CN211529036U

CN211529036U - Computer mainboard with high-efficient heat dispersion

Info

Publication number: CN211529036U
Application number: CN201922207696.6U
Authority: CN
Inventors: 李约军
Original assignee: Shenzhen Jintaiyi Electronic Co ltd
Current assignee: Shenzhen Jintaiyi Electronic Co ltd
Priority date: 2019-12-11
Filing date: 2019-12-11
Publication date: 2020-09-18
Anticipated expiration: 2029-12-11

Abstract

The utility model discloses a computer mainboard with high-efficient heat dispersion, including the mainboard, the surface mounting of mainboard has a plurality of electronic component, wherein a plurality of the bilateral symmetry of electronic component has seted up the radiating groove, the cross section of radiating groove is the both ends form of buckling, install the installation piece on the bottom face of mainboard, the through-hole has all been seted up to the inside of installation piece and the surface of mainboard through running through, the mainboard passes through the through-hole through the bolt and is connected with outside quick-witted case fixed connection; through the radiating groove and the installation block of design, can form the air flow when the fan dispels the heat to the mainboard cooling to radiating effect with higher speed, the radiating groove carries out certain separation with the biggest part of calorific capacity on the mainboard simultaneously, further reduces with the heat-conduction of mainboard, has reduced the heat conductivity.

Description

Computer mainboard with high-efficient heat dispersion

Technical Field

The utility model belongs to the technical field of the computer mainboard, concretely relates to computer mainboard with high-efficient heat dispersion.

Background

The computer case mainboard is also called a mainboard, a system board or a motherboard; it is divided into two types, namely a commercial mainboard and an industrial mainboard. It is installed in the cabinet, and is one of the most basic and important parts of the microcomputer. The main board is generally a rectangular circuit board, on which the main circuit system forming the computer is installed, and generally includes elements such as a BIOS chip, an I/O control chip, a keyboard and a panel control switch interface, an indicator light plug-in, an expansion slot, a main board, and a direct current power supply plug-in of a plug-in card.

When the existing computer mainboard is used, the temperature is increased due to the operation of a plurality of connectors mounted on the surface, the air flow is increased through the fan in the existing common heat dissipation mode, so that the heat dissipation phenomenon is achieved, but because the computer mainboard is in a whole plane shape, the air flow cannot be formed with the wind generated by the fan, the heat dissipation can be carried out on the surface, the heat dissipation efficiency is lower, and the improved space is provided.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a computer mainboard with high-efficient heat dispersion to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a computer mainboard with high-efficient heat dispersion, includes the mainboard, the surface mounting of mainboard has a plurality of electronic component, and is wherein a plurality of the radiating groove has been seted up to electronic component's bilateral symmetry, the form is buckled at both ends to the transversal personally submitting of radiating groove, install the installation piece on the bottom face of mainboard, the through-hole has all been run through to the inside of installation piece and the surface of mainboard, the mainboard passes through-hole and outside quick-witted case fixed connection through the bolt.

Preferably, the cross section of the mounting block is of a concave structure, the mounting block is a plastic component, and the bottom end face of the main board is separated from the external case through the mounting block.

Preferably, the both ends edge symmetry of mainboard is provided with spacing, a plurality of spliced poles are installed to spacing bottom equidistance, the mounting hole with spliced pole looks adaptation is seted up on the surface of mainboard, spacing is the half cylinder structure.

Preferably, the connecting column is a composite structure of a circular truncated cone and a cylinder, and the connecting column is an elastic material component.

Preferably, the thickness of the main board is two millimeters, and the main board is a PCB material component.

Preferably, the surface of the main plate is coated with a polytetrafluoroethylene coating.

Compared with the prior art, the beneficial effects of the utility model are that:

1. through the designed heat dissipation grooves and the mounting blocks, air flow can be formed when the fan dissipates heat and cools the mainboard, so that the heat dissipation effect is accelerated, meanwhile, the heat dissipation grooves separate the parts with the largest heat productivity on the mainboard to a certain extent, the heat conduction with the mainboard is further reduced, and the heat conductivity is reduced;

2. through the spacing strip of design, can in use, protect the edge of mainboard, avoid in the installation to and the dismantlement in later stage, the phenomenon of collision appears with other parts, guarantee to be in that edge electronic component does not receive the damage.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a cross-sectional view of the present invention;

FIG. 3 is a schematic view of the installation of the main board and the position-limiting strip of the present invention;

FIG. 4 is an enlarged schematic view of the area A in FIG. 3 according to the present invention;

in the figure: 1. a main board; 2. an electronic component; 3. a through hole; 4. a heat sink; 5. mounting blocks; 6. a limiting strip; 7. mounting holes; 8. connecting columns.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1

Referring to fig. 1 and fig. 2, the present invention provides a technical solution: the utility model provides a computer mainboard with high-efficient heat dispersion, including mainboard 1, the surface mounting of mainboard 1 has a plurality of electronic component 2, wherein radiating groove 4 has been seted up to a plurality of electronic component 2's bilateral symmetry, radiating groove 4's transversal personally submits the both ends form of buckling, install installation piece 5 on the bottom face of mainboard 1, radiating groove 4 and installation piece 5 through the design, can be when the fan dispels the heat to mainboard 1, can form the air flow, thereby radiating effect with higher speed, radiating groove 4 carries out certain partition with the biggest part of calorific capacity on mainboard 1 simultaneously, further reduce the heat-conduction with mainboard 1, the heat conductivity has been reduced, the inside of installation piece 5 all runs through with the surface of mainboard 1 and has seted up through-hole 3, mainboard 1 runs through-hole 3 and outside quick-witted case fixed connection through the bolt.

In this embodiment, preferably, the cross section of the mounting block 5 is a concave structure, the mounting block 5 is a plastic component, and the bottom end surface of the main board 1 is separated from the external chassis by the mounting block 5.

In this embodiment, preferably, the thickness of the main board 1 is two millimeters, and the main board 1 is a PCB material member.

In this embodiment, preferably, the surface of the main plate 1 is coated with a teflon coating.

Example 2

Referring to fig. 1 to 4, the present invention provides a technical solution: the utility model provides a computer mainboard with high-efficient heat dispersion, including mainboard 1, the surface mounting of mainboard 1 has a plurality of electronic component 2, wherein radiating groove 4 has been seted up to a plurality of electronic component 2's bilateral symmetry, radiating groove 4's transversal personally submits the both ends form of buckling, install installation piece 5 on the bottom face of mainboard 1, radiating groove 4 and installation piece 5 through the design, can be when the fan dispels the heat to mainboard 1, can form the air flow, thereby radiating effect with higher speed, radiating groove 4 carries out certain partition with the biggest part of calorific capacity on mainboard 1 simultaneously, further reduce the heat-conduction with mainboard 1, the heat conductivity has been reduced, the inside of installation piece 5 all runs through with the surface of mainboard 1 and has seted up through-hole 3, mainboard 1 runs through-hole 3 and outside quick-witted case fixed connection through the bolt.

In this embodiment, it is preferred, the both ends edge symmetry of mainboard 1 is provided with spacing 6, spacing 6 through the design, can in use, protect mainboard 1's edge, avoid in the installation, and in the dismantlement in later stage, the phenomenon of collision appears with other parts, guarantee that it is not damaged to be in the electronic component of edge, a plurality of spliced poles 8 are installed to the bottom equidistance of spacing 6, mounting hole 7 with spliced pole 8 looks adaptation is seted up on mainboard 1's surface, spacing 6 is the half-cylinder structure.

In this embodiment, preferably, the connecting column 8 is a composite structure of a circular truncated cone and a cylinder, wherein the maximum diameter of the circular truncated cone is one point three times of the aperture of the mounting hole 7, and the connecting column 8 is an elastic member, so that the connecting column can be clamped into the mounting hole 7.

The utility model discloses a theory of operation and use flow: the utility model discloses when using, run through mainboard 1 through-hole 3 of seting up with 5 surfaces of installation piece through outside bolt, and be connected with quick-witted case, in use, each electronic component 2 on the mainboard 1 carries out corresponding work, and meanwhile, blow to mainboard 1 through the fan of quick-witted incasement, some wind-force blows off from the inboard of radiating groove 4 this moment, because radiating groove 4 is in the higher electronic component 2 edge of calorific capacity, consequently, can drive more heat, and discharge through the clearance between installation piece 5 and the radiating groove 4, when incessant wind power output, reach the air current and flow, increase the heat dissipation, before the installation, fix in inserting mounting hole 7 with the spliced pole 8 of spacing 6 through the bottom earlier, with this avoid when installation and dismantlement mainboard 1, cause the damage to electronic component 2 of mainboard 1 top edge department.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A computer mainboard with high-efficiency heat dissipation performance comprises a mainboard (1), wherein a plurality of electronic elements (2) are installed on the surface of the mainboard (1), and the computer mainboard is characterized in that: it is wherein a plurality of radiating groove (4) have been seted up to the bilateral symmetry of electronic component (2), the form of buckling at both ends is personally submitted in the transversal of radiating groove (4), install installation piece (5) on the bottom face of mainboard (1), through-hole (3) have all been seted up in the inside of installation piece (5) and the surface of mainboard (1) through running through, mainboard (1) runs through-hole (3) and outside quick-witted case fixed connection through the bolt.

2. The computer motherboard with high heat dissipation performance as recited in claim 1, wherein: the cross section of the mounting block (5) is of a concave structure, the mounting block (5) is a plastic component, and the bottom end face of the main board (1) is separated from an external chassis through the mounting block (5).

3. The computer motherboard with high heat dissipation performance as recited in claim 1, wherein: the both ends edge symmetry of mainboard (1) is provided with spacing (6), a plurality of spliced poles (8) are installed to the bottom equidistance of spacing (6), mounting hole (7) with spliced pole (8) looks adaptation are seted up on the surface of mainboard (1), spacing (6) are the half cylinder structure.

4. The computer motherboard with high heat dissipation performance as recited in claim 3, wherein: the connecting column (8) is of a composite structure of a circular truncated cone and a cylinder, and the connecting column (8) is an elastic material component.

5. The computer motherboard with high heat dissipation performance as recited in claim 1, wherein: the thickness of mainboard (1) is two millimeters, just mainboard (1) is PCB material component.

6. The computer motherboard with high-efficiency heat dissipation performance as recited in claim 5, wherein: the surface of the main board (1) is coated with a polytetrafluoroethylene coating.