CN213880402U

CN213880402U - Heat radiation assembly of small laminated PCB

Info

Publication number: CN213880402U
Application number: CN202120158718.9U
Authority: CN
Inventors: 张冠; 黄新宇
Original assignee: Changsha Microbrain Intelligent Technology Co ltd
Current assignee: Changsha Microbrain Intelligent Technology Co ltd
Priority date: 2021-01-21
Filing date: 2021-01-21
Publication date: 2021-08-03
Anticipated expiration: 2031-01-21

Abstract

The utility model provides a radiator unit of small-size stromatolite PCB board, include: the chip comprises a chip, a first PCB, a first through hole, a first copper exposure area, a heat conduction silica gel sheet, a second PCB, a second through hole, a second copper exposure area, a third copper exposure area and a metal structural member, wherein the first PCB is a core board of the system; the chip is arranged on the TOP surface of the first PCB; the first via hole is a ground via hole set punched in a main chip area on the first PCB; the first copper exposing area is formed by windowing and exposing copper under the BOTTOM surface main chip of the first PCB; the second PCB is an interface board of the system; the second via hole is a ground via hole set punched on the second PCB; the second copper exposing area is formed by windowing and exposing copper on the TOP surface of the second PCB; and the third copper exposing area is the copper exposing area of the second PCB BOTTOM surface window. The utility model discloses can effectively solve the heat dissipation problem of small-size stromatolite PCB board, small-size product design also can effectual heat be scattered away, avoids the system temperature rise to bring and produces property ability decline.

Description

Heat radiation assembly of small laminated PCB

Technical Field

The utility model belongs to the technical field of the heat dissipation of PCB board, concretely relates to radiator unit of small-size stromatolite PCB board.

Background

Electric energy consumed by electronic equipment during working, such as chips of radio frequency power amplifiers, MCU, DSP, FPGA and the like, and power supply products, except useful work, most of the electric energy is converted into heat to be dissipated. The heat generated by the electronic equipment can quickly raise the internal temperature, if the heat is not dissipated in time, the equipment can continue to be heated, the device can lose efficacy due to overheating, and the reliability of the electronic equipment can be reduced. SMT increases the mounting density of electronic devices, reduces the effective heat dissipation area, and severely affects the reliability due to temperature rise of the devices, and thus, it is very important to study heat dissipation design. At present, the PCB needs to be smaller and smaller in some applications, and two boards are required to be laminated, so that the heat dissipation is difficult if the heat dissipation is also carried out through the PCB or the heat dissipation is directly carried out by adding a metal structural part.

Disclosure of Invention

The problem that provides to the background art, the utility model aims at, provide a small-size stromatolite PCB's radiator unit, reduce the heat of PCB board, avoid the system temperature to rise and influence the performance of product.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a heat dissipating assembly for a small laminated PCB board, comprising: the chip comprises a chip (1), a first PCB (printed circuit board) (2), a first via hole (3), a first copper exposure area (4), a heat-conducting silicon sheet (5), a second PCB (6), a second via hole (7), a second copper exposure area (8), a third copper exposure area (9) and a metal structural part (10); the first PCB (2) is a core board of the system; the chip (1) is arranged on the TOP surface of the first PCB (2); the first via hole (3) is a ground via hole set which is formed in a chip area on the first PCB (2); the first copper exposure area (4) is formed by window copper exposure under a BOTTOM surface chip of the first PCB (2); the second PCB (6) is an interface board of the system; the second via hole (7) is a ground via hole set punched on the second PCB (6); the second copper exposing area (8) is used for carrying out copper exposing on a TOP surface of the second PCB (6) in a windowing way; and the third copper exposing area (9) is used for carrying out copper exposing on the BOTTOM surface of the second PCB (6).

Furthermore, the first through hole (3) is arranged right below the main chip and used for conducting heat generated by the main chip; a first copper-exposed area (4) is arranged on the BOTTOM surface of the first PCB (2) and covers the first through hole (3); the second copper exposing area (8) is arranged at the position, corresponding to the first copper exposing area (4), of the TOP surface of the second PCB (6); the third copper exposing area (9) is arranged at the position, corresponding to the second copper exposing area (8), of the BOTTOM surface of the second PCB (6) and is connected through the second through hole (7).

Furthermore, one section of the heat-conducting silica gel sheet (5) is attached to the first copper exposing area (4), and the other end of the heat-conducting silica gel sheet is attached to the second copper exposing area (8), so that the heat of the first PCB (2) is conducted to the second PCB (6).

Furthermore, the metal structural part (10) is tightly attached to the third copper exposing area (9) and dissipates the heat of the first PCB (2) through the metal structural part (10).

Further, the metal structural part (10) is a metal block or a metal shell.

Furthermore, radiator unit still includes reference column (11), reference column (11) are a plurality of, the one end of reference column (11) is connected first PCB board (2), and the other end is connected second PCB board (6).

The utility model discloses a radiator unit of small-size stromatolite PCB board can the effectual heat dissipation problem of solving the small-size stromatolite PCB board, even small-size product design also can effectual heat go out, avoids the system temperature rise to bring and produces property ability decline.

Drawings

Fig. 1 is an overall configuration diagram of a small-sized laminated PCB heat dissipation assembly;

fig. 2 is a flow chart of heat guiding of a heat sink assembly of a small-sized laminated PCB board.

Fig. 3 is an external view of a heat sink assembly of a small-sized laminated PCB board.

Fig. 4 is a PCB exploded view of a small laminated PCB heat sink assembly.

Description of the reference numerals

The chip comprises a chip 1, a chip 2, a first PCB, a first via hole 3, a first copper exposure area 4, a heat-conducting silica gel sheet 5, a second PCB 6, a second via hole 7, a second copper exposure area 8, a third copper exposure area 9, a metal structural part 10, a positioning column 11, a TOP surface 12 and a BOTTOM surface 13.

Detailed Description

The present invention will be further described with reference to the accompanying drawings so as to facilitate the understanding of the present invention by those skilled in the art.

As shown in fig. 1, a heat dissipating assembly of a small-sized laminated PCB board includes: the chip comprises a chip 1, a first PCB 2, a first via hole 3, a first copper exposure area 4, a heat-conducting silica gel sheet 5, a second PCB 6, a second via hole 7, a second copper exposure area 8, a third copper exposure area 9 and a metal structural part 10; the first PCB board 2 is a core board of the system; the chip 1 is arranged on the TOP surface of the first PCB board 2 and is a power chip such as an MCU, a DSP, an FPGA, a power supply and the like; the first via hole 3 is a ground via hole set punched in the chip area of the first PCB 2; the first copper exposing area 4 is formed by windowing and exposing copper under a BOTTOM surface chip of the first PCB 2; the second PCB 6 is an interface board of the system; the second via hole 7 is a ground via hole set formed on the second PCB 6; the second copper exposing area 8 is formed by windowing and exposing copper on the TOP surface of the second PCB 6; the third copper exposing area 9 exposes copper for the window opening of the BOTTOM surface of the second PCB 6. The heat-conducting silica gel sheet 5 is a heat-conducting medium material synthesized by taking silica gel as a base material, adding various auxiliary materials such as metal oxide and the like and adopting a special process; the metal structure 10 is a metal block or a metal housing. The positioning columns 11 are multiple, one end of each positioning column 11 is connected with the corresponding first PCB 2, and the other end of each positioning column 11 is connected with the corresponding second PCB 6. The number of the positioning posts 11 is plural, and the number of the positioning posts 11 is preferably 4 in this embodiment, and the 4 positioning posts are located at four corners of the first PCB 2 and the second PCB 6.

As shown in fig. 2 the utility model discloses a radiator unit heat direction flow chart, the heat that chip 1 during operation produced is conducted first dew copper district 4 by first via hole 3, passes to second dew copper district 8 through heat conduction silica gel piece 5, and second dew copper district 8 leads third dew copper district 9 through second via hole 7 again, conducts away by metallic structure 10 again, reaches radiating effect. In addition, the heat conducting silica gel sheet 5 is positioned between the first PCB 2 and the second PCB 6 and exposed in the air, so that the heat dissipation can be assisted, and the heat dissipation effect is further improved.

As shown in fig. 3 and 4, in the heat dissipation assembly of the small-sized laminated PCB, a first via hole 7 is formed right below a main chip 1 to conduct heat generated by the main chip 1; the first copper exposing area 4 is arranged on a BOTTOM surface 13 of the first PCB 2, covers the first through hole 3 and is as large as possible in area; the second copper exposing area 8 is arranged at the position, corresponding to the first copper exposing area 4, of the TOP surface 12 of the second PCB 6; the third copper exposing area 9 is located at a position corresponding to the second copper exposing area 8 on the BOTTOM surface 13 of the second PCB 2, and is connected through the second via 7. One section of heat conduction silica gel piece 5 pastes in first dew copper district 4, and the other end pastes in second dew copper district 8, makes the heat of first PCB board 2 lead to second PCB board 6. The metal structure 10 is tightly attached to the third copper exposing area 9, and heat is dissipated through the metal structure 10.

The utility model discloses a radiator unit of small-size stromatolite PCB board to small-size stromatolite PCB board, adopts heat transfer assembly to constitute heat dissipation channel, can effectual solution system's heat dissipation problem, even small-size product design also can effectual heat be scattered away, avoids system's temperature rise to bring and produces property ability decline.

The foregoing is merely a preferred embodiment of the invention and is not intended to limit the invention in any way. Although the present invention has been described with reference to the preferred embodiments, it is not intended to be limited thereto. The technical solution of the present invention can be used by anyone skilled in the art to make many possible variations and modifications, or to modify equivalent embodiments, without departing from the scope of the technical solution of the present invention, using the technical content disclosed above. Therefore, any simple modification, equivalent change and modification made to the above embodiments by the technical entity of the present invention should fall within the protection scope of the technical solution of the present invention.

Claims

1. A heat dissipation assembly for a small laminated PCB board, comprising: the chip comprises a chip (1), a first PCB (printed circuit board) (2), a first via hole (3), a first copper exposure area (4), a heat-conducting silicon sheet (5), a second PCB (6), a second via hole (7), a second copper exposure area (8), a third copper exposure area (9) and a metal structural part (10); the first PCB (2) is a core board of the system; the chip (1) is arranged on the TOP surface of the first PCB (2); the first via hole (3) is a ground via hole set which is formed in a chip area on the first PCB (2); the first copper exposure area (4) is formed by window copper exposure under a BOTTOM surface chip of the first PCB (2); the second PCB (6) is an interface board of the system; the second via hole (7) is a ground via hole set punched on the second PCB (6); the second copper exposing area (8) is used for carrying out copper exposing on a TOP surface of the second PCB (6) in a windowing way; and the third copper exposing area (9) is used for carrying out copper exposing on the BOTTOM surface of the second PCB (6).

2. The heat dissipating assembly of a small laminated PCB as claimed in claim 1, wherein the first via hole (3) is opened right under the main chip for conducting heat generated from the main chip; a first copper-exposed area (4) is arranged on the BOTTOM surface of the first PCB (2) and covers the first through hole (3); the second copper exposing area (8) is arranged at the position, corresponding to the first copper exposing area (4), of the TOP surface of the second PCB (6); the third copper exposing area (9) is arranged at the position, corresponding to the second copper exposing area (8), of the BOTTOM surface of the second PCB (6) and is connected through the second through hole (7).

3. The heat dissipation assembly of a small laminated PCB board according to claim 1, wherein one section of the heat conductive silicone sheet (5) is attached to the first exposed copper area (4), and the other end is attached to the second exposed copper area (8), so that the heat of the first PCB board (2) is conducted to the second PCB board (6).

4. The heat sink assembly of a small laminated PCB board as claimed in claim 3, wherein the metal structure (10) is closely attached to the third exposed copper area (9) and dissipates heat of the first PCB board (2) through the metal structure (10).

5. The heat sink assembly of a small laminated PCB board according to claim 1, wherein the metal structure (10) is a metal block or a metal housing.

6. The heat dissipation assembly of small laminated PCB board as claimed in claim 1, further comprising a plurality of positioning pillars (11), wherein one end of the positioning pillars (11) is connected to the first PCB board (2), and the other end is connected to the second PCB board (6).