CN220108534U - Display main board provided with heat dissipation layer - Google Patents
Display main board provided with heat dissipation layer Download PDFInfo
- Publication number
- CN220108534U CN220108534U CN202321023220.7U CN202321023220U CN220108534U CN 220108534 U CN220108534 U CN 220108534U CN 202321023220 U CN202321023220 U CN 202321023220U CN 220108534 U CN220108534 U CN 220108534U
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- China
- Prior art keywords
- heat dissipation
- main board
- dissipation layer
- protection
- display
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 136
- 230000007246 mechanism Effects 0.000 claims abstract description 20
- 230000001681 protective effect Effects 0.000 claims description 20
- 238000012546 transfer Methods 0.000 abstract description 4
- 238000001816 cooling Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 230000005855 radiation Effects 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The utility model provides a display main board provided with a heat dissipation layer, which comprises a main board body, wherein a heat dissipation mechanism is arranged at the bottom of the main board body and comprises the heat dissipation layer, and a positioning piece is arranged on the heat dissipation layer. According to the utility model, through the heat dissipation mechanism, the heat dissipation layer in the heat dissipation mechanism can accelerate the heat transfer efficiency of the main board body to the outside, so that the heat dissipation efficiency of the main board body can be improved, the use is facilitated, the positioning piece on the heat dissipation layer is arranged to avoid the mounting hole on one hand, and on the other hand, the positioning piece can be matched with the mounting column to position the main board body when the main board body is mounted on the mounting column, and the use is facilitated.
Description
Technical Field
The utility model relates to the technical field of display mainboards, in particular to a display mainboard provided with a heat dissipation layer.
Background
The display is a display tool for displaying a certain electronic file on a screen through a specific transmission device, and the display main board is an important part on the display;
the main board of the display can generate a large amount of heat during working, and most of the main boards of the display in the prior art are not provided with heat dissipation layers, so that the heat dissipation efficiency is low during the use process, and the use is not facilitated;
for example: chinese utility model patent: CN202222671549.6, "a display driving motherboard with ventilation and heat dissipation structure", the specification discloses: the display driving main board can be called as a driving board, and the driving board has the main functions of processing and controlling signals sent by an external host, then sending the signals to the liquid crystal panel, displaying images, and arranging integrated circuits such as a main control chip, a microcontroller and the like on the driving board. In real life, the display driving main board is generally installed in the display installation shell, and generates a large amount of heat during operation, in order to ensure the normal operation of the display driving main board, a radiating hole is usually formed in one side of the installation shell to radiate heat and cool the driving main board, but for a display in a smoldering environment, the efficiency is low, and equipment can be damaged even after long-time operation by radiating through the radiating hole; the above patent can be used to demonstrate the drawbacks of the prior art.
Therefore, we have made improvements to this and have proposed a display motherboard provided with a heat dissipation layer.
Disclosure of Invention
The utility model aims at: the heat dissipation device aims at the problems that the existing main board of the display is not provided with a heat dissipation layer, and the heat dissipation efficiency is low in the use process, so that the use is not facilitated.
In order to achieve the above object, the present utility model provides a display motherboard provided with a heat dissipation layer to improve the above problems.
The utility model is specifically as follows:
the novel heat dissipation device comprises a main board body, wherein a heat dissipation mechanism is arranged at the bottom of the main board body and comprises a heat dissipation layer, and a positioning piece is arranged on the heat dissipation layer.
As a preferable technical scheme of the utility model, the heat dissipation layer is a heat conduction piece, and the heat conduction piece is fixedly connected to the bottom of the main board body.
As a preferable technical scheme of the utility model, the main board body is provided with four mounting holes, the positioning piece comprises four positioning grooves which are respectively arranged at four corners of the heat conducting piece, and the positions of the four positioning grooves respectively correspond to the positions of the four mounting holes.
As the preferable technical scheme of the utility model, the heat dissipation mechanism further comprises a plurality of connecting grooves, and the plurality of connecting grooves are all arranged at the bottom of the heat conduction piece.
As a preferable technical scheme of the utility model, the outside of the main board body is provided with a protection heat dissipation structure, and the protection heat dissipation structure comprises a first heat dissipation protection part arranged between two sides of the main board body and a second heat dissipation protection part arranged between the other two sides of the main board body.
As a preferable technical scheme of the utility model, the first heat radiation protection part comprises a first protection heat radiation plate, and clamping grooves are formed in one sides of the first protection heat radiation plate, which are close to each other, and are spliced with the main board body and the side surfaces of the heat conducting piece.
As a preferable technical scheme of the utility model, screw holes are formed on two sides of one of the two protection heat dissipation plates.
As the preferable technical scheme of the utility model, the second heat radiation protection part comprises the second protection heat radiation plate, the second protection heat radiation plate is provided with through holes, and four fixing bolts are connected between the four through holes and the four screw holes in a threaded manner.
As a preferable technical scheme of the utility model, a connecting piece is arranged between every two second protection radiating plates, the connecting piece comprises a slot and a side slot, and the slot and the side slot are respectively arranged at one end of the two protection radiating plates, which are close to each other.
As the preferable technical scheme of the utility model, a connecting shaft is fixedly arranged in the side groove, a rotatable clamping plate is sleeved on the outer surface of the connecting shaft, and the clamping plate is spliced with the inner wall of the slot.
Compared with the prior art, the utility model has the beneficial effects that:
in the scheme of the utility model:
in order to solve the problems that in the prior art, a main board of a display is not provided with a heat dissipation layer mostly, and the heat dissipation efficiency is low in the use process, and the use is not facilitated, the heat dissipation mechanism is provided with the heat dissipation layer in the heat dissipation mechanism, so that the heat transfer efficiency of the main board body to the outside can be accelerated, the heat dissipation efficiency of the main board body can be improved, the use is facilitated, the positioning piece on the heat dissipation layer is arranged to avoid the mounting hole, and the main board body can be positioned by being matched with the mounting column when the main board body is mounted on the mounting column, and the use is facilitated.
Drawings
Fig. 1 is a schematic structural diagram of a display motherboard provided with a heat dissipation layer according to the present utility model;
fig. 2 is a schematic structural diagram of a heat conducting member of a display motherboard provided with a heat dissipation layer according to the present utility model;
fig. 3 is a schematic structural diagram of a protection heat dissipation structure of a display motherboard provided with a heat dissipation layer according to the present utility model;
FIG. 4 is a schematic diagram showing a connection structure between a first protective heat dissipating plate and a main board body of a display main board with a heat dissipating layer according to the present utility model;
FIG. 5 is a schematic diagram of a first heat dissipating plate of a display motherboard with a heat dissipating layer according to the present utility model;
fig. 6 is a schematic structural diagram of a second protection heat dissipation plate of the display motherboard provided with a heat dissipation layer according to the present utility model;
FIG. 7 is a schematic diagram of a side slot of a display motherboard with a heat dissipation layer according to the present utility model;
FIG. 8 is a schematic structural diagram of a motherboard of a display provided with a heat dissipation layer according to the present utility model;
fig. 9 is a schematic structural diagram of a display motherboard provided with a heat dissipation layer in use according to the present utility model.
The figures indicate:
1. a main board body;
2. a mounting hole;
3. a heat dissipation mechanism; 301. a heat conductive member; 302. a positioning groove; 303. a connecting groove;
4. a protective heat dissipation structure; 401. a first protection radiating plate; 402. a clamping groove; 403. a screw hole; 404. a second protective heat dissipation plate; 405. a through hole; 406. a slot; 407. a side groove; 408. a connecting shaft; 409. a clamping plate; 410. and (5) fixing bolts.
Detailed Description
In order that those skilled in the art will better understand the present utility model, a technical solution in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.
As described in the background art, most of the mainboards of the display in the prior art do not have a heat dissipation layer, so that the heat dissipation efficiency is low in the use process, and the use is not facilitated.
In order to solve the technical problem, the utility model provides a display main board provided with a heat dissipation layer, which is applied to improving the heat dissipation effect of the display main board.
Specifically, referring to fig. 1-2, the display motherboard provided with the heat dissipation layer specifically includes:
the mainboard body 1, the bottom of mainboard body 1 is provided with cooling mechanism 3, and cooling mechanism 3 includes the heat dissipation layer, is provided with the setting element on the heat dissipation layer.
According to the display main board provided with the heat dissipation layer, the heat dissipation mechanism 3 is arranged, and the heat dissipation layer in the heat dissipation mechanism 3 can accelerate the heat transfer efficiency of the main board body 1 to the outside, so that the heat dissipation efficiency of the main board body 1 can be improved, the display main board provided with the heat dissipation layer is beneficial to use, the positioning piece on the heat dissipation layer is arranged to avoid the mounting hole 2 on one hand, and on the other hand, the positioning piece on the heat dissipation layer can be matched with the mounting column to position the main board body 1 when the main board body 1 is mounted on the mounting column, so that the display main board provided with the heat dissipation layer is beneficial to use.
In order to make the person skilled in the art better understand the solution of the present utility model, the technical solution of the embodiment of the present utility model will be clearly and completely described below with reference to the accompanying drawings.
It should be noted that, under the condition of no conflict, the embodiments of the present utility model and the features and technical solutions in the embodiments may be combined with each other.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
Example 1
Referring to fig. 1-2, a display motherboard with a heat dissipation layer includes a motherboard body 1, a heat dissipation mechanism 3 is disposed at the bottom of the motherboard body 1, the heat dissipation mechanism 3 includes a heat dissipation layer, and a positioning member is disposed on the heat dissipation layer.
According to the utility model, through the heat dissipation mechanism 3, the heat dissipation layer in the heat dissipation mechanism 3 can accelerate the heat transmission efficiency of the main board body 1 to the outside, so that the heat dissipation efficiency of the main board body 1 can be improved, the use is facilitated, the positioning piece on the heat dissipation layer is arranged to avoid the mounting hole 2 on one hand, and on the other hand, the main board body 1 can be positioned by being matched with the mounting column when the main board body 1 is mounted on the mounting column, the use is facilitated, and the main board body 1 is a multi-picture display main board.
Further, as shown in fig. 1-2, the heat dissipation layer is a heat conduction member 301, the heat conduction member 301 is fixedly connected to the bottom of the main board body 1, the heat conduction member 301 is a heat conduction silica gel sheet, the heat conduction silica gel sheet uses silica gel as a base material, various auxiliary materials such as metal oxide are added, and the heat conduction medium material synthesized by a special process can effectively improve heat transfer efficiency and also has the functions of insulation, shock absorption, sealing and the like.
Further, as shown in fig. 2, four mounting holes 2 are formed in the main board body 1, the positioning member includes four positioning grooves 302 formed in four corners of the heat conducting member 301, positions of the four positioning grooves 302 correspond to positions of the four mounting holes 2, and the positioning grooves 302 are arranged to avoid the mounting holes 2 on one hand and to cooperate with the mounting columns to position the main board body 1 when the main board body 1 is mounted on the mounting columns on the other hand, so that the use is facilitated.
Further, as shown in fig. 2, the heat dissipation mechanism 3 further includes a plurality of connection grooves 303, the plurality of connection grooves 303 are all formed in the bottom of the heat conducting member 301, and the connection grooves 303 are configured to cooperate with the protection heat dissipation structure 4 to improve the heat dissipation effect.
Example 2
As shown in fig. 3-9, a protective heat dissipation structure 4 is disposed on the outer side of the main board body 1, and the protective heat dissipation structure 4 includes a first heat dissipation protection portion disposed between two sides of the main board body 1 and a second heat dissipation protection portion disposed between two other sides of the main board body 1;
the first heat dissipation protection part and the second heat dissipation protection part can form a frame-shaped structure around the main board body 1, so that the main board body 1 can be protected in the transportation process, the damage condition of the main board body 1 is reduced, and when the heat dissipation protection device is used, the first heat dissipation protection part and the second heat dissipation protection part are matched with the connecting groove 303, so that the heat conduction efficiency can be improved, the heat dissipation effect can be further improved, and the functionality of the protection heat dissipation structure 4 can be improved.
Further, as shown in fig. 3-5, the first heat dissipation protection part includes two first protection heat dissipation plates 401, the side of the two first protection heat dissipation plates 401 close to each other is provided with a clamping groove 402, the clamping groove 402 is inserted into the main board body 1 and the side surface of the heat conducting piece 301, and the limit of connection between the protection heat dissipation structure 4 and the main board body 1 and between the heat conducting piece 301 can be realized through the clamping groove 402, so that the main board body 1 is prevented from being separated from the protection heat dissipation structure 4.
Further, as shown in fig. 3 and 6, screw holes 403 are formed on two sides of the first protection heat dissipation plate 401, and the screw holes 403 are used for being matched with the fixing bolts 410 to fix the second protection heat dissipation plate 404 and the first protection heat dissipation plate 401.
Further, as shown in fig. 3-6, the second heat dissipation protection part includes the second four protection heat dissipation plates 404, through holes 405 are formed in the second four protection heat dissipation plates 404, four fixing bolts 410 are screwed between the four through holes 405 and the four screw holes 403, the fixing bolts 410 can be matched with the screw holes 403 and the through holes 405 to fix the first protection heat dissipation plate 401 and the second protection heat dissipation plate 404 together in the state of fig. 3, and in the state of fig. 9, the fixing bolts 410 are matched with the mounting holes 2 to mount and fix the main board body 1.
Example 3
For further optimization of the display motherboard provided with the heat dissipation layer provided in embodiment 2, specifically, as shown in fig. 7-8, a connecting piece is provided between every two second protection heat dissipation plates 404, where the connecting piece includes a slot 406 and a side slot 407, and the slot 406 and the side slot 407 are respectively opened at one end of the two second protection heat dissipation plates 404 that are close to each other.
Further, as shown in fig. 7-8, a connecting shaft 408 is fixedly installed in the side slot 407, a rotatable clamping plate 409 is sleeved on the outer surface of the connecting shaft 408, the clamping plate 409 is inserted into the inner wall of the slot 406, the two protection heat dissipation plates 404 can be connected together through the mutual matching of the clamping plate 409 and the slot 406, the clamping plate 409 is rotated to be located in the side slot 407 after being erected, and the clamping plate 409 can be limited in the side slot 407 by means of friction force between the clamping plate 409 and the side slot 407.
The use process of the display main board provided with the heat dissipation layer provided by the utility model is as follows:
referring to fig. 3, the fixing bolts 410 are screwed off, the second protective cooling plate 404 is removed, one of the second protective cooling plates 404 is pulled upwards, the second protective cooling plate 404 is separated, then the clamping plate 409 is rotated to be erected, the first protective cooling plate 401 is pulled to separate the first protective cooling plate 401 from the main board body 1, the main board body 1 is placed on the mounting post, at the moment, the inner walls of the four positioning grooves 302 are in contact with the mounting post, so that the main board body 1 is positioned, then the four fixing bolts 410 pass through the four mounting holes 2 and are connected with the mounting post, the fixing bolts 410 are not screwed, the four second protective cooling plates 404 and the two first protective cooling plates 401 are inserted into the connecting grooves 303, and then the fixing bolts 410 are screwed, so that the fixing bolts 410 are in contact with the display housing, and the mounting can be completed.
The operation of the present utility model is changed from fig. 9 to fig. 3 by first screwing off four fixing bolts 410, then separating the first protective heat dissipating plate 401 and the second protective heat dissipating plate 404 from the connecting groove 303, respectively placing the first two protective heat dissipating plates 401 on both sides of the main board body 1, inserting both sides of the main board body 1 into the two clamping grooves 402, rotating the clamping plate 409 horizontally, inserting the clamping plate 409 into the slot 406 from above the slot 406, namely connecting the two second protective heat dissipating plates 404 together, inserting the fixing bolts 410 into the through holes 405, then screwing onto the screw holes 403, and fixing the second protective heat dissipating plates 404 and the first protective heat dissipating plates 401 together by the fixing bolts 410.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
It is apparent that the above-described embodiments are only some embodiments of the present utility model, but not all embodiments, and the preferred embodiments of the present utility model are shown in the drawings, which do not limit the scope of the patent claims. This utility model may be embodied in many different forms, but rather, embodiments are provided in order to provide a thorough and complete understanding of the present disclosure. Although the utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing description, or equivalents may be substituted for elements thereof. All equivalent structures made by the content of the specification and the drawings of the utility model are directly or indirectly applied to other related technical fields, and are also within the scope of the utility model.
Claims (8)
1. The display main board with the heat dissipation layer comprises a main board body (1), and is characterized in that a heat dissipation mechanism (3) is arranged at the bottom of the main board body (1), the heat dissipation mechanism (3) comprises the heat dissipation layer, and a positioning piece is arranged on the heat dissipation layer;
the heat dissipation layer is a heat conduction piece (301), and the heat conduction piece (301) is fixedly connected to the bottom of the main board body (1);
four mounting holes (2) are formed in the main board body (1), the locating piece comprises four locating grooves (302) which are formed in four corners of the heat conducting piece (301) respectively, and the positions of the four locating grooves (302) correspond to the positions of the four mounting holes (2) respectively.
2. The display motherboard provided with the heat dissipation layer according to claim 1, wherein the heat dissipation mechanism (3) further comprises a plurality of connection grooves (303), and the plurality of connection grooves (303) are all formed at the bottom of the heat conducting member (301).
3. A display motherboard provided with a heat dissipation layer according to claim 2, characterized in that the outside of the motherboard body (1) is provided with a protective heat dissipation structure (4), the protective heat dissipation structure (4) comprising a first heat dissipation protection part arranged between two of the two sides of the motherboard body (1) and a second heat dissipation protection part arranged between the other two sides of the motherboard body (1).
4. A display motherboard provided with a heat dissipation layer according to claim 3, wherein the first heat dissipation protection part comprises two first protection heat dissipation plates (401), two sides of the two first protection heat dissipation plates (401) close to each other are respectively provided with a clamping groove (402), and the clamping grooves (402) are spliced with the side surfaces of the motherboard body (1) and the heat conducting piece (301).
5. The display motherboard provided with the heat dissipation layer according to claim 4, wherein screw holes (403) are formed on both sides of the two protection heat dissipation plates (401).
6. The display motherboard provided with the heat dissipation layer according to claim 5, wherein the second heat dissipation protection part comprises two protection heat dissipation plates (404), the four two protection heat dissipation plates (404) are respectively provided with a through hole (405), and four fixing bolts (410) are connected between the four through holes (405) and the four screw holes (403) in a threaded manner.
7. The display motherboard provided with the heat dissipation layer according to claim 6, wherein a connecting piece is arranged between every two protection heat dissipation plate pairs (404), the connecting piece comprises a slot (406) and a side slot (407), and the slot (406) and the side slot (407) are respectively arranged at one end of the two protection heat dissipation plate pairs (404) close to each other.
8. The display main board with the heat dissipation layer according to claim 7, wherein a connecting shaft (408) is fixedly installed in the side groove (407), a rotatable clamping board (409) is sleeved on the outer surface of the connecting shaft (408), and the clamping board (409) is spliced with the inner wall of the slot (406).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321023220.7U CN220108534U (en) | 2023-04-28 | 2023-04-28 | Display main board provided with heat dissipation layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321023220.7U CN220108534U (en) | 2023-04-28 | 2023-04-28 | Display main board provided with heat dissipation layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220108534U true CN220108534U (en) | 2023-11-28 |
Family
ID=88864811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321023220.7U Active CN220108534U (en) | 2023-04-28 | 2023-04-28 | Display main board provided with heat dissipation layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220108534U (en) |
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2023
- 2023-04-28 CN CN202321023220.7U patent/CN220108534U/en active Active
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