CN217543780U - Computer motherboard radiator convenient to dismantle - Google Patents
Computer motherboard radiator convenient to dismantle Download PDFInfo
- Publication number
- CN217543780U CN217543780U CN202220335110.3U CN202220335110U CN217543780U CN 217543780 U CN217543780 U CN 217543780U CN 202220335110 U CN202220335110 U CN 202220335110U CN 217543780 U CN217543780 U CN 217543780U
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- China
- Prior art keywords
- heat dissipation
- dissipation box
- convenient
- computer motherboard
- radiator
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 60
- 238000009434 installation Methods 0.000 abstract description 3
- 230000033228 biological regulation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model belongs to the technical field of the mainboard heat dissipation, especially, be a computer motherboard radiator convenient to dismantle, including the heat dissipation box, the top of heat dissipation box evenly is provided with the heat dissipation fan, one side of heat dissipation box evenly is provided with the second spliced pole. The computer mainboard radiator convenient to disassemble is convenient to splice a plurality of radiating boxes together by respectively arranging the second connecting column and the second connecting sleeve on one side and the other side of the radiating box so as to change the length of the radiator and be conveniently installed on computer mainboards with different lengths, and the first connecting column and the first connecting sleeve are respectively arranged at one end and the other end of the radiating box, the width size of being convenient for change the radiator to conveniently install the device on the computer motherboard of different width sizes, solved the problem that computer motherboard heat abstractor size was not convenient for adjust in the past on the one hand, on the other hand is convenient to the installation and the dismantlement of radiator, reduces the volume, is convenient for store.
Description
Technical Field
The utility model belongs to the technical field of the mainboard heat dissipation, concretely relates to computer motherboard radiator convenient to dismantle.
Background
The mainboard is generally a rectangular circuit board, on which the main circuit system forming the computer is mounted, and generally has BIOS chip, I/O control chip, keyboard and panel control switch interface, indicator lamp plug-in unit, expansion slot, mainboard and DC power supply plug-in unit of plug-in card, etc. the mainboard is also named as mainboard, motherboard and system board, in a microcomputer, the main circuit system and lots of integrated circuits of computer are mounted on the mainboard, and has expansion slot and various external plug-ins. The quality of a computer has a great relationship with the design and process of a motherboard.
The heat dissipation work of computer motherboard in the course of the work is very important, if fail in time the effluvium can cause serious loss to the mainboard, and current computer motherboard radiator most all is fixed size, and the regulation size of being not convenient for is difficult to be applicable to the mainboard that the size is different.
SUMMERY OF THE UTILITY MODEL
To solve the problems set forth in the background art described above. The utility model provides a computer motherboard radiator convenient to dismantle has solved current computer motherboard radiator most and all is fixed size, is not convenient for adjust the size, is difficult to be applicable to the problem of the mainboard that the size is different.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a computer motherboard radiator convenient to dismantle, includes the heat dissipation box, the top of heat dissipation box evenly is provided with the heat dissipation fan, one side of heat dissipation box evenly is provided with the second spliced pole, the opposite side of heat dissipation box evenly is provided with the second connecting sleeve, the one end of heat dissipation box evenly is provided with first connecting column, the other end of heat dissipation box evenly is provided with first connecting sleeve, the inside of heat dissipation box evenly is provided with heat radiation fins.
Preferably, the bottom of the heat dissipation box is provided with a rubber pad, and four corners of the heat dissipation box are uniformly provided with screw through holes.
Preferably, the surfaces of the first connecting column, the first connecting sleeve, the second connecting column and the second connecting sleeve are provided with limiting holes.
Preferably, be connected with spacing post between the spacing hole on first spliced pole and first connecting sleeve surface, be connected with spacing post between the spacing hole on second spliced pole and second connecting sleeve surface.
Preferably, the surface of the inner wall of the limiting hole and the surface of the limiting column are both provided with threads.
Preferably, a filter screen is arranged above the radiating fins.
Compared with the prior art, the beneficial effects of the utility model are that:
this computer motherboard radiator convenient to dismantle, one side and the opposite side through at the heat dissipation box set up second spliced pole and second connecting sleeve respectively, be convenient for with a plurality of heat dissipation box splices together, thereby change the length of radiator, thereby convenient to install on the computer motherboard of different length, through set up first spliced pole and first connecting sleeve respectively at the one end of heat dissipation box and the other end, be convenient for change the width size of radiator, thereby conveniently install the device on the computer motherboard of different width sizes, the problem of computer motherboard heat abstractor size regulation not convenient for in the past has been solved on the one hand, on the other hand is convenient to the installation and the dismantlement of radiator, reduce the volume, be convenient for store.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a first three-dimensional structure diagram of the present invention;
FIG. 2 is a second perspective structural view of the present invention;
fig. 3 is a front sectional view of the present invention.
In the figure: 1. a heat dissipation box; 2. a heat dissipation fan; 3. a screw passing hole; 4. a first connecting post; 5. a limiting hole; 6. a limiting column; 7. a first connecting sleeve; 8. a rubber pad; 9. heat dissipation fins; 10. a filter screen; 11. a second connecting column; 12. a second connecting sleeve.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides the following technical solutions: the utility model provides a computer motherboard radiator convenient to dismantle, includes heat dissipation box 1, and the top of heat dissipation box 1 evenly is provided with heat dissipation fan 2, and one side of heat dissipation box 1 evenly is provided with second spliced pole 11, and the opposite side of heat dissipation box 1 evenly is provided with second connecting sleeve 12, and the one end of heat dissipation box 1 evenly is provided with first spliced pole 4, and the other end of heat dissipation box 1 evenly is provided with first connecting sleeve 7, and the inside of heat dissipation box 1 evenly is provided with heat radiation fins 9.
Firstly, according to the size of a computer mainboard, a plurality of heat dissipation boxes 1 are spliced together, a first connecting column 4 of one of the heat dissipation boxes 1 is inserted into a first connecting sleeve 7 of the other heat dissipation box 1, then a limiting column 6 is inserted into a limiting hole 5, then a rubber gasket 8 at the bottom of the heat dissipation box 1 is contacted with the computer mainboard, then the heat dissipation box 1 and the computer mainboard are fixed together by inserting a fixing bolt through a screw through hole 3, heat is transmitted to the heat dissipation box 1 through the rubber gasket 8, heat on the surface of the heat dissipation box 1 is transmitted to a heat dissipation fin 9, and heat on the surface of the heat dissipation fin 9 is radiated out through a heat dissipation fan 2, so that the purpose of heat dissipation is achieved, and dust can be prevented from entering the heat dissipation box 1 through a filter screen 10.
In one aspect of the present embodiment, the second connection column 11 and the second connection sleeve 12 are respectively disposed on one side and the other side of the heat dissipation box 1, so that the plurality of heat dissipation boxes 1 can be conveniently spliced together, the length of the heat sink can be changed, and the heat dissipation box can be conveniently mounted on computer main boards with different lengths.
In an aspect of this embodiment, through setting up first spliced pole 4 and first connecting sleeve 7 respectively at the one end of heat dissipation box 1 and the other end, be convenient for change the width size of radiator to conveniently install the device on the computer motherboard of different width sizes, solved the problem that computer motherboard heat abstractor size in the past was not convenient for to adjust on the one hand, on the other hand is convenient to the installation and the dismantlement of radiator, reduces the volume, is convenient for store.
In an aspect of this embodiment, set up the rubber pad through the bottom at heat dissipation box 1, can play the effect of protection to the computer motherboard on the one hand, on the other hand can accelerate heat conduction speed, improves the radiating efficiency.
In the description of the present specification, reference to the description of "one embodiment," "an example," "a specific example," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The utility model provides a computer motherboard radiator convenient to dismantle, includes heat dissipation box (1), its characterized in that: the heat dissipation box is characterized in that a heat dissipation fan (2) is uniformly arranged at the top of the heat dissipation box (1), a second connecting column (11) is uniformly arranged on one side of the heat dissipation box (1), a second connecting sleeve (12) is uniformly arranged on the other side of the heat dissipation box (1), a first connecting column (4) is uniformly arranged at one end of the heat dissipation box (1), a first connecting sleeve (7) is uniformly arranged at the other end of the heat dissipation box (1), and heat dissipation fins (9) are uniformly arranged inside the heat dissipation box (1).
2. The computer motherboard heat sink of claim 1, wherein: the bottom of the heat dissipation box (1) is provided with a rubber pad (8), and the four corners of the heat dissipation box (1) are uniformly provided with screw through holes (3).
3. The computer motherboard heat sink of claim 1, wherein: the surface of the first connecting column (4), the first connecting sleeve (7), the second connecting column (11) and the second connecting sleeve (12) is provided with a limiting hole (5).
4. The computer motherboard heat sink of claim 1, wherein: spacing post (6) are connected with between spacing hole (5) on first spliced pole (4) and first connecting sleeve (7) surface, be connected with spacing post (6) between spacing hole (5) on second spliced pole (11) and second connecting sleeve (12) surface.
5. The computer motherboard heat sink of claim 4, wherein: the surface of the inner wall of the limiting hole (5) and the surface of the limiting column (6) are both provided with threads.
6. The computer motherboard heat sink of claim 1, wherein: a filter screen (10) is arranged above the radiating fins (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220335110.3U CN217543780U (en) | 2022-02-18 | 2022-02-18 | Computer motherboard radiator convenient to dismantle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220335110.3U CN217543780U (en) | 2022-02-18 | 2022-02-18 | Computer motherboard radiator convenient to dismantle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217543780U true CN217543780U (en) | 2022-10-04 |
Family
ID=83428209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220335110.3U Expired - Fee Related CN217543780U (en) | 2022-02-18 | 2022-02-18 | Computer motherboard radiator convenient to dismantle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217543780U (en) |
-
2022
- 2022-02-18 CN CN202220335110.3U patent/CN217543780U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20221004 |