CN219536381U - Outdoor power supply circuit board and outdoor power supply device - Google Patents
Outdoor power supply circuit board and outdoor power supply device Download PDFInfo
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- CN219536381U CN219536381U CN202223205244.2U CN202223205244U CN219536381U CN 219536381 U CN219536381 U CN 219536381U CN 202223205244 U CN202223205244 U CN 202223205244U CN 219536381 U CN219536381 U CN 219536381U
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- circuit board
- power supply
- outdoor power
- pcb
- heat sink
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Abstract
The utility model discloses an outdoor power supply circuit board and an outdoor power supply device, wherein the outdoor power supply circuit board comprises: the PCB is provided with a bonding pad and a copper-clad layer, and the copper-clad layer is at least partially exposed on the PCB; the power device is arranged on a bonding pad of the PCB; and the radiating fin is arranged on the copper-clad layer exposed on the PCB and is attached to the power device. The technical scheme of the utility model aims to improve the heat dissipation effect of the outdoor power supply circuit board.
Description
Technical Field
The utility model relates to the field of outdoor power supply devices, in particular to an outdoor power supply circuit board and an outdoor power supply device.
Background
When the outdoor power supply device works, the power device can generate heat, and the working state of the outdoor power supply device can be influenced when the temperature of the power device is too high, so that the power device is usually radiated by adopting radiating fins, the existing radiating fins are mostly directly welded on a circuit board, only the device is radiated, and no radiating effect is generated on the circuit board.
Disclosure of Invention
The utility model mainly aims to provide an outdoor power supply circuit board and an outdoor power supply device, and aims to improve the heat dissipation effect of the outdoor power supply circuit board.
In order to achieve the above object, the present utility model provides an outdoor power circuit board, comprising:
the PCB is provided with a bonding pad and a copper-clad layer, and the copper-clad layer is at least partially exposed on the PCB;
the power device is arranged on the bonding pad of the PCB;
and the radiating fin is arranged on the copper-clad layer exposed on the PCB and is attached to the power device.
Optionally, the heat sink has at least two fixing pins, and the fixing pins of the heat sink are fixed on the copper-clad layer exposed on the PCB.
Optionally, the outdoor power circuit board is provided with a plurality of power devices, the number of the radiating fins is plural, and each radiating fin is arranged corresponding to one power device;
or the number of the radiating fins is one, and the power devices are respectively attached to the radiating fins.
Optionally, the power device is composed of one or more of a switch tube, an inductor, a transformer and a power tube.
Optionally, the heat sink is in the shape of one or more of a plug, a fin, and a fin.
Optionally, the heat sink is made of one of silver, copper, aluminum and steel.
The utility model also provides an outdoor power supply device which comprises the outdoor power supply circuit board.
Optionally, the outdoor power supply device further includes:
the outdoor power supply circuit board is arranged in the accommodating cavity formed by the shell.
According to the technical scheme, the outdoor power supply circuit board is formed by the PCB, the power device and the radiating fins, wherein a bonding pad and a copper-clad layer are arranged on the PCB, and the copper-clad layer is at least partially exposed on the PCB; the power device is arranged on a bonding pad of the PCB; the radiating fin is arranged on the copper-clad layer exposed on the PCB and is attached to the power device; therefore, the radiating fin can radiate heat of the PCB while radiating heat of the power device, and the grounding area is increased. The utility model aims to increase the heat dissipation effect of an outdoor power supply circuit board.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a functional module of an embodiment of an outdoor power board according to the present utility model;
fig. 2 is a schematic functional block diagram of another embodiment of an outdoor power circuit board according to the present utility model.
Reference numerals illustrate:
| reference numerals | Name of the name | Reference numerals | Name of the name |
| 10 | Power device | 30 | PCB (printed circuit board) |
| 20 | Heat sink |
The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present utility model, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present utility model, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.
When the outdoor power supply device works, the power device can generate heat, and the working state of the outdoor power supply device can be influenced when the temperature of the power device is too high, so that the power device is usually radiated by adopting radiating fins, the existing radiating fins are mostly directly welded on a circuit board, only the device is radiated, and no radiating effect is generated on the circuit board.
The utility model provides an outdoor power supply circuit board.
Referring to fig. 1, in an embodiment of the present utility model, the outdoor power circuit board includes:
the PCB 30 is provided with a bonding pad and a copper-clad layer, and the copper-clad layer is at least partially exposed on the PCB 30;
a power device 10, wherein the power device 10 is arranged on a bonding pad of the PCB 30;
and the radiating fins 20 are arranged on the copper-clad layer exposed out of the PCB 30 and are attached to the power device 10.
In this embodiment, the PCB board 30 is also called an ultra-thin circuit board, a printed (copper etching technique) circuit board, etc.; the heat sink 20 in the present solution may be a device for dissipating heat of a power device 10, which is an element that is easy to generate heat on an outdoor power circuit board, and the power device 10 may be a device such as a switching tube, an inductor, a transformer, etc.; the heat sink 20 is made of aluminum alloy, brass or bronze into a plate shape, a sheet shape, a multi-sheet shape and the like, and different shapes can be suitable for different outdoor power supply circuit board designs; the heat sink 20 may be coated with a layer of thermally conductive silicone on the surface of the power device 10 in contact with the heat sink 20 during use, so that heat from the power device 10 is more effectively transferred to the heat sink 20 and dissipated to the ambient air via the heat sink 20.
The bonding pad of the PCB board 30 may be used to bond and fix the power devices 10 with different functions, after the pins of the power devices 10 are fixedly bonded on the bonding pad, the heat sink 20 with a corresponding shape may be selected or designed according to the shape of the power devices 10 after being fixed, so that the heat sink 20 may be attached to the power devices 10, thereby improving the heat dissipation effect of the heat sink 20 on the power devices 10, for example, the power devices 10 may be cylindrical, the circular arc heat sink 20 may be selected, the power devices 10 may be rectangular, the sheet heat sink 20 may be selected, and if the power devices 10 are irregular, the heat sink 20 with a corresponding shape may be customized; the copper-clad layer can reduce the impedance of the ground wire, improve the anti-interference capability, reduce the voltage drop, improve the power efficiency, and is connected with the ground wire to reduce the loop area; when the power device 10 on the bonding pad of the PCB 30 works, higher heat is generated due to the passing of current, so that the temperature of the power device 10 is increased, and when the temperature is too high, the working state of the power device is influenced, the temperature of surrounding devices is increased, and the temperature of the power device 10 is increased due to the fact that the power device 10 is arranged on the bonding pad on the PCB 30, and the temperature of the PCB 30 is increased; in the scheme, the radiating fins 20 are tightly attached to the power device 10 to radiate heat of the power device 10, and the area of the PCB 30 corresponding to the radiating fins 20 is windowed, namely, a solder mask layer is removed, so that the copper-clad layer is partially exposed on the PCB 30, and the material of the solder mask layer can be realized through a liquid wet process or a dry film lamination; after windowing the area where the cooling fin 20 is arranged, the cooling fin 20 can be directly welded and fixed on the copper-clad layer so as to dissipate heat of the PCB 30 and further increase the grounding area.
According to the technical scheme, an outdoor power supply circuit board is formed by a PCB (printed circuit board) 30, a power device 10 and a radiating fin 20, wherein a bonding pad and a copper-clad layer are arranged on the PCB 30, and the copper-clad layer is at least partially exposed on the PCB 30; the power device 10 is arranged on a bonding pad of the PCB 30; the heat sink 20 is disposed on the copper-clad layer exposed on the PCB 30 and is attached to the power device 10; the heat sink 20 can radiate heat to the PCB 30 and increase the grounding area while radiating heat to the power device 10. The utility model aims to increase the heat dissipation effect of an outdoor power supply circuit board.
In an embodiment, the heat sink 20 has at least two fixing pins, and the fixing pins of the heat sink 20 are fixed on the copper-clad layer exposed on the PCB 30.
In this embodiment, the heat sink 20 may be fixedly welded on the copper-clad layer exposed on the PCB 30 through at least two fixing pins, because the heat sink 20 with different shapes may have different numbers of fixing pins, for example, three or more fixing pins may be disposed on the heat sink 20 with a larger area, so as to ensure that the heat sink 20 can be stably fixed on the PCB 30, and avoid that the heat sink 20 is loose and falls off to cause that the power device 10 cannot be cooled, thereby affecting the normal operation of the power device 10 on the whole PCB 30, so that the fixing pins of the heat sink 20 may be disposed according to specific conditions, and the shapes of the fixing pins may also be designed correspondingly according to the distribution design of the specific power device 10 of the PCB 30, so that the heat sink 20 can be fixed on the PCB 30. In this embodiment, the heat sink 20 can be fixed on the copper-clad layer exposed on the PCB 30 by at least two fixing pins of the heat sink 20.
Referring to fig. 1 to 2, in an embodiment, the outdoor power circuit board has a plurality of power devices 10 thereon, and the number of the heat sinks 20 is plural, and each heat sink 20 is disposed corresponding to one power device 10;
alternatively, the number of the heat sinks 20 may be one, and the plurality of the power devices 10 may be attached to the heat sinks 20.
In this embodiment, since the PCB board 30 has the power devices 10 with different functions, the heat dissipation fins 20 are required to be arranged for dissipating heat for the power devices 10 with higher heat dissipation in operation, so that a plurality of heat dissipation fins 20 are required to be arranged, each power device 10 with higher heat dissipation usually corresponds to one heat dissipation fin 20 for dissipating heat, and the heat dissipation fins 20 or the heat dissipation fins 20 can be not arranged for the power devices 10 with lower heat dissipation, and the heat dissipation fins can be arranged according to specific situations; when the power device 10 is smaller and the heat sink 20 is larger, one heat sink 20 can be attached to the plurality of power devices 10, and the plurality of power devices 10 can be cooled by the one heat sink 20; or in the case of larger power device 10, the heat dissipation may be slower with one heat sink 20, so that the heat dissipation effect is worse, and two or more heat sinks 20 may be disposed for larger power device 10, or heat dissipation may be performed by using heat sinks 20 with larger area, so as to increase the heat dissipation speed. The present embodiment provides a plurality of heat dissipation fins 20 to dissipate heat from a plurality of power devices 10 on an outdoor power circuit board.
In one embodiment, the power device 10 is composed of one or more of a switching tube, an inductor, a transformer, and a power tube.
In this embodiment, the power device 10 may be one or more of a switching tube, an inductor, a transformer and a power tube, or other devices that can emit higher heat during working, such as an inverter, etc., so that the overall temperature of the circuit board can be effectively reduced by radiating the power device 10 with higher heat, so that the outdoor power supply device can work normally.
In one embodiment, the heat sink 20 is in the shape of one or more of a paddle, a fin, and a fin.
In this embodiment, the inserted fin 20 is made of an alloy material like a paper sheet and is inserted on a flat base, and the inserted fin 20 is mostly used on various mechanical circuit boards, and the production process of the inserted fin 20 of the flat base is relatively simple and the cost is lower. The fin type heat sink 20 has various shapes of bases including circular arc, solid circle, hollow circle, solid square or other shapes, and is thus more costly in terms of design, production and the like, and is generally used in places where heat dissipation is required. The fin type heat sink 20 comprises a main body and a plurality of heat dissipation fins arranged around the main body, wherein the heat dissipation fins can encircle the main body in a circular shape, the fin type heat sink 20 is lighter to manufacture, the heat dissipation surface area is increased, the heat effect is good, and the manufacturing cost is higher. The specific shape of the heat sink 20 may be selected according to the actual situation and the needs of the user.
In one embodiment, the heat sink 20 is made of one of silver, copper, aluminum and steel.
In this embodiment, the material of the heat sink 20 may be made of metal materials such as silver, copper, aluminum, iron, and steel, and the metal materials have good thermal conductivity, so that the heat generated by the power device 10 on the PCB 30 during operation can be absorbed and then dissipated into the surrounding environment; copper is cheaper than silver, and is more suitable for mass production; iron is cheaper than copper, but has no better thermal conductivity, so that considering the common user comprehensively, copper can be used as the material of the heat sink 20, and users with special requirements can use silver or iron as the material of the heat sink 20, and can also use other metal materials or alloys. The heat sink 20 is made of one of silver, copper, aluminum and steel in this embodiment, so that heat generated when the power device 10 on the PCB 30 works can be better dissipated to the surrounding environment.
The utility model also provides an outdoor power supply device which comprises the outdoor power supply circuit board. The outdoor power supply device adopts all the technical schemes of all the embodiments, so that the outdoor power supply device has at least all the beneficial effects brought by the technical schemes of the embodiments, and the detailed description is omitted.
In an embodiment, the outdoor power supply apparatus further includes:
the outdoor power supply circuit board is arranged in the accommodating cavity formed by the shell.
In this embodiment, the housing may be used to fix the positional relationship of the outdoor power circuit board, so as to ensure the safety and stability of the interior of the accommodating cavity formed by the housing of the outdoor power device, and when the outdoor power device works, the positional relationship of the outdoor power circuit board will not change, and external air or objects will not fall on the outdoor power circuit board, so as to affect the work of the power device 10 on the circuit board; the shell also has a protective effect on the outside of the outdoor power supply device, and the shell mainly has a better bearing effect on external force by middle-plane stress evenly distributed along the thickness.
The foregoing description is only of the optional embodiments of the present utility model, and is not intended to limit the scope of the utility model, and all the equivalent structural changes made by the description of the present utility model and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the utility model.
Claims (8)
1. An outdoor power circuit board, comprising:
the PCB is provided with a bonding pad and a copper-clad layer, and the copper-clad layer is at least partially exposed on the PCB;
the power device is arranged on the bonding pad of the PCB;
and the radiating fin is arranged on the copper-clad layer exposed on the PCB and is attached to the power device.
2. The outdoor power circuit board of claim 1, wherein the heat sink has at least two fixing legs, and the fixing legs of the heat sink are fixed on the copper-clad layer exposed on the PCB.
3. The outdoor power supply circuit board of claim 1, wherein the outdoor power supply circuit board has a plurality of power devices thereon, the number of heat sinks is plural, and each heat sink is disposed corresponding to one of the power devices;
or the number of the radiating fins is one, and the power devices are respectively attached to the radiating fins.
4. The outdoor power circuit board of claim 1, wherein the power device is comprised of one or more of a switching tube, an inductor, a transformer, and a power tube.
5. The outdoor power circuit board of claim 1, wherein the heat sink is in the shape of one or more of a plug, a fin, and a fin.
6. The outdoor power circuit board of claim 1, wherein the heat sink is one of silver, copper, aluminum, and steel.
7. An outdoor power supply unit comprising an outdoor power supply circuit board according to any one of claims 1-6.
8. The outdoor power supply apparatus of claim 7, further comprising:
the outdoor power supply circuit board is arranged in the accommodating cavity formed by the shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223205244.2U CN219536381U (en) | 2022-11-30 | 2022-11-30 | Outdoor power supply circuit board and outdoor power supply device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223205244.2U CN219536381U (en) | 2022-11-30 | 2022-11-30 | Outdoor power supply circuit board and outdoor power supply device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219536381U true CN219536381U (en) | 2023-08-15 |
Family
ID=87626193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223205244.2U Active CN219536381U (en) | 2022-11-30 | 2022-11-30 | Outdoor power supply circuit board and outdoor power supply device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219536381U (en) |
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2022
- 2022-11-30 CN CN202223205244.2U patent/CN219536381U/en active Active
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