CN210247145U

CN210247145U - PCB board with embedded heat dissipation structure

Info

Publication number: CN210247145U
Application number: CN201920944062.6U
Authority: CN
Inventors: Qihui Xie; 谢齐辉; Han Ling; 凌翰; Fan Chen; 陈凡
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-06-21
Filing date: 2019-06-21
Publication date: 2020-04-03
Anticipated expiration: 2029-06-21

Abstract

The utility model discloses an embedded heat radiation structure's PCB board, which comprises a substrate, the base plate facing is equipped with the welding panel, the mounting groove has been seted up to the upper end of base plate, install the conducting strip in the mounting groove, the welding has a plurality of heat conduction silks, and is a plurality of on the conducting strip the heat conduction silk is connected with convection current heat dissipation mechanism jointly. The utility model discloses a first metal cooling tube and second metal cooling tube form the difference in temperature for the difference in temperature air forms the convection current, and the heating gives off with higher speed, the energy can be saved, and embedded body structure is more space-saving, is convenient for produce thinner electronic product.

Description

PCB board with embedded heat dissipation structure

Technical Field

The utility model relates to a waist holds in the palm the steel wire and examines the utensil field, especially relates to embedded heat radiation structure's PCB board.

Background

In the use process of the PCB, because electronic components can generate a large amount of heat, and the heat dissipation performance of the PCB substrate is poor, the temperature cannot be rapidly dissipated, and the work of the electronic components is influenced.

Most of the existing heat dissipation structures increase heat dissipation for increasing fan air cooling or water pump liquid cooling, but additional mechanisms need additional power supply, energy consumption is increased, the size is increased, the structure is not suitable for small electronic products, the existing embedded structure is mostly embedded into a heat dissipation sheet to increase heat dissipation area, but the independent use effect of the heat dissipation sheet is not obvious, and the heat dissipation sheet can not cover the whole PCB, so that the heat dissipation speed is slower.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing a PCB board with an embedded heat dissipation structure.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the PCB board with the embedded heat dissipation structure comprises a base plate, wherein a welding panel is attached to the base plate, a mounting groove is formed in the upper end of the base plate, a heat conducting sheet is mounted in the mounting groove, a plurality of heat conducting wires are welded to the heat conducting sheet, and the heat conducting wires are connected with a convection heat dissipation mechanism.

Preferably, the upper surface of the heat conducting sheet is coated with heat conducting silicone grease, the upper surface of the heat conducting silicone grease is completely contacted with the lower surface of the welding panel, and the heat conducting silicone grease with high heat conductivity coefficient can conduct heat emitted when electronic components on the welding panel run to the heat conducting sheet.

Preferably, the convection heat dissipation mechanism includes a plurality of radiating grooves arranged in the substrate, each radiating groove is internally provided with a first metal radiating pipe and a second metal radiating pipe, the first metal radiating pipe is connected with the second metal radiating pipe, the diameters of the first metal radiating pipe and the second metal radiating pipe are the same, and the first metal radiating pipe and the second metal radiating pipe are connected in a welding mode.

Preferably, every all the cover is equipped with heat conduction coil on the outside pipe wall of first metal cooling tube, and is a plurality of heat conduction coil is connected with a plurality of heat conduction silk, and a plurality of heat conduction silk can be with heat conduction to a plurality of heat conduction coils on the conducting strip, and a plurality of heat conduction coils are through the large tracts of land contact conduction with heat conduction to first metal cooling tube on.

Preferably, a plurality of radiating fins are inserted in the welding panel, the lower ends of the plurality of radiating fins penetrate through the welding panel and are inserted in the substrate, the plurality of second metal radiating pipes are inserted in the plurality of radiating fins in the substrate, and the plurality of radiating fins are in contact with the plurality of second metal radiating pipes and used for quickly dissipating heat on the plurality of second metal radiating pipes through contact of outside air, namely the plurality of radiating fins can ensure that the second metal radiating pipes are at a relatively low temperature.

Preferably, the thermal conductivity coefficient of first metallic heat radiating pipe is not equal to the thermal conductivity coefficient of second metallic heat radiating pipe, first metallic heat radiating pipe and second metallic heat radiating pipe that two kinds of thermal conductivity are different can make both ends have certain difference in temperature, and second metallic heat radiating pipe makes self temperature lower through a plurality of fin, first metallic heat radiating pipe makes self temperature higher through leading the heat coil, can know according to gaseous convection phenomenon, the gas of low temperature department flows to high temperature department gas, form the air current, make to form the air current that flows to first metallic heat radiating pipe by second metallic heat radiating pipe in the total radiating pipe that first metallic heat radiating pipe and second metallic heat radiating pipe connect into, make the heat disperse along with the air current, increase the heat dissipation of PCB board, and need not the power supply, the energy can be saved.

The utility model discloses following beneficial effect has:

1. the different formation difference in temperature of coefficient of heat conductivity through first metal cooling tube and second metal cooling tube, rethread fin and heat conduction coil make the increase in temperature difference, thereby make the air temperature of second metal cooling tube department be less than the air temperature of first metal cooling tube department, form the air flow, make the heat of first metal cooling tube department spill along with the air current fast, increase the heat-sinking capability of PCB board, and need not the power supply, save the electric energy.

2. The heat conduction silicone grease can conduct heat generated by electronic components on the welding panel to the heat conduction sheet quickly, and the heat conduction sheet conducts the heat to the heat conduction coil quickly through the plurality of heat conduction wires, so that the temperature of the first metal radiating pipe rises, the flowing speed of air flow is increased, and the radiating speed is increased.

3. The convection heat dissipation mechanism is embedded into the substrate, extra power supply is not needed, and large space installation outside is not needed, so that the size of the PCB is reduced, and thinner electronic products are convenient to produce.

To sum up, the utility model discloses a first metal cooling tube and second metal cooling tube form the difference in temperature for the difference in temperature air forms the convection current, and thermal giving off with higher speed, the energy can be saved, and embedded body structure is saved space more, is convenient for produce thinner electronic product.

Drawings

Fig. 1 is a schematic structural diagram of a PCB board with an embedded heat dissipation structure according to the present invention;

fig. 2 is a plan view of the PCB board of the embedded heat dissipation structure according to the present invention.

In the figure: the heat radiating structure comprises a base plate 1, a first metal heat radiating pipe 2, a heat conducting coil 3, a heat radiating groove 4, a welded panel 5, heat conducting silicone grease 6, a heat conducting sheet 7, a heat conducting wire 8, a heat radiating fin 9 and a second metal heat radiating pipe 10.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Referring to fig. 1-2, the PCB of the embedded heat dissipation structure includes a substrate 1, a welding panel 5 attached to the substrate 1, a mounting groove formed in an upper end of the substrate 1, a heat conducting fin 7 mounted in the mounting groove, a plurality of heat conducting wires 8 welded to the heat conducting fin 7, and a convection heat dissipation mechanism connected to the plurality of heat conducting wires 8.

Scribble heat conduction silicone grease 6 on the upper surface of conducting strip 7, and the upper surface of heat conduction silicone grease 6 and the lower surface full contact of welding panel 5, high coefficient of thermal conductivity's heat conduction silicone grease 6 can be with the heat conduction that gives off when electronic components on the welding panel 5 moves on conducting strip 7.

The convection heat dissipation mechanism comprises a plurality of heat dissipation grooves 4 arranged in the substrate 1, a first metal heat dissipation pipe 2 and a second metal heat dissipation pipe 10 are inserted into each heat dissipation groove 4, the first metal heat dissipation pipe 2 is connected with the second metal heat dissipation pipe 10, the diameters of the first metal heat dissipation pipe 2 and the second metal heat dissipation pipe 10 are the same, the first metal heat dissipation pipe 2 and the second metal heat dissipation pipe 10 are connected in a welding mode, a heat conduction coil 3 is sleeved on the outer side pipe wall of each first metal heat dissipation pipe 2, the heat conduction coils 3 are connected with a plurality of heat conduction wires 8, the heat conduction wires 8 can conduct heat on the heat conduction sheet 7 to the heat conduction coils 3, and the heat conduction coils 3 conduct heat to the first metal heat dissipation pipe 2 through large-area contact conduction.

A plurality of radiating fins 9 are inserted on the welding panel 5, the lower ends of the radiating fins 9 penetrate through the welding panel 5 and are inserted into the substrate 1, a plurality of second metal radiating pipes 10 are inserted into the radiating fins 9 in the substrate 1, the radiating fins 9 are in contact with the second metal radiating pipes 10, the heat on the second metal radiating pipes 10 is rapidly radiated through the contact of the outside air, and the radiating fins 9 can ensure that the second metal radiating pipes 10 are at a relatively low temperature.

The thermal conductivity coefficient of first metal cooling tube 2 is not equal to the thermal conductivity coefficient of second metal cooling tube 10, first metal cooling tube 2 and second metal cooling tube 10 that two kinds of thermal conductivity are different can make both ends have certain difference in temperature, and second metal cooling tube 10 makes self temperature lower through a plurality of fin 9, first metal cooling tube 2 makes self temperature higher through heat conduction coil 3, can know according to the convection phenomenon of gas, the gas of low temperature department flows to high temperature department gas, form the air current, make to form the air current that flows to first metal cooling tube 2 by second metal cooling tube 10 in the total cooling tube that first metal cooling tube 2 and second metal cooling tube 10 connect into, make the heat along with the air current effluvium, increase the heat dissipation of PCB board, and need not the power supply, energy can be saved.

When the utility model is used, when the electronic components on the welding panel 5 start working, heat is emitted, the heat is conducted to the heat conducting sheet 7 through the heat conducting silicone grease 6, the heat on the heat conducting sheet 7 is conducted to the plurality of heat conducting coils 3 through the plurality of heat conducting wires 8, because the plurality of heat conducting coils 3 are sleeved on the first metal radiating pipe 2, the heat is conducted to the plurality of first metal radiating pipes 2 to increase the temperature of the first metal radiating pipe 2, because the plurality of second metal radiating pipes 10 are contacted with the plurality of radiating fins 9, the heat of the second metal radiating pipe 10 is radiated through the radiating fins 9, the temperature of the second metal radiating pipe 10 is lower than that of the first metal radiating pipe 2, the air is far away from the known air flow, the cold air flows towards the hot air, the low-temperature air in the second metal radiating pipe 10 flows towards the high-temperature air in the first metal radiating pipe 2 to form an air flow, the heat dissipation in the first metal heat dissipation tube 2 is accelerated, i.e. the heat dissipation speed of the PCB is increased.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The PCB board with the embedded heat dissipation structure comprises a substrate (1) and is characterized in that a welding panel (5) is attached to the substrate (1), a mounting groove is formed in the upper end of the substrate (1), a heat conducting sheet (7) is mounted in the mounting groove, a plurality of heat conducting wires (8) are welded to the heat conducting sheet (7), and the heat conducting wires (8) are connected with a convection heat dissipation mechanism.

2. The PCB board of an embedded heat dissipation structure of claim 1, wherein the upper surface of the heat conductive sheet (7) is coated with a heat conductive silicone grease (6), and the upper surface of the heat conductive silicone grease (6) is in full contact with the lower surface of the soldering panel (5).

3. The PCB board of embedded heat dissipation structure as defined in claim 1, wherein the convection heat dissipation mechanism comprises a plurality of heat dissipation slots (4) opened in the substrate (1), each of the heat dissipation slots (4) is inserted with a first metal heat dissipation tube (2) and a second metal heat dissipation tube (10), and the first metal heat dissipation tube (2) is connected with the second metal heat dissipation tube (10).

4. The PCB board of embedded heat dissipation structure as recited in claim 3, wherein each of the first metallic heat dissipation pipes (2) is sleeved with a heat conductive coil (3) on the outer pipe wall, and a plurality of heat conductive coils (3) are connected with a plurality of heat conductive wires (8).

5. The PCB board of the embedded heat dissipation structure as recited in claim 4, wherein a plurality of heat dissipation fins (9) are inserted on the soldering panel (5), lower ends of the plurality of heat dissipation fins (9) are inserted through the soldering panel (5) and into the base plate (1), and a plurality of second metallic heat dissipation pipes (10) are inserted on the plurality of heat dissipation fins (9) in the base plate (1).

6. The PCB board of embedded heat dissipation structure as claimed in claim 5, wherein the thermal conductivity of the first metallic heat dissipation tube (2) is not equal to the thermal conductivity of the second metallic heat dissipation tube (10).