CN216146505U - Circuit structure and electronic equipment - Google Patents
Circuit structure and electronic equipment Download PDFInfo
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- CN216146505U CN216146505U CN202121659521.XU CN202121659521U CN216146505U CN 216146505 U CN216146505 U CN 216146505U CN 202121659521 U CN202121659521 U CN 202121659521U CN 216146505 U CN216146505 U CN 216146505U
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- circuit board
- heat sink
- circuit structure
- circuit
- copper foil
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Abstract
The utility model discloses a circuit structure and an electronic device, wherein the circuit structure comprises: the circuit board is provided with a copper foil grounding end; the at least two connecting bonding pads are symmetrically arranged on the copper foil grounding end; the radiating fin is positioned on the surface of the circuit board and communicated with the at least two connecting bonding pads, and the radiating fin is connected with a copper foil grounding end on the circuit board through the connecting bonding pads, so that the radiating fin is prevented from becoming a radiating antenna, and meanwhile, a good radiation interference shielding effect is achieved; the circuit structure in the embodiment of the utility model utilizes the original radiating fins to perform the radiation shielding function, and reduces the radiation interference under the condition of not increasing the circuit cost.
Description
Technical Field
The present invention relates to the field of TV power supply technologies, and in particular, to a circuit structure and an electronic device.
Background
With the rapid development of science and technology, the updating and upgrading process of a TV (television) product is faster and faster, and the size of a TV power supply needs to be made smaller and thinner, and the TV power supply needs to be suitable for the space change of a television rear shell. This means that TV power supplies with different output parameters, different power, and diversified circuit boards face unpredictable radiation interference challenges.
In order to face the challenge of radiation interference, the radiation interference is reduced mainly by optimizing circuit wiring, matching a common-mode inductor and an X capacitor at a power input end, adding a Y capacitor to the ground, and taking measures such as a transformer magnetic core cladding copper sheet. However, these measures cannot be fully effective for different TV power supplies, and it is necessary to continuously and complexly adjust inductance and capacitance parameters, try different inductance and capacitance combinations to solve the problem of radiation interference, and these conventional measures undoubtedly increase the cost of raw materials.
Thus, the prior art has yet to be improved and enhanced.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned shortcomings in the prior art, an object of the present invention is to provide a circuit structure and an electronic device, which are used to solve the problem of high cost in the prior art when solving the radiated interference.
In order to achieve the purpose, the utility model adopts the following technical scheme:
an embodiment of the present invention provides a circuit structure, including:
the circuit board is provided with a copper foil grounding end;
the at least two connecting bonding pads are symmetrically arranged on the copper foil grounding end;
and the radiating fin is positioned on the surface of the circuit board and communicated with the at least two connecting welding pads.
Further, in the circuit structure, the circuit structure further includes:
the field effect tube is arranged on the other surface of the circuit board, which is far away from the radiating fin;
wherein, the circuit board is provided with heat dissipation holes in a run-through manner, and the heat dissipation holes are positioned between the heat dissipation fins and the field effect transistors.
Further, in the circuit structure, the position of the field effect tube on the side of the circuit board facing away from the heat sink corresponds to the position of the heat sink on the surface of the circuit board.
Furthermore, in the circuit structure, the heat sink is made of aluminum.
Furthermore, in the circuit structure, a connection column is arranged on the surface of the radiating fin facing the circuit board, and the connection column is connected with the connection pad.
Further, in the circuit structure, the heat sink is rectangular.
Furthermore, in the circuit structure, the surface of the radiating fin, which is far away from the circuit board, is in a wave shape.
Furthermore, in the circuit structure, an insulating layer is arranged on the surface of the radiating fin facing the circuit board.
Further, in the circuit structure, the connecting columns are symmetrically distributed along the length direction of the surface of the heat sink facing the circuit board.
The embodiment of the utility model also provides electronic equipment which comprises the circuit structure.
The technical scheme adopted by the utility model has the following beneficial effects:
the radiating fin is connected with the copper foil grounding end on the circuit board through the connecting bonding pad, so that the radiating fin is prevented from becoming a radiating antenna, and meanwhile, a good radiation interference shielding effect is achieved; the circuit structure in the embodiment of the utility model utilizes the original radiating fins to perform the radiation shielding function, and reduces the radiation interference under the condition of not increasing the circuit cost.
Drawings
Fig. 1 is a schematic structural diagram of a circuit structure according to the present invention;
FIG. 2 is an enlarged view of a portion of FIG. 1 at A;
FIG. 3 is a schematic diagram of a heat sink in a circuit structure according to the present invention;
fig. 4 is a schematic structural diagram of an electronic device provided in the present invention.
In the figure: 100. a circuit board; 200. a connection pad; 300. a heat sink; 110. a copper foil grounding end; 400. a field effect transistor; 101. heat dissipation holes; 310. connecting columns; 10 housing.
Detailed Description
In order to make the objects, technical solutions and effects of the present invention clearer and clearer, the present invention is further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
In the embodiments and claims, the terms "a" and "an" can mean "one or more" unless the article is specifically limited.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
At present, radiation interference is reduced mainly by means of a large number of safety devices, cost is high, and debugging is difficult.
Based on this, the present application intends to provide a solution to the above technical problem, the details of which will be explained in the following embodiments.
The present invention discloses a specific preferred embodiment of a circuit structure, referring to fig. 1 to 3, the circuit structure includes: a circuit board 100, at least two connection pads 200, and a heat sink 300; specifically, the Circuit Board 100 may be a common PCB (Printed Circuit Board), the specific type of the Circuit Board is not limited in the present invention, the Circuit Board 100 is provided with a copper foil grounding terminal 110, the copper foil grounding terminal 110 is used for grounding the Circuit Board 100, the at least two connection pads 200 are symmetrically disposed on the copper foil grounding terminal 110, and the heat sink 300 is used for dissipating heat of each component on the Circuit Board 100, is located on the surface of the Circuit Board 100, and is connected to the at least two connection pads 200. It should be understood that other components in the prior art, such as a control chip (not shown), etc., are naturally disposed on the circuit board 100, and will not be further described herein.
In the embodiment of the present invention, a rectangular heat sink 300 may be used, and the size of the heat sink 300 is: length 170MM, width 67MM, thickness 3 MM; of course, the shape of the heat sink 300 is only illustrated, and may be adapted to a specific use case, and the ultra-thin heat sink 300 is connected to the copper foil ground 110 of the circuit board 100, which not only prevents the heat sink 300 from becoming a radiation antenna, but also has a good radiation interference shielding effect. And the ultra-thin volume of the heat sink 300 can be designed for ultra-thin power supply. Compared with the debugging of the safety device at the input end of the power supply to weaken radiation, the utility model utilizes the radiating fin 300 of the power supply to perform the radiation shielding function, which is equivalent to reducing radiation interference under the condition of not adding cost and does not additionally increase the area of the circuit board 100.
As a further solution, referring to fig. 1 and fig. 2, the circuit structure further includes: a field effect transistor 400(MOS transistor), the field effect transistor 400 being disposed on a side of the circuit board 100 facing away from the heat sink 300; wherein, the circuit board 100 is provided with a heat dissipation hole 101, and the heat dissipation hole 101 is located between the heat sink 300 and the fet 400; that is to say, the fet 400 and the heat sink 300 are located on different surfaces of the circuit board 100, and are arranged oppositely, the fet 400 belongs to a device with higher temperature rise, and the temperature itself is higher, and the heat of the fet 400 can be conducted to the heat sink 300 through the heat dissipation hole 101 formed on the circuit board 100, thereby facilitating heat dissipation; so that the heat sink 300 also has a good heat dissipation effect when shielding radiation.
Wherein, the position of the fet 400 on the side of the circuit board 100 facing away from the heat sink 300 corresponds to the position of the heat sink 300 on the surface of the circuit board 100; for example, the heat sink 300 is disposed in the middle area of the front surface of the circuit board 100, and the corresponding fet 400 is disposed in the middle area of the back surface of the circuit board 100, so that the heat dissipated by the fet 400 is absorbed by the heat sink 300, thereby ensuring the normal operation of the fet 400.
Referring to fig. 3, as a further embodiment, the heat sink 300 is made of aluminum, which has good thermal conductivity, low density and is not easy to oxidize, and copper with better heat dissipation effect may be selected in practical use, which is not limited in the present invention. The surface of the heat sink 300 facing the circuit board 100 is provided with a connecting column 310, the connecting column 310 is connected with the connecting pad 200, and the heat sink 300 is supported by the connecting column 310, so that a certain gap is formed between the circuit board 100 and the heat sink 300, and heat is prevented from flowing back to the circuit board 100 due to direct contact between the heat sink 300 and the circuit board 100.
Optionally, the connection posts 310 are symmetrically distributed along the length direction of the surface of the heat sink 300 facing the circuit board 100, for example, the number of the connection posts 310 is two, and the two connection posts 310 are located in the middle of the heat sink 300 and symmetrically arranged along the length direction of the heat sink 300, so that the connection posts 310 can keep balance while supporting the heat sink 300, and the heat sink 300 is prevented from tilting after the connection posts 310 are connected with the connection pads 200.
In one implementation, the surface of the heat sink 300 facing away from the circuit board 100 is wavy, and the surface of the heat sink 300 is wavy, so that the heat dissipation surface of the heat sink 300 is increased, the contact area between the heat sink 300 and air is increased, heat is exchanged with air more quickly, and a better heat dissipation effect is achieved.
In another implementation, an insulating layer (not shown) is disposed on a surface of the heat sink 300 facing the circuit board 100, and the thickness of the insulating layer is 1mm, so that the heat sink 300 is prevented from being conducted with the circuit board 100 through the insulating layer. Ensuring proper operation of the circuit board 100.
The working principle of the circuit structure in the present invention is described in detail below with reference to specific usage scenarios:
by connecting the ultra-thin heat sink 300 to the copper foil ground terminal 110 of the circuit board 100, the heat sink 300 is prevented from becoming a radiation antenna, and a good radiation interference shielding effect is achieved. The heat of the field effect transistor 400 can be conducted to the heat sink 300 through the heat dissipation hole 101 formed in the circuit board 100, so that heat dissipation is facilitated; so that the heat sink 300 also has a good heat dissipation effect when shielding radiation.
Example two:
referring to fig. 4, the present invention further discloses an electronic device, which includes the above circuit structure, and optionally, the electronic device is a television, and the television includes a housing 10 and a circuit structure disposed in the housing 10. It should be understood that the electronic device may also include other existing structures, which are not described in detail herein.
In summary, the present invention provides a circuit structure and an electronic device, wherein the circuit structure includes: the circuit board is provided with a copper foil grounding end; the at least two connecting bonding pads are symmetrically arranged on the copper foil grounding end; the radiating fin is positioned on the surface of the circuit board and communicated with the at least two connecting bonding pads, and the radiating fin is connected with the copper foil grounding end on the circuit board through the connecting bonding pads, so that the radiating fin is prevented from becoming a radiating antenna, and meanwhile, a good radiation interference shielding effect is achieved; the circuit structure in the embodiment of the utility model utilizes the original radiating fins to perform the radiation shielding function, and reduces the radiation interference under the condition of not increasing the circuit cost.
Other embodiments of the utility model will be apparent to those skilled in the art from consideration of the specification and practice of the utility model disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the utility model following, in general, the principles of the utility model and including such departures from the present disclosure as come within known or customary practice within the art to which the utility model pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the utility model being indicated by the following claims.
Claims (10)
1. A circuit structure, comprising:
the circuit board is provided with a copper foil grounding end;
the at least two connecting bonding pads are symmetrically arranged on the copper foil grounding end;
and the radiating fin is positioned on the surface of the circuit board and communicated with the at least two connecting welding pads.
2. The circuit structure of claim 1, further comprising:
the field effect tube is arranged on the other surface of the circuit board, which is far away from the radiating fin;
wherein, the circuit board is provided with heat dissipation holes in a run-through manner, and the heat dissipation holes are positioned between the heat dissipation fins and the field effect transistors.
3. The circuit structure of claim 2, wherein the fet is located on a side of the circuit board facing away from the heat sink at a position corresponding to a position of the heat sink on a surface of the circuit board.
4. The circuit structure of claim 1, wherein the heat sink is made of aluminum.
5. The circuit structure of claim 4, wherein an insulating layer is provided on a surface of the heat sink facing the circuit board.
6. The circuit structure of claim 1, wherein a surface of the heat sink facing the circuit board is provided with connection posts, the connection posts being connected with the connection pads.
7. The circuit structure of claim 6, wherein the connection posts are symmetrically distributed along a length of a surface of the heat sink facing the circuit board.
8. The circuit structure of claim 1, wherein the heat sink is rectangular.
9. The circuit structure of claim 1, wherein a surface of the heat sink facing away from the circuit board is undulating.
10. An electronic device, characterized in that it comprises a circuit arrangement according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121659521.XU CN216146505U (en) | 2021-07-20 | 2021-07-20 | Circuit structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121659521.XU CN216146505U (en) | 2021-07-20 | 2021-07-20 | Circuit structure and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216146505U true CN216146505U (en) | 2022-03-29 |
Family
ID=80803640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121659521.XU Active CN216146505U (en) | 2021-07-20 | 2021-07-20 | Circuit structure and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216146505U (en) |
-
2021
- 2021-07-20 CN CN202121659521.XU patent/CN216146505U/en active Active
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