CN113395830B - Electronic module and manufacturing method thereof - Google Patents
Electronic module and manufacturing method thereof Download PDFInfo
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- CN113395830B CN113395830B CN202110535734.XA CN202110535734A CN113395830B CN 113395830 B CN113395830 B CN 113395830B CN 202110535734 A CN202110535734 A CN 202110535734A CN 113395830 B CN113395830 B CN 113395830B
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- conductive elastic
- die
- elastic member
- conductive
- electronic module
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 65
- 239000000758 substrate Substances 0.000 claims abstract description 69
- 239000000463 material Substances 0.000 claims abstract description 36
- 239000007788 liquid Substances 0.000 claims description 42
- 239000004033 plastic Substances 0.000 claims description 42
- 229920003023 plastic Polymers 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 32
- 230000006835 compression Effects 0.000 claims description 15
- 238000007906 compression Methods 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 13
- 238000004806 packaging method and process Methods 0.000 claims description 13
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 abstract description 4
- 238000000465 moulding Methods 0.000 description 10
- 238000003466 welding Methods 0.000 description 7
- 229920001971 elastomer Polymers 0.000 description 6
- 239000000806 elastomer Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 238000005429 filling process Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/1078—Leads having locally deformed portion, e.g. for retention
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
A manufacturing method of an electronic module comprises the following steps: providing a substrate, wherein a conductive circuit is formed on the surface of the substrate, and the conductive circuit is provided with at least one contact; fixedly connecting a first end of the conductive elastic member to the contact; and forming an insulating package which wraps at least a portion of the conductive elastic member and exposes a second end portion of the conductive elastic member. Therefore, the conductive elastic piece can be used as a conductive contact for the electrical connection of the electronic element. The manufacturing method simplifies the manufacturing process steps, can greatly shorten the whole processing time and reduce the manufacturing cost. In addition, the reliability of the fixed connection between the conductive elastic piece and the contact of the base material and the pins of the electronic element can be improved, so that the influence on the transmission of electric signals between the electronic element and the base material is avoided.
Description
The application relates to a Chinese patent application with the application number 201910172306.8, the electronic module, the manufacturing method thereof, the shell of the electronic device and the manufacturing method thereof, and the application of the Chinese patent application with the application number 2019, 3, 7.
Technical Field
The present invention relates to electronic modules and methods for manufacturing the same, and more particularly, to an electronic module with conductive contacts and a method for manufacturing the same, and a housing of an electronic device and a method for manufacturing the same.
Background
In the prior art, for example, a conductive contact of a circuit board is manufactured by forming an insulating layer on a substrate, such that the insulating layer covers a plurality of conductive traces of the substrate. And drilling a plurality of holes corresponding to the guide connection parts on the insulating layer by CNC processing mode, so that each guide connection part is exposed through the corresponding hole. Next, conductive paste is filled in each hole, and a pin is inserted in the conductive paste in each hole so that one end of the pin contacts the conductive portion. Thereafter, the conductive paste is baked to be cured. And coating insulating glue around the outer periphery of each pin to seal the corresponding conductive glue, and baking the insulating glue to solidify the insulating glue. Thus, each pin can be used as a conductive contact for the electrical connection of the electronic element.
Because the above-mentioned process steps are many, and it takes a while to bake the conductive adhesive and the insulating adhesive, it takes time to cure them, so that the whole processing time is long and the manufacturing cost is easy to increase. In addition, since the pin only passes through one end of the pin to contact the guide connection part and the contact area between the pin and the guide connection part is small, when the pin is displaced due to expansion caused by heat and contraction caused by cold of the conductive adhesive, the poor contact between the pin and the guide connection part is easily caused, so that the conduction of an electric signal is influenced, and the reliability of a product is influenced.
Disclosure of Invention
The present invention is directed to a method for manufacturing an electronic module that overcomes at least one of the drawbacks of the related art.
The invention aims at solving the background technical problems by adopting the following technical proposal, and the manufacturing method of the electronic module provided by the invention comprises the following steps:
providing a substrate, wherein a conductive circuit is formed on the surface of the substrate, and the conductive circuit is provided with at least one contact;
Fixedly connecting a first end of the conductive elastic member to the contact; and
An insulating package is formed that encapsulates at least a portion of the conductive elastomer and exposes a second end of the conductive elastomer.
The manufacturing method of the electronic module further comprises the following steps: the second end portion of the conductive elastic member is shielded from the insulating package before the insulating package is formed.
In the manufacturing method of the electronic module, in the step, the second end part is compressed and shielded to enable the conductive elastic piece to be in a compressed state.
In the manufacturing method of the electronic module, in the step, the base material and the conductive elastic piece connected to the base material are firstly placed in a die cavity of a first die, so that the second end part protrudes out of a first die combining surface of the first die, and then a second die is combined with the first die, so that the second die combining surface of the second die is compressed and shields the second end part.
In the manufacturing method of the electronic module, in the step, the base material and the conductive elastic piece connected to the base material are firstly placed in a die cavity of a first die, and then a second die is clamped with the first die, wherein the second die is provided with a second die combining surface and a convex part protruding from the second die combining surface, and the convex part is abutted against and shields the second end part.
In the manufacturing method of the electronic module, in the step, the base material and the conductive elastic piece connected to the base material are firstly placed in a die cavity of a first die, then a second die is clamped with the first die, the second die is provided with a second die clamping surface, and the second die clamping surface is sunken to form a containing groove for containing the second end part.
In the manufacturing method of the electronic module, in the step, the base material is firstly placed in the die cavity of the first die, the second end part of the conductive elastic piece is arranged on the second die-combining surface of the second die, then the second die is combined with the first die, the first end part is supported on the contact point, and then the second die-combining surface compresses and shields the second end part.
In the manufacturing method of the electronic module, in the step of forming the insulating packaging body, liquid plastic is injected into the mold cavity, and the insulating packaging body is formed after the liquid plastic is solidified.
The manufacturing method of the electronic module further comprises the following steps: before the insulating package is formed, the base material and the conductive elastic piece connected to the base material are placed in a mold cavity of a first mold, in the step of forming the insulating package, liquid plastic is filled in the mold cavity in a low-temperature and low-pressure mode, and the insulating package is formed after the liquid plastic is solidified.
The manufacturing method of the electronic module further comprises the following steps: after the substrate is provided, the substrate is shaped to be curved.
Another object of the present invention is to provide an electronic module that overcomes at least one of the drawbacks of the prior art.
The invention aims at solving the background technical problems and adopts the following technical scheme that the electronic module provided by the invention comprises a substrate, a conductive elastic piece and an insulating packaging body, wherein the substrate comprises a surface and a conductive circuit formed on the surface, the conductive circuit is provided with at least one contact, the conductive elastic piece comprises a first end fixedly connected with the contact and a second end opposite to the first end, and the insulating packaging body at least covers a part of the conductive elastic piece and exposes the second end.
In the electronic module of the present invention, the insulating package includes an outer surface, and the second end portion is exposed on the outer surface.
In the electronic module, the conductive elastic piece is in a compressed state, and the second end part is flush with the outer surface.
In the electronic module of the invention, the second end part protrudes out of the outer surface and is separated from the outer surface by a distance.
In the electronic module of the invention, the insulating package body comprises an outer surface, the outer surface is recessed downwards to form a groove, and the second end part is exposed in the groove.
The electronic module comprises a conductive elastic piece, a first sheet body and a second sheet body, wherein the conductive elastic piece is a Z-shaped spring piece and comprises a first sheet body and a second sheet body opposite to the first sheet body, the first sheet body is provided with a first end part, the second sheet body is provided with a second end part, and the second end part is an end face.
The electronic module comprises a conductive elastic piece, a first sheet body and a second sheet body, wherein the conductive elastic piece is a sigma-shaped spring piece and comprises a first sheet body and a second sheet body opposite to the first sheet body, the first sheet body is provided with the first end part, the second sheet body is provided with the second end part, and the second end part is an end face.
The electronic module comprises a compression spring, a first metal gasket connected to one end of the compression spring and a second metal gasket connected to the other end of the compression spring, wherein the first metal gasket is provided with a first end, the first end is an end face connected to the contact, the second metal gasket is provided with a second end, and the second end is an end face.
The electronic module comprises a conductive elastic piece and a connecting piece, wherein the conductive elastic piece is a V-shaped spring piece and comprises a first sheet body and a second sheet body connected with one end of the first sheet body, the first sheet body is provided with a first end part, the first end part is an end face connected with the contact, the second sheet body is provided with a second end part, and the second end part is an end edge.
In the electronic module, the base material is in a bent shape.
In the electronic module, the first end part is adhered to the contact through the conductive adhesive, the second end part is provided with the clamping hole, and the clamping hole is a blind hole.
It is a further object of the present invention to provide a method for manufacturing a housing of an electronic device that overcomes at least one of the drawbacks of the related art.
The invention aims at solving the background technical problems and is realized by adopting the following technical proposal, and the manufacturing method of the shell of the electronic device provided by the invention comprises the following steps:
Providing a substrate and an outer film, wherein the substrate comprises an inner surface, and a conductive circuit is formed on the inner surface of the substrate, and the conductive circuit is provided with at least one contact;
forming the substrate and the outer film;
Fixedly connecting a first end of the conductive elastic member to the contact; and
An insulating package is formed that encapsulates at least a portion of the conductive elastomer and exposes a second end of the conductive elastomer.
In the method for manufacturing a case of an electronic device according to the present invention, in the step of forming the base material and the outer film, the base material and the outer film are bent into a curved shape.
The method for manufacturing a case of an electronic device according to the present invention further includes a step of assembling and bonding the outer film to an outer surface of the base material after fixedly connecting the first end portion to the contact, and the method further includes a step of positioning the base material and the outer film in a mold after assembling and bonding the outer film to the outer surface.
It is a further object of the present invention to provide a housing for an electronic device that overcomes at least one of the drawbacks of the prior art.
The invention aims at solving the background technical problems and is realized by adopting the following technical scheme that the shell of the electronic device provided by the invention comprises an outer film and an electronic module, wherein the electronic module comprises a base material, a conductive elastic piece and an insulating packaging body, the base material comprises an inner surface, an outer surface combined with the outer film and a conductive circuit formed on the inner surface, the conductive circuit is provided with at least one joint, the conductive elastic piece comprises a first end fixedly connected with the joint and a second end opposite to the first end, and the insulating packaging body at least covers a part of the conductive elastic piece and exposes the second end.
The invention aims at solving the background technical problems and is realized by adopting the following technical scheme that the electronic module provided by the invention comprises a substrate, a conductive elastic piece and an insulating packaging body, wherein the substrate comprises a surface and a conductive circuit formed on the surface, the conductive circuit is provided with at least one contact, the conductive elastic piece comprises a first end fixedly connected with the contact and a second end opposite to the first end, and the insulating packaging body covers all parts of the conductive elastic piece except the second end.
The invention aims at solving the background technical problems by adopting the following technical proposal, and the manufacturing method of the electronic module provided by the invention comprises the following steps:
providing a substrate and a conductive elastic piece, wherein a conductive circuit is formed on the surface of the substrate, the conductive circuit is provided with at least one contact, and the conductive elastic piece comprises a first end part and a second end part opposite to the first end part;
fixedly connecting the first end of the conductive elastic member to the contact; and
An insulating package is formed that encapsulates all portions of the conductive elastic member except the second end portion.
The invention has the beneficial effects that: the manufacturing method of the electronic module simplifies the manufacturing process steps, can greatly shorten the whole processing time and reduce the manufacturing cost. In addition, the convenience in welding can be effectively improved by the design of each conductive elastic piece, and the conductive elastic pieces can be firmly welded on the contact points of the base material and the pins of the electronic element. Therefore, the reliability of the fixed connection between the conductive elastic piece, the contact point of the base material and the pin of the electronic element can be improved, so that the influence on the transmission of electric signals between the electronic element and the base material is avoided.
Drawings
FIG. 1 is a flowchart illustrating steps of a first embodiment of a method for manufacturing an electronic module according to the present invention;
FIG. 2 is a top view illustrating the structure of a substrate used in the first embodiment;
FIG. 3 is a side view illustrating the conductive elastic member used in the first embodiment having a first sheet body, a second sheet body and a connecting sheet body;
FIG. 4 is a top view illustrating two conductive elastic members used in the first embodiment fixedly connected to two contacts of the substrate, respectively;
FIG. 5 is a partial cross-sectional view illustrating the substrate and the conductive elastomer used in the first embodiment placed in the cavity of a first mold with a second mold in an initial position;
FIG. 6 is a partial cross-sectional view similar to FIG. 5 illustrating the second mold being moved to a closed position with a second clamping surface of the second mold compressing the conductive spring used in the first embodiment and shielding a second end of the conductive spring and liquid plastic being injected into the mold cavity;
Fig. 7 is a partial sectional view illustrating a structure of the electronic module manufactured by the first embodiment;
Fig. 8 is a partial sectional view illustrating that two receiving grooves are concavely formed in the second clamping surface of the second mold used in the second embodiment of the manufacturing method of the electronic module according to the present invention;
FIG. 9 is a partial cross-sectional view similar to FIG. 8, illustrating the second mold being moved to the closed position, the second sheet body of the conductive elastic member and a portion of the connecting sheet body used in the second embodiment being threaded and received in the corresponding receiving groove, and the conductive elastic member being in an uncompressed state;
Fig. 10 is a partial sectional view illustrating a structure of the electronic module manufactured by the second embodiment;
FIG. 11 is a partial cross-sectional view illustrating that the second mold used in the third embodiment of the method for manufacturing an electronic module according to the present invention has two protrusions protruding from the second molding surface;
FIG. 12 is a partial cross-sectional view similar to FIG. 11 illustrating the second die being moved to the closed position with the protrusions of the second die compressing the corresponding conductive elastic members used in the third embodiment and shielding the second end;
fig. 13 is a partial sectional view illustrating a structure of the electronic module manufactured by the third embodiment;
Fig. 14 is a partial cross-sectional view illustrating a fourth embodiment of the method for manufacturing an electronic module according to the present invention, in which the liquid plastic is filled into the mold cavity at a low temperature and a low pressure in a potting process;
fig. 15 is a partial sectional view illustrating a structure of the electronic module manufactured by the fourth embodiment;
Fig. 16 is a side view illustrating the conductive elastic member structure used in the fifth embodiment of the manufacturing method of the electronic module according to the present invention;
Fig. 17 is a side view illustrating a conductive elastic member structure used in a sixth embodiment of the manufacturing method of the electronic module according to the present invention;
fig. 18 is a side view illustrating the structure of the conductive elastic member used in the seventh embodiment of the manufacturing method of the electronic module according to the present invention;
Fig. 19 is a side view illustrating the conductive elastic member structure used in the eighth embodiment of the manufacturing method of the electronic module according to the present invention;
fig. 20 is a side view illustrating the structure of the conductive elastic member used in the ninth embodiment of the manufacturing method of the electronic module according to the present invention;
Fig. 21 is a flowchart illustrating a method of manufacturing a housing of an electronic device using a tenth embodiment of the method of manufacturing an electronic module according to the present invention;
FIG. 22 is a top view illustrating the substrate cut outline and outer film cut outline used in the tenth embodiment;
Fig. 23 is a side view illustrating that the base material used in the tenth embodiment is bent in a curved shape and the outer film is bent in a curved shape;
FIG. 24 is a side view illustrating the outer film assembly coupled to the outer surface of the substrate used in the tenth embodiment;
Figure 25 is a partial cross-sectional view illustrating the placement of the outer film and the substrate used in the tenth embodiment within the mold cavity;
FIG. 26 is a partial cross-sectional view similar to FIG. 25 illustrating the second die being moved to the closed position with an arcuate face of the second die compressing the conductive spring used in the tenth embodiment and shielding the second end of the conductive spring;
FIG. 27 is a side view illustrating the electronic module together with the outer membrane forming the housing;
FIG. 28 is a partial cross-sectional view illustrating the placement of the base member within the cavity of the first mold and a snap-fit engagement of the conductive elastic member with a latch of the second mold used in accordance with an eleventh embodiment of the method of manufacturing an electronic module according to the present invention;
FIG. 29 is a partial cross-sectional view similar to FIG. 28, illustrating the second die being moved to the closed position with the conductive paste on the conductive elastomer adhered to the corresponding contact; and
Fig. 30 is a partial sectional view illustrating a structure of the electronic module manufactured by the eleventh embodiment.
Detailed Description
The invention is described in detail below with reference to the attached drawings and examples:
Before the present invention is described in detail, it is noted that in the following description, like elements are denoted by the same reference numerals.
A first embodiment of a method for manufacturing an electronic module according to the present invention includes the steps of:
As shown in fig. 1 and 2, step S1 is performed to provide a substrate 1, wherein a conductive circuit 12 is formed on a surface 11 of the substrate 1, and the conductive circuit 12 has at least one contact 121;
As shown in fig. 1 and 5, step S2, the first end 211 of the conductive elastic member 2 is fixedly connected to the contact 121;
step S3, positioning the substrate 1 in the mold 4; and
As shown in fig. 1 and 7, in step S4, an insulating package 5 is formed, and the insulating package 5 at least covers a portion of the conductive elastic member 2 and exposes the second end 221 of the conductive elastic member 2.
Referring to fig. 2 and 3, in the first embodiment, the substrate 1 is exemplified by a flexible circuit board (FPC), the conductive circuit 12 has a plurality of contacts 121, and the number of contacts 121 is exemplified by two. At least one electronic component 13 electrically connected to the conductive tracks 12 is mounted on the surface 11 of the substrate 1. The conductive elastic member 2 is a metal spring sheet having a Z shape and has a first sheet 21, a second sheet 22 opposite to the first sheet 21, and a connecting sheet 23. The connection piece 23 is connected between one end of the first piece 21 and one end of the second piece 22 on opposite sides in an inclined manner. The first sheet 21 has a first end 211, and the first end 211 is an end surface to be welded to the corresponding contact 121. The second sheet 22 has a second end 221 located on the opposite side of the connecting sheet 23, and the second end 221 is an end surface.
Referring to fig. 4 and 5, in step S2, two conductive elastic members 2 are respectively connected to two contacts 121, wherein a first end 211 of each conductive elastic member 2 is fixedly connected to the corresponding contact 121 by, for example, welding. Since the first end 211 is an end surface, the contact area between the first end 211 and the corresponding contact 121 is large, and the area available for solder application is also large. Therefore, besides the convenience in welding can be effectively improved, the first end 211 can be firmly welded to the corresponding contact 121, so that the reliability of the fixed connection of the first end 211 and the contact 121 is improved.
Referring to fig. 5 and 6, the mold 4 of the present embodiment includes a first mold 41 and a second mold 42. The first mold 41 has a first molding surface 411, and the first mold 41 is formed with a cavity 412 recessed from the first molding surface 411. The second die 42 has a second die-engaging surface 421 for abutting against the first die-engaging surface 411. In step S3, the substrate 1 and the conductive elastic members 2 connected thereto are placed in the cavity 412 of the first mold 41, such that the second end 221 of each conductive elastic member 2 protrudes from the first molding surface 411 of the first mold 41 and is spaced apart from the same by a suitable distance D. Wherein, a plurality of stoppers (not shown) disposed in the mold cavity 412 through the first mold 41 block the outer periphery of the substrate 1, so that the substrate 1 can be positioned in the mold cavity 412. Next, the second mold 42 is driven to move from the initial position shown in fig. 5 along the mold closing direction I, and since the second end 221 of each conductive elastic member 2 is spaced from the first mold closing surface 411 by a suitable distance D, the second mold closing surface 421 will first contact the second end 221 of each conductive elastic member 2 and exert pressure on the second end 221 during the movement of the second mold 42. After the second end 221 is pressed, the second sheet 22 compresses the connecting sheet 23, so that the connecting sheet 23 bends and deforms relative to the first sheet 21 and the second sheet 22. Thereby, the second sheet 22 gradually approaches the first sheet 21 during compression by the moving second die 42. Subsequently, when the second die 42 is moved to the die-closing position where the second die-closing surface 421 abuts against the first die-closing surface 411 of the first die 41 as shown in fig. 6, the second die-closing surface 421 of the second die 42 compresses each conductive elastic member 2 to be in a compressed state, and the second die-closing surface 421 comes into surface contact with the second end 221 of each conductive elastic member 2 and shields the second end 221.
Referring to fig. 6 and 7, in step S4, the insulating package 5 is formed by in-mold injection molding (Insert molding). First, a liquid plastic 50 is injected into the mold cavity 412 through a runner (not shown) of the second mold 42, so that the liquid plastic 50 fills the mold cavity 412. The liquid plastic 50 is exemplified by a thermoplastic in a molten state, and is made of, for example, polycarbonate (PC) or acrylonitrile-butadiene-styrene (ABS). Since the second end 221 is tightly contacted with the second clamping surface 421 and is shielded by the second clamping surface 421 under the action of the elastic force accumulated when the connecting sheet 23 is deformed, the situation that the liquid plastic 50 infiltrates between the second end 221 of each conductive elastic member 2 and the second clamping surface 421 after filling the mold cavity 412 can be reduced or avoided, so that the liquid plastic 50 only covers the surface 11 and the periphery of the substrate 1 and covers a part of each conductive elastic member 2 but not covers the second end 221. In the present embodiment, the liquid plastic 50 covers all portions of each conductive elastic member 2 except the second end 221. In addition, since the second molding surface 421 of the second mold 42 compresses each conductive elastic member 2 to be in a compressed state, the second mold 42 and the first mold 41 clamp each conductive elastic member 2 and the substrate 1, respectively, so that the substrate 1 and each conductive elastic member 2 can be stably positioned in the mold cavity 412, and the position of the substrate 1 and the conductive elastic member 2 is prevented from being affected during the process of filling the mold cavity 412 with the liquid plastic 50 and flowing therein.
After a period of cooling time, the liquid plastic 50 solidifies to form the insulating package 5, and the insulating package 5 covers the surface 11 and the outer periphery of the substrate 1, and covers a portion of each conductive elastic member 2 but not the second end 221, that is, the insulating package 5 covers all portions of each conductive elastic member 2 except the second end 221. Then, the second mold 42 is driven to move in a direction opposite to the mold closing direction I and returns to the initial position, at this time, the electronic module 10 formed by the base material 1, the conductive elastic member 2 and the insulating package 5 together is taken out from the mold cavity 412 of the first mold 41.
As shown in fig. 7, the cured insulating package 5 includes an outer surface 51, and the second end 221 of each conductive elastic member 2 is exposed on the outer surface 51 and is flush with the outer surface 51. Thus, each conductive elastic member 2 can be used as a conductive contact for electrically connecting with an external electronic component (not shown) such as a battery, an integrated circuit device, a buzzer, or a vibration motor. Two pins (not shown) of the external electronic component can be electrically connected to the second ends 221 of the two conductive elastic members 2, respectively, so that the electronic component can transmit positive and negative signals with the substrate 1 through the two conductive elastic members 2. Since the second end 221 is an end surface, a contact area between the second end 221 and a corresponding pin of the electronic component is large, and an area available for solder coating is also large. Therefore, besides the convenience in welding can be effectively improved, the second end 221 can be firmly welded to the corresponding pin, so that the reliability of the fixed connection of the second end 221 and the pin is improved.
It should be noted that, in other embodiments of the present first embodiment, the number of the contacts 121 of the conductive trace 12 and the number of the conductive elastic members 2 may be one, which is not limited to the number disclosed in the present first embodiment. In step S4, the liquid plastic 50 may be a two-part thermosetting plastic, and the insulating package 5 may be formed by uniformly mixing the main agent and the hardening agent in a certain ratio to form the liquid plastic 50, and then curing the liquid plastic 50 at room temperature for a while or after heating for a while.
Compared with the prior art, the method for manufacturing the electronic module 10 of the first embodiment simplifies the manufacturing steps, and omits the time required for baking the conductive adhesive and the insulating adhesive, thereby greatly shortening the whole processing time and reducing the manufacturing cost. In addition, the first end 211 and the second end 221 of each conductive elastic member 2 are designed to be end surfaces, so that the convenience in welding can be effectively improved, and the first end 211 and the second end 221 can be firmly welded to the corresponding contact 121 and the pin, respectively. Therefore, the reliability of the fixed connection between the first end 211 and the contact 121 and between the second end 221 and the pin can be improved, so as to avoid influencing the transmission of electric signals between the electronic element and the substrate 1.
Referring to fig. 8, a second embodiment of the method for manufacturing an electronic module according to the present invention has the same overall steps as those of the first embodiment, except that the second mold 42 is different from the electronic module 10 in structure and filling manner of the liquid plastic 50.
In the second embodiment, the second die-closing surface 421 of the second die 42 is concavely formed with two accommodating grooves 422, the two accommodating grooves 422 respectively correspond to the positions of the two conductive elastic members 2, and each accommodating groove 422 is used for the second end 221 of the corresponding conductive elastic member 2 to pass through.
Referring to fig. 8, 9 and 10, in step S3 shown in fig. 1, when the second mold 42 moves from the initial position along the mold closing direction I, the two accommodating grooves 422 gradually approach the two conductive elastic members 2. When the second mold 42 moves to the mold closing position, a part of the second sheet 22 and the connecting sheet 23 of each conductive elastic member 2 is inserted and accommodated in the corresponding accommodating groove 422, and each conductive elastic member 2 is in an uncompressed state. Thereby, the second mold 42 is allowed to shield the second ends 221 of the two conductive elastic members 2.
In step S4 shown in fig. 1, the liquid plastic 50 is filled into the cavity 412 of the first mold 41 by a filling method such as low temperature and low pressure injection, instead of high pressure injection, of the filling process Potting process. Since the second end 221 of each conductive elastic member 2 protrudes out of the first die-closing surface 411 of the first die 41 and is spaced apart from the same by a proper distance D, and a portion of the second sheet 22 and the connecting sheet 23 of each conductive elastic member 2 are inserted into the corresponding receiving groove 422, the liquid plastic 50 only covers the surface 11 and the outer periphery of the substrate 1 and covers a portion of the first sheet 21 and the connecting sheet 23 of each conductive elastic member 2, but not the second sheet 22, by controlling the amount of the liquid plastic 50 filled into the die cavity 412 and the liquid plastic 50 filled into the die cavity 412. After the liquid plastic 50 is cooled and solidified to form the insulating package 5, the insulating package 5 covers the surface 11 and the periphery of the substrate 1 and covers a portion of the first sheet 21 and the connecting sheet 23 of each conductive elastic member 2, but does not cover the second sheet 22, and the second end 221 of each conductive elastic member 2 protrudes from and is spaced apart from the outer surface 51 of the insulating package 5. Thus, each conductive elastic member 2 can also serve as a conductive contact for electrically connecting pins of the electronic component.
In the foregoing step S4, after the mold cavity 412 is filled with the liquid plastic 50, only a part of the first sheet 21 and the connecting sheet 23 of each conductive elastic member 2 is covered, and according to the size of each conductive elastic member 2 and the change of the distance D, the liquid plastic 50 may cover only the first sheet 21, or cover both the first sheet 21 and the whole connecting sheet 23, so that the area of each conductive elastic member 2 protruding out of the outer surface 51 of the insulating package 5 may be the whole connecting sheet 23 and the second sheet 22, or only the second sheet 22 after the liquid plastic 50 is cooled and solidified to form the insulating package 5. In addition, in other embodiments of the second embodiment, the number of the contacts 121 of the conductive traces 12, the number of the conductive elastic members 2, and the number of the accommodating grooves 422 may be one, which is not limited to the number disclosed in the second embodiment.
Referring to fig. 11, a third embodiment of the method for manufacturing an electronic module according to the present invention has the same overall steps as those of the first embodiment, except that the structures of the first mold 41, the second mold 42 and the electronic module 10 are slightly different.
In the third embodiment, the thickness of the first mold 41 is thicker than that of the first mold 41 of the first embodiment, and the second end 221 of each conductive elastic member 2 is located in the mold cavity 412 and spaced apart from the first molding surface 411. The second mold 42 has two protruding portions 423 protruding from the second molding surface 421, where the two protruding portions 423 correspond to the positions of the two conductive elastic members 2, and each protruding portion 423 is configured to compress and shield the second end 221 of the corresponding conductive elastic member 2.
Referring to fig. 11, 12 and 13, in step S3 shown in fig. 1, when the second mold 42 moves from the initial position in the mold clamping direction I, each protrusion 423 first contacts the second end 221 of the corresponding conductive elastic member 2 and applies pressure to the second end 221, so that the connecting sheet 23 is bent and deformed relative to the first sheet 21 and the second sheet 22. When the second die 42 is moved to the die-closing position, each conductive elastic member 2 is in a compressed state, and each protrusion 423 is in surface contact with the second end 221 of the corresponding conductive elastic member 2 and shields the second end 221.
In step S4 shown in fig. 1, since each protrusion 423 covers the second end 221 of the corresponding conductive elastic member 2, the liquid plastic 50 covers the surface 11 and the periphery of the substrate 1 and a portion of each conductive elastic member 2 without covering the second end 221 after filling the mold cavity 412. After the liquid plastic 50 is cooled and solidified to form the insulating package 5, the insulating package 5 covers the surface 11 and the outer periphery of the substrate 1, and covers a portion of the first sheet 21, the connecting sheet 23, and the second sheet 22 of each conductive elastic member 2 without covering the second end 221. The insulating package 5 is formed with two grooves 52 recessed downward from the outer surface 51, and the second ends 221 of the conductive elastic members 2 are exposed from the grooves 52. After the grooves 52 are filled with conductive adhesive or solder, the pins of the electronic component are inserted into the corresponding grooves 52 and contacted with the corresponding second ends 221, and after the conductive adhesive or solder is cured, the pins of the electronic component can be fixedly connected with the corresponding second ends 221 and electrically connected with the corresponding second ends 221. Thus, each conductive elastic member 2 can also serve as a conductive contact for electrically connecting pins of the electronic component.
It should be noted that, in the third embodiment, the filling process disclosed in the second embodiment can be used to fill the liquid plastic 50 into the mold cavity 412 of the first mold 41 in a low-temperature and low-pressure filling manner.
Referring to fig. 14, a fourth embodiment of the method for manufacturing an electronic module according to the present invention has the same overall steps as those of the first embodiment, except that the first mold 41 and the electronic module 10 have slightly different structures.
Referring to fig. 14 and 15, in the fourth embodiment, the mold 4 omits the second mold 42 shown in fig. 5. In step S4 shown in fig. 1, the liquid plastic 50 is filled into the cavity 412 of the first mold 41 by a filling process at a low temperature and a low pressure, so that the liquid plastic 50 fills the cavity 412 to cover the surface 11 and the periphery of the substrate 1 and cover a portion of the first sheet 21 and the connecting sheet 23 of each conductive elastic member 2 without covering the second sheet 22. Since the liquid plastic 50 is filled into the cavity 412 at a low temperature and a low pressure, it is possible to reduce the influence on the electronic components which are mounted on the surface 11 of the substrate 1 and are sensitive to high temperature and high pressure.
After the liquid plastic 50 is cooled and solidified to form the insulating package 5, the insulating package 5 wraps the surface 11 and the outer periphery of the substrate 1, and wraps a part of the first sheet body 21 and the connecting sheet body 23 of each conductive elastic member 2, but does not wrap the second sheet body 22, and the second end 221 of each conductive elastic member 2 protrudes out of the outer surface 51 of the insulating package 5 and is spaced apart from the same by a distance. Thus, each conductive elastic member 2 can also serve as a conductive contact for electrically connecting pins of the electronic component.
Referring to fig. 16, a fifth embodiment of the method for manufacturing an electronic module according to the present invention has the overall steps substantially the same as those of the first embodiment, except that the conductive elastic member 2 has a slightly different structure.
In the fifth embodiment, the conductive elastic member 2 is a sigma-type spring piece and has a first sheet 21, a second sheet 22, and a connecting sheet 23. The connecting sheet body 23 of the conductive elastic member 2 is in a horizontal V shape, and both ends of the connecting sheet body 23 are respectively connected to one end of the first sheet body 21 and one end of the second sheet body 22 located on the same side. Therefore, the conductive elastic member 2 can also effectively improve the convenience in soldering, and can firmly solder the first end portion 211 and the second end portion 221 to the corresponding contact 121 of the substrate 1 and the corresponding pin of the electronic component, respectively.
Referring to fig. 17, a sixth embodiment of the method for manufacturing an electronic module according to the present invention has the same overall steps as those of the first embodiment, except that the conductive elastic member 2 has a slightly different structure.
In the sixth embodiment, the conductive elastic member 2 includes a compression spring 24, a first metal pad 25 welded to one end of the compression spring 24, and a second metal pad 26 welded to the other end of the compression spring 24. The first metal pad 25 has a first end 251, and the first end 251 is welded to an end surface of the corresponding contact 121. The second metal pad 26 has a second end 261, and the second end 261 is an end surface for soldering a corresponding pin of the electronic component. Therefore, the conductive elastic member 2 can also effectively improve the convenience in welding, and can firmly weld the first end 251 and the second end 261 to the corresponding contact 121 of the substrate 1 and the corresponding pin of the electronic component respectively.
Referring to fig. 18, a seventh embodiment of the method for manufacturing an electronic module according to the present invention has the same overall steps as those of the first embodiment, except that the conductive elastic member 2 has a slightly different structure.
In the seventh embodiment, the conductive elastic member 2 is a lying V-shaped spring plate and has a first plate 21 and a second plate 22 connected to one end of the first plate 21. The second end 221 of the second sheet 22 is a linear end edge, and the second end 221 contacts the corresponding pin of the electronic component through a line contact manner. Therefore, the conductive elastic member 2 can also effectively improve the convenience in soldering, and can firmly solder the first end portion 211 and the second end portion 221 to the corresponding contact 121 of the substrate 1 and the corresponding pin of the electronic component, respectively.
Referring to fig. 19, an eighth embodiment of the method for manufacturing an electronic module according to the present invention has the same overall steps as those of the first embodiment, but the conductive elastic member 2 has a slightly different structure.
In the eighth embodiment, the conductive elastic member 2 is a compression spring and has a first end 211 and a second end 221 at opposite ends. Therefore, the conductive elastic member 2 can also effectively improve the convenience in soldering, and can firmly solder the first end portion 211 and the second end portion 221 to the corresponding contact 121 of the substrate 1 and the corresponding pin of the electronic component, respectively.
Referring to fig. 20, a ninth embodiment of the method for manufacturing an electronic module according to the present invention has the same overall steps as those of the first embodiment, but the conductive elastic member 2 has a slightly different structure.
In the ninth embodiment, the conductive elastic member 2 is a Pogo pin (Pogo pin) including a hollow sleeve 27, a pin 28, a compression spring 29 and a plug body 30. The spike 28 is movably inserted into the hollow sleeve 27 and protrudes out of one end of the hollow sleeve 27. The pin 28 has a second end portion 281, and the second end portion 281 is an end surface for soldering a corresponding pin of the electronic component. The plug body 30 is disposed in the hollow sleeve 27 and can be fixed to the other end of the hollow sleeve 27 by, for example, a tight fit or a screw connection, and the plug body 30 and the hollow sleeve 27 cooperate to define a first end 301, where the first end 301 is welded to the end face of the corresponding contact 121. The compression spring 29 is inserted into the hollow sleeve 27, one end of the compression spring is abutted against the spike 28, and the other end is abutted against the plug 30, and the compression spring 29 applies elastic force to the spike 28 in a direction away from the plug 30. Therefore, the conductive elastic member 2 can also effectively improve the convenience in soldering, and can firmly solder the first end 301 and the second end 281 to the corresponding contact 121 of the substrate 1 and the corresponding pin of the electronic component, respectively.
Referring to fig. 21, a tenth embodiment of a method for manufacturing an electronic module according to the present invention is applied to a process of manufacturing a housing 100 (shown in fig. 27) of an electronic device.
The manufacturing method of the housing 100 of the electronic device includes the following steps:
As shown in fig. 21 and 22, step S11 is performed to provide a substrate 1 and an outer film 6, wherein the substrate 1 includes an inner surface 11 'and an outer surface 14, the inner surface 11' of the substrate 1 is formed with a conductive trace 12, and the conductive trace 12 has at least one contact 121;
step S12, processing and forming the substrate 1 and the outer film 6;
As shown in fig. 21 and 24, step S13, the first end 211 of the conductive elastic member 2 is fixedly connected to the contact 121;
Step S14, assembling and bonding the outer film 6 on the outer surface 14 of the base material 1;
as shown in fig. 21, 26 and 27, step S15 is to position the base material 1 and the outer film 6 in the mold 4;
In step S16, an insulating package 5 is formed, and the insulating package 5 encapsulates at least a portion of the conductive elastic member 2 and exposes the second end 221 of the conductive elastic member 2.
Referring to fig. 21 and 22, in the tenth embodiment, a smart phone is taken as an example of the electronic device, but the electronic device may also be a tablet computer, a global satellite positioning system, or other electronic devices with a housing and of different types. In step S11, the conductive trace 12 is formed on the inner surface 11' of the substrate 1, for example, by printing. The conductive line 12 has a plurality of contacts 121, and the number of the contacts 121 is two as an example. The electronic component 13 is exemplified by an ultraviolet sensor. The base material 1 and the outer film 6 are rectangular, for example.
In step S12, the outline of the base material 1 and the outer film 6 is cut by, for example, press molding. Subsequently, the base material 1 and the outer film 6 are thermally pressed by thermal press molding, and the base material 1 and the outer film 6 are bent into a curved shape as shown in fig. 23.
Referring to fig. 21 and 24, in step S13, the first ends 211 of the two conductive elastic members 2 are welded to the two contacts 121, respectively. In step S14, the outer film 6 is assembled and bonded to the outer surface 14 of the base material 1. The outer film 6 can be adhered to the outer surface 14 of the substrate 1 through the double-sided adhesive tape by applying the double-sided adhesive tape to the outer surface 14 of the substrate 1 and attaching the outer film 6 to the double-sided adhesive tape.
Referring to fig. 25, 26 and 27, in step S15, the assembled substrate 1 and the outer film 6 are placed in the cavity 412 of the first mold 41, so that a bearing surface 413 of the first mold 41 having a concave arc shape bears the outer film 6. When the second mold 42 moves from the initial position along the mold clamping direction I, the arc surface portion 424 of the second mold clamping surface 421 of the second mold 42 having the outer convex arc shape contacts the second end portion 221 of the corresponding conductive elastic member 2 and applies pressure to the second end portion 221, so that the connecting sheet 23 is bent and deformed relative to the first sheet 21 and the second sheet 22. When the second die 42 is moved to the die-closing position, each conductive elastic member 2 is in a compressed state, and the arc-shaped face portion 424 is in face contact with the second end portion 221 of the conductive elastic member 2 and shields the second end portion 221. After the liquid plastic 50 fills the mold cavity 412, it covers the inner surface 11' of the substrate 1 and a portion of each conductive elastic member 2, but not the second end 221. After the liquid plastic 50 is cooled and solidified to form the insulating package 5, the insulating package 5 covers the surface 11 of the substrate 1 and a portion of each conductive elastic member 2 without covering the second end 221, and the second end 221 is exposed on the outer surface 51. The electronic module 10 and the outer film 6 together form a housing 100 of the electronic device.
It should be noted that, the fifth to tenth embodiments can also be used to fill the liquid plastic 50 into the mold cavity 412 of the first mold 41 by the filling process disclosed in the second embodiment.
Referring to fig. 28, an eleventh embodiment of the method for manufacturing an electronic module according to the present invention, the overall steps and the structure of the second mold 42 and the electronic module 10 are slightly different from those of the first embodiment.
In the eleventh embodiment, the second die 42 has two pins 425 protruding from the second die-engaging surface 421. The second end 221 of the second sheet 22 of each conductive elastic member 2 is formed with a clamping hole 222, the clamping hole 222 is used for the latch 425 to be clamped, and the clamping hole 222 is a blind hole, so that the latch 425 does not protrude out of one end of the second sheet 22 opposite to the second end 221 after penetrating into the clamping hole 222. The first end 211 of the first sheet 21 of each conductive elastic member 2 is coated or otherwise formed with a conductive paste 20.
Firstly, the base material 1 is placed in the mold cavity 412 of the first mold 41, and the clamping holes 222 of the second sheet 22 of each conductive elastic member 2 are clamped to the corresponding pins 425, so that each conductive elastic member 2 is pre-combined on the second mold 42.
Referring to fig. 29, the second mold 42 is driven to move along the mold closing direction I, and during the movement of the second mold 42, the conductive adhesive 20 on the first end 211 of each conductive elastic member 2 will first contact the corresponding contact 121, so that the first end 211 is adhered to the corresponding contact 121 through the conductive adhesive 20. Then, the second die-bonding surface 421 contacts the second end 221 of each conductive elastic member 2 and applies pressure to the second end 221, so that the connecting sheet 23 is bent and deformed relative to the first sheet 21 and the second sheet 22.
When the second die 42 moves to the die-closing position shown in fig. 29, the second die-closing surface 421 of the second die 42 compresses each conductive elastic member 2 to be in a compressed state, and the second die-closing surface 421 shields the second end 221 of each conductive elastic member 2. Thereafter, the liquid plastic 50 is injected into the mold cavity 412, and the blocking holes 222 are blind holes, so that the liquid plastic 50 does not cover the second sheet 22 of each conductive elastic member 2, but does not cover the second end 221, and does not cover each pin 425 of the second mold 42.
Referring to fig. 29 and 30, after the liquid plastic 50 is solidified to form the insulating package 5, the second mold 42 is driven to move in a direction opposite to the mold closing direction I. Since the insulating package 5 encapsulates all the portions of each conductive elastic member 2 except the second end 221, each conductive elastic member 2 is kept in a fixed state, and thus each latch 425 is driven to move away from the corresponding card hole 222 during the movement of the second mold 42. When the second mold 42 is reset to the position shown in fig. 28, the electronic module 10 composed of the substrate 1, the conductive elastic member 2 and the insulating package 5 is taken out from the cavity 412 of the first mold 41.
In summary, the manufacturing method of the electronic module 10 of each embodiment simplifies the manufacturing steps, and can greatly shorten the whole processing time and reduce the manufacturing cost. In addition, the design of each conductive elastic member 2 can effectively improve the convenience in welding, and can be firmly welded on the contact 121 of the base material 1 and the pins of the electronic element. Therefore, the reliability of the fixed connection between the conductive elastic member 2, the contact 121 of the substrate 1 and the pins of the electronic element can be improved, so as to avoid the influence on the transmission of electric signals between the electronic element and the substrate 1, and the aim of the invention can be achieved.
Claims (9)
1. A method of manufacturing an electronic module, the method comprising the steps of:
providing a substrate, wherein a conductive circuit is formed on the surface of the substrate, and the conductive circuit is provided with at least one contact;
Fixedly connecting a first end of the conductive elastic member to the contact; and
Forming an insulating package body, wherein the insulating package body at least covers a part of the conductive elastic piece and exposes the second end part of the conductive elastic piece, and the part of the insulating package body, which covers the conductive elastic piece, is in contact with the conductive elastic piece and has no gap with the conductive elastic piece;
Shielding the second end portion of the conductive elastic member from wrapping the second end portion by the insulating package before forming the insulating package; in the step, the base material and the conductive elastic piece connected to the base material are placed between a first die and a second die, and then the second die and the first die are clamped, so that the second die is compressed and shields the second end part to enable the conductive elastic piece to be in a compressed state;
In the step, the base material and the conductive elastic piece connected to the base material are placed in a die cavity of the first die, then the second die is clamped with the first die, the second die is provided with a second die combining surface and a convex part protruding from the second die combining surface, the convex part is abutted against and shields the second end part, and the second end part is separated from the outer surface of the insulating package body by a distance.
2. The method for manufacturing an electronic module according to claim 1, wherein: in the step, the first die is provided with a first die matching surface, and the second end part of the conductive elastic piece is positioned in the die cavity and is separated from the first die matching surface by a distance.
3. The method for manufacturing an electronic module according to claim 1, wherein: in the step, the insulating package is formed by cooling and solidifying the liquid plastic, and the liquid plastic fills the mold cavity to cover the surface and the periphery of the substrate and cover a part of the conductive elastic member but not cover the second end portion.
4. The electronic module is characterized by comprising a substrate, a conductive elastic member and an insulating packaging body, wherein the substrate comprises a surface and a conductive circuit formed on the surface, the conductive circuit is provided with at least one contact, the conductive elastic member comprises a first end fixedly connected with the contact and a second end opposite to the first end, the insulating packaging body at least coats a part of the conductive elastic member and enables the second end to be exposed, the part of the insulating packaging body, which coats the conductive elastic member, is in contact with the conductive elastic member and has no gap with the conductive elastic member, the insulating packaging body comprises an outer surface, the outer surface is downwards sunken to form a groove, the second end is exposed in the groove, conductive adhesive or solder can be filled in the groove, and the second end is spaced from the outer surface of the insulating packaging body by a certain distance.
5. The electronic module of claim 4, wherein: the conductive elastic piece is in a compressed state.
6. The electronic module of claim 4, wherein: the conductive elastic piece is a Z-shaped spring piece and comprises a first sheet body and a second sheet body opposite to the first sheet body, the first sheet body is provided with a first end part, the second sheet body is provided with a second end part, and the second end part is an end face.
7. The electronic module of claim 4, wherein: the conductive elastic piece is a sigma-type spring piece and comprises a first sheet body and a second sheet body opposite to the first sheet body, wherein the first sheet body is provided with a first end part, the second sheet body is provided with a second end part, and the second end part is an end face.
8. The electronic module of claim 4, wherein: the conductive elastic piece comprises a compression spring, a first metal gasket connected to one end of the compression spring and a second metal gasket connected to the other end of the compression spring, wherein the first metal gasket is provided with a first end part, the first end part is an end face connected to the contact, the second metal gasket is provided with a second end part, and the second end part is an end face.
9. The electronic module of claim 4, wherein: the insulating package is formed by cooling and solidifying liquid plastic.
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| TW107107852A TWI655891B (en) | 2018-03-08 | 2018-03-08 | Electronic module, manufacturing method thereof, housing of electronic device and manufacturing method thereof |
| TW107107852 | 2018-03-08 | ||
| CN202110535734.XA CN113395830B (en) | 2018-03-08 | 2019-03-07 | Electronic module and manufacturing method thereof |
| CN201910172306.8A CN110248468B (en) | 2018-03-08 | 2019-03-07 | Electronic module and manufacturing method thereof, and shell of electronic device and manufacturing method thereof |
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| CN201910172306.8A Active CN110248468B (en) | 2018-03-08 | 2019-03-07 | Electronic module and manufacturing method thereof, and shell of electronic device and manufacturing method thereof |
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| CN112106258B (en) * | 2019-11-27 | 2023-01-31 | 苏州昀冢电子科技股份有限公司 | Crimp electrical connector |
| CN114122748A (en) * | 2020-08-31 | 2022-03-01 | 华为技术有限公司 | Electronic equipment |
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| WO2003041192A1 (en) * | 2001-11-05 | 2003-05-15 | Shin-Etsu Polymer Co., Ltd. | Circuit component connector, its connection structure, and gasket |
| DE102008045615A1 (en) * | 2008-09-03 | 2010-03-18 | Infineon Technologies Ag | Power semiconductor module, has electronic components arranged on surface of substrate, and contact elements arranged in channel and pressed on surface of substrate by elastic spring to electrically contact surface of substrate |
| EP2252135A2 (en) * | 2009-05-15 | 2010-11-17 | Hamilton Sundstrand Corporation | Motor controller assembly with capacitor thermal isolation |
| CN102891116A (en) * | 2011-07-20 | 2013-01-23 | 国碁电子(中山)有限公司 | Embedded element packaging structure and manufacturing method thereof |
| KR101488266B1 (en) * | 2013-08-06 | 2015-01-30 | 주식회사 유니드 | Matable electrical interconnection structure for electrical interconnection, connector, semiconductor package assembly, and electrical device having the same |
| CN105643855A (en) * | 2014-11-28 | 2016-06-08 | 东和株式会社 | Electronic component, method and apparatus for producing same |
| CN105744749A (en) * | 2014-12-24 | 2016-07-06 | 绿点高新科技股份有限公司 | Method for forming conductive circuit on substrate insulating surface |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110248468B (en) | 2021-08-17 |
| TWI655891B (en) | 2019-04-01 |
| CN113395830A (en) | 2021-09-14 |
| TW201940034A (en) | 2019-10-01 |
| CN110248468A (en) | 2019-09-17 |
| CN113453430A (en) | 2021-09-28 |
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