JP3328688B2 - Structure for connecting metal terminal plate to substrate in molded article and method of connecting the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for connecting a metal terminal plate to a substrate in a molded product and a method for connecting the same.

[0002]

2. Description of the Prior Art Conventionally, a metal terminal plate is connected to a conductive pattern provided on a substrate, and a molding resin is molded around the metal terminal plate. There are parts.

In the manufacture of this type of electronic component, a conductive pattern and a metal terminal plate are fixed in advance with a conductive adhesive or a reinforcing film, and then the substrate is sandwiched between upper and lower molds. This has been performed by molding a mold resin around the substrate including the fixed portion.

[0004]

However, according to the above conventional example, two steps of a step of fixing the conductive pattern and the metal terminal plate in advance and a step of molding the mold resin are required, and the manufacturing steps are complicated. Met.

The present invention has been made in view of the above points, and has as its object the purpose of facilitating the manufacture of a printed circuit board in a molded product in which there is no possibility of poor connection between the conductive pattern and the metal terminal plate. An object of the present invention is to provide a metal terminal board connection structure and a connection method thereof.

[0006]

In order to solve the above-mentioned problem, the metal terminal plate and the substrate are sandwiched between upper and lower dies in a state where the metal terminal plate is merely brought into contact with the conductive pattern.
A mold resin is molded around the substrate, and the conductive resin and the metal terminal plate are fixed in a state of being kept in contact with the mold resin. This is preferable because it can be manufactured in one step.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail. That is, in order to solve the above-mentioned inconvenience, the present invention provides a method in which the metal terminal plate and the substrate are sandwiched between upper and lower dies in a state where the metal terminal plate is merely brought into contact with the conductive pattern, and molded around the substrate. A resin was molded, and the conductive pattern and the metal terminal plate were fixed while being kept in contact with each other by the mold resin. This is preferable because it can be manufactured in one step.

However, in this case, since the conductive pattern and the metal terminal plate after molding are only fixed by the molding resin, if the temperature around the molded product changes and high and low temperatures are repeated, The mold resin repeats expansion and contraction, whereby the mold resin around the contact portion between the conductive pattern and the metal terminal plate also repeats expansion and contraction, and the space between the conductive pattern formed by the mold resin and the metal terminal plate over time. The fixing force is weakened, and in the worst case, a connection failure may occur between the two. In addition, the mold resin repeatedly expands and contracts due to moisture, which may cause the same disadvantages as described above. Therefore, means for solving this inconvenience will be described below as a reference example.

FIG. 1 is a view showing a molded resin case of a built-in substrate type used in a rotary variable resistor to which the present embodiment is applied. FIG. 1A is a plan view and FIG. b)
3A is a sectional view taken along line AA of FIG. 3A, FIG. 3C is a rear view, and FIG. 3D is a sectional view taken along line BB of FIG.

As shown in FIG. 1, this molded resin case is formed by molding a molded product 30 over the upper and lower surfaces of the flexible substrate 10 with one ends of three metal terminal plates 20 abutting on the flexible substrate 10. It is configured. Hereinafter, each component will be described.

FIG. 3 is a plan view showing the flexible substrate 10. As shown in FIG. 1, the flexible substrate 10 is made of substantially circular polyethylene terephthalate (PET) [polyphenylene sulfide (PPS), polyimide (PI),
A circular hole 13 is provided at the center of a film 11 made of polyetherimide (PEI) or the like, and the conductor pattern 15 and the resistor pattern 1 are concentrically formed on the outer surface of the circular hole 13.
6 is formed by printing, and furthermore, the elastic conductive paint layers 50 are formed by printing on the three conductive patterns 17 for connecting the terminals drawn out from the resistor pattern 16 and the conductive pattern 15 to the ends of the film 11, respectively. ing.

Here, as a material of the conductive patterns 17 and the conductive patterns 15, a material obtained by kneading silver powder with a phenolic thermosetting resin is used.

The material of the elastic conductive paint layer 50 is as follows.
A material obtained by kneading silver powder with a thermosetting crosslinked urethane resin is used. The elastic conductive coating layer 50 has a predetermined rubber elasticity even after printing and drying.

Next, a molded product 30 shown in FIG. 1 is molded so as to cover the flexible substrate 10 from above and below, and a concave portion 31 exposing the conductor pattern 15 and the resistor pattern 17 is formed on the upper surface side. A through hole 33 is formed at the center thereof and penetrates the circular hole 13 of the flexible substrate 10.
Are formed.

FIG. 2 is an enlarged schematic view of a portion C in FIG. 1D. As shown in the figure, a molded product 30 is formed on the upper and lower surfaces of the film 11 without any adhesive layer between the metal terminal plate 20 and the elastic conductive paint layer 50.
The metal terminal plate 20 is integrally fixed while being pressed in the direction of the elastic conductive paint layer 50. At this time, since the elastic conductive paint layer 50 has elasticity, the elastic conductive paint layer 50 is pressed against the metal terminal plate 20 and is elastically deformed.

Therefore, even if the molded product 30 undergoes thermal expansion and contraction with a change in the ambient temperature, the mold resin around the press-contact portion between the elastic conductive paint layer 50 and the metal terminal plate 20 expands and contracts. The amount of expansion and contraction is absorbed by the change in the amount of elastic deformation of the elastic conductive paint layer 50, and
The elastic conductive paint layer 50 always maintains an elastic contact state with an appropriate elastic contact force. Therefore, no connection failure occurs between them.

Next, a brief description will be given of a method of manufacturing the molded resin case having the built-in substrate. First, one end of the metal terminal plate 20 is placed on each elastic conductive paint layer 50 of the flexible substrate 10 as shown in FIG.

Next, the flexible substrate 10 is sandwiched between the first and second molds 60 and 70 as shown in FIG. At this time, the upper end portion 21 of the metal terminal plate 20 is sandwiched together with the flexible substrate 10 by the first and second molds 60 and 70, and the lower portion 23 of the metal terminal plate 20 is independently formed by the first and second molds 60. , 70. That is, the upper and lower portions of the metal terminal plate 20 are securely fixed by the first and second molds 60 and 70.

And a high-temperature and high-pressure molten molding resin of about 260 ° C. from the pin gate 71 provided on the second mold 70 side;
For example, polybutylene terephthalate (PBT) or PET
After the cavity 73 provided on the side of the second mold 70 is filled with the mold resin, the cavity 63 provided on the side of the first mold 60 is filled with the mold resin. .

At this time, as shown in FIG.
First, the contact portion between the elastic conductive paint layer 50 and the second conductive
By filling the cavity 73 with the molten mold resin, the elastic conductive paint layer 50 is pressed together with the film 11 against the metal terminal plate 20 side, and adheres closely to the cavity. Since the molten resin is also filled in the inside 63, there is no possibility that the molding resin enters between them, and the connection is ensured.

At the same time, the injection pressure (10
(0 to 600 kgf / cm 2), the space between the elastic conductive paint layer 50 and the metal terminal plate 20 is pressed from above and below, so that both are pressed and the elastic conductive paint layer 50 is elastically deformed by a predetermined amount. It is connected in a state of being elastically contacted. At this time, since the molten mold resin has a high temperature, the elastic conductive paint 50 is softened by the heat to increase elasticity, and the pressure contact state between the elastic conductive paint layer 50 and the metal terminal plate 20 due to the pressure of the molten mold resin is further improved.

When the first and second molds 60 and 70 are removed after the molten mold resin is cooled and solidified, the mold resin case shown in FIGS. 1 and 2 is completed.

Second Embodiment FIGS. 7 and 8 are views showing a molded resin molded product of an electronic component built-in type constructed by using the second embodiment. FIG. 7A is a plan view. 8B is a sectional view taken along line DD of FIG. 7A, FIG. 8C is a sectional view taken along line EE of FIG. 7A, FIG. 8D is a rear view, and FIG. (A)
It is FF sectional drawing of.

As shown in both figures, this molded resin molded product is configured by mounting an electronic component 130 on the upper surface of a flexible substrate 110 and molding the periphery of the electronic component 130 with a support 150.

FIG. 9 is a plan view showing the flexible substrate 110. As shown in FIG.
Are formed on a substrate 118 made of a synthetic resin film having flexibility (for example, polyethylene terephthalate), and four conductive patterns 111, 112, 113,
114 and each of the conductive patterns 111, 112, 113, 1
The three circuit patterns 115, 116, and 117 made of silver paste drawn from the substrate 14 are formed by screen printing, and further, each of the conductive patterns 111, 112, and 11 is formed.
The elastic conductive paint layer 200 is formed by printing on the first and third 3,114. This elastic conductive paint layer 200
Is made of the same material as the elastic conductive paint layer 50.

Further, each of the conductive patterns 111,
Circular through holes 11 are provided at the center portions of 112, 113 and 114.
9 and a circular through hole 1 is provided in other portions as well.
21 and six small holes 123 are provided.

Next, FIG. 10 is a view showing the electronic component 130, FIG. 10 (a) is a plan view, and FIG. 10 (b) is a side view.

The electronic component 130 is a photo sensor, and a light emitting unit 135 and a light receiving unit 137 are provided on a surface 133 of a functional unit main body 131 made of a molded resin. The electronic component 130 receives light emitted from the light emitting unit 135, for example, and detects the object (not shown) (for example, the surface of an optical disk).
And the reflected light is received by the light receiving unit 137. Therefore, the distance between the surface 133 and the object to be detected must be accurately positioned.

Also, from both sides of the functional unit main body 131, 2
The metal terminal plates 139 project one by one.

Returning to FIG. 7, the support base 150 integrates the support base upper part 151 and the support base lower part 153 provided on the upper and lower surfaces of the flexible substrate 110 through the small holes 123 and the through holes 119 provided in the flexible substrate 110. It is configured by molding.

The upper portion 151 of the support base is
It is formed so that the entire periphery thereof is molded in a state where the surface 133 of the electronic component 130 on the top is exposed. Further, two circular holes 155 are formed in a portion where the metal terminal plate 139 is located. Also, three holes 157 are formed at the left and right root portions where the metal terminal plate 139 protrudes from the functional portion main body 131.

Here, the hole 155 is formed because a pin 181 described below for sandwiching between the metal terminal plate 139 and the flexible substrate 110 is inserted when the support base 150 is formed, and the hole 157 is formed in the support base 150. It is formed because a guide pin 183 for positioning the metal terminal plate 139 is sometimes inserted.

On the other hand, the support base lower part 153 is
Is formed so as to reach the lower surface of the through hole 121 in addition to the surface facing the through hole 121. A through hole 161 for screwing is formed in the through hole 121. Holes 163 are formed at positions facing the holes 155, respectively.

Here, the metal terminal plate 139 and the elastic conductive paint layer 200 (see FIG. 9) in contact with the metal terminal plate 139 are the same as those shown in FIG.
Similarly, by forming the support base 150 on the upper and lower surfaces of the flexible substrate 110, the elastic conductive paint layer 200 is fixed in a press-contact state pressed against the metal terminal plate 139. At this time, since the elastic conductive paint layer 200 has elasticity, the elastic conductive paint layer 200 is pressed against the metal terminal plate 139 and is in an elastically deformed state. Is held.

Next, a method of manufacturing the molded resin molded product will be described. 11A and 11B are schematic cross-sectional views showing the manufacturing method. FIG. 11A corresponds to the cross section of FIG. 7B, and FIG. 11B corresponds to the cross section of FIG.

First, as shown in FIG.
The electronic component 130 is inserted into the 73 cavity 177. At this time, the surface 133 of the functional portion main body 131 contacts the contact surface 179 provided in the cavity 177.

Two pins 181 are provided at positions facing the respective metal terminal plates 139 in the cavity 177, and the respective pins 181 are in contact with the respective metal terminal plates 139.

The metal terminal plate 1 in the cavity 177
39, two metal terminal plates 139 each on the left and right sides.
There are provided two sets of guide pins 183 and 183 for performing the positioning.

FIG. 12 is a cross-sectional view of the guide pin 183 and shows a cross section corresponding to the cross section of FIG. As shown in the figure, a recess 185 for inserting two metal terminal plates 139 is provided between the guide pins 183, and by inserting the metal terminal plates 139 into the recesses 185, the inside of the cavity 177 of the electronic component 130 is formed. Is performed.

Returning to FIG. 11, the flexible substrate 110 is placed on the second mold 173 in which the electronic component 130 has been inserted, whereby the four elastic conductive paint layers 200 (see FIG. 9) and the four metal terminals are formed. The plate 139 is joined.

Next, the first mold 171 is placed on the flexible substrate 110, and the first mold 171 and the second mold 173 are clamped by a predetermined force.

Since the fixing pin 187 is provided at a position facing the fixing pin 181 of the first mold 171, the flexible substrate 110 and the metal terminal plate 139 are properly held by the fixing pin 181 and the fixing pin 187. It is pinched.

In this state, a high-temperature and high-pressure molten mold resin, for example, PBT or the like at about 260 ° C. is injected from a pin gate 189 provided at a position facing the through-hole 119 provided in the flexible substrate 110 of the first mold 171. The molten mold resin is directly in contact with the back surface of the functional unit main body 131 via the through hole 119 of the flexible substrate 110.

Thus, the surface 13 of the functional unit main body 131
3 is strongly pressed against the contact surface 179 of the cavity 177, and in this state, the entire cavity 175, 177 is filled with the molten mold resin.

Therefore, the main part 1 of the functional part is filled while the mold resin is being filled.
31 and the contact surface 179 of the cavity 177
There is no danger that a gap will occur between the surface 133 and the contact surface 1
There is no possibility that the molding resin enters between the portions 79, and the molding resin does not form burrs on the surface 133 of the functional portion main body 131.

Since the four elastic conductive paint layers 200 of the flexible substrate 110 and the metal terminal plate 139 are sandwiched between the two fixing pins 181 and 187 with an appropriate clamping force as described above, the molding resin is interposed therebetween. There is no risk of intrusion, and the connection is secure.

At the same time, the injection pressure (10
0-600 kgf / cm 2), the space between the elastic conductive paint layer 200 and the metal terminal plate 139 is pressed from above and below, so that the elastic conductive paint layer 200 and the metal terminal plate 139 are pressed together.
Are elastically deformed by a predetermined amount so that they are elastically connected. At this time, since the molten mold resin has a high temperature, the elastic conductive paint layer 200 is formed in the same manner as in the first embodiment.
Is softened and its elasticity is increased, and the pressure-contact state between the elastic conductive paint layer 200 and the metal terminal plate 139 is further improved.

Then, the molten mold resin is cooled and solidified,
When the first and second dies 171 and 173 are removed, a molded resin molded product of a built-in electronic component type shown in FIG. 7 is completed.

The through-hole 161 formed in the support 150 shown in FIG. 7 is provided for screwing the support 150 to another fixing member. 133 can be installed in a state where it is accurately separated from the object to be detected such as another optical disk by a predetermined distance.

In each of the above embodiments, a flexible substrate is used as the substrate, but a hard substrate, a ceramic substrate, or the like may be used instead.

[0051]

As described above in detail, according to the present invention, the electrical connection between the metal terminal plate and the conductive pattern of the substrate and the mechanical fixing by molding resin surrounding the periphery can be performed in one step. Therefore, there is an excellent effect that the production can be performed easily and quickly.

[Brief description of the drawings]

FIGS. 1A and 1B are diagrams showing a molded resin case of a built-in substrate type used in a rotary variable resistor to which a first reference example is applied, wherein FIG. 1A is a plan view and FIG. 4A), FIG. 4C is a back view, and FIG. 5D is a BB sectional view of FIG.

FIG. 2 is an enlarged schematic view of a portion C in FIG. 1 (d).

FIG. 3 is a plan view showing a flexible substrate 10;

FIG. 4 is an explanatory diagram of a method for manufacturing a molded resin case.

FIG. 5 is an explanatory view of a method for manufacturing a molded resin case, wherein FIG. 5 (a) shows a portion corresponding to FIG. 1 (b),
FIG. 2B is a diagram showing a portion corresponding to FIG.

FIG. 6 is an explanatory diagram of a method for manufacturing a molded resin case.

FIGS. 7A and 7B are diagrams showing a molded resin molded product of an electronic component built-in type constituted by using the second reference example, wherein FIG. 7A is a plan view, and FIG. FIG. 3C is a sectional view taken along line EE of FIG. 3A, and FIG. 3D is a rear view.

FIG. 8 is a sectional view taken along line FF of FIG.

FIG. 9 is a plan view showing a flexible substrate 110.

FIG. 10 is a view showing the electronic component 130, and FIG.
Is a plan view, and FIG. 2B is a side view.

11A and 11B are explanatory diagrams of a method for manufacturing a molded resin molded product, wherein FIG. 11A shows a portion corresponding to FIG.
FIG. 7B is a diagram showing a portion corresponding to FIG. 7C.

FIG. 12 is a sectional view of a guide pin 183.

[Explanation of symbols]

 Reference Signs List 10 flexible substrate (substrate) 17 conductive pattern 20 metal terminal plate 30 molded product 50 elastic conductive paint layer 60 first mold 63 cavity 70 second mold 73 cavity 110 flexible substrate (substrate) 111, 112, 113, 114 Conductive pattern 119 Through hole 200 Elastic conductive paint layer 130 Electronic component 131 Function part main body 139 Metal terminal plate 150 Support base (molded product) 171 First mold 173 Second mold 175 Cavity 177 Cavity 179 Contact surface 189 Pin gate

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-8-306720 (JP, A) JP-A-6-163096 (JP, A) JP-A-2-216896 (JP, A) JP-A-1- 163971 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01R 9/09 H01R 43/24

Claims (2)

(57) [Claims] In a state where a metal terminal plate is directly brought into contact with a conductive pattern formed on a substrate, a molded product is formed so as to cover a connection portion between the conductive pattern and the metal terminal plate. A structure for connecting a metal terminal plate to a substrate in a molded product, wherein the conductive pattern of the substrate and the metal terminal plate are fixed in direct contact with each other. 2. A semiconductor device comprising: a substrate provided with a conductive pattern; a metal terminal plate connected to the conductive pattern; and a first and a first provided with a cavity so as to cover a portion connecting the conductive pattern and the metal terminal plate. A second mold is prepared, and the substrate is sandwiched between the first and second molds in a state where the conductive pattern of the substrate and the metal terminal plate are directly in contact with each other. The molten mold resin is injection-molded in the cavity of the mold, and the pressure of the molten mold resin presses the contact portion between the conductive pattern and the metal terminal plate. In this state, the molten mold resin is solidified to form the conductive resin. A method for connecting a metal terminal plate to a substrate in a molded product, wherein the pattern and the metal terminal plate are electrically connected and mechanically fixed while directly contacting each other.