CN215499734U - Electronic component and household appliance - Google Patents
Electronic component and household appliance Download PDFInfo
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- CN215499734U CN215499734U CN202122074263.5U CN202122074263U CN215499734U CN 215499734 U CN215499734 U CN 215499734U CN 202122074263 U CN202122074263 U CN 202122074263U CN 215499734 U CN215499734 U CN 215499734U
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Abstract
The utility model discloses an electronic component and a household appliance, wherein the electronic component comprises a circuit board, an electronic device and a heat dissipation piece, a heat conduction medium layer is arranged on one side of the circuit board, the electronic device is arranged on the circuit board and is in heat conduction with the heat conduction medium layer, and the heat dissipation piece is arranged adjacent to the electronic device and is welded with the heat conduction medium layer. The heat conducting medium layer absorbs heat generated by the circuit board and the electronic device so as to achieve a certain cooling effect, and the heat radiating piece is connected with the heat conducting medium layer so as to radiate the heat absorbed by the heat conducting medium layer, so that the heat conducting medium layer can continuously absorb heat. The heat dissipation member is also disposed adjacent to the electronic device, so that the heat dissipation member itself can absorb part of the heat of the electronic device, thereby further enhancing the heat dissipation capability of the electronic component.
Description
Technical Field
The utility model relates to the technical field of household appliances, in particular to an electronic component and a household appliance.
Background
When the household appliance is used, the use effect of the household appliance is poor due to the overhigh temperature of the electronic device, and even the household appliance is burnt out. Therefore, heat dissipation is very important for electronic devices, and some electronic components in the household appliances are in small spaces, so that it is difficult to install a conventional heat sink to dissipate heat of the electronic devices, thereby causing difficulty in heat dissipation of the electronic devices.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide an electronic component, and aims to solve the problem that the traditional electronic component is difficult to dissipate heat when the space is small.
To achieve the above object, the present invention provides an electronic component, including:
the circuit board comprises a first side and a second side which are oppositely arranged, and a heat-conducting medium layer is arranged on the first side of the circuit board;
the electronic device is arranged on the first side of the circuit board and is in thermal conduction with the heat-conducting medium layer; and the number of the first and second groups,
and the heat dissipation piece is arranged close to the electronic device and welded with the heat conducting medium layer.
Optionally, the heat conducting medium layer includes a copper foil layer.
Optionally, the first side and the second side of the circuit board are both provided with the heat conducting medium layer;
the circuit board is provided with a through hole, and a heat conduction part for connecting the heat conduction medium layers on the first side and the second side of the circuit board is arranged in the through hole.
Optionally, the electronic device is connected with the heat-conducting medium layer arranged on the first side of the circuit board through welding; and/or the presence of a gas in the gas,
the electronic device comprises an MOS tube, a drain electrode of the MOS tube is connected with the heat-conducting medium layer arranged on the first side of the circuit board in a welding mode, and a grid electrode pin and a source electrode pin of the MOS tube extend towards the direction far away from the drain electrode and are directly welded with the circuit board; and/or the presence of a gas in the gas,
and the signal pin of the electronic device is welded with the circuit board through a surface mounting technology.
Optionally, the electronic device comprises a MOS transistor.
Optionally, the heat sink is provided with pins;
the heat conducting medium layer is provided with welding holes for the pins to be inserted and welded.
Optionally, the heat dissipation member includes a heat dissipation fin extending in a thickness direction of the circuit board, and one end of the heat dissipation fin adjacent to the circuit board is provided with pins.
Optionally, the heat dissipation member includes two first heat dissipation fins arranged at an interval and a second heat dissipation fin connected to the two first heat dissipation fins, and the two first heat dissipation fins and the second heat dissipation fin together enclose to form a mounting groove;
the electronic device comprises an MOS tube, the MOS tube is installed in the installation groove, the drain electrode of the MOS tube is arranged on one side close to the second radiating fin, and the grid pin and the source pin of the MOS tube extend towards the direction far away from the second radiating fin to extend out of the installation groove.
The utility model also proposes a household appliance comprising an electronic assembly comprising:
the circuit board comprises a first side and a second side which are oppositely arranged, and a heat-conducting medium layer is arranged on the first side of the circuit board;
the electronic device is arranged on the first side of the circuit board and is in thermal conduction with the heat-conducting medium layer; and the number of the first and second groups,
and the heat dissipation piece is arranged close to the electronic device and welded with the heat conducting medium layer.
Optionally, the household appliance is a television or a washing machine.
In the technical scheme of the utility model, the heat conducting medium layer is arranged on the first side of the circuit board to absorb heat generated by the circuit board and the electronic devices on the circuit board, so that a certain cooling effect is achieved. The heat dissipation piece is connected with the heat conducting medium layer, so that the heat dissipation piece can dissipate the heat absorbed by the heat conducting medium layer, and the heat conducting medium layer can continuously absorb the heat. The heat dissipation member is also disposed adjacent to the electronic device, so that the heat dissipation member itself can absorb part of the heat of the electronic device, thereby further enhancing the heat dissipation capability of the electronic component. The electronic component absorbs heat by laying the heat-conducting medium layer and is provided with the heat-radiating piece for radiating, so that the occupied space is small, and the radiating effect is obvious.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic side view of an electronic assembly according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a circuit board of the electronic assembly of FIG. 1;
fig. 3 is a schematic front view of a heat sink in the electronic assembly of fig. 1.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | |
10 | |
| 11 | Through |
12 | Heat conducting |
| 13 | |
20 | The |
| 21 | |
22 | Pin |
| 30 | MOS tube |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
When the household appliance is used, the use effect of the household appliance is poor due to the overhigh temperature of the electronic device, and even the household appliance is burnt out. Therefore, heat dissipation is very important for electronic devices, and some electronic components in the household appliances are in small spaces, so that it is difficult to install a conventional heat sink to dissipate heat of the electronic devices, thereby causing difficulty in heat dissipation of the electronic devices.
In view of this, the present invention provides a household appliance, which includes an electronic component, and as long as the household appliance having the electronic component belongs to the household appliance of the present invention, fig. 1 to 3 are an embodiment of the electronic component provided by the present invention.
Referring to fig. 1 to 2, an electronic device 100 includes: circuit board 10, electronics and heat sink. The circuit board 10 comprises a first side and a second side which are oppositely arranged, and a heat-conducting medium layer 12 is arranged on the first side of the circuit board 10; the electronic device is arranged on the first side of the circuit board 10 and is in thermal conduction with the heat-conducting medium layer 12; the heat sink is disposed adjacent to the electronic device and is welded to the layer of thermally conductive medium 12.
In the technical scheme of the utility model, the heat conducting medium layer 12 is arranged on the first side of the circuit board 10 to absorb heat generated by the circuit board 10 and the electronic devices on the circuit board 10, so that a certain cooling effect is achieved. The heat dissipation member is connected with the heat-conducting medium layer 12, so that the heat dissipation member can dissipate the heat absorbed by the heat-conducting medium layer 12, and the heat-conducting medium layer 12 can continuously absorb the heat. The heat dissipation member is also disposed adjacent to the electronic device, so that the heat dissipation member itself can absorb part of the heat of the electronic device, thereby further enhancing the heat dissipation capability of the electronic assembly 100. The electronic component 100 absorbs heat by laying the heat-conducting medium layer 12 and is provided with the heat dissipation piece for heat dissipation, so that the occupied space is small, and the heat dissipation effect is obvious.
Further, the heat-conducting medium layer 12 includes a copper foil layer.
In this embodiment, the heat-conducting medium layer 12 is specifically designed as a copper foil layer, and the copper foil layer has an excellent heat-conducting effect and can quickly absorb heat of the electronic device. As for the heat-conducting medium layer 12, the heat-conducting medium layer 12 may be an aluminum foil or a silver foil as long as it can absorb heat of the electronic device.
Further, referring to fig. 2, the heat conducting medium layer 12 is disposed on both the first side and the second side of the circuit board 10; the circuit board 10 is provided with a through hole 11, and a heat conduction part for connecting the heat conduction medium layers 12 on the first side and the second side of the circuit board 10 is arranged in the through hole 11.
In this embodiment, the heat-conducting medium layers 12 are disposed on both the first side and the second side of the circuit board 10, so that the heat-conducting medium layers 12 can absorb heat from both sides of the circuit board 10, and the speed of heat absorption by the heat-conducting medium layers 12 can be enhanced, so that the electronic device can be kept at a proper temperature. The circuit board 10 is provided with a through hole 11, and the heat conducting parts are arranged in the through hole 11 to connect the heat conducting medium layers 12 on the two sides of the circuit board 10, so that heat between the heat conducting medium layers 12 on the two sides can be mutually transferred, the heat conducting medium layer 12 on the first side of the circuit board 10 is connected with the heat radiating part, and then the heat conducting medium layers 12 on the two sides can timely radiate the heat, so that the heat radiating capacity of the electronic component 100 is improved.
Regarding the heat conducting portion, the heat conducting portion may be a copper rod or an aluminum rod, as long as the heat conducting portion can connect and conduct heat to the heat conducting medium layers 12 on both sides of the circuit board 10, and the specific structure is not limited herein, and in a specific application of the electronic assembly 100, the through hole 11 penetrates the heat conducting medium layers 12 on both sides of the circuit board 10 together, which can also perform a certain heat transfer function.
Further, referring to fig. 1, the electronic device is connected to the heat-conducting medium layer 12 disposed on the first side of the circuit board 10 by welding; and/or the electronic device comprises an MOS tube 30, a drain of the MOS tube 30 is connected with the heat-conducting medium layer 12 on the first side of the circuit board 10 by welding, and a gate pin and a source pin of the MOS tube 30 extend towards a direction away from the drain to be directly welded with the circuit board 10; and/or, the signal pins of the electronic device are soldered to the circuit board 10 by surface mount technology.
In this embodiment, soldering is the most common way of thermal conduction in electronic products, and soldering is not only simple in operation, but also has good thermal conduction effect, so that the electronic device is connected with the thermal conduction medium on the first side of the circuit board 10 by soldering. The heat conducting medium layer 12 is generally made of metal heat conducting material in circuit design to reduce resistance, so that only a one-way circuit is generally arranged in the area where the circuit board 10 is laid on the heat conducting medium layer 12, thereby preventing the heat conducting medium layer 12 from causing short circuit. The electronic device may be a MOS transistor 30, where the MOS transistor 30 has three pins, namely a drain, a gate and a source, and obviously, the three pins of the MOS transistor 30 cannot be all mounted on the heat-conducting medium layer 12, otherwise, a short circuit may be caused. Therefore, the drain of the MOS transistor 30 is directly soldered to the heat-conducting medium layer 12, so as to supply power to the MOS transistor 30, and at this time, the gate and the source of the MOS transistor 30 must extend out of the heat-conducting medium layer 12 to be connected to the circuit board 10, so as to avoid short-circuiting the MOS transistor 30. In fact, in order to avoid short circuit of the electronic device, the pins of the electronic device may all extend out of the heat-conducting medium layer 12, and the heat-generating portion of the electronic device may be close to the heat-conducting medium layer 12, so as to ensure normal use of the electronic device while performing heat dissipation.
Further, the electronic device comprises a MOS transistor 30. In this embodiment, the electronic component 100 is very suitable for being used as a part of a structure of a power switch in the household appliance in a specific application, and the MOS transistor 30 is a main heating element of the power switch, so the electronic device in the electronic component 100 is generally the MOS transistor 30. Of course, the electronic device may also be other components, such as a diode, a transistor, and other heating elements, that is, the electronic device may be properly adjusted according to the specific use environment.
Further, referring to fig. 1 to 3, the heat sink is provided with pins 22; the heat-conducting medium layer 12 is provided with soldering holes 13 into which the pins 22 are inserted and soldered.
In the present embodiment, welding is the most common way of thermal conduction in electronic products, the welding is not only simple, but also has good thermal conduction effect, the heat sink is inserted into the welding hole 13 through the pin 22 and welded, the connection is firm, and heat transfer can be better performed.
Further, referring to fig. 1 and 3, the heat sink includes a heat sink extending along a thickness direction of the circuit board 10, and one end of the heat sink adjacent to the circuit board 10 is provided with pins 22.
In the present embodiment, the heat sink has a smaller volume, so that the use of the heat sink as the heat sink can greatly save the occupied space of the electronic component 100, which is very suitable for the design purpose of the present invention. The heat sink extends in the thickness direction of the circuit board 10, so that the pins 22 of the heat sink facing the circuit board 10 can be connected to the heat-conducting medium layer 12 while the heat sink can be attached to the electronic device as much as possible. Therefore, the heat sink can directly absorb part of heat of the electronic device and can also dissipate the heat absorbed by the heat-conducting medium layer 12, and the space occupied by the heat sink is extremely small.
Further, the heat dissipation member comprises two first heat dissipation fins 20 arranged at intervals oppositely and a second heat dissipation fin 21 connected with the two first heat dissipation fins 20, and the two first heat dissipation fins 20 and the second heat dissipation fin 21 enclose together to form a mounting groove; the electronic device comprises an MOS tube 30, the MOS tube 30 is installed in the installation groove, a drain electrode of the MOS tube 30 is arranged on one side close to the second radiating fin 21, and a grid electrode pin and a source electrode pin of the MOS tube 30 extend towards the direction far away from the second radiating fin 21 to extend out of the installation groove.
In this embodiment, the electronic component 100 forms the mounting groove by enclosing the two first heat dissipation fins 20 and the second heat dissipation fins 21, so that three sides of the electronic device mounted in the mounting groove can be fully contacted with the heat dissipation fins, and the heat dissipation efficiency is increased. The heat dissipation member is connected to the heat conductive medium layer 12, and the heat conductive medium layer 12 is generally made of a metal material, so that both the first heat dissipation member 20 and the second heat dissipation member 21 can obtain a voltage from the heat conductive medium layer 12. The electronic device includes a MOS transistor 30, and a drain of the MOS transistor 30 as an input electrode may be mounted close to the second heat sink 21, so that the MOS transistor 30 may be directly connected to the heat-conducting medium layer 12, thereby obtaining the same voltage as that of the two first heat sinks 20 and the second heat sink 21, but in order to avoid a short circuit, the source and the gate of the MOS transistor 30 may no longer be connected to the heat-conducting medium layer 12. At this time, the source and the gate of the MOS transistor 30 are both in voltage difference with the heat sink, so that the MOS transistor 30 needs to be away from the heat sink to avoid sparking due to too close distance, and the drain of the MOS transistor 30 is the same as the voltage of the heat sink, so that sparking does not occur. Thus, in this embodiment, the gate pin and the source pin of the MOS transistor 30 extend toward the direction away from the second heat sink 21, so as to be away from the two first heat sinks 20 and the second heat sink 21, thereby ensuring the normal use of the electronic device while obtaining a better heat dissipation effect.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. An electronic assembly, comprising:
the circuit board comprises a first side and a second side which are oppositely arranged, and a heat-conducting medium layer is arranged on the first side of the circuit board;
the electronic device is arranged on the first side of the circuit board and is in thermal conduction with the heat-conducting medium layer; and the number of the first and second groups,
and the heat dissipation piece is arranged close to the electronic device and welded with the heat conducting medium layer.
2. The electronic assembly of claim 1, wherein the layer of heat-conducting medium comprises a layer of copper foil.
3. An electronic assembly according to claim 1 or 2, wherein both the first side and the second side of the circuit board are provided with the layer of heat conducting medium;
the circuit board is provided with a through hole, and a heat conduction part for connecting the heat conduction medium layers on the first side and the second side of the circuit board is arranged in the through hole.
4. The electronic assembly of claim 1, wherein the electronic device is connected to the layer of thermally conductive medium disposed on the first side of the circuit board by soldering; and/or the presence of a gas in the gas,
the electronic device comprises an MOS tube, a drain electrode of the MOS tube is connected with the heat-conducting medium layer arranged on the first side of the circuit board in a welding mode, and a grid electrode pin and a source electrode pin of the MOS tube extend towards the direction far away from the drain electrode and are directly welded with the circuit board; and/or the presence of a gas in the gas,
and the signal pin of the electronic device is welded with the circuit board through a surface mounting technology.
5. The electronic assembly of claim 1, wherein the electronic device comprises a MOS transistor.
6. An electronic assembly according to claim 1, wherein the heat sink is provided with pins;
the heat conducting medium layer is provided with welding holes for the pins to be inserted and welded.
7. An electronic assembly according to claim 6, wherein the heat sink comprises a heat sink extending in a thickness direction of the circuit board, the heat sink being provided with pins adjacent an end of the circuit board.
8. The electronic component of claim 7, wherein the heat dissipation member comprises two first heat dissipation fins arranged at intervals and a second heat dissipation fin connected with the two first heat dissipation fins, and the two first heat dissipation fins and the second heat dissipation fin jointly enclose to form a mounting groove;
the electronic device comprises an MOS tube, the MOS tube is installed in the installation groove, the drain electrode of the MOS tube is arranged on one side close to the second radiating fin, and the grid pin and the source pin of the MOS tube extend towards the direction far away from the second radiating fin to extend out of the installation groove.
9. An electric household appliance comprising an electronic assembly according to any one of claims 1 to 8.
10. The household appliance according to claim 9, wherein the household appliance is a television or a washing machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122074263.5U CN215499734U (en) | 2021-08-30 | 2021-08-30 | Electronic component and household appliance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122074263.5U CN215499734U (en) | 2021-08-30 | 2021-08-30 | Electronic component and household appliance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215499734U true CN215499734U (en) | 2022-01-11 |
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ID=79766190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122074263.5U Active CN215499734U (en) | 2021-08-30 | 2021-08-30 | Electronic component and household appliance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215499734U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115623670A (en) * | 2022-12-16 | 2023-01-17 | 深圳依源科技有限公司 | Heat dissipation device and power supply |
-
2021
- 2021-08-30 CN CN202122074263.5U patent/CN215499734U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115623670A (en) * | 2022-12-16 | 2023-01-17 | 深圳依源科技有限公司 | Heat dissipation device and power supply |
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