TWI655891B - Electronic module, manufacturing method thereof, housing of electronic device and manufacturing method thereof - Google Patents

Abstract

An electronic module manufacturing method includes the following steps: providing a base material, a conductive line formed on one surface of the base material, the conductive line having at least one contact point; and fixing a first end portion of a conductive elastic member The ground is connected to the contact; and an insulating package is formed, which covers at least a part of the conductive elastic member and exposes a second end portion of the conductive elastic member. Thereby, the conductive elastic member can be used as a conductive contact for electrically connecting an electronic component. The aforementioned manufacturing method simplifies the process steps, can greatly shorten the entire processing man-hour and reduce the manufacturing cost. In addition, the reliability of the fixed connection between the conductive elastic members, the contacts of the substrate, and the pins of the electronic component can be improved, so as to avoid the impact on the transmission of electrical signals between the electronic component and the substrate.

Description

Electronic module and manufacturing method thereof, casing of electronic device and manufacturing thereof method

The invention relates to an electronic module and a manufacturing method thereof, and particularly to an electronic module having a conductive contact, a manufacturing method thereof, and a housing of an electronic device and a manufacturing method thereof.

A conventional manufacturing method of a conductive contact of a circuit board, for example, is to form an insulating layer on a substrate, so that the insulating layer covers a plurality of conductive portions of a conductive circuit of the substrate. Subsequently, through the CNC machining method, a plurality of holes corresponding to the conductive portions are drilled in the insulation layer, so that the conductive portions are exposed through the corresponding holes. Next, a conductive adhesive is filled in each hole, and a pin is inserted into the conductive adhesive in each hole, so that one end of the pin contacts the conductive portion. After that, the conductive adhesive is baked to be cured. Apply insulating glue around each pin to seal the corresponding conductive glue, and then bake the insulating glue to cure it. In this way, each pin can be used as an electronic component. Electrically connected conductive contact.

Since the above-mentioned process steps are many, and it takes time to bake the conductive adhesive and the insulating adhesive to cure them, the whole processing time is long and the manufacturing cost is easy to increase. In addition, because the pin contacts the lead portion only through one end and the contact area with the lead portion is small, when the conductive glue expands and contracts due to thermal displacement, it is easy to cause a poor contact between the pin and the lead portion and affect the signal Conduction and affect product reliability.

Therefore, an object of the present invention is to provide a method for manufacturing an electronic module capable of overcoming at least one disadvantage of the prior art.

Therefore, the manufacturing method of the electronic module of the present invention includes the following steps: providing a substrate, a surface of which is provided with a conductive circuit, the conductive circuit having at least one contact point; a first conductive elastic member An end portion is fixedly connected to the contact point; and an insulating package is formed, which covers at least a part of the conductive elastic member and exposes a second end portion of the conductive elastic member.

Therefore, the method for manufacturing an electronic module of the present invention includes the following steps: providing a substrate and a conductive elastic member, a conductive line formed on one surface of the substrate, the conductive circuit having at least one contact point, and the conductive elastic member Include one A first end portion and a second end portion opposite to the first end portion; the first end portion of the conductive elastic member is fixedly connected to the contact; and an insulating package body is formed. Covering all parts of the conductive elastic member except the second end portion.

Another object of the present invention is to provide an electronic module capable of overcoming at least one disadvantage of the prior art.

Therefore, the electronic module of the present invention includes a substrate, a conductive elastic member, and an insulating package.

The substrate includes a surface and a conductive circuit formed on the surface, and the conductive circuit has at least one contact. The conductive elastic member includes a first end portion fixedly connected to the contact, and a second end portion opposite to the first end portion. The insulating package covers at least a part of the conductive elastic member and exposes the second end portion.

Therefore, the electronic module of the present invention includes a substrate, a conductive elastic member, and an insulating package.

The substrate includes a surface and a conductive circuit formed on the surface, and the conductive circuit has at least one contact. The conductive elastic member includes a first end portion fixedly connected to the contact, and a second end portion opposite to the first end portion. The insulating package covers all parts of the conductive elastic member except the second end portion.

Another object of the present invention is to provide an electric circuit having conductive contacts. Method for manufacturing casing of sub-device.

Therefore, the manufacturing method of the casing of the electronic device of the present invention includes the following steps: providing a base material and an outer film, the base material including an inner surface, the inner surface of the base material is formed with a conductive circuit, and the conductive circuit Having at least one contact point; processing to form the base material and the outer film; fixedly connecting a first end portion of a conductive elastic member to the contact point; and forming an insulating package body which at least covers the insulating package body A part of the conductive elastic member exposes a second end portion of the conductive elastic member.

Another object of the present invention is to provide a housing of an electronic device having conductive contacts.

Therefore, the casing of the electronic device of the present invention includes an outer film and an electronic module.

The electronic module includes a substrate, a conductive elastic member, and an insulating package. The substrate includes an inner surface, an outer surface bonded to the outer film, and a conductive circuit formed on the inner surface. The conductive circuit has at least one contact. The conductive elastic member includes a first end portion fixedly connected to the contact, and a second end portion opposite to the first end portion. The insulating package covers at least a part of the conductive elastic member and exposes the second end portion.

The effect of the present invention is that the manufacturing method of the electronic module simplifies the process steps, can greatly shorten the entire processing man-hour and reduce the manufacturing cost. In addition, the design of each conductive elastic member can effectively improve the convenience of soldering, and can be firmly soldered to the contacts of the substrate and the pins of the electronic component. Thereby, the reliability of the fixed connection between the conductive elastic member, the contact points of the base material, and the pins of the electronic component can be improved, so as to avoid affecting the electronic signal transmission between the electronic component and the base material.

100‧‧‧shell

10‧‧‧Electronic Module

1‧‧‧ substrate

11‧‧‧ surface

11’‧‧‧ 内 表面

12‧‧‧ conductive line

121‧‧‧Contact

13‧‧‧Electronic components

14‧‧‧ outer surface

2‧‧‧ conductive elastic

21‧‧‧ the first body

211‧‧‧first end

22‧‧‧Second body

221‧‧‧ second end

23‧‧‧Connecting piece

24‧‧‧ Compression Spring

25‧‧‧The first metal gasket

251‧‧‧first end

26‧‧‧Second metal gasket

261‧‧‧Second end

27‧‧‧ hollow sleeve

28‧‧‧ Needle

281‧‧‧second end

29‧‧‧ compression spring

30‧‧‧ plug

301‧‧‧first end

4‧‧‧Mould

41‧‧‧first mold

411‧‧‧first clamping surface

412‧‧‧mould cavity

413‧‧‧bearing surface

42‧‧‧Second mode

421‧‧‧Second clamping surface

422‧‧‧Receiving slot

423‧‧‧ convex

424‧‧‧curved face

50‧‧‧ Liquid Plastic

5‧‧‧ insulated package

51‧‧‧outer surface

52‧‧‧Groove

6‧‧‧ outer film

Steps S1 ~ S4‧‧‧‧

S11 ~ S16‧‧‧step

D‧‧‧distance

I‧‧‧ clamping direction

Other features and effects of the present invention will be clearly presented in the embodiment with reference to the drawings, in which: FIG. 1 is a step flow chart illustrating the manufacturing steps of the first embodiment of the manufacturing method of the electronic module of the present invention; 2 is a plan view illustrating the structure of a substrate used in the first embodiment; FIG. 3 is a side view illustrating a conductive elastic member used in the first embodiment having a first sheet body, a first Two pieces and a connecting piece; FIG. 4 is a plan view illustrating that two conductive elastic members used in the first embodiment are fixedly connected to two contacts of the base material respectively; FIG. 5 is a partial cross-sectional view, Explain that the substrate and the two conductive elastic members used in the first embodiment are placed in a cavity of a first mold, and a second mold is in an initial position; 6 is a partial cross-sectional view similar to FIG. 5, illustrating that the second mold is moved to a mold clamping position, and a second mold clamping surface of the second mold compresses each of the conductive elastic members used in the first embodiment and A second end of each conductive elastic member is shielded, and a liquid plastic is injected into the cavity; FIG. 7 is a partial cross-sectional view illustrating the structure of the electronic module manufactured by the first embodiment; FIG. 8 is A partial cross-sectional view illustrating two recesses formed in the second mold clamping surface of the second mold used in the second embodiment of the manufacturing method of the electronic module of the present invention; FIG. 9 is a view similar to FIG. 8. Partial cross-sectional view illustrating that the second mold is moved to the mold clamping position, and a part of the second sheet body and the connecting sheet body of each of the conductive elastic members used in the second embodiment are passed through and accommodated in the corresponding ones. It is accommodated in the groove, and each of the conductive elastic members is in an uncompressed state. FIG. 10 is a partial cross-sectional view illustrating the structure of the electronic module manufactured by the second embodiment. FIG. 11 is a partial cross-sectional view illustrating the present invention. Third Embodiment of Invention Method for Manufacturing Electronic Module The second mold used has two convex portions protruding from the second mold clamping surface; FIG. 12 is a partial cross-sectional view similar to FIG. 11, illustrating that the second mold moves to the mold clamping position, and the second mold Each of the convex portions compresses the corresponding conductive elastic member used in the third embodiment and shields the second end portion; FIG. 13 is a partial cross-sectional view illustrating the electron manufactured by the third embodiment Structure of the module; FIG. 14 is a partial cross-sectional view illustrating the fourth embodiment of the manufacturing method of the electronic module of the present invention, and the liquid plastic is filled into the mold cavity in a low temperature and low pressure manner by a potting process; FIG. 15 is A partial cross-sectional view illustrating the structure of the electronic module manufactured in the fourth embodiment; FIG. 16 is a side view illustrating the structure of the conductive elastic member used in the fifth embodiment of the manufacturing method of the electronic module of the present invention FIG. 17 is a side view illustrating the structure of the conductive elastic member used in the sixth embodiment of the manufacturing method of the electronic module of the present invention; FIG. 18 is a side view illustrating the seventh of the manufacturing method of the electronic module of the present invention The conductive elastic member structure used in the embodiment; FIG. 19 is a side view illustrating the conductive elastic member structure used in the eighth embodiment of the manufacturing method of the electronic module of the present invention; FIG. 20 is a side view illustrating the present invention The structure of the conductive elastic member used in the ninth embodiment of the manufacturing method of the electronic module of the invention; FIG. 21 is a flowchart showing the steps of using the tenth embodiment of the manufacturing method of the electronic module of the invention. 22 is a plan view illustrating a cut shape of the substrate and a cut shape of the outer film used in the tenth embodiment; FIG. 23 is a side view illustrating that the substrate used in the tenth embodiment is bent into a curved shape, and the outer film is bent into a curved shape; FIG. 24 is a side view illustrating that the outer film is assembled and combined with the An outer surface of the substrate used in the tenth embodiment; FIG. 25 is a partial cross-sectional view illustrating that the outer film and the substrate used in the tenth embodiment are placed in the cavity; FIG. 26 is similar to 25 is a partial cross-sectional view illustrating that the second mold is moved to the mold clamping position, and an arc-shaped face of the second mold compresses the conductive elastic members used in the tenth embodiment and shields the conductive elastic members. The second end portion; and FIG. 27 is a side view illustrating that the electronic module and the outer film together constitute the casing.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are represented by the same numbers.

A first embodiment of a method for manufacturing an electronic module of the present invention includes the following steps: as shown in FIG. 1 and FIG. 2, step S1, a substrate 1 is provided, and a conductive line 12 is formed on a surface 11 of the substrate 1. The conductive circuit 12 has at least one contact point 121; as shown in FIG. 1 and FIG. 5, step S2, a first conductive elastic member 2 One end 211 is fixedly connected to the contact 121; step S3, positioning the substrate 1 in a mold 4; and as shown in FIG. 1 and FIG. 7, step S4, an insulating package 5 is formed, and the insulating package 5 is at least A part of the conductive elastic member 2 is covered and a second end portion 221 of the conductive elastic member 2 is exposed.

Referring to FIG. 2 and FIG. 3, in the first embodiment, the substrate 1 is a flexible circuit board (FPC) as an example. The conductive circuit 12 has a plurality of contacts 121, and the number of the contacts 121 is two. example. At least one electronic component 13 electrically connected to the conductive line 12 is mounted on the surface 11 of the substrate 1. The conductive elastic member 2 is a Z-shaped metal spring sheet and has a first sheet body 21, a second sheet body 22 opposite to the first sheet body 21, and a connecting sheet body 23. The connecting piece 23 is connected obliquely between one end of the first piece 21 and one end of the second piece 22 on opposite sides. The first sheet body 21 has a first end portion 211, and the first end portion 211 is an end surface for welding to the corresponding contact point 121. The second sheet body 22 has a second end portion 221 located on a side opposite to the connecting sheet body 23, and the second end portion 221 is an end surface.

Referring to FIG. 4 and FIG. 5, in step S2, two conductive elastic members 2 are respectively connected to two contacts 121, wherein a first end portion 211 of each conductive elastic member 2 is fixedly connected to the two ends by, for example, welding. Corresponding contact 121. Since the first end portion 211 is an end surface, the contact area between the first end portion 211 and the corresponding contact 121 is large, and the area where solder can be applied is also large. In this way, in addition to effectively improving the convenience during welding, the first end portion 211 can also be stably welded to the corresponding contact 121 to improve Reliability of fixed connection between the first end portion 211 and the contact 121.

Referring to FIGS. 5 and 6, the mold 4 of this embodiment includes a first mold 41 and a second mold 42. The first mold 41 has a first mold clamping surface 411, and the first mold 41 is formed with a cavity 412 recessed by the first mold clamping surface 411. The second mold 42 has a second mold clamping surface 421 for abutting against the first mold clamping surface 411. In step S3, the substrate 1 and the conductive elastic member 2 connected to the substrate 1 are placed in the cavity 412 of the first mold 41 so that the second end portion 221 of each conductive elastic member 2 protrudes from the first mold 41. The first mold clamping surface 411 is separated from the first mold clamping surface 411 by an appropriate distance D. Among them, a plurality of stoppers (not shown) disposed in the cavity 412 through the first mold 41 are blocked around the outside of the substrate 1 so that the substrate 1 can be positioned in the cavity 412. Next, the second mold 42 is driven to move from an initial position shown in FIG. 5 in a mold clamping direction I. Since the second end portion 221 of each conductive elastic member 2 is spaced from the first mold clamping surface 411 by an appropriate distance D Therefore, during the movement of the second mold 42, the second mold clamping surface 421 will first contact the second end portion 221 of each conductive elastic member 2 and apply pressure to the second end portion 221. After the second end portion 221 is compressed, the second sheet body 22 compresses the connecting sheet body 23, so that the connecting sheet body 23 is deformed with respect to the first sheet body 21 and the second sheet body 22. Thereby, the second sheet body 22 will gradually approach the first sheet body 21 during the process of being compressed by the moving second die 42. Subsequently, when the second mold 42 is moved to a mold clamping position where the second mold clamping surface 421 abuts the first mold clamping surface 411 of the first mold 41 as shown in FIG. 6, the second mold 42 is closed. The mold surface 421 compresses each of the conductive elastic members 2 into a compressed state, and the second mold clamping surface 421 is in surface contact with the second end portion 221 of each conductive elastic member 2 and covers the second end portion 221.

Referring to FIG. 6 and FIG. 7, in step S4, the first embodiment of the present invention is to form an insulating package 5 by insert molding. First, a liquid plastic 50 is injected into the cavity 412 through a runner (not shown) of the second mold 42 so that the liquid plastic 50 fills the cavity 412. The liquid plastic 50 is a molten thermoplastic plastic as an example, and the material is, for example, polycarbonate (PC) or acrylonitrile-butadiene-styrene copolymer (ABS). Since the conductive elastic members 2 accumulate the elastic force when the connecting piece 23 is deformed, the second end portion 221 is forced to contact the second mold clamping surface 421 and is shielded by the second mold clamping surface 421. Therefore, it can reduce Or avoid the situation where the liquid plastic 50 fills the cavity 412 and penetrates between the second end portion 221 and the second mold clamping surface 421 of each conductive elastic member 2 so that the liquid plastic 50 will only cover the substrate 1 The surface 11 and the outer periphery, and a part of each conductive elastic member 2 without covering the second end portion 221. In this embodiment, the liquid plastic 50 covers all parts of the conductive elastic members 2 except the second end portion 221. In addition, since the second mold clamping surface 421 of the second mold 42 compresses the conductive elastic members 2 into a compressed state, the second mold 42 and the first mold 41 clamp the conductive elastic members 2 and the substrate 1 respectively. , So that the substrate 1 and the conductive elastic members 2 can be firmly positioned in the cavity 412 to avoid the position of the substrate 1 and the conductive elastic member 2 during the process of filling and flowing the liquid plastic 50 into the cavity 412. Make an impact.

After a period of cooling time, the liquid plastic 50 will solidify to form an insulating package 5. The insulating package 5 covers the surface 11 and the outer periphery of the substrate 1 and a part of each conductive elastic member 2 without covering. To hold the second end 221, that is, The insulating package 5 covers all parts of each conductive elastic member 2 except the second end portion 221. Then, the second mold 42 is driven to move in a direction opposite to the clamping direction I and returned to the initial position. At this time, an electronic module composed of the substrate 1, the conductive elastic member 2 and the insulating package 5 can be combined. 10 is taken out from the cavity 412 of the first mold 41.

As shown in FIG. 7, the cured insulating package 5 includes an outer surface 51, and the second end portions 221 of the conductive elastic members 2 are exposed on the outer surface 51 and are flush with the outer surface 51. Thereby, each conductive elastic member 2 can be used as a conductive contact for electrically connecting an external electronic component (not shown) such as a battery, an integrated circuit component, a buzzer, or a vibration motor. The two pins (not shown) of the external electronic component can be electrically connected to the second ends 221 of the two conductive elastic members 2 respectively, so that the electronic component can transmit positive and negative electrical signals to the substrate 1 through the two conductive elastic members 2. . Since the second end portion 221 is an end surface, the contact area between the second end portion 221 and the corresponding pin of the electronic component is large, and the area for solder coating is also large. In this way, in addition to effectively improving the convenience during welding, the second end portion 221 can be stably welded to the corresponding pin, so as to improve the reliability of the fixed connection between the second end portion 221 and the pin.

It should be noted that in other implementations of the first embodiment, the number of the contacts 121 of the conductive circuit 12 and the number of the conductive elastic members 2 may be one each, and the number disclosed in the first embodiment is not used as limit. In addition, in step S4, the liquid plastic 50 may also be a two-component thermosetting plastic. By mixing the main agent and the hardener uniformly into a liquid plastic 50 at a certain ratio, the liquid plastic 50 may be heated at room temperature for a period of time or heated. After a period of time, the insulation package 5 can be cured.

Compared with the prior art, the manufacturing method of the electronic module 10 of the first embodiment simplifies the manufacturing steps, and can omit the time required to bake the conductive adhesive and the insulating adhesive. Therefore, the entire processing time can be greatly shortened and reduced. manufacturing cost. In addition, the first end portion 211 and the second end portion 221 of each conductive elastic member 2 are designed in an end surface manner, which can effectively improve the convenience during welding, and can make the first end portion 211 and the second end portion 221 respectively. Stably soldered to corresponding contacts 121 and pins. Thereby, the reliability of the fixed connection between the first end portion 211 and the contact point 121 and between the second end portion 221 and the pin can be improved, so as to avoid the electrical signal transmission between the electronic component and the substrate 1. influences.

Referring to FIG. 8, it is a second embodiment of the manufacturing method of the electronic module of the present invention. The overall steps are substantially the same as the first embodiment, but the structure of the second mold 42 and the electronic module 10 and the filling method of the liquid plastic 50 are different. .

In the second embodiment, the second mold clamping surface 421 of the second mold 42 is recessed to form two accommodating grooves 422, and the two accommodating grooves 422 respectively correspond to the positions of the two conductive elastic members 2, and each accommodating The groove 422 is configured to pass through the second end portion 221 of the corresponding conductive elastic member 2.

Referring to FIG. 8, FIG. 9 and FIG. 10, in step S3 shown in FIG. 1, when the second mold 42 moves from the initial position in the mold clamping direction I, the two receiving grooves 422 will gradually approach the two conductive elastic members 2. . When the second mold 42 is moved to the mold clamping position, a part of the second sheet body 22 and the connecting sheet body 23 of each conductive elastic member 2 are passed through and accommodated in the corresponding accommodations. In the groove 422, each of the conductive elastic members 2 is in an uncompressed state. Thereby, the second mold 42 can cover the second end portions 221 of the two conductive elastic members 2.

In step S4 shown in FIG. 1, the liquid plastic 50 is filled into the cavity 412 of the first mold 41 by a filling method such as a low temperature and low pressure injection instead of high pressure, which is a potting process. Since the second end portion 221 of each conductive elastic member 2 protrudes from the first mold clamping surface 411 of the first mold 41 and is spaced a proper distance D therefrom, and the second sheet body 22 and the connecting piece of each conductive elastic member 2 A part of the body 23 is penetrated and accommodated in the corresponding receiving groove 422. Therefore, by controlling the amount of the liquid plastic 50 filled in the cavity 412 and filling the liquid plastic 50 into the cavity 412, 50 liquid plastics It will cover the surface 11 and the outer periphery of the substrate 1 and a part of the first sheet 21 and the connecting sheet 23 of each conductive elastic member 2 without covering the second sheet 22. After the liquid plastic 50 is cooled and solidified to form the insulating package 5, the insulating package 5 covers the surface 11 and the outer periphery of the substrate 1, and the first sheet 21 and the connecting sheet 23 of the conductive elastic members 2. A part of the second sheet body 22 is not covered, and the second end portion 221 of each conductive elastic member 2 protrudes from the outer surface 51 of the insulating package 5 and is spaced apart from it. Thereby, each of the conductive elastic members 2 can also serve as a conductive contact point for the electrical connection of the pins of the power supply element.

It should be noted that in the foregoing step S4, after the liquid plastic 50 fills the cavity 412, only the first sheet body 21 and the connecting sheet body 23 of each conductive elastic member 2 will only cover one part of the implementation manner. The size of each conductive elastic member 2 is different. And the change in the distance D, the liquid plastic 50 may also cover only the first sheet 21, or cover the first sheet 21 and the entire connecting sheet 23 at the same time, and cool and solidify the liquid plastic 50 to form an insulating package. After 5, the area where each conductive elastic member 2 protrudes from the outer surface 51 of the insulating package 5 may be the entire connecting piece 23 and the second piece 22 or only the second piece 22. In addition, in other implementation aspects of the second embodiment, the number of the contacts 121 of the conductive circuit 12, the number of the conductive elastic members 2, and the number of the accommodating grooves 422 may also be one, which are not disclosed in the second embodiment. The number is limited.

Referring to FIG. 11, a third embodiment of an electronic module manufacturing method according to the present invention is shown. The overall steps are substantially the same as those of the first embodiment, but the structures of the first mold 41, the second mold 42, and the electronic module 10 are slightly different. .

In the third embodiment, the thickness of the first mold 41 is thicker than the thickness of the first mold 41 of the first embodiment, and the second end portion 221 of each conductive elastic member 2 is located in the cavity 412 and merges with the first cavity. The die surfaces 411 are spaced apart from each other. The second mold 42 has two convex portions 423 protruding from the second mold clamping surface 421. The two convex portions 423 respectively correspond to the positions of the two conductive elastic members 2. Each convex portion 423 is used to compress and shield the corresponding conductive elasticity. Of the second end portion 221 of the piece 2.

Referring to FIG. 11, FIG. 12, and FIG. 13, in step S3 shown in FIG. 1, when the second mold 42 is moved from the initial position in the mold clamping direction I, each convex portion 423 first contacts the corresponding conductive elastic member 2. The second end portion 221 is pressed and pressure is applied to the second end portion 221, so that the connecting piece 23 is bent and deformed relative to the first piece 21 and the second piece 22. when When the second mold 42 is moved to the mold clamping position, each conductive elastic member 2 is in a compressed state, and each convex portion 423 is in surface contact with the second end portion 221 of the corresponding conductive elastic member 2 and covers the second end portion 221.

In step S4 shown in FIG. 1, since each convex portion 423 covers the second end portion 221 of the corresponding conductive elastic member 2, the surface of the substrate 1 will be covered by the liquid plastic 50 after filling the cavity 412. 11 and the outer periphery, and covering a part of each conductive elastic member 2 without covering the second end portion 221. After the liquid plastic 50 is cooled and solidified to form the insulating package 5, the insulating package 5 covers the surface 11 and the outer periphery of the substrate 1, and the first sheet 21, the connecting sheet 23 and the conductive sheet 2 A part of the second sheet body 22 does not cover the second end portion 221. The insulating package 5 is formed with two grooves 52 recessed downward from the outer surface 51, and the second end portion 221 of each conductive elastic member 2 is exposed in the groove 52. Each groove 52 can be filled with, for example, conductive glue or solder, and then each pin of the electronic component is inserted into the corresponding groove 52 and contacts the corresponding second end portion 221. After the conductive glue or solder is cured, the electronic component Each of the pins can be fixedly connected to the corresponding second end portion 221 and electrically connected thereto. Thereby, each of the conductive elastic members 2 can also serve as a conductive contact point for the electrical connection of the pins of the power supply element.

It should be noted that, in the third embodiment, the liquid plastic 50 can be filled into the cavity 412 of the first mold 41 in a low-temperature and low-pressure filling manner through the potting process disclosed in the second embodiment.

Referring to FIG. 14, it is a fourth embodiment of the manufacturing method of the electronic module of the present invention. For example, the overall steps are substantially the same as the first embodiment, but the structures of the first mold 41 and the electronic module 10 are slightly different.

14 and FIG. 15, in the fourth embodiment, the second mold 42 shown in FIG. 5 is omitted from the mold 4. In step S4 shown in FIG. 1, the liquid plastic 50 is filled into the cavity 412 of the first mold 41 at a low temperature and low pressure by a potting process, and the liquid plastic 50 is filled with the cavity 412 and then covered. The surface 11 and the outer periphery of the base material 1 and a part of the first sheet body 21 and the connecting sheet body 23 of each conductive elastic member 2 are not covered by the second sheet body 22. Since the liquid plastic 50 is filled into the cavity 412 in a low-temperature and low-pressure manner, the influence on the electronic components mounted on the surface 11 of the substrate 1 and sensitive to high-temperature and high-pressure can be reduced.

After the liquid plastic 50 is cooled and solidified to form the insulating package 5, the insulating package 5 covers the surface 11 and the outer periphery of the substrate 1, and the first sheet 21 and the connecting sheet 23 of the conductive elastic members 2. A part of the second sheet body 22 is not covered, and the second end portion 221 of each conductive elastic member 2 protrudes from the outer surface 51 of the insulation package 5 and is spaced apart from it. Thereby, each of the conductive elastic members 2 can also serve as a conductive contact point for the electrical connection of the pins of the power supply element.

Referring to FIG. 16, it is a fifth embodiment of the method for manufacturing an electronic module according to the present invention. The overall steps are substantially the same as those of the first embodiment, but the structure of the conductive elastic member 2 is slightly different.

In the fifth embodiment, the conductive elastic member 2 is a sigma-shaped spring piece. The first sheet body 21, the second sheet body 22, and the connecting sheet body 23 are provided. The connecting piece 23 of the conductive elastic member 2 has a horizontal V shape, and two ends of the connecting piece 23 are respectively connected to one end of the first piece 21 and one end of the second piece 22 on the same side. Thereby, the conductive elastic member 2 can also effectively improve the convenience when welding, and can make the first end portion 211 and the second end portion 221 firmly welded to the corresponding contact 121 of the base material 1 and the corresponding connection of the electronic component, respectively. foot.

Referring to FIG. 17, a sixth embodiment of a method for manufacturing an electronic module according to the present invention is generally the same as the first embodiment, except that the structure of the conductive elastic member 2 is slightly different.

In the sixth embodiment, the conductive elastic member 2 includes a compression spring 24, a first metal washer 25 welded to one end of the compression spring 24, and a second metal washer 26 welded to the other end of the compression spring 24. The first metal washer 25 has a first end portion 251, and the first end portion 251 is an end surface welded to the corresponding contact 121. The second metal washer 26 has a second end portion 261, and the second end portion 261 is an end surface for welding the corresponding pins of the electric component. Thereby, the conductive elastic member 2 can also effectively improve the convenience during welding, and can make the first end portion 251 and the second end portion 261 firmly welded to the corresponding contact 121 of the base material 1 and the corresponding connection of the electronic component, respectively. foot.

Referring to FIG. 18, it is a seventh embodiment of a method for manufacturing an electronic module according to the present invention. The overall steps are substantially the same as those of the first embodiment, but the structure of the conductive elastic member 2 is slightly different.

In this seventh embodiment, the conductive elastic member 2 is a horizontal V-shaped elastic The reed has a first sheet body 21 and a second sheet body 22 connected to one end of the first sheet body 21. The second end portion 221 of the second sheet body 22 is a linear edge. The second end portion 221 is in contact with the corresponding pin of the electronic component through a line contact method. Thereby, the conductive elastic member 2 can also effectively improve the convenience when welding, and can make the first end portion 211 and the second end portion 221 firmly welded to the corresponding contact 121 of the base material 1 and the corresponding connection of the electronic component, respectively. foot.

Referring to FIG. 19, it is an eighth embodiment of a method for manufacturing an electronic module according to the present invention. The overall steps are substantially the same as those of the first embodiment, but the structure of the conductive elastic member 2 is slightly different.

In the eighth embodiment, the conductive elastic member 2 is a compression spring and has a first end portion 211 and a second end portion 221 at opposite ends. Thereby, the conductive elastic member 2 can also effectively improve the convenience when welding, and can make the first end portion 211 and the second end portion 221 firmly welded to the corresponding contact 121 of the base material 1 and the corresponding connection of the electronic component, respectively. foot.

Referring to FIG. 20, a ninth embodiment of a method for manufacturing an electronic module according to the present invention is generally the same as the first embodiment, except that the structure of the conductive elastic member 2 is slightly different.

In the ninth embodiment, the conductive elastic member 2 is a pogo pin, which includes a hollow sleeve 27, a needle post 28, a compression spring 29, and a plug body 30. The needle post 28 is movably inserted in the hollow sleeve 27 and protrudes from the hollow sleeve 27 One end. The needle post 28 has a second end portion 281, and the second end portion 281 is an end surface for welding the corresponding pins of the electrical component. The plug body 30 is inserted into the hollow sleeve 27 and can be fixed to the other end of the hollow sleeve 27 by, for example, a tight fit or a screw connection. The plug body 30 and the hollow sleeve 27 cooperate to define a first end portion 301. One end portion 301 is an end surface welded to the corresponding contact point 121. The compression spring 29 passes through the hollow sleeve 27 and has one end abutting the needle post 28 and the other end abutting the plug body 30. The compression spring 29 applies an elastic force to the needle post 28 in a direction away from the plug body 30. Thereby, the conductive elastic member 2 can also effectively improve the convenience during welding, and can make the first end portion 301 and the second end portion 281 firmly welded to the corresponding contact 121 of the base material 1 and the corresponding connection of the electronic component, respectively. foot.

Referring to FIG. 21, a tenth embodiment of a method for manufacturing an electronic module according to the present invention is applied in a manufacturing process of a casing 100 (as shown in FIG. 27) of an electronic device.

The method for manufacturing a casing 100 of an electronic device includes the following steps: as shown in FIG. 21 and FIG. 22, step S11, a substrate 1 is provided, and an outer film 6, the substrate 1 includes an inner surface 11 ′, and A conductive line 12 is formed on the outer surface 14 and the inner surface 11 ′ of the substrate 1, and the conductive line 12 has at least one contact 121; in step S12, the substrate 1 and the outer film 6 are processed and formed; as shown in FIGS. 21 and 24, In step S13, a first end portion 211 of a conductive elastic member 2 is fixedly connected to the contact 121; in step S14, the outer film 6 is assembled and bonded to the outer surface 14 of the base material 1; as shown in FIG. 21, FIG. 26, and FIG. As shown in step 27, in step S15, the substrate 1 and the outer layer are thin. The film 6 is positioned in a mold 4; in step S16, an insulating package 5 is formed. The insulating package 5 covers at least a part of the conductive elastic member 2 and exposes a second end portion 221 of the conductive elastic member 2.

Referring to FIG. 21 and FIG. 22, in the tenth embodiment, the electronic device is a smart phone as an example, but the electronic device may also be a tablet computer, a global positioning system, or other electronic devices with a casing and different types. . In step S11, the conductive circuit 12 is formed on the inner surface 11 'of the base material 1 by printing, for example. The conductive circuit 12 has a plurality of contacts 121. The number of the contacts 121 is two. The electronic component 13 is exemplified by an ultraviolet sensor. The base material 1 and the outer film 6 have a rectangular shape, for example.

In step S12, the outer contours of the base material 1 and the outer film 6 are first cut by, for example, a press molding method. Subsequently, the base material 1 and the outer film 6 are thermocompression-bonded by means of hot-press molding to bend the base material 1 and the outer film 6 into a curved shape as shown in FIG. 23.

Referring to FIGS. 21 and 24, in step S13, the first ends 211 of the two conductive elastic members 2 are respectively welded to the two contacts 121. In step S14, the outer film 6 is assembled and bonded to the outer surface 14 of the substrate 1. The outer surface 14 of the substrate 1 is coated with double-sided adhesive and the outer film 6 is attached to the double-sided adhesive, so that the outer film 6 can be adhered to the outer surface 14 of the substrate 1 through the double-sided adhesive.

Referring to FIG. 25, FIG. 26 and FIG. 27, in step S15, the assembled base material 1 and the outer film 6 are first placed in the cavity 412 of the first mold 41, so that one of the first mold 41 is a concave arc The shaped bearing surface 413 carries the outer film 6. When the second die 42 is When the position is moved in the mold clamping direction I, an arc-shaped curved surface portion 424 of the second mold clamping surface 421 of the second mold 42 first contacts the second end portion 221 of the corresponding conductive elastic member 2 and Pressure is applied to the second end portion 221 to bend the connecting piece 23 relative to the first piece 21 and the second piece 22. When the second mold 42 is moved to the mold clamping position, each conductive elastic member 2 is in a compressed state, and the curved surface portion 424 is in surface contact with the second end portion 221 of the conductive elastic member 2 and covers the second end portion 221. When the liquid plastic 50 fills the cavity 412, it will cover the inner surface 11 'of the base material 1 and a part of each conductive elastic member 2 without covering the second end portion 221. After the liquid plastic 50 is cooled and solidified to form the insulating package 5, the insulating package 5 covers the surface 11 of the substrate 1 and a portion of each conductive elastic member 2 without covering the second end portion 221, and The second end portion 221 is exposed on the outer surface 51. Thereby, the electronic module 10 and the outer film 6 together constitute the casing 100 of the electronic device.

It should be noted that, in the foregoing fifth embodiment to the tenth embodiment, the liquid plastic 50 can be filled into the cavity 412 of the first mold 41 in a low-temperature and low-pressure filling method through the potting process disclosed in the second embodiment.

In summary, the manufacturing method of the electronic module 10 of each embodiment simplifies the process steps, can greatly shorten the entire processing man-hour and reduce the manufacturing cost. In addition, the design of each conductive elastic member 2 can effectively improve the convenience during soldering, and can be firmly soldered to the contact 121 of the base material 1 and the pin of the electronic component. Thereby, the reliability of the fixed connection between the conductive elastic member 2, the contact 121 of the base material 1, and the pins of the electronic component can be improved. To avoid affecting the electronic signal transmission between the electronic component and the substrate 1, so it can indeed achieve the purpose of the invention.

However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited in this way, any simple equivalent changes and modifications made in accordance with the scope of the patent application and the content of the patent specification of the present invention are still Within the scope of the invention patent.

Claims (27)

An electronic module manufacturing method includes the following steps: providing a base material, a conductive line formed on one surface of the base material, the conductive line having at least one contact point; and fixing a first end portion of a conductive elastic member The ground is connected to the contact; and an insulating package is formed, which covers at least a part of the conductive elastic member and exposes a second end portion of the conductive elastic member. The method for manufacturing an electronic module according to claim 1, further comprising a step of covering the conductive elastic member after the conductive elastic member is fixedly connected to the contact and before forming the insulating package. Two end portions, so that the insulating package does not cover the second end portion. The method for manufacturing an electronic module according to claim 2, wherein in this step, the second end portion is compressed and shielded so that the conductive elastic member is in a compressed state. The method for manufacturing an electronic module according to claim 3, wherein, in this step, the substrate and the conductive elastic member connected thereto are first placed in a cavity of a first mold, so that the The second end part protrudes from a first clamping surface of the first mold, and then clamps a second mold with the first mold to compress a second clamping surface of the second mold and shield the first mold. Two ends. The method for manufacturing an electronic module according to claim 3, wherein, in this step, the substrate and the conductive elastic member connected thereto are first placed in a cavity of a first mold, and then A second mold is clamped with the first mold. The second mold has a second mold clamping surface and a convex portion protruding from the second mold clamping surface. The convex portion abuts and shields the second end portion. . The method for manufacturing an electronic module according to claim 2, wherein in this step, the substrate and the conductive elastic member connected thereto are first placed in a cavity of a first mold, and then A second mold is clamped with the first mold, the second mold has a second mold clamping surface, and the second mold clamping surface is recessed to form a receiving groove for receiving the second end portion. The method for manufacturing an electronic module according to any one of claims 4 to 6, wherein, in the step of forming the insulating package, a liquid plastic is injected into the cavity, and the liquid plastic is solidified to form the Insulated package. The method for manufacturing an electronic module according to claim 1, further comprising a step of fixedly connecting the conductive elastic member to the contact and before forming the insulating package, and connecting the substrate and the substrate to the conductive elastic member. The conductive elastic member is placed in a cavity of a first mold. In the step of forming the insulating package, a liquid plastic is filled into the cavity at a low temperature and a low pressure, and the liquid plastic is formed after curing. The insulated package. The method for manufacturing an electronic module according to claim 1, wherein the first end portion of the conductive elastic member is welded to the contact. The method for manufacturing an electronic module according to claim 1, further comprising a step of providing the substrate, and forming the substrate into a curved shape. An electronic module includes: a substrate including a surface, and a conductive circuit formed on the surface, the conductive circuit having at least one contact point; a conductive elastic member including a first fixedly connected to the contact point; One end portion and a second end portion opposite to the first end portion; and an insulating package covering at least a part of the conductive elastic member and exposing the second end portion. The electronic module according to claim 11, wherein the insulating package includes an outer surface, and the second end portion is exposed on the outer surface. The electronic module according to claim 12, wherein the conductive elastic member is in a compressed state and the second end portion is flush with the outer surface. The electronic module according to claim 12, wherein the second end portion protrudes from the outer surface and is spaced apart from the outer surface. The electronic module according to claim 11, wherein the insulating package includes an outer surface, the outer surface is recessed downward to form a groove, and the second end portion is exposed in the groove. The electronic module according to any one of claims 11 to 15, wherein the conductive elastic member is a Z-shaped spring piece and includes a first piece body, and a first piece body opposite to the first piece body. Two pieces, the first piece has the first end, the first end is an end surface welded to the contact, the second piece has the second end, and the second end is a End face. The electronic module according to any one of claims 11 to 15, wherein the conductive elastic member is a sigma-shaped spring piece and includes a first piece body, and a first piece body opposite to the first piece body. Two pieces, the first piece has the first end, the first end is an end surface welded to the contact, the second piece has the second end, and the second end is a End face. The electronic module according to any one of claims 11 to 15, wherein the conductive elastic member includes a compression spring, a first metal gasket welded to one end of the compression spring, and another compression welded to the compression spring. A second metal gasket at one end, the first metal gasket having the first end portion, the first end portion being an end surface welded to the contact, the second metal gasket having the second end portion, the The second end portion is an end surface. The electronic module according to any one of claims 11 to 15, wherein the conductive elastic member is a spring leaf in a horizontal V shape and includes a first piece body, and a first piece body connected to the first piece body. A second piece at one end, the first piece having the first end, the first end being an end surface welded to the contact, the second piece having the second end, and the second end The part is an end edge. The electronic module according to claim 11, wherein the first end portion is soldered to the contact. The electronic module according to claim 11, wherein the substrate is curved. A method for manufacturing a casing of an electronic device includes the following steps: providing a base material and an outer film, the base material including an inner surface, the inner surface of the base material being formed with a conductive circuit, the conductive circuit having at least A contact; processing to form the base material and the outer film; fixedly connecting a first end of a conductive elastic member to the contact; and forming an insulating package that at least covers the conductive elastic member And a second end portion of the conductive elastic member is exposed. The method for manufacturing a casing of an electronic device according to claim 22, wherein in the step of processing and forming the base material and the outer film, the base material and the outer film are bent into a curved shape. The method for manufacturing a housing of an electronic device according to claim 22 or 23, further comprising a step of fixedly connecting the first end portion to the contact, and assembling and bonding the outer film to the base material. An outer surface of the substrate, and the manufacturing method further includes a step of assembling and bonding the outer film to the outer surface, positioning the substrate and the outer film in a mold. A housing of an electronic device includes: an outer film; an electronic module including: a substrate including an inner surface, an outer surface bonded to the outer film, and a conductive circuit formed on the inner surface, The conductive circuit has at least one contact point; a conductive elastic member includes a first end portion fixedly connected to the contact point, and a second end portion opposite to the first end portion; and an insulating package, Cover at least a part of the conductive elastic member and expose the second end portion. An electronic module includes: a substrate including a surface, and a conductive circuit formed on the surface, the conductive circuit having at least one contact point; a conductive elastic member including a first fixedly connected to the contact point; One end portion and a second end portion opposite to the first end portion; and an insulating package covering all parts of the conductive elastic member except the second end portion. An electronic module manufacturing method includes the following steps: providing a substrate and a conductive elastic member, a conductive line formed on one surface of the substrate, the conductive circuit having at least one contact point, and the conductive elastic member including a first One end portion and a second end portion opposite to the first end portion; the first end portion of the conductive elastic member is fixedly connected to the contact point; and an insulation package is formed, the insulation package covers All parts of the conductive elastic member except the second end portion.