lead surface is removed. A lead frame characterized by having resin injected into the part that also covers the lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7023588A JPH01241850A (en) | 1988-03-24 | 1988-03-24 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7023588A JPH01241850A (en) | 1988-03-24 | 1988-03-24 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01241850A true JPH01241850A (en) | 1989-09-26 |
Family
ID=13425703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7023588A Pending JPH01241850A (en) | 1988-03-24 | 1988-03-24 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01241850A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5989474A (en) * | 1994-07-29 | 1999-11-23 | Nec Corporation | Method for fabricating resin-sealed semiconductor device using leadframe provided with resin dam bar |
| US7084511B2 (en) * | 2001-03-27 | 2006-08-01 | Nec Electronics Corporation | Semiconductor device having resin-sealed area on circuit board thereof |
-
1988
- 1988-03-24 JP JP7023588A patent/JPH01241850A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5989474A (en) * | 1994-07-29 | 1999-11-23 | Nec Corporation | Method for fabricating resin-sealed semiconductor device using leadframe provided with resin dam bar |
| US7084511B2 (en) * | 2001-03-27 | 2006-08-01 | Nec Electronics Corporation | Semiconductor device having resin-sealed area on circuit board thereof |
| US7268439B2 (en) | 2001-03-27 | 2007-09-11 | Nec Electronics Corporation | Semiconductor device having resin-sealed area on circuit board thereof |
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