JP2842917B2 - Electronic device mounting structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial applications]

The present invention relates to a mounting structure of an electronic device, and more particularly to a mounting structure of an electronic device suitable for thinning.

[Prior art]

For electronic devices, high-density mounting is desired, and usually targets a cubic structure with a high volume utilization rate of the housing, but effective use of the installation floor area of the device is also an important issue,
A thin and slim device with a small floor space is also desired. Further, as the density of electronic devices increases, the amount of heat generated inside the devices increases, and efficient cooling means is required to maintain the reliability of the devices. In response to such demands, as thin mounting of electronic devices,
For example, JP-A-63-227100, JP-A-61-284996, and the like, and examples of an efficient heat dissipation structure from a wiring board include JP-A-59-213192 and JP-A-59-213192. 63−2668
No. 98, Japanese Unexamined Patent Publication No. 63-184397, and
No. 109192 has been proposed.

[Problems to be solved by the invention]

In the above prior art, in the thin configuration, maintenance replacement of components inside the apparatus is not taken into consideration, and the replacement of components takes a lot of time. In the heat radiation configuration, the heat of the heat generating component escapes, but the work of removing the heat generating component from the heat radiating member for component replacement is complicated, and there is a problem in maintenance operability. The present invention has been made to solve the conventional problems in view of the above situation, and a first object of the present invention is to provide a structure capable of efficiently cooling a heat generating portion without impairing the thinness of the device. A second object of the present invention is to further improve the invention of the first object by providing a structure in which electronic components can be attached to and detached from a wiring board by a simple operation, and heat from the electronic components can be efficiently transmitted to a panel. A third object is to further improve the invention of the second object and maintain a thin structure, and in particular, to a structure for simplifying electrical connection between an electronic component and a wiring board.
The object of the present invention is to further develop the invention of the first object, and to improve the maintenance and operability of the device. The fifth object is to further develop the invention of the fourth object, And a sixth object is to further develop the invention of the first object and to provide a structure for effectively utilizing the wall surface after installation of the device. To provide.

[Means for Solving the Problems]

The first and second objects are as follows: (1) An electronic circuit package module is formed by bonding a wiring board to a cooling panel having good heat conductivity, and has a depth not exceeding the thickness of the module at one end of the module. In a mounting structure of an electronic device in which a heat radiation fin is provided and these modules and the heat radiation fin are housed in the same device housing, or (2) a circuit board is bonded to a cooling panel having good heat conduction. A heat radiating means which constitutes a package module and thermally connects an end of the cooling panel to a device housing frame and exchanges heat generated from the electronic circuit package module with outside air via the device housing frame. In the mounting structure of an electronic device provided and accommodating the module in a device housing, the planar component mounted on the wiring board is A spring having a function of being placed in parallel with the mounting panel surface, rotating in the in-plane direction of the planar component by pressing it from above and self-holding, and releasing the rotation by rotating the planar component out of the plane. A heat transfer member having high thermal conductivity is held between the flat component surface and the cooling panel surface through a hole provided in the wiring board. And the first or second mounting structure of the electronic device according to (1) or (2), wherein the electronic component package module is configured to simultaneously hold the planar component and the heat transfer member to form the electronic circuit package module. This is achieved by the invention. The third object is as follows. (3) The mounting member fixed to the wiring board by the spring material is provided with an electric plug function, and when the mounting member holds the planar component, the wiring board is provided. The mounting structure of the electronic device according to the above (1) or (2), wherein the plug provided on the upper surface and the plug provided on the planar component are electrically connected by an electric plug function of the mounting member. This is achieved by the third invention comprising: The fourth object is to improve maintenance operability.
The entire panel is rotated and the front and back surfaces of the panel are opened and closed. More specifically, (4) a wiring duct having the same thickness as that of the device housing is provided, and this wiring duct is used as a fulcrum. A door is fixed to the wiring duct so that the housing rotates toward the front surface thereof, and a door is connected to at least one main surface of the device housing so as to be openable and closable with any one side as a fulcrum. (1) comprising means for temporarily fixed at an arbitrary angle in an open state.
Or, a fourth device comprising the mounting structure of the electronic device according to (2).
The invention is achieved by the invention described above. The fifth object is to provide a clamp for rotating the interface cable in the pulling direction of the cable in order to improve operability and protect the cable during maintenance of the apparatus. More specifically, (5) the wiring Means that is locked to the wiring duct so that the casing rotates toward the front surface side with the duct as a fulcrum is a wiring connecting at least from the wiring duct to an electronic circuit package module in the casing, and fixed to the wiring. This is achieved by the fifth invention comprising the electronic device mounting structure according to the above (4), further comprising a cable clamp which rotates in the pulling direction of the wiring. The sixth object is to have a structure in which the surface of the device is kept smooth and a member for wall hanging is provided in order to effectively use the housing wall surface after the device is installed. More specifically, (6) The above-mentioned (1), further comprising means for holding the main surface of the housing flat and holding a display object on the flat surface.
Or, a sixth structure comprising the mounting structure of the electronic device according to (2).
The invention is achieved by the invention described above.

[Action]

According to the structure of the first aspect of the invention, heat from the components on the wiring board is transmitted to the cooling panel and further transmitted from the cooling panel to the radiating fins or to the housing frame. can do. In addition, by using heat radiation fins thinner than the thickness of the electronic circuit module, the heat radiation fins can be accommodated in the device housing, so that a thin structure becomes possible, and it is not necessary to secure cooling fin space when stacking and installing devices. The appearance of the device is refreshing, and it is comparable to the interior. According to the configuration of the second aspect, the component and the cooling medium can be easily attached to and detached from the front of the apparatus, and the heat of the component is transmitted to the cooling panel via the cooling medium. Can be mounted in parallel with the device, so that the housing can be made thin. According to the configuration of the third invention, electrical connection between the component and the wiring board can be easily achieved by the mounting member, and the cooling medium can be easily removed, so that the maintainability of the device is improved. I do. According to the configuration of the fourth aspect of the invention, the electronic circuit module portion rotates toward the front in a state where the wiring duct is fixed to the wall surface, so that the backside of the electronic circuit module can be easily maintained. Also, the front and back surfaces of the housing can be freely opened and closed so that the maintenance panel surface can be easily inspected. In addition, since the module is rotated when the module is open and maintenance operation is difficult to perform, the module has a function of temporarily fixing during maintenance. According to the configuration of the fifth aspect, by rotating the cable clamp to which the wiring is fixed, the stress applied to the wiring between the wiring duct and the electronic circuit module can be absorbed in accordance with the pulling stress. There is no breakage of the part. According to the sixth invention, since there is no unevenness on the surface of the device, a notice can be attached to the surface of the housing, and the device can be used as a wall. In addition, by providing the mounting member at the corner of the housing, even a heavy object such as a display panel can be mounted, so that the indoor wall surface can be effectively used.

【Example】

Embodiment 1 Hereinafter, an embodiment of the entire configuration of heat radiation according to the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of one embodiment of the present invention. A hole 2 is disclosed in the upper part of the device housing 1, and a radiation fin 3 having a beautiful design is projected from the hole 2. Thereby, the heat radiation efficiency of the electronic device mounted inside the housing is improved, and the appearance of the entire device is beautiful. The radiation fins 3 are provided on a cooling panel 5 having a wiring board 4 attached to both sides.
A structure in which one end of the fin is projected as it is to form a radiation fin 3;
Alternatively, a configuration in which fins made of a lightweight material having good thermal conductivity such as aluminum are directly connected to the upper portion of the cooling panel 5 is used. Further, it is needless to say that the radiation fin 3 has a hollow structure, in which a refrigerant is put, and the same effect as the heat pipe is obtained, so that the radiation efficiency can be improved. The heat generated from the electronic components 6 and the like inside the housing is cooled by transmitting heat to the upper radiating fins 3 by heat conduction through the cooling panel 5 to which the wiring board 4 is attached. The side surface has no holes or protrusions such as an air inlet required for air cooling or the like, and realizes a flat and thin casing. The housing 1 is provided with a door 22 that can be freely opened and closed. FIG. 5 is a perspective view of the overall configuration showing one embodiment of the cooling panel 5 according to the present invention. This panel 5 is mounted on the thin and lightweight housing 1.
A large number of package blocks 10 and 10 'are mounted on the large-sized electronic circuit module 33 in parallel. The heat generated by the package blocks 10 and 10 ′ is transmitted through the electronic circuit module 22 and is radiated from the radiating fins 3. More specifically, the electronic circuit module 33 will be described in detail. A heat radiation fin 3 is provided at one end of the panel 5, and its main surface is connected to wiring boards 4, 4 'to which package blocks 10, 10' on which electronic components are mounted are connected. Are bonded to both sides to constitute the electronic circuit module 33. The heat generated from the package blocks 10 and 10 'mounted on the board is
Then, the heat is radiated from the radiating fins 3. Wiring board 4,
Reference numeral 4 'denotes a flexible printed board or a rigid printed board made of glass epoxy or the like. On the other hand, the cooling panel 5 is made of a lightweight member having good heat conductivity such as aluminum. Further, the radiation fins 3 may be formed integrally with the cooling panel 5 or may be formed separately and connected thereto.
Furthermore, it is needless to say that as one means for increasing the heat transfer efficiency, it is possible to easily achieve the heat pipe effect by enclosing the cooling panel 5 and the fin 3 in a hollow structure and enclosing the refrigerant therein. 6, the configuration of the package block 10 will be described in detail. FIG. 6 shows an embodiment of a package block in which a part of the panel shown in FIG. 5 is enlarged. The package block 10 includes a package 43 and mounting members 7 and 7 ′, and is held on the electronic circuit module 33 by a spring 8. Various electronic components 6 are mounted on both sides of the package 43 at high density. Heat generated from the package 43 is efficiently transmitted to the electronic circuit module 33 via the heat transfer member 50. FIG. 7 shows one embodiment of the heat transfer member, and FIG. 8 shows another embodiment. FIG. 7 shows an example in which a refrigerant-sealed flexible conductive plate is used as a heat transfer member 50, and FIG. 8 shows an example in which a conductive plate directly attached to the cooling panel 5 is used as a heat transfer member 50 '. In each of the embodiments, the heat generated by the package 43 is efficiently transmitted to the cooling panel 5 through the heat transfer members 50 and 50 '. A complete cooling structure can be obtained by considering the mounting and the improvement of the conduction efficiency of the front and back by the package containing the metal core. Further, it is needless to say in detail that a heat transfer plate may be simply added to directly transfer heat from the surface of the package 43 to the wiring board 4. The operation and connection mechanism of the package block 10 of FIG. 6 according to the present invention will be described in detail with reference to FIGS. 9 and 10. FIG. 9 is a perspective view showing one embodiment of the mounting member 7. As shown in FIG. The bottom surface of the mounting member 7 is a two-sloped surface forming a ridgeline of the protruding portion 11 at the center. The package 43 rotates in the direction shown by the arrow 12 with the fulcrum 11 as a fulcrum, and the package 43 together with the facing member 7 '.
Is held by a pressing spring 8 between these members 7, 7 '. On the other hand, when removing the package 43, the mounting members 7, 7 'are rotated in the direction opposite to the arrow 12 so that the mounting members 7, 7' are opened with the projection 11 as a fulcrum.
Is held by As described above, the package 43 has a simple structure in which the package 43 can be inserted and removed between the mounting members 7 and 7 'in one operation. Next, an electrical connection mechanism between the package 43 and the substrate 4 will be described. A plug (not shown) serving as an electrode terminal provided at an end of the package 43 is provided with a plug provided on the mounting members 7, 7 '.
It is configured to connect with 13 when connected. The plug portion 13 not shown in detail in the figure is raised to form a convex portion, and is stably connected to the plug of the package 43 by the pressing force of the spring 8. The plug 13 and the plug 13 ′ disposed on the lower surface of the mounting members 7, 7 ′ are connected by wiring 15, and the tangent 13 ′ is connected to the plug 14 of the substrate 4. The plug 13 'has a convex portion like the plug 13 of the mounting members 7, 7', and is stably connected to the plug 14. In this embodiment, the material of the mounting members 7 and 7 'is not specified. However, it is needless to say that the plugs 13 and 13' and the wiring 15 can be easily formed of metal or plastic. In addition, the contact portion of the present embodiment has a high contact plug 13 and a convex contact plug 13 ', so that the pressing travel of the spring 8 is concentrated on the contact portion, so that stable contact characteristics can be obtained. It is possible to provide an inexpensive contact part without having to use a noble metal such as FIG. 10 is an alternative to FIG. 9 and is a perspective view of a main part showing another embodiment of the mounting member 7. FIG. The mounting block 16 (corresponding to 7 in FIG. 9) held on the substrate 4 has connection pins 17. The connection pins 17 are implanted and fixed to the mounting block 16, and a local portion 18 on the bottom surface of the mounting block 16 is provided. Plug located in
It is wired up to 19. The plug 19 is a plug of the substrate 4.
Abuts 14 and is connected. Although the structure for holding the mounting block 16 to the wiring board 4 is not sufficiently shown in the drawing, it is needless to say that the function can be sufficiently achieved with the spring 8 shown in FIG. On the other hand, the package connector 20 is mounted on the package 43, and the package connector 20 is attached to the mounting block.
Inserted into 16 and connected to connection pin 17. Since the mounting block 16 has the curved portion 18, the mounting block 16 has a structure that can be rotated with the fulcrum as a fulcrum.
Maintenance is possible. Further, after the package 43 is inserted, the package 43 is rotated in the direction of the arrow 21 with the curved portion 18 as a fulcrum, whereby high-density thin mounting is realized. FIG. 1 and FIGS. 5 to 10 show an example in which the cooling panel 5 provided with the radiation fins 3 is a component of the module 33.
This is explained in detail in the figure. Next, another embodiment will be described in which, as a heat dissipating means, a frame (frame) constituting the entire device housing 1, particularly a part thereof, has a heat dissipating effect instead of the heat dissipating fins 3. Embodiment 2 That is, FIG. 2 is a perspective view of another embodiment of the present invention, in which the entire casing 1 ', particularly the frame itself, is a heat sink. Cooling panel 5
3 is connected at the upper part of the housing 1 'as shown in a partially enlarged view in FIG. 3, and is formed at the lower part of the housing 1' in the housing 1 'as shown in the sectional view of FIG. It is set in 9. Therefore, the heat generated from the heat-generating component 6 is transmitted from the wiring board 4 through the cooling panel 5 to the housing 1 ′ and is radiated from the entire housing 1 ′, particularly from its frame portion. As a result, a thin housing 1 'that can efficiently radiate generated heat to the outside of the housing 1' can be realized. In addition, since all surfaces of the housing 1 'are flat, the housing 1' can cope with a plurality of horizontal stacks. Further, since the entire casing 1 'is a heat radiating plate, it is needless to say that when the casing 1' is brought into close contact with a heat-sensitive wall or the like, a heat insulating material or the like can be attached to the surface of the casing. Furthermore,
In this embodiment, it goes without saying that the configurations shown in FIGS. 5 to 10 described in the first embodiment can be applied in exactly the same manner. The following Examples 3 to 5 are all examples of a mounting structure and a housing 1 for mounting an electronic component thinning mounting device provided with the heat radiating means obtained in the above Example 1 or 2 at an actual installation location. This shows alternatives and modifications around the door 22 of FIG. Embodiment 3 Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 11 to 13. FIG. 11 is a perspective view of the open / closed state of the door 22 of the housing 1 as viewed obliquely from above. The housing 1 has a structure that rotates around a housing rotation shaft 24. The housing 1 is movably connected to a frame 23 by a housing rotation shaft 24, and the frame 23 is firmly fixed to a wall surface 60 and supports the housing 1. FIG. 12 is a plan view of this embodiment as viewed from above. FIG. 13 is a cross-sectional plan view of FIG. 12 specifically showing the housing rotating unit and the door rotating unit of the present embodiment, and the door 22 of the housing is movably connected to the housing 1 by the rotating shaft 25; Similarly, the door 22 'is movably connected to the housing 1 by a rotation shaft 25'. 26 is a reinforcing plate of the housing, and 27 is a reinforcing plate for reinforcing the door 22. As described above, according to the present embodiment, in maintenance of the thin electronic device, both sides of the electronic circuit module 33 can be easily maintained by rotating the housing 1 and opening the doors 22, 22 'on the front and back surfaces. It is needless to say that the frame 23 according to the present embodiment can also be used as a wiring duct. Further, the position of the wiring duct or the frame can be arranged in any direction except for the heat radiation fin portion in the electronic component mounting apparatus, which increases the degree of freedom of the apparatus configuration. Further, when it is necessary to temporarily fix the movable part at the time of maintenance, the movable part can be simply constituted by rails and screws as needed.
Similarly, in a normal installation state, it is necessary to fix the movable portion, and it is obvious that the housing on the back of the device can be fixed to the wall with screws or the like. Embodiment 4 This embodiment shows a modification of the front panel of the housing 1 shown in FIG. 1, FIG. 2 or FIGS. 11 to 13, and will be described below with reference to FIG. In the figure, reference numeral 28 denotes a front panel main body of the housing 1, which corresponds to the door 22, and has a central portion provided with an opening 29 for circulating the internal air with the outside air. Further, reinforcing ribs 30 are extruded at upper and lower portions of the panel main body 28 to reduce deformation of the panel in the lateral direction. Numeral 31 is a reinforcing plate formed by bending a thin plate, and attached between the surface panel body 28 and the surface panel 32 and joined to each surface to form a plywood, thereby increasing the rigidity of the panel in the vertical direction. This is a structure in which the rigidity of the entire panel can be obtained in combination with the lateral rigidity of the front panel main body 28. FIG. 15 is a cross-sectional view of the surface panel structure obtained in this manner, and shows the equipment inside the panel (electronic circuit module 33).
The air heated by the heat of the air can be circulated as shown by the arrow, and the reinforcing plate 31 is formed by bending a thin plate and processing it to secure a large surface area, which promotes heat exchange with the internal air and the outside air, From outside to the outside air is reduced. As described above, according to this embodiment, there are effects such as obtaining a surface panel structure which is lightweight, has excellent rigidity, and has a high heat radiation effect. Embodiment 5 This embodiment is an example in which the electronic circuit module 33 housed in the housing 1 shown in FIGS. 11 to 14 of the embodiment 3 is connected to the wiring duct 23 also serving as a frame by a wiring cable clamp mechanism. It shows. Hereinafter, FIG. 16, FIG. 17, and FIG.
An embodiment of a cable clamp for wiring between the electronic circuit module 33 and the wiring duct 23 will be described with reference to the drawings. Between the electronic circuit module 33 and the wiring duct 23, various wirings such as an interface wiring from the outside of the apparatus and a power supply line and an alarm line inside the apparatus pass. These wires are usually fixed by cable clamps so that no mechanical stress is applied to the connections of the wires. The electronic circuit module 33 according to the present embodiment is configured so that it can be opened and closed with the wiring duct 23 as a fulcrum in order to improve the maintenance operability of the device.
33 pulls the wiring. For this reason, when fixed by the cable clamp, stress is applied to the connection portion of the wiring of the electronic circuit module 33 and the connector 44, and disconnection or poor contact may occur. Therefore, the embodiment shown in FIG. 16 uses the rotating cable clamp 35 to avoid concentration of stress. No.
FIG. 17 shows the rotary cable clamp 35 with the wiring 34 fixed.The rotary cable clamp 35 was pulled in the direction of the arrow when the electronic circuit module 33 was opened, as shown in FIG. The wiring 34 'rotates in the pulling direction around the fulcrum 36, and when the electronic circuit module 33 is closed, the wiring rotates in the opposite direction due to the restoring force returned by the wiring and returns to the original position. In other words, the elastic force of the wiring 34 and the action of the clamp 35 supported by the fulcrum 36 allow the wiring 34 to easily open and close the duct 23 and the module 33. According to this configuration, stress on the connection portion of the wiring and the connector is reduced, so that a highly reliable connection structure can be obtained. Sixth Embodiment FIG. 19 is an example of a wall-hanging type in which the electronic mounting difference 37 of the second embodiment is hung on a wall 60. Panels 38 for displaying photographs, posters, and the like are provided at the four corners of the device. This is an example of being held and fixed by a holder 39 provided. Thereby, the panel 38 as an interior can be fixed on the apparatus, and the panel 38 can be replaced as appropriate. Since the device is thin and the panel 38 is posted, even if the device is placed in a room, it can be arranged without any discomfort. FIG. 20 shows another embodiment of the wall-mounted arrangement, in which the device 37
This is an example in which a liquid crystal plate 40 is provided on the front cover. Since the liquid crystal plate 40 can display characters and images, for example, it can display information such as a weekly event schedule, and can also have a function as an information display plate by displaying television images and the like. . FIG. 21 shows an example in which the device is arranged on a wall surface 60 and a floor 61. Since the surface cover of the device 37 can be decorated by painting or wallpaper, for example, if the pattern of the wall 60 and the surface of the device are unified as shown in this example, the appearance of the room is impaired by the installation of the device. Never. FIG. 22 shows an example in which the individual devices 37 are held by a pair of columns 41, 41 ', and are stacked vertically and mounted. By the vertical stacked mounting as in this example, the wall surface 60 can be effectively used. Also, a plurality of them can be arranged in the horizontal direction. FIG. 23 shows a perspective view of the room 42 with the ceiling removed, but if the columns 41 and the devices 37 are arranged on the floor other than the wall as in this example, they can be effectively used as partitions in the room. Is also possible. At this time, if the panel 38 and the liquid crystal panel 40 described above are attached, it is needless to say that the device can be arranged without discomfort.

【The invention's effect】

As described above, according to the mounting structure of the electronic device according to the present invention, heat generated from the electronic device housed in the housing can be effectively cooled, and further, the entire device can be configured to be thin and the installation area can be reduced. Less. In addition, the maintenance operability of the device is good, and it can be used as an interior.

[Brief description of the drawings]

FIG. 1 and FIG. 2 are perspective views of an electronic device showing a different embodiment of the present invention, FIG. 3 is an enlarged perspective view of an essential part of FIG. 2, FIG. FIG. 6 is a perspective view of the electronic circuit module 33 used in FIG. 1, FIG. 6 is an enlarged perspective view of the main part thereof, and FIGS. 7 and 8 are essential views showing the arrangement of heat transfer members in the electronic circuit module. FIG. 9 is a perspective view showing the state of attachment of the package in the electronic circuit module by the attachment member, and FIG.
The figure is a perspective view showing a mounting state according to another embodiment,
11 to 13 are perspective views, plan views, and cross-sectional plan views of the electronic device in an open / closed state, respectively. FIGS. 14 and 15 are perspective views and longitudinal sectional views of a reinforcing structure of the front panel of the electronic device, respectively. FIG. 17 is an enlarged perspective view showing the installation state of the cable clamp, FIG. 17 is an enlarged perspective view showing the rotary cable clamp portion, FIG. 18 is a side view showing the movable state of the cable clamp, and FIGS. FIG. 3 is a perspective view of an example of a mounting structure when the surface of the electronic device is applied to an interior. <Explanation of reference numerals> 1 ... device housing, 2 ... upper hole of housing 3 ... radiation fins, 4 ... wiring board 5 ... cooling panel, 6 ... electronic components 7 ... mounting member, 8 ... Spring 9: Fixing groove, 10: Package block 11: Projection of mounting member, 12: Arrow in rotation direction 13: Plug of mounting member, 14: Plug of wiring board 15: Mounting member Wiring on top, 16 Mounting block 17 Connection pin of mounting block, 18 Curved surface of mounting block 19 Connection part of mounting block, 20 Package connector 21 Arrow, 22 Body door 23… Frame, 24… Rotary axis 25 …… Rotary axis of the door, 26 …… Case reinforcement plate 27 …… Door reinforcement plate, 28 …… Case surface panel 29 …… Opening, 30… … Reinforcing ribs 31… Reinforcing plates 32… Outer panel of surface panel 33… Electronic circuit module 34… Wiring cable 35… Bull clamp 36 Rotating fulcrum 37 Electronic device 38 Display panel 39 Holder 40 LCD panel 41 Column 42 Room 43 Package 44 Connector 50 ... heat transfer members, 60 ... walls.

──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Toshiyuki Mori 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Inside the Hitachi, Ltd. Totsuka Plant (72) Inventor Yoichi Igarashi 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Co., Ltd. Inside Hitachi, Ltd. Totsuka Plant (72) Inventor Yoshifumi Asakawa 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Inside Hitachi, Ltd.Mitsuo Matsunaga 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Hitachi, Ltd. Inside the Totsuka Plant (56) References JP-A-56-19694 (JP, A) JP-A-59-39992 (JP, U) JP-A-59-109192 (JP, U) JP-A-58-36433 (JP, A) U) Japanese Patent Publication No. 57-24678 (JP, B2) (58) Fields investigated (Int. Cl. ⁶ , DB name) H05K 7/20, 1/18

Claims (6)

(57) [Claims] An electronic circuit package module is formed by bonding a wiring board to a cooling panel having good heat conduction, and a radiation fin having a depth not exceeding the thickness of the module is provided at one end of the module. In a mounting structure of an electronic device in which a module and a radiating fin are housed in the same device housing, a planar component to be mounted on the wiring board is placed in parallel with the cooling panel surface and pressed from above by pressing from above. The flat component is rotated in the in-plane direction and held by itself, and is held by the mounting member locked to the wiring board with a spring material having a function of releasing the rotation by rotating the flat component in the out-of-plane direction, and A heat transfer member having high thermal conductivity disposed between the plane component surface and the cooling panel surface through a hole provided in the wiring board; Mounting structure for an electronic device which holds the member simultaneously formed by forming the electronic circuit package module. 2. An electronic circuit package module is formed by bonding a wiring board to a cooling panel having good heat conduction and thermally connecting an end of the cooling panel to a device housing frame. In a mounting structure of an electronic device including a heat radiating means for exchanging heat generated from the device housing frame with the outside air and housing the module in the device housing, a planar component mounted on the wiring board, It has a function of being placed in parallel with the cooling panel surface, being pressed in from above, rotating in the in-plane direction of the planar component and self-holding, and being released in the out-of-plane direction of the planar component to release the holding. Held by a mounting member locked to the wiring board with a spring material,
A heat transfer member having high thermal conductivity is provided between the plane component surface and the cooling panel surface through a hole provided in the wiring board, and the flat component and the heat transfer member are simultaneously held. And a mounting structure of an electronic device comprising the electronic circuit package module. 3. An electric plug function is provided to a mounting member locked to the wiring board by the spring material, and the mounting member is provided on the wiring board when the mounting member holds the planar component. 3. The mounting structure of an electronic device according to claim 1, wherein the plug and the plug provided on the planar component are electrically connected by an electric plug function of the mounting member. 4. A wiring duct having the same thickness as the device housing is provided, and the wiring duct is engaged with the wiring duct so that the housing rotates around the wiring duct as a fulcrum. 3. The electronic device according to claim 1, further comprising a door disposed on at least one of the main surfaces so as to be openable and closable with an arbitrary side as a fulcrum, and a means temporarily fixed at an arbitrary angle in an open state. Device mounting structure. 5. A means locked to the wiring duct so that the housing rotates to the front side with the wiring duct serving as a fulcrum connects at least the wiring duct to an electronic circuit package module in the housing. 5. The mounting structure of an electronic device according to claim 4, further comprising a wiring, and a cable clamp fixed to the wiring and rotating in a pulling direction of the wiring. 6. The mounting structure of an electronic device according to claim 1, further comprising means for holding a main surface of said housing flat and holding means for holding a display object on said flat surface.