CN211090348U - Customized board mounting plate - Google Patents
Customized board mounting plate Download PDFInfo
- Publication number
- CN211090348U CN211090348U CN202020069073.7U CN202020069073U CN211090348U CN 211090348 U CN211090348 U CN 211090348U CN 202020069073 U CN202020069073 U CN 202020069073U CN 211090348 U CN211090348 U CN 211090348U
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- Prior art keywords
- bottom plate
- plate
- heat dissipation
- integrated circuit
- mounting
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a customized board mounting plate, which comprises a bottom plate, wherein a plurality of mounting columns are arranged in the middle of the bottom plate, threaded holes are formed in the tops of the mounting columns, a plurality of grooves with different sizes are formed in the bottom plate, and a heat dissipation structure is arranged on the side surface of the bottom plate opposite to the grooves; the utility model discloses a fixed integrated circuit board on the erection column, integrated circuit board and mounting panel have certain clearance, help the integrated circuit board to produce the heat and scatter and disappear, and components and parts on the integrated circuit board can hold in the recess of each variation in size, can increase components and parts with the utility model discloses an area of contact improves the radiating efficiency, and what the heat radiation structure of installation can be timely on the bottom plate will the utility model discloses a heat that components and parts produced distributes away, satisfies integrated circuit board heat dissipation demand.
Description
Technical Field
The utility model belongs to the technical field of the integrated circuit board device, especially, a customization integrated circuit board mounting panel has been related to.
Background
Along with the rapid development of electronic technology, the integration level of electronic equipment is further improved, the functions of integrated devices are increasingly complex, the power is continuously increased, in addition, the electronic equipment in the special field is required to be miniaturized and motorized, the structural design of the electronic equipment is developed towards the direction of small-sized assembly, the power of a unit area is continuously increased, the heat emitted by electronic components is correspondingly increased, the heat flux density is also increased in multiple times, the electronic components are welded on a PCB board card at present, then the PCB board card is installed in a case through screws, the simple installation cannot timely emit a large amount of heat generated by the PCB board card, and the reliability of the electronic components on the PCB board card is greatly influenced.
SUMMERY OF THE UTILITY MODEL
To the above problem, the utility model provides a customization integrated circuit board mounting panel, fine solution the PCB board produce the problem that a large amount of heat consumptions can not in time distribute.
In order to realize the purpose, the utility model discloses a technical scheme as follows: the utility model provides a customization integrated circuit board mounting panel, includes the bottom plate, and the bottom plate middle part sets up a plurality of erection columns, and the screw hole is seted up at the erection column top, is provided with the recess of a plurality of variation in size on the bottom plate, and the side relative with the recess on the bottom plate is provided with heat radiation structure.
Furthermore, both ends of the bottom plate in the length direction are provided with first fixing plates, and one end of the bottom plate in the width direction is provided with a second fixing plate.
Furthermore, a flange extending towards the outside of the bottom plate is arranged at one end, away from the heat dissipation structure, of the first fixing plate, and a mounting hole is formed in the flange; a plurality of through holes for the board card interface to extend out are formed in the second fixing plate.
Furthermore, one end of the bottom plate in the width direction, which is opposite to the second fixing plate, is provided with a plurality of mounting bosses, one side of the bottom plate, which is opposite to the first fixing plate, is provided with a plurality of mounting bosses, and the mounting bosses are provided with threaded holes.
Further, the heat dissipation structure comprises a plurality of heat dissipation holes.
Furthermore, the heat dissipation structure comprises a plurality of heat dissipation fins arranged in parallel, and the length of each heat dissipation fin is the same as the width or the length of the bottom plate.
Furthermore, the whole material of mounting panel adopts the aluminum alloy, and mounting panel integrated into one piece.
Compared with the prior art, the utility model discloses following beneficial effect has: the utility model discloses a fixed integrated circuit board on the erection column, integrated circuit board and mounting panel have certain clearance, help the integrated circuit board to produce the heat and scatter and disappear, and components and parts on the integrated circuit board can hold in the recess of each variation in size, can increase components and parts with the utility model discloses an area of contact improves the radiating efficiency, and what the heat radiation structure of installation can be timely on the bottom plate will the utility model discloses a heat that components and parts produced distributes away, satisfies integrated circuit board heat dissipation demand.
Drawings
Fig. 1 is a top view of the present invention;
FIG. 2 is a front view of FIG. 1;
fig. 3 is a right side view of fig. 1.
In the figure: 1. a base plate; 2. mounting a column; 3. a threaded hole; 4. a groove; 5. a first fixing plate; 6. a second fixing plate; 7. a flange; 8. mounting holes; 9. a through hole; 10. mounting a boss; 11. and (4) radiating fins.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1
As shown in fig. 1-3, a customization integrated circuit board mounting panel, including bottom plate 1, 1 middle part of bottom plate sets up a plurality of erection columns 2, and threaded hole 3 is seted up at 2 tops of erection column, is provided with the recess 4 of a plurality of variation in size on the bottom plate 1, is provided with heat radiation structure with the side that recess 4 is relative on the bottom plate 1.
The material of the utility model adopts aluminum alloy, because the aluminum alloy has low density, but has higher strength, is close to or exceeds high-quality steel, has good plasticity, can be processed into various sectional materials, has excellent electrical conductivity, thermal conductivity and corrosion resistance, can provide good heat dissipation environment for the board card, and can dissipate heat for the board card in time; the utility model discloses an integrated into one piece machine-shaping uses the monoblock filter plate to process in the digit control machine tool, can produce in batches, has improved production efficiency, reduction in production cost.
In this embodiment, the two ends of the bottom plate 1 in the length direction are both provided with a first fixing plate 5, and one end of the bottom plate 1 in the width direction is provided with a second fixing plate 6; a flange 7 extending towards the outside of the bottom plate 1 is arranged at one end, away from the heat dissipation structure, of the first fixing plate 5, and a mounting hole 8 is formed in the flange 7; a plurality of through holes 9 for the card interfaces to extend out are formed in the second fixing plate 6; first fixed plate 5 and second fixed plate 6 can play the effect of location integrated circuit board to install the integrated circuit board the utility model discloses go up the back, can protect the border of integrated circuit board not receive to collide with, reduce the rejection rate of integrated circuit board.
In this embodiment, a plurality of mounting bosses 10 are provided at one end of the bottom plate 1 in the width direction opposite to the second fixing plate 6, a plurality of mounting bosses 10 are provided at one side of the bottom plate 1 opposite to the first fixing plate 5, and the mounting bosses 10 are provided with threaded holes 3.
In this embodiment, the heat dissipation structure is formed by a plurality of heat dissipation holes formed in the bottom plate 1, so as to keep the ventilation of the motherboard, thereby achieving the heat dissipation effect. The structure of second kind includes a plurality of radiating fin 11 that a plurality of parallels were arranged, and radiating fin 11 length is the same with bottom plate 1's width or length, distributes away the heat of integrated circuit board in time through radiating fin 11 to, in the heat dissipation engineering, can prevent that the dust from passing through the utility model discloses one side of bottom plate 1 is attached to with the integrated circuit board on, have certain dustproof effect, preferred, select the second kind of heat radiation structure.
Use the utility model discloses in the time, the utility model discloses an install column 2 is gone up and is fixed the integrated circuit board, and integrated circuit board and mounting panel have certain clearance, help the integrated circuit board to produce the heat and scatter and disappear, and components and parts on the integrated circuit board can hold in recess 4 of each variation in size, can increase components and parts with the utility model discloses an area of contact improves the radiating efficiency, and what the heat radiation structure of installation can be timely on the bottom plate 1 will the utility model discloses a heat that components and parts produced distributes away, satisfies integrated circuit board heat dissipation demand.
Example 2
The present embodiment is different from the above embodiments in that: as shown in fig. 3, heat radiation structure includes a plurality of radiating fin 11 that a plurality of parallels were arranged, and radiating fin 11 length is the same with bottom plate 1's width or length, in time distributes away the heat of integrated circuit board through radiating fin 11 to, in the heat dissipation process, can prevent that the dust from passing through the utility model discloses one side of bottom plate 1 is attached to with the integrated circuit board on, has certain dustproof effect, and the structure is more excellent.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (7)
1. The utility model provides a customization integrated circuit board mounting panel which characterized in that: the heat dissipation structure comprises a bottom plate (1), wherein a plurality of mounting columns (2) are arranged in the middle of the bottom plate (1), threaded holes (3) are formed in the tops of the mounting columns (2), a plurality of grooves (4) with different sizes are formed in the bottom plate (1), and a heat dissipation structure is arranged on the side face, opposite to the grooves (4), of the bottom plate (1).
2. The customized board mounting plate of claim 1, wherein: both ends of the length direction of the bottom plate (1) are provided with first fixing plates (5), and one end of the width direction of the bottom plate (1) is provided with a second fixing plate (6).
3. The customized board mounting plate of claim 2, wherein: a flange (7) extending towards the outside of the bottom plate (1) is arranged at one end, away from the heat dissipation structure, of the first fixing plate (5), and a mounting hole (8) is formed in the flange (7); a plurality of through holes (9) for the card interfaces to extend out are formed in the second fixing plate (6).
4. The customized board mounting plate of claim 2, wherein: one end, opposite to the second fixing plate (6), of the width direction of the base plate (1) is provided with a plurality of mounting bosses (10), one side, opposite to the first fixing plate (5), of the base plate (1) is provided with a plurality of mounting bosses (10), and the mounting bosses (10) are provided with threaded holes (3).
5. The customized board mounting plate of claim 1, wherein: the heat dissipation structure comprises a plurality of heat dissipation holes.
6. The customized board mounting plate of claim 1, wherein: the heat dissipation structure comprises a plurality of heat dissipation fins (11) which are arranged in parallel, and the length of each heat dissipation fin (11) is the same as the width or the length of the bottom plate (1).
7. The customized board mounting plate of claim 1, wherein: the whole material of mounting panel adopts the aluminum alloy, mounting panel integrated into one piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020069073.7U CN211090348U (en) | 2020-01-10 | 2020-01-10 | Customized board mounting plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020069073.7U CN211090348U (en) | 2020-01-10 | 2020-01-10 | Customized board mounting plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211090348U true CN211090348U (en) | 2020-07-24 |
Family
ID=71644288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020069073.7U Active CN211090348U (en) | 2020-01-10 | 2020-01-10 | Customized board mounting plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211090348U (en) |
-
2020
- 2020-01-10 CN CN202020069073.7U patent/CN211090348U/en active Active
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