CN113453430A - Electronic module and manufacturing method thereof - Google Patents
Electronic module and manufacturing method thereof Download PDFInfo
- Publication number
- CN113453430A CN113453430A CN202110536093.XA CN202110536093A CN113453430A CN 113453430 A CN113453430 A CN 113453430A CN 202110536093 A CN202110536093 A CN 202110536093A CN 113453430 A CN113453430 A CN 113453430A
- Authority
- CN
- China
- Prior art keywords
- conductive elastic
- substrate
- electronic module
- mold
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 64
- 239000000758 substrate Substances 0.000 claims abstract description 93
- 238000004806 packaging method and process Methods 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims description 48
- 239000007788 liquid Substances 0.000 claims description 40
- 239000004033 plastic Substances 0.000 claims description 40
- 229920003023 plastic Polymers 0.000 claims description 40
- 230000006835 compression Effects 0.000 claims description 15
- 238000007906 compression Methods 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 13
- 238000001816 cooling Methods 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000012545 processing Methods 0.000 abstract description 5
- 230000005540 biological transmission Effects 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 description 16
- 230000001070 adhesive effect Effects 0.000 description 16
- 230000013011 mating Effects 0.000 description 13
- 239000000463 material Substances 0.000 description 9
- 238000005476 soldering Methods 0.000 description 8
- 229920001971 elastomer Polymers 0.000 description 6
- 239000000806 elastomer Substances 0.000 description 6
- 239000003292 glue Substances 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000004382 potting Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005429 filling process Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/1078—Leads having locally deformed portion, e.g. for retention
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
A manufacturing method of an electronic module comprises the following steps: providing a substrate, wherein a conductive circuit is formed on the surface of the substrate and is provided with at least one contact point; fixedly connecting a first end of a conductive elastic member to the contact; and forming an insulating packaging body, wherein the insulating packaging body at least covers one part of the conductive elastic piece and exposes the second end part of the conductive elastic piece. Therefore, the conductive elastic piece can be used as a conductive contact for the electric connection of the electronic element. The manufacturing method simplifies the manufacturing steps, greatly shortens the whole processing time and reduces the manufacturing cost. In addition, the reliability of the fixed connection between the conductive elastic piece, the contact of the substrate and the pin of the electronic element can be improved, so that the influence on the transmission of the electric signal between the electronic element and the substrate can be avoided.
Description
The present application is a divisional application of a chinese patent application entitled "electronic module and method for manufacturing the same, housing of electronic device and method for manufacturing the same", having an application date of 2019, 3, 7 and an application number of 201910172306.8.
Technical Field
The present invention relates to an electronic module and a method for manufacturing the same, and more particularly, to an electronic module having conductive contacts and a method for manufacturing the same, and a housing of an electronic device and a method for manufacturing the same.
Background
The conventional method for manufacturing conductive contacts of a circuit board is to form an insulating layer on a substrate so that the insulating layer covers a plurality of conductive portions of a conductive circuit of the substrate. And then, drilling a plurality of holes respectively corresponding to the guide connection parts on the insulating layer in a CNC machining mode, so that each guide connection part is exposed through the corresponding hole. Next, conductive paste is filled in each hole, and a pin is inserted into the conductive paste in each hole so that one end of the pin contacts the conductive connection portion. And baking the conductive adhesive to cure the conductive adhesive. Coating insulating glue on the periphery of each pin to seal the corresponding conductive glue, and baking the insulating glue to solidify the insulating glue. Therefore, each pin can be used as a conductive contact for the electric connection of the electronic element.
Because the above-mentioned process steps are many, and it takes a period of time to bake both the conductive adhesive and the insulating adhesive to solidify them, the whole process time is very long and the manufacturing cost is easily increased. In addition, because the pin only penetrates through one end of the pin to contact the conductive connection part and the contact area of the pin and the conductive connection part is small, when the conductive adhesive expands with heat and contracts with cold to cause pin displacement, poor contact between the pin and the conductive connection part is easy to cause, and then the conduction of an electric signal is influenced, and the reliability of a product is influenced.
Disclosure of Invention
It is an object of the present invention to provide a method for manufacturing an electronic module that overcomes at least one of the disadvantages of the background art.
The purpose of the invention and the technical problem to be solved are realized by adopting the following technical scheme, and the manufacturing method of the electronic module provided by the invention comprises the following steps:
providing a substrate, wherein a conductive circuit is formed on the surface of the substrate and is provided with at least one contact point;
fixedly connecting a first end of a conductive elastic member to the contact; and
and forming an insulating packaging body, wherein the insulating packaging body at least covers a part of the conductive elastic piece and exposes the second end part of the conductive elastic piece.
The method for manufacturing the electronic module further comprises the following steps: before the insulating packaging body is formed, the second end part of the conductive elastic piece is shielded, so that the insulating packaging body does not cover the second end part.
In the manufacturing method of the electronic module, the second end is compressed and shielded to enable the conductive elastic piece to be in a compressed state.
In the step, the substrate and the conductive elastic member connected thereto are placed in a cavity of a first mold, so that the second end portion protrudes out of a first mold clamping surface of the first mold, and then a second mold and the first mold are clamped, so that a second mold clamping surface of the second mold compresses and shields the second end portion.
In the method for manufacturing an electronic module according to the present invention, in the above step, the substrate and the conductive elastic member connected thereto are placed in a cavity of a first mold, and then a second mold having a second mating surface and a convex portion provided to protrude from the second mating surface is closed to the first mold, and the convex portion abuts against and shields the second end portion.
In the manufacturing method of the electronic module, in the step, the substrate and the conductive elastic member connected thereto are placed in a cavity of a first mold, and then a second mold is closed with the first mold, wherein the second mold has a second closing surface, and the second closing surface is recessed to form a receiving groove for receiving the second end portion.
In the method for manufacturing an electronic module according to the present invention, in the above step, the substrate is placed in a cavity of a first mold, the second end of the conductive elastic member is disposed on a second mating surface of a second mold, the second mold and the first mold are mated with each other, the first end is supported by the contact, and the second mating surface compresses and shields the second end.
In the step of forming the insulating package, liquid plastic is injected into the mold cavity, and the insulating package is formed after the liquid plastic is solidified.
The method for manufacturing the electronic module further comprises the following steps: before the insulating packaging body is formed, the base material and the conductive elastic piece connected with the base material are placed in a mold cavity of a first mold, in the step of forming the insulating packaging body, liquid plastic is filled into the mold cavity in a low-temperature and low-pressure mode, and the insulating packaging body is formed after the liquid plastic is solidified.
The method for manufacturing the electronic module further comprises the following steps: after providing the substrate, shaping the substrate into a curved shape.
It is another object of the present invention to provide an electronic module that overcomes at least one of the disadvantages of the background art.
The electronic module comprises a substrate, a conductive elastic element and an insulating packaging body, wherein the substrate comprises a surface and a conductive circuit formed on the surface, the conductive circuit is provided with at least one contact, the conductive elastic element comprises a first end part fixedly connected with the contact and a second end part opposite to the first end part, and the insulating packaging body at least covers one part of the conductive elastic element and exposes the second end part.
In the electronic module of the invention, the insulating package body includes an outer surface, and the second end portion is exposed at the outer surface.
In the electronic module of the invention, the conductive elastic element is in a compressed state and the second end part is flush with the outer surface.
In the electronic module of the present invention, the second end portion protrudes out of the outer surface and is spaced apart from the outer surface by a distance.
In the electronic module of the invention, the insulating package body includes an outer surface, the outer surface is recessed downward to form a groove, and the second end is exposed in the groove.
In the electronic module of the present invention, the conductive elastic member is a Z-shaped spring plate and includes a first plate and a second plate opposite to the first plate, the first plate has the first end, the second plate has the second end, and the second end is an end surface.
In the electronic module of the present invention, the conductive elastic member is a Σ -shaped spring piece and includes a first piece and a second piece opposite to the first piece, the first piece has the first end, the second piece has the second end, and the second end is an end surface.
In the electronic module of the present invention, the conductive elastic member includes a compression spring, a first metal gasket connected to one end of the compression spring, and a second metal gasket connected to the other end of the compression spring, the first metal gasket has the first end portion, the first end portion is an end surface connected to the contact, the second metal gasket has the second end portion, and the second end portion is an end surface.
In the electronic module of the present invention, the conductive elastic member is a V-shaped spring plate and includes a first plate and a second plate connected to one end of the first plate, the first plate has the first end portion, the first end portion is an end surface connected to the contact, the second plate has the second end portion, and the second end portion is an end edge.
In the electronic module of the present invention, the substrate is curved.
According to the electronic module, the first end part is fixedly connected to the contact through the conductive adhesive, the second end part is provided with the clamping hole, and the clamping hole is a blind hole.
It is a further object of the present invention to provide a method of manufacturing a housing for an electronic device that overcomes at least one of the disadvantages of the background art.
The object of the present invention and the problem of the background art are achieved by the following technical solutions, and the method for manufacturing the housing of the electronic device according to the present invention includes the following steps:
providing a substrate and an outer film, wherein the substrate comprises an inner surface, the inner surface of the substrate is provided with a conductive circuit, and the conductive circuit is provided with at least one contact;
forming the substrate and the outer film;
fixedly connecting a first end of a conductive elastic member to the contact; and
and forming an insulating packaging body, wherein the insulating packaging body at least covers a part of the conductive elastic piece and exposes the second end part of the conductive elastic piece.
In the method for manufacturing a case of an electronic device according to the present invention, in the step of processing and molding the base material and the outer film, the base material and the outer film are bent into a curved shape.
The method for manufacturing a case of an electronic device according to the present invention further includes a step of assembling and bonding the outer film to the outer surface of the base material after the first end portion is fixedly connected to the contact, and a step of positioning the base material and the outer film in a mold after the outer film is assembled and bonded to the outer surface.
It is a further object of the present invention to provide a housing for an electronic device that overcomes at least one of the disadvantages of the background art.
The object of the present invention and the background problem to be solved are achieved by the following technical solutions, where a housing of an electronic device according to the present invention includes an outer film and an electronic module, the electronic module includes a substrate, a conductive elastic member, and an insulating package, the substrate includes an inner surface, an outer surface combined with the outer film, and a conductive circuit formed on the inner surface, the conductive circuit has at least one contact, the conductive elastic member includes a first end portion fixedly connected to the contact and a second end portion opposite to the first end portion, and the insulating package at least covers a portion of the conductive elastic member and exposes the second end portion.
The present invention is directed to an electronic module including a substrate, a conductive elastic element, and an insulating package, wherein the substrate includes a surface and a conductive trace formed on the surface, the conductive trace has at least one contact, the conductive elastic element includes a first end fixedly connected to the contact and a second end opposite to the first end, and the insulating package covers all portions of the conductive elastic element except the second end.
The purpose of the invention and the technical problem to be solved are realized by adopting the following technical scheme, and the manufacturing method of the electronic module provided by the invention comprises the following steps:
providing a substrate and a conductive elastic part, wherein a conductive circuit is formed on the surface of the substrate and is provided with at least one contact point, and the conductive elastic part comprises a first end part and a second end part opposite to the first end part;
fixedly connecting the first end of the conductive elastic member to the contact; and
and forming an insulating packaging body, wherein the insulating packaging body wraps all parts of the conductive elastic piece except the second end part.
The invention has the beneficial effects that: the manufacturing method of the electronic module simplifies the manufacturing steps, can greatly shorten the whole processing working hour and reduce the manufacturing cost. In addition, the design of each conductive elastic piece can effectively improve the convenience in welding and can be stably welded on the joint of the base material and the pin of the electronic element. Therefore, the reliability of the fixed connection among the conductive elastic piece, the contact of the substrate and the pin of the electronic element can be improved, and the influence on the transmission of electric signals between the electronic element and the substrate is avoided.
Drawings
FIG. 1 is a process flow diagram illustrating the steps of a first embodiment of the method of manufacturing an electronic module of the present invention;
FIG. 2 is a plan view illustrating the structure of the substrate used in the first embodiment;
FIG. 3 is a side view illustrating the first embodiment using a conductive elastic member having a first plate, a second plate and a connecting plate;
FIG. 4 is a top view illustrating two conductive elastic members used in the first embodiment fixedly connected to two contacts of the substrate, respectively;
FIG. 5 is a partial cross-sectional view illustrating the substrate and the conductive elastic member used in the first embodiment placed in a cavity of a first mold with a second mold in an initial position;
FIG. 6 is a partial cross-sectional view similar to FIG. 5, illustrating the second mold moved to a closed position with a second clamping surface of the second mold compressing the conductive elastomer used in the first embodiment and shielding a second end of the conductive elastomer, and liquid plastic injected into the mold cavity;
fig. 7 is a partial sectional view illustrating the structure of the electronic module manufactured by the first embodiment;
fig. 8 is a partial cross-sectional view illustrating that two receiving grooves are formed in the second mold clamping surface of the second mold used in the second embodiment of the method for manufacturing an electronic module according to the present invention;
FIG. 9 is a partial cross-sectional view similar to FIG. 8, illustrating the second die moved to the closed position, the second sheet and a portion of the connecting sheet of the conductive elastic member used in the second embodiment being inserted and received in the corresponding receiving slots, and the conductive elastic member being in an uncompressed state;
fig. 10 is a partial sectional view illustrating the structure of the electronic module manufactured by the second embodiment;
fig. 11 is a partial cross-sectional view illustrating that the second mold used in the method for manufacturing an electronic module according to the third embodiment of the present invention has two convex portions protruding from the second mating surface;
FIG. 12 is a partial cross-sectional view similar to FIG. 11 illustrating the second die moved to the clamped position with the projections of the second die compressing the corresponding conductive elastomer used in the third embodiment and shielding the second end;
fig. 13 is a partial sectional view illustrating the structure of the electronic module manufactured by the third embodiment;
fig. 14 is a partial cross-sectional view illustrating that the liquid plastic is filled into the mold cavity at a low temperature and a low pressure by means of a potting process in the fourth embodiment of the method for manufacturing an electronic module according to the present invention;
fig. 15 is a partial sectional view illustrating the structure of the electronic module manufactured by the fourth embodiment;
fig. 16 is a side view illustrating the structure of the conductive elastic member used in the fifth embodiment of the method for manufacturing an electronic module according to the present invention;
fig. 17 is a side view illustrating a structure of a conductive elastic member used in the sixth embodiment of the manufacturing method of the electronic module according to the present invention;
fig. 18 is a side view illustrating the structure of the conductive elastic member used in the seventh embodiment of the method for manufacturing an electronic module according to the present invention;
fig. 19 is a side view illustrating the structure of the conductive elastic member used in the eighth embodiment of the method for manufacturing an electronic module according to the present invention;
fig. 20 is a side view illustrating the structure of the conductive elastic member used in the ninth embodiment of the method for manufacturing an electronic module according to the present invention;
fig. 21 is a flowchart of steps for explaining a method of manufacturing a case of an electronic device using a tenth embodiment of the method of manufacturing an electronic module of the present invention;
FIG. 22 is a top plan view illustrating the substrate cut profile and outer film cut profile used in the tenth embodiment;
FIG. 23 is a side view illustrating the substrate and the outer membrane used in the tenth embodiment bent into a curved shape;
FIG. 24 is a side view illustrating the outer film assembled to the outer surface of the substrate used in the tenth embodiment;
FIG. 25 is a partial cross-sectional view illustrating the outer film and the substrate used in the tenth embodiment placed within the mold cavity;
FIG. 26 is a partial cross-sectional view similar to FIG. 25, illustrating the second die moved to the clamped position with an arcuate surface portion of the second die compressing the conductive elastomer used in the tenth embodiment and shielding the second end of the conductive elastomer;
FIG. 27 is a side view illustrating the electronic module and the outer membrane together forming the housing;
fig. 28 is a partial cross-sectional view illustrating that the substrate member used in the eleventh embodiment of the method for manufacturing an electronic module according to the present invention is placed in the cavity of the first mold, and a locking hole of the conductive elastic member is locked to a pin of the second mold;
FIG. 29 is a partial cross-sectional view similar to FIG. 28, illustrating the second die moved to the clamped position to secure the conductive glue on the conductive elastomer to the corresponding contact; and
fig. 30 is a partial sectional view illustrating the structure of the electronic module manufactured by the eleventh embodiment.
Detailed Description
The invention is described in detail below with reference to the following figures and examples:
before the present invention is described in detail, it is noted that like elements are represented by like reference numerals throughout the following description.
The first embodiment of the method for manufacturing an electronic module according to the present invention comprises the steps of:
as shown in fig. 1 and fig. 2, in step S1, a substrate 1 is provided, a conductive trace 12 is formed on a surface 11 of the substrate 1, and the conductive trace 12 has at least one contact 121;
as shown in fig. 1 and 5, in step S2, the first end 211 of the conductive elastic element 2 is fixedly connected to the contact 121;
step S3, positioning the substrate 1 in the mold 4; and
as shown in fig. 1 and 7, in step S4, an insulating package 5 is formed, where the insulating package 5 at least covers a portion of the conductive elastic member 2 and exposes the second end 221 of the conductive elastic member 2.
Referring to fig. 2 and 3, in the first embodiment, the substrate 1 is a Flexible Printed Circuit (FPC), the conductive traces 12 have a plurality of contacts 121, and the number of the contacts 121 is two. On the surface 11 of the substrate 1 at least one electronic component 13 is mounted which is electrically connected to the conductive track 12. The conductive elastic member 2 is a metal spring plate in a Z shape and has a first plate 21, a second plate 22 opposite to the first plate 21, and a connecting plate 23. The connecting piece 23 is connected obliquely between one end of the first piece 21 and one end of the second piece 22 on the opposite side. The first sheet 21 has a first end 211, and the first end 211 is an end surface for being soldered to the corresponding contact 121. The second blade 22 has a second end 221 on the side opposite to the connecting blade 23, the second end 221 being an end face.
Referring to fig. 4 and 5, in step S2, two conductive elastic elements 2 are respectively connected to two contacts 121, wherein the first end 211 of each conductive elastic element 2 is fixedly connected to the corresponding contact 121 by, for example, welding. Since the first end portion 211 is an end surface, a contact area between the first end portion 211 and the corresponding contact 121 is large, and an area where solder can be applied is also large. Therefore, the convenience of welding can be effectively improved, and the first end portion 211 can be stably welded to the corresponding contact 121, so that the reliability of the fixed connection between the first end portion 211 and the contact 121 is improved.
Referring to fig. 5 and 6, the mold 4 of the present embodiment includes a first mold 41 and a second mold 42. The first die 41 has a first mating surface 411, and the first die 41 is formed with a die cavity 412 recessed by the first mating surface 411. The second die 42 has a second die surface 421 for contacting the first die surface 411. In step S3, the substrate 1 and the conductive elastic members 2 connected thereto are placed in the cavity 412 of the first mold 41, such that the second end 221 of each conductive elastic member 2 protrudes out of the first mating surface 411 of the first mold 41 and is spaced apart therefrom by a suitable distance D. The substrate 1 can be positioned in the mold cavity 412 by a plurality of stoppers (not shown) of the first mold 41 disposed in the mold cavity 412 and blocking the outer periphery of the substrate 1. Next, the second die 42 is driven to move from the initial position shown in fig. 5 along the die closing direction I, and since the second end 221 of each conductive elastic member 2 is spaced from the first die surface 411 by a suitable distance D, the second die surface 421 will contact the second end 221 of each conductive elastic member 2 and apply pressure to the second end 221 during the movement of the second die 42. After the second end 221 is pressed, the second sheet 22 compresses the connecting sheet 23, so that the connecting sheet 23 bends and deforms relative to the first sheet 21 and the second sheet 22. Therefore, the second sheet 22 gradually approaches the first sheet 21 in the process of being compressed by the moving second die 42. Subsequently, when the second die 42 moves to the die-clamping position where the second die surface 421 abuts against the first die surface 411 of the first die 41 as shown in fig. 6, the second die surface 421 of the second die 42 compresses each conductive elastic member 2 to be in a compressed state, and the second die surface 421 comes into surface contact with the second end portion 221 of each conductive elastic member 2 and shields the second end portion 221.
Referring to fig. 6 and 7, in step S4, the first embodiment forms the insulating package 5 by in-mold injection molding (Insert molding). First, a liquid plastic 50 is injected into the mold cavity 412 through a runner (not shown) of the second mold 42, so that the liquid plastic 50 fills the mold cavity 412. The liquid plastic 50 is a molten thermoplastic, such as Polycarbonate (PC) or Acrylonitrile Butadiene Styrene (ABS). Since the second end portion 221 of each conductive elastic member 2 is pressed against the second mold clamping surface 421 and shielded by the second mold clamping surface 421 under the action of the elastic force accumulated when the connecting sheet 23 is deformed, the liquid plastic 50 can be prevented or prevented from seeping into the space between the second end portion 221 of each conductive elastic member 2 and the second mold clamping surface 421 after filling the mold cavity 412, so that the liquid plastic 50 only covers the surface 11 and the outer periphery of the substrate 1 and covers a portion of each conductive elastic member 2 without covering the second end portion 221. In the present embodiment, the liquid plastic 50 covers all parts of each conductive elastic member 2 except the second end 221. In addition, since the second clamping surface 421 of the second mold 42 compresses each conductive elastic element 2 to be in a compressed state, the second mold 42 and the first mold 41 respectively clamp each conductive elastic element 2 and the substrate 1, so that the substrate 1 and each conductive elastic element 2 can be stably positioned in the mold cavity 412, and the influence on the positions of the substrate 1 and the conductive elastic element 2 in the process of filling the liquid plastic 50 into the mold cavity 412 and flowing in the mold cavity is avoided.
After a period of cooling time, the liquid plastic 50 is solidified to form the insulating package 5, and the insulating package 5 covers the surface 11 and the outer periphery of the substrate 1, and covers a portion of each conductive elastic member 2 without covering the second end 221, that is, the insulating package 5 covers all portions of each conductive elastic member 2 except the second end 221. Then, the second mold 42 is driven to move along the direction opposite to the mold clamping direction I and return to the initial position, so that the electronic module 10 formed by the substrate 1, the conductive elastic member 2 and the insulating package 5 can be taken out from the cavity 412 of the first mold 41.
As shown in fig. 7, the cured insulating encapsulation 5 includes an outer surface 51, and the second end 221 of each conductive elastic element 2 is exposed at the outer surface 51 and is flush with the outer surface 51. Thus, each conductive elastic member 2 can be used as a conductive contact for electrically connecting an external electronic device (not shown) such as a battery, an integrated circuit device, a buzzer or a vibration motor. Two pins (not shown) of an external electronic component can be electrically connected to the second ends 221 of the two conductive elastic members 2, respectively, so that the electronic component can transmit positive and negative electrical signals with the substrate 1 through the two conductive elastic members 2. Since the second end 221 is an end surface, the contact area between the second end 221 and the corresponding pin of the electronic component is large, and the area for coating solder is also large. Therefore, in addition to effectively improving the convenience of welding, the second end 221 can be stably welded to the corresponding pin, so as to improve the reliability of the fixed connection between the second end 221 and the pin.
It should be noted that, in other implementation manners of the first embodiment, the number of the contacts 121 of the conductive traces 12 and the number of the conductive elastic members 2 may also be one, and the number is not limited to the number disclosed in the first embodiment. In step S4, the liquid plastic 50 may be a two-part thermosetting plastic, and the liquid plastic 50 is uniformly mixed with the main agent and the curing agent in a certain ratio to be cured into the insulating package 5 at room temperature for a certain period of time or after being heated for a certain period of time.
Compared with the prior art, the method for manufacturing the electronic module 10 of the first embodiment simplifies the process steps and saves the time required for baking the conductive adhesive and the insulating adhesive, thereby greatly reducing the whole process time and the manufacturing cost. In addition, the first end 211 and the second end 221 of each conductive elastic element 2 are designed to be end surfaces, which can effectively improve the convenience of welding and can ensure that the first end 211 and the second end 221 are respectively and stably welded to the corresponding contact 121 and the corresponding pin. Therefore, the reliability of the fixed connection between the first end portion 211 and the contact 121 and between the second end portion 221 and the pin can be improved, so as to avoid the influence on the electrical signal transmission between the electronic component and the substrate 1.
Referring to fig. 8, the overall steps of the method for manufacturing an electronic module according to the second embodiment of the present invention are substantially the same as the first embodiment, except that the structure of the second mold 42 and the electronic module 10 and the filling manner of the liquid plastic 50 are different.
In the second embodiment, two receiving grooves 422 are recessed from the second mating surface 421 of the second mold 42, the two receiving grooves 422 correspond to the positions of the two conductive elastic members 2, and each receiving groove 422 is used for the second end 221 of the corresponding conductive elastic member 2 to pass through.
Referring to fig. 8, 9 and 10, in step S3 shown in fig. 1, when the second mold 42 moves from the initial position along the mold closing direction I, the two receiving grooves 422 gradually approach the two conductive elastic members 2. When the second die 42 moves to the die closing position, a portion of the second sheet 22 and the connecting sheet 23 of each conductive elastic member 2 is inserted and received in the corresponding receiving slot 422, and each conductive elastic member 2 is in an uncompressed state. Thereby, the second mold 42 can cover the second ends 221 of the two conductive elastic members 2.
In step S4 shown in fig. 1, the liquid plastic 50 is filled into the cavity 412 of the first mold 41 by a filling method such as a Potting process (low-temperature low-pressure injection) instead of a high-pressure injection. Since the second end 221 of each conductive elastic member 2 protrudes out of the first mating surface 411 of the first die 41 and is spaced apart from the first mating surface by a certain distance D, and the second sheet 22 and a portion of the connecting sheet 23 of each conductive elastic member 2 are inserted and accommodated in the corresponding accommodating groove 422, by controlling the amount of the liquid plastic 50 filled in the cavity 412 and filling the cavity 412 with the liquid plastic 50, the liquid plastic 50 only covers the surface 11 and the outer periphery of the substrate 1, and covers the first sheet 21 and a portion of the connecting sheet 23 of each conductive elastic member 2, but does not cover the second sheet 22. After the liquid plastic 50 is cooled and solidified to form the insulating package 5, the insulating package 5 covers the surface 11 and the outer periphery of the substrate 1 and covers a portion of the first sheet 21 and the connecting sheet 23 of each conductive elastic member 2 without covering the second sheet 22, and the second end 221 of each conductive elastic member 2 protrudes out of the outer surface 51 of the insulating package 5 and is spaced apart from the outer surface. Therefore, each conductive elastic part 2 can also be used as a conductive contact for electrically connecting the pins of the electronic element.
It should be noted that, in the step S4, the liquid plastic 50 only covers the first sheet 21 and a portion of the connecting sheet 23 of each conductive elastic member 2 after filling the cavity 412, and the liquid plastic 50 may only cover the first sheet 21 or both cover the first sheet 21 and the entire connecting sheet 23 with the size of each conductive elastic member 2 and the variation of the distance D, so that after the liquid plastic 50 is cooled and solidified to form the insulating package 5, the area of each conductive elastic member 2 protruding out of the outer surface 51 of the insulating package 5 may be the entire connecting sheet 23 and the second sheet 22 or only the second sheet 22. In addition, in other implementation manners of the second embodiment, the number of the contacts 121 of the conductive circuit 12, the number of the conductive elastic members 2, and the number of the receiving grooves 422 may be one, and the number is not limited to the number disclosed in the second embodiment.
Referring to fig. 11, the third embodiment of the method for manufacturing an electronic module according to the present invention has the same overall steps as the first embodiment, except that the first mold 41, the second mold 42 and the electronic module 10 have different structures.
In the third embodiment, the thickness of the first mold 41 is greater than that of the first mold 41 of the first embodiment, and the second end 221 of each conductive elastic member 2 is located in the mold cavity 412 and spaced apart from the first mold clamping surface 411 by a certain distance. The second mold 42 has two protrusions 423 protruding from the second mating surface 421, the two protrusions 423 correspond to the two conductive elastic members 2, and each protrusion 423 compresses and shields the second end 221 of the corresponding conductive elastic member 2.
Referring to fig. 11, 12 and 13, in step S3 shown in fig. 1, when the second die 42 moves from the initial position along the die closing direction I, each protrusion 423 contacts the corresponding second end 221 of the conductive elastic member 2 first and applies pressure to the second end 221, so that the connecting sheet body 23 bends and deforms relative to the first sheet body 21 and the second sheet body 22. When the second die 42 moves to the die clamping position, each conductive elastic member 2 is in a compressed state, and each convex portion 423 comes into surface contact with the second end portion 221 of the corresponding conductive elastic member 2 and shields the second end portion 221.
In step S4 shown in fig. 1, since each protrusion 423 shields the second end 221 of the corresponding conductive elastic member 2, the liquid plastic 50 fills the mold cavity 412 to cover the surface 11 and the outer periphery of the substrate 1 and a portion of each conductive elastic member 2 without covering the second end 221. After the liquid plastic 50 is cooled and solidified to form the insulating package 5, the insulating package 5 covers the surface 11 and the outer periphery of the substrate 1, and covers a portion of the first sheet 21, the connecting sheet 23, and the second sheet 24 of each conductive elastic member 2 without covering the second end 221. The insulating package 5 is formed with two grooves 52 recessed downward from the outer surface 51, and the second end 221 of each conductive elastic element 2 is exposed in the grooves 52. After the grooves 52 are filled with, for example, conductive adhesive or solder, the pins of the electronic component are inserted into the corresponding grooves 52 and contact with the corresponding second end portions 221, and after the conductive adhesive or solder is cured, the pins of the electronic component can be fixedly connected to the corresponding second end portions 221 and electrically connected thereto. Therefore, each conductive elastic part 2 can also be used as a conductive contact for electrically connecting the pins of the electronic element.
It should be noted that, in the third embodiment, the liquid plastic 50 may be filled into the cavity 412 of the first mold 41 through the filling process disclosed in the second embodiment.
Referring to fig. 14, the overall steps of the method for manufacturing an electronic module according to the fourth embodiment of the present invention are substantially the same as those of the first embodiment, except that the first mold 41 and the electronic module 10 have different structures.
Referring to fig. 14 and 15, in the fourth embodiment, the second mold 42 shown in fig. 5 is omitted from the mold 4. In step S4 shown in fig. 1, the liquid plastic 50 is filled into the cavity 412 of the first mold 41 by a potting process at a low temperature and a low pressure, so that the liquid plastic 50 covers the surface 11 and the outer periphery of the substrate 1 and covers a portion of the first sheet 21 and the connecting sheet 23 of each conductive elastic element 2 without covering the second sheet 22 after filling the cavity 412. Since the liquid plastic 50 is filled into the cavity 412 at a low temperature and a low pressure, it is possible to reduce the influence on the electronic components which are mounted on the surface 11 of the substrate 1 and are sensitive to high temperature and high pressure.
After the liquid plastic 50 is cooled and solidified to form the insulating package 5, the insulating package 5 covers the surface 11 and the outer periphery of the substrate 1, and covers a portion of the first sheet 21 and the connecting sheet 23 of each conductive elastic member 2 without covering the second sheet 22, and the second end 221 of each conductive elastic member 2 protrudes out of the outer surface 51 of the insulating package 5 and is spaced apart from the outer surface. Therefore, each conductive elastic part 2 can also be used as a conductive contact for electrically connecting the pins of the electronic element.
Referring to fig. 16, a fifth embodiment of the method for manufacturing an electronic module according to the present invention has the same overall steps as the first embodiment, except that the structure of the conductive elastic element 2 is slightly different.
In the fifth embodiment, the conductive elastic element 2 is a spring plate in a sigma-shape and has a first plate 21, a second plate 22 and a connecting plate 23. The connecting sheet 23 of the conductive elastic element 2 is in a horizontal V shape, and two ends of the connecting sheet 23 are respectively connected to one end of the first sheet 21 and one end of the second sheet 22 on the same side. Therefore, the conductive elastic element 2 can also effectively improve the convenience of soldering, and the first end portion 211 and the second end portion 221 can be firmly soldered to the corresponding contact 121 of the substrate 1 and the corresponding pin of the electronic component, respectively.
Referring to fig. 17, the steps of the method for manufacturing an electronic module according to the sixth embodiment of the present invention are substantially the same as the steps of the first embodiment, except that the structure of the conductive elastic element 2 is slightly different.
In the sixth embodiment, the conductive elastic member 2 includes a compression spring 24, a first metal pad 25 welded to one end of the compression spring 24, and a second metal pad 26 welded to the other end of the compression spring 24. The first metal pad 25 has a first end 251, and the first end 251 is soldered to the end surface of the corresponding contact 121. The second metal pad 26 has a second end portion 261, and the second end portion 261 is an end surface for soldering a corresponding pin of the electronic component. Therefore, the conductive elastic element 2 can also effectively improve the convenience of soldering, and the first end 251 and the second end 261 can be firmly soldered to the corresponding contact 121 of the substrate 1 and the corresponding pin of the electronic device, respectively.
Referring to fig. 18, the seventh embodiment of the method for manufacturing an electronic module according to the present invention has the same overall steps as the first embodiment, except that the structure of the conductive elastic element 2 is slightly different.
In the seventh embodiment, the conductive elastic element 2 is a spring plate in a horizontal V shape and has a first plate 21 and a second plate 22 connected to one end of the first plate 21. The second end 221 of the second sheet 22 is a linear edge, and the second end 221 contacts with a corresponding pin of the electronic device through a line contact manner. Therefore, the conductive elastic element 2 can also effectively improve the convenience of soldering, and the first end portion 211 and the second end portion 221 can be firmly soldered to the corresponding contact 121 of the substrate 1 and the corresponding pin of the electronic component, respectively.
Referring to fig. 19, the eighth embodiment of the method for manufacturing an electronic module according to the present invention has the same overall steps as the first embodiment, but the structure of the conductive elastic element 2 is slightly different.
In the eighth embodiment, the conductive elastic member 2 is a compression spring and has a first end 211 and a second end 221 at opposite ends. Therefore, the conductive elastic element 2 can also effectively improve the convenience of soldering, and the first end portion 211 and the second end portion 221 can be firmly soldered to the corresponding contact 121 of the substrate 1 and the corresponding pin of the electronic component, respectively.
Referring to fig. 20, a ninth embodiment of the method for manufacturing an electronic module according to the present invention has the same overall steps as the first embodiment, but the structure of the conductive elastic element 2 is slightly different.
In the ninth embodiment, the conductive elastic member 2 is a Pogo pin (Pogo pin), which includes a hollow sleeve 27, a pin 28, a compression spring 29 and a plug 30. The needle post 28 is movably disposed through the hollow sleeve 27 and protrudes out of one end of the hollow sleeve 27. The pin 28 has a second end portion 281, and the second end portion 281 is an end surface for soldering a corresponding pin of the electronic component. The plug 30 is disposed through the hollow sleeve 27 and can be fixed to the other end of the hollow sleeve 27 by, for example, a tight fit or a screw connection, the plug 30 and the hollow sleeve 27 cooperate to define a first end 301, and the first end 301 is welded to the end surface of the corresponding contact 121. The compression spring 29 is inserted into the hollow sleeve 27, one end of the compression spring abuts against the needle cylinder 28, and the other end of the compression spring abuts against the stopper 30, and the compression spring 29 applies an elastic force to the needle cylinder 28 in a direction away from the stopper 30. Therefore, the conductive elastic element 2 can also effectively improve the convenience of soldering, and the first end portion 301 and the second end portion 281 can be firmly soldered to the corresponding contact 121 of the substrate 1 and the corresponding pin of the electronic device, respectively.
Fig. 21 shows a tenth embodiment of the method for manufacturing an electronic module according to the present invention, which is applied to the process of manufacturing a housing 100 (as shown in fig. 27) of an electronic device.
The method for manufacturing the housing 100 of the electronic device includes the steps of:
as shown in fig. 21 and fig. 22, in step S11, a substrate 1 and an outer film 6 are provided, the substrate 1 includes an inner surface 11 'and an outer surface 14, the inner surface 11' of the substrate 1 is formed with a conductive trace 12, and the conductive trace 12 has at least one contact 121;
step S12, processing the shaped substrate 1 and the outer film 6;
as shown in fig. 21 and 24, in step S13, the first end portion 211 of the conductive elastic element 2 is fixedly connected to the contact 121;
step S14, assembling and bonding the outer film 6 to the outer surface 14 of the substrate 1;
as shown in fig. 21, 26 and 27, step S15 is to position the substrate 1 and the outer film 6 in the mold 4;
step S16, forming an insulating package 5, where the insulating package 5 at least covers a portion of the conductive elastic member 2 and exposes the second end 221 of the conductive elastic member 2.
Referring to fig. 21 and 22, in the tenth embodiment, the electronic device is a smart phone, but the electronic device may be a tablet computer, a gps, or other electronic devices with different types of housings. In step S11, the conductive traces 12 are formed on the inner surface 11' of the substrate 1 by, for example, printing. The conductive trace 12 has a plurality of contacts 121, and the number of the contacts 121 is two for example. The electronic component 13 is exemplified by an ultraviolet sensor. The substrate 1 and the outer film 6 are rectangular, for example.
In step S12, the outline of the substrate 1 and the outer film 6 are cut by, for example, press-forming. Subsequently, the base material 1 and the outer film 6 are thermally pressed by hot press molding, and the base material 1 and the outer film 6 are bent into a curved shape as shown in fig. 23.
Referring to fig. 21 and 24, in step S13, the first end portions 211 of the two conductive elastic elements 2 are respectively soldered to the two contacts 121. In step S14, the outer film 6 is assembled and bonded to the outer surface 14 of the substrate 1. The outer film 6 can be adhered to the outer surface 14 of the substrate 1 through the double-sided adhesive by coating the double-sided adhesive on the outer surface 14 of the substrate 1 and attaching the outer film 6 to the double-sided adhesive.
Referring to fig. 25, 26 and 27, in step S15, the substrate 1 and the outer film 6 are put together in the cavity 412 of the first mold 41, so that the outer film 6 is carried by a concave arc-shaped carrying surface 413 of the first mold 41. When the second die 42 moves from the initial position along the die closing direction I, the arc surface 424 of the second die surface 421 of the second die 42, which is in an outward arc shape, first contacts the corresponding second end 221 of the conductive elastic member 2 and applies pressure to the second end 221, so that the connecting sheet 23 is bent and deformed relative to the first sheet 21 and the second sheet 22. When the second die 42 moves to the die clamping position, each conductive elastic member 2 is in a compressed state, and the arc-shaped surface portion 424 is in surface contact with the second end portion 221 of the conductive elastic member 2 and shields the second end portion 221. When the liquid plastic 50 fills the mold cavity 412, it covers the inner surface 11' of the substrate 1 and a portion of each conductive elastic member 2 without covering the second end 221. After the liquid plastic 50 is cooled and solidified to form the insulating package 5, the insulating package 5 covers the surface 11 of the substrate 1 and covers a portion of each conductive elastic member 2 without covering the second end portion 221, and the second end portion 221 is exposed at the outer surface 51. Thereby, the electronic module 10 and the outer film 6 together form a housing 100 of the electronic device.
It should be noted that, the liquid plastic 50 may be filled into the cavity 412 of the first mold 41 through the filling process disclosed in the second embodiment.
Referring to fig. 28, the eleventh embodiment of the method for manufacturing an electronic module according to the present invention is slightly different from the first embodiment in the overall steps and the structures of the second mold 42 and the electronic module 10.
In the eleventh embodiment, the second die 42 has two pins 425 protruding from the second die surface 421. The second end 221 of the second plate 22 of each conductive elastic member 2 is formed with a locking hole 222, the locking hole 222 is used for locking the pin 425, and the locking hole 222 is a blind hole, so that the pin 425 does not protrude out of an end of the second plate 22 opposite to the second end 221 after penetrating into the locking hole 222. The conductive adhesive 20 is coated or otherwise formed on the first end 211 of the first sheet 21 of each conductive elastic element 2.
First, the substrate 1 is placed in the cavity 412 of the first mold 41, and the locking holes 222 of the second sheet 22 of each conductive elastic member 2 are locked with the corresponding pins 425, so that each conductive elastic member 2 is pre-combined on the second mold 42.
Referring to fig. 29, the second mold 42 is driven to move along the mold clamping direction I, and during the movement of the second mold 42, the conductive adhesive 20 on the first end portion 211 of each conductive elastic member 2 contacts the corresponding contact 121 first, so that the first end portion 211 is adhered to the corresponding contact 121 through the conductive adhesive 20. Subsequently, the second mating surface 421 contacts the second end 221 of each conductive elastic member 2 and applies pressure to the second end 221, so that the connecting piece 23 is bent and deformed relative to the first piece 21 and the second piece 22.
When the second die 42 moves to the die clamping position shown in fig. 29, the second clamping surface 421 of the second die 42 compresses each conductive elastic member 2 to be in a compressed state, and the second clamping surface 421 shields the second end 221 of each conductive elastic member 2. Then, the liquid plastic 50 is injected into the mold cavity 412, and since the locking hole 222 is a blind hole, the liquid plastic 50 will not cover the second end 221 and the pins 425 of the second mold 42 when covering the second sheet 22 of each conductive elastic member 2.
Referring to fig. 29 and 30, after the liquid plastic 50 is solidified to form the insulating package 5, the second mold 42 is driven to move in a direction opposite to the mold clamping direction I. Since the insulating package 5 covers all portions of each conductive elastic member 2 except the second end 221, so that each conductive elastic member 2 is kept in a fixed state, the pins 425 are driven to move away from the corresponding card holes 222 during the movement of the second mold 42. When the second mold 42 is returned to the position shown in fig. 28, the electronic module 10 formed by the substrate 1, the conductive elastic member 2 and the insulating package 5 can be taken out from the cavity 412 of the first mold 41.
In summary, the manufacturing method of the electronic module 10 according to the embodiments simplifies the manufacturing steps, greatly reduces the whole processing time, and reduces the manufacturing cost. In addition, the design of each conductive elastic element 2 can effectively improve the convenience of soldering, and can be firmly soldered to the contact 121 of the substrate 1 and the pin of the electronic component. Therefore, the reliability of the fixed connection among the conductive elastic part 2, the contact 121 of the substrate 1 and the pins of the electronic element can be improved, so that the influence on the transmission of electric signals between the electronic element and the substrate 1 is avoided, and the aim of the invention can be really achieved.
Claims (10)
1. A method of manufacturing an electronic module, the method comprising the steps of:
providing a substrate, wherein a conductive circuit is formed on the surface of the substrate and is provided with at least one contact point;
fixedly connecting a first end of a conductive elastic member to the contact; and
forming an insulating packaging body, wherein the insulating packaging body at least covers one part of the conductive elastic piece and exposes the second end part of the conductive elastic piece;
before the insulating packaging body is formed, the second end part of the conductive elastic piece is shielded, so that the insulating packaging body does not cover the second end part; in the step, the substrate and the conductive elastic part connected with the substrate are placed between a first die and a second die, and then the second die and the first die are closed, so that the second die compresses and shields the second end part to enable the conductive elastic part to be in a compressed state;
in the step, the substrate is placed in the cavity of the first mold, the second end of the conductive elastic member is arranged on the second clamping surface of the second mold, the second mold and the first mold are clamped, the first end is supported on the contact, and then the second clamping surface compresses and shields the second end.
2. The method of manufacturing an electronic module according to claim 1, wherein: and the second die is provided with a bolt which is convexly arranged on the second joint surface, a clamping hole is formed at the second end part of the second sheet body of the conductive elastic piece, and in the step, the clamping hole of the second sheet body of the conductive elastic piece is clamped to the corresponding bolt, so that the conductive elastic piece is combined on the second die in advance.
3. The method of manufacturing an electronic module according to claim 2, wherein: in the step, the bolt does not protrude out of one end of the second sheet body opposite to the second end after penetrating into the clamping hole.
4. The method of manufacturing an electronic module according to claim 1, wherein: in the step, the insulating package is formed by cooling and solidifying liquid plastic, and the liquid plastic covers the surface and the outer periphery of the substrate and covers a part of the conductive elastic member without covering the second end portion after filling the mold cavity.
5. An electronic module, characterized in that, the electronic module includes substrate, conductive elastic component, and insulating packaging body, the substrate includes the surface, and form in the conducting wire on the surface, the conducting wire has at least one contact, the conductive elastic component includes the first end that fixedly connects to the contact, and the second end opposite to the first end, the insulating packaging body at least wraps a part of the conductive elastic component and makes the second end expose, the insulating packaging body wraps the position of the conductive elastic component with the conductive elastic component contacts and with there is not the space between the conductive elastic component, the second end of the second lamellar body of the conductive elastic component forms the card hole.
6. The electronic module of claim 5, wherein: in the step, the clamping hole is a blind hole.
7. The electronic module of claim 5, wherein: the conductive elastic member is in a compressed state.
8. The electronic module of claim 5, wherein: the conductive elastic part is a Z-shaped spring piece and comprises a first piece body and a second piece body opposite to the first piece body, the first piece body is provided with a first end part, the second piece body is provided with a second end part, and the second end part is an end face.
9. The electronic module of claim 5, wherein: the conductive elastic part is a sigma-shaped spring piece and comprises a first piece body and a second piece body opposite to the first piece body, the first piece body is provided with a first end part, the second piece body is provided with a second end part, and the second end part is an end face.
10. The electronic module of claim 4, wherein: the conductive elastic part comprises a compression spring, a first metal gasket connected to one end of the compression spring and a second metal gasket connected to the other end of the compression spring, the first metal gasket is provided with a first end part, the first end part is connected to the end face of the contact, the second metal gasket is provided with a second end part, and the second end part is an end face.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107107852 | 2018-03-08 | ||
| TW107107852A TWI655891B (en) | 2018-03-08 | 2018-03-08 | Electronic module, manufacturing method thereof, housing of electronic device and manufacturing method thereof |
| CN201910172306.8A CN110248468B (en) | 2018-03-08 | 2019-03-07 | Electronic module and manufacturing method thereof, and shell of electronic device and manufacturing method thereof |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910172306.8A Division CN110248468B (en) | 2018-03-08 | 2019-03-07 | Electronic module and manufacturing method thereof, and shell of electronic device and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113453430A true CN113453430A (en) | 2021-09-28 |
Family
ID=66996046
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910172306.8A Active CN110248468B (en) | 2018-03-08 | 2019-03-07 | Electronic module and manufacturing method thereof, and shell of electronic device and manufacturing method thereof |
| CN202110535734.XA Active CN113395830B (en) | 2018-03-08 | 2019-03-07 | Electronic module and manufacturing method thereof |
| CN202110536093.XA Pending CN113453430A (en) | 2018-03-08 | 2019-03-07 | Electronic module and manufacturing method thereof |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910172306.8A Active CN110248468B (en) | 2018-03-08 | 2019-03-07 | Electronic module and manufacturing method thereof, and shell of electronic device and manufacturing method thereof |
| CN202110535734.XA Active CN113395830B (en) | 2018-03-08 | 2019-03-07 | Electronic module and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (3) | CN110248468B (en) |
| TW (1) | TWI655891B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7239730B2 (en) * | 2019-11-27 | 2023-03-14 | 蘇州▲ユン▼塚電子科技股▲フン▼有限公司 | crimp electrical connectors |
| CN114122748A (en) * | 2020-08-31 | 2022-03-01 | 华为技术有限公司 | Electronic equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1032499A (en) * | 1996-07-16 | 1998-02-03 | Nippon Telegr & Teleph Corp <Ntt> | Micro light-weight electronic unit |
| JPH1076528A (en) * | 1996-09-03 | 1998-03-24 | Fujitsu Ten Ltd | Mold structure and connector structure |
| CN102891116A (en) * | 2011-07-20 | 2013-01-23 | 国碁电子(中山)有限公司 | Embedded element packaging structure and manufacturing method thereof |
| JP2016162874A (en) * | 2015-03-02 | 2016-09-05 | 三菱電機株式会社 | Electronic equipment unit and mold device for manufacturing |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5476211A (en) * | 1993-11-16 | 1995-12-19 | Form Factor, Inc. | Method of manufacturing electrical contacts, using a sacrificial member |
| US5065282A (en) * | 1986-10-17 | 1991-11-12 | Polonio John D | Interconnection mechanisms for electronic components |
| US4885126A (en) * | 1986-10-17 | 1989-12-05 | Polonio John D | Interconnection mechanisms for electronic components |
| JP2842917B2 (en) * | 1990-02-09 | 1999-01-06 | 株式会社日立製作所 | Electronic device mounting structure |
| JP3101866B2 (en) * | 1996-12-17 | 2000-10-23 | 帝国通信工業株式会社 | Structure for connecting metal terminal plate to substrate in molded article and method of connecting the same |
| JPH1146056A (en) * | 1997-07-25 | 1999-02-16 | Hitachi Chem Co Ltd | Electronic component device |
| EP1453121A4 (en) * | 2001-11-05 | 2007-11-21 | Shinetsu Polymer Co | Circuit component connector, its connection structure, and gasket |
| JP4457943B2 (en) * | 2002-11-12 | 2010-04-28 | 日本電気株式会社 | Wiring board and method for manufacturing wiring board |
| US7244125B2 (en) * | 2003-12-08 | 2007-07-17 | Neoconix, Inc. | Connector for making electrical contact at semiconductor scales |
| JP4598779B2 (en) * | 2004-11-16 | 2010-12-15 | 富士通セミコンダクター株式会社 | Contactor and test method using contactor |
| JP2006261565A (en) * | 2005-03-18 | 2006-09-28 | Alps Electric Co Ltd | Electronic functional component mounted body and its manufacturing method |
| US8841779B2 (en) * | 2005-03-25 | 2014-09-23 | Stats Chippac, Ltd. | Semiconductor device and method of forming high routing density BOL BONL and BONP interconnect sites on substrate |
| KR100652405B1 (en) * | 2005-03-28 | 2006-12-01 | 삼성전자주식회사 | Mold die set for preventing a resin bleed defect and manufacturing method of semiconductor package using the same |
| DE102008045615C5 (en) * | 2008-09-03 | 2018-01-04 | Infineon Technologies Ag | Method for producing a power semiconductor module |
| US8897023B2 (en) * | 2009-05-15 | 2014-11-25 | Hamilton Sundstrand Corporation | Motor controller assembly with capacitor thermal isolation |
| TW201204986A (en) * | 2010-07-21 | 2012-02-01 | Hon Hai Prec Ind Co Ltd | Light Emitting Diode lead frame assembly and method of making the same |
| TWI553775B (en) * | 2010-12-09 | 2016-10-11 | 史達晶片有限公司 | Semiconductor device and method of confining conductive bump material with solder mask patch |
| TWI527178B (en) * | 2010-12-15 | 2016-03-21 | 史達晶片有限公司 | Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask |
| US8531821B2 (en) * | 2011-01-28 | 2013-09-10 | Raytheon Company | System for securing a semiconductor device to a printed circuit board |
| JP2013048031A (en) * | 2011-08-29 | 2013-03-07 | Shinko Electric Ind Co Ltd | Substrate with spring terminal and manufacturing method of the same |
| CN103402307B (en) * | 2013-07-31 | 2016-09-07 | 安徽博泰电路科技有限公司 | A kind of printed circuit board (PCB) elastomeric pad structure |
| KR101488266B1 (en) * | 2013-08-06 | 2015-01-30 | 주식회사 유니드 | Matable electrical interconnection structure for electrical interconnection, connector, semiconductor package assembly, and electrical device having the same |
| EP2874233B1 (en) * | 2013-11-14 | 2017-01-25 | Joinset Co., Ltd | Surface-mount type electric connecting terminal, and electronic module unit and circuit board using the same |
| JP6444707B2 (en) * | 2014-11-28 | 2018-12-26 | Ｔｏｗａ株式会社 | Electronic component, manufacturing method and manufacturing apparatus |
| TWI577257B (en) * | 2014-12-24 | 2017-04-01 | 綠點高新科技股份有限公司 | Method of forming conductive lines on an insulating surface of a substrate |
-
2018
- 2018-03-08 TW TW107107852A patent/TWI655891B/en active
-
2019
- 2019-03-07 CN CN201910172306.8A patent/CN110248468B/en active Active
- 2019-03-07 CN CN202110535734.XA patent/CN113395830B/en active Active
- 2019-03-07 CN CN202110536093.XA patent/CN113453430A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1032499A (en) * | 1996-07-16 | 1998-02-03 | Nippon Telegr & Teleph Corp <Ntt> | Micro light-weight electronic unit |
| JPH1076528A (en) * | 1996-09-03 | 1998-03-24 | Fujitsu Ten Ltd | Mold structure and connector structure |
| CN102891116A (en) * | 2011-07-20 | 2013-01-23 | 国碁电子(中山)有限公司 | Embedded element packaging structure and manufacturing method thereof |
| JP2016162874A (en) * | 2015-03-02 | 2016-09-05 | 三菱電機株式会社 | Electronic equipment unit and mold device for manufacturing |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI655891B (en) | 2019-04-01 |
| TW201940034A (en) | 2019-10-01 |
| CN110248468A (en) | 2019-09-17 |
| CN113395830B (en) | 2024-05-10 |
| CN113395830A (en) | 2021-09-14 |
| CN110248468B (en) | 2021-08-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4595655B2 (en) | Electronic circuit device and manufacturing method thereof | |
| US5244840A (en) | Method for manufacturing an encapsulated IC card having a molded frame and a circuit board | |
| US7739791B2 (en) | Method of producing an overmolded electronic module with a flexible circuit pigtail | |
| KR100281836B1 (en) | IC card module, IC card module manufacturing method, hybrid integrated circuit module and manufacturing method thereof | |
| KR101065525B1 (en) | Electronic circuit device and method of making the same | |
| KR101006621B1 (en) | Electronic circuit device and method of making the same | |
| KR20040037268A (en) | An ic card and method of manufacturing the same | |
| US8053684B2 (en) | Mounting structure and method for mounting electronic component onto circuit board | |
| US8300419B2 (en) | Electronic circuit device and method of making the same | |
| EP1643818A4 (en) | Module and method for fabricating the same | |
| CN110248468B (en) | Electronic module and manufacturing method thereof, and shell of electronic device and manufacturing method thereof | |
| JPH10116962A (en) | Semiconductor device and manufacturing method thereof | |
| US6128195A (en) | Transfer molded PCMCIA standard cards | |
| JP5016140B2 (en) | Electronic sensor or sensor device having a chip module mounted in a sensor casing, in particular an acceleration sensor | |
| US5689137A (en) | Method for transfer molding standard electronic packages and apparatus formed thereby | |
| CN110800093B (en) | Circuit device, method for manufacturing circuit device, and connector | |
| KR960002077A (en) | Integrated circuit card assembly method and resulting electronic integrated circuit card | |
| KR100892305B1 (en) | Antenna and its manufacturing method for handheld device | |
| WO2008024441A2 (en) | Relay connector for fpc using adhesive | |
| JP4942541B2 (en) | Electrical and electronic module and manufacturing method thereof | |
| CN104466613A (en) | Conductive ink elastomeric molded connector | |
| JP2014239103A (en) | Electronic control device, electronic control unit, and method of manufacturing electronic control device | |
| KR101295181B1 (en) | Tact switch and method for producting thereof | |
| KR100748593B1 (en) | Heat adhesive conductive elastomer gasket and Method for the same | |
| JP5178387B2 (en) | Metal base and electric / electronic module using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |