CN210967381U - Cooling device of reflow soldering machine - Google Patents
Cooling device of reflow soldering machine Download PDFInfo
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- CN210967381U CN210967381U CN201922141474.9U CN201922141474U CN210967381U CN 210967381 U CN210967381 U CN 210967381U CN 201922141474 U CN201922141474 U CN 201922141474U CN 210967381 U CN210967381 U CN 210967381U
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Abstract
The utility model discloses a backward flow soldering tin machine cooling device, the power distribution box comprises a box body, it is connected with the chamber door to rotate on the rear end face of box, is provided with the electric heating board on the inside wall except the chamber door on the box, is provided with water cooling plant on the box, water cooling plant includes cooling plate and lower cooling plate, go up cooling plate fixed connection on the last lateral wall of box, cooling plate fixed connection is on the lower lateral wall of box down, goes up cooling plate and cooling plate horizontal align to grid in the box down, goes up the cooling plate and is provided with the cooling water course in the cooling plate down, the cooling water course mesocycle has cold water. The utility model relates to a simple structure, the cooling effect is good, water-saving's backward flow soldering tin machine cooling device.
Description
Technical Field
The utility model relates to a reflow soldering machine technical field specifically is a reflow soldering machine cooling device.
Background
The reflow soldering machine is a welding device commonly used in the surface mounting industry, and the processing process mainly comprises the following steps: 1. placing one or more PCB circuit boards in a heating box of a reflow soldering machine; 2. uniformly heating the PCB circuit board in a high-temperature environment through uniformly distributed heating pipes, and finishing one-time welding of a welding spot on the surface of the PCB circuit board after keeping for a certain time; 3. and (5) starting a cooling fan on the heating box to quickly cool the PCB, taking out the PCB, and finishing the welding process. After high-temperature welding, the cooling speed has a large influence on the quality of the welding spot, and if the welding spot is not cooled in time, the brightness of the welding spot is not high, and the welding spot is easy to break and peel. However, most of the cooling devices in the conventional reflow soldering machine have poor cooling effect, and cannot maintain stable cooling effect. Therefore, a new cooling device for reflow soldering machine is needed to overcome the above technical drawbacks.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a reflow soldering tin machine cooling device to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a backward flow soldering tin machine cooling device, includes the box, it is connected with the chamber door to rotate on the rear end face of box, is provided with the electrical heating board on the inside wall except the chamber door on the box, is provided with water cooling plant on the box, water cooling plant includes cooling plate and lower cooling plate, go up cooling plate fixed connection on the last lateral wall of box, cooling plate fixed connection is on the lower lateral wall of box down, goes up cooling plate and cooling plate horizontal align to grid in the box down, goes up the cooling plate and is provided with the cooling water course in the cooling plate down, cooling water course mesocycle has cold water.
Preferably, a semiconductor refrigerating piece is fixedly mounted on the front end face of the box body through a connecting rod, a guide plate is fixedly connected to the end face, facing the side of the box body, of the semiconductor refrigerating piece, a water channel is arranged in the guide plate, and two ends of the water channel are connected with the cooling water channel through pipelines.
Preferably, fixed mounting has the water pump on the right-hand member face of box, the end of intaking of water pump links to each other through the one end of inlet tube with the water course, and the play water end of water pump links to each other through outlet pipe and cooling water course one end, the one end that the outlet pipe was kept away from to the cooling water course is passed through the connecting pipe and is linked to each other with the one end that the inlet tube was kept away from to the water.
Preferably, the bottom of the box body is fixedly connected with a group of supporting legs, the upper end face and the lower end face of the box body are provided with heat dissipation devices, and each heat dissipation device comprises an upper heat dissipation aluminum fin arranged on the upper end face of the box body and a lower heat dissipation aluminum fin arranged on the lower end face of the box body.
Preferably, the upper and lower cooling plates and the baffle are made of copper.
Preferably, the box body, the upper heat dissipation aluminum fins and the lower heat dissipation aluminum fins are made of copper.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses in, go up the cooling water course mesocycle cold water in cooling plate and the lower cooling plate and cool off the PCB circuit board, the parallel arrangement of cooling water course is relative with the spiral around establishing the water-cooled effect that has improved. The semiconductor refrigeration piece cools the water that flows out of the cooling water channel, and the cooled water enters the cooling water channel again to cool the PCB, so that the cyclic utilization of the cooling water is realized. The water pump provides power for the circulation of water in the cooling water channel and the water channel. The upper heat dissipation aluminum fins and the lower heat dissipation aluminum fins are used for assisting in cooling the PCB. Copper has good heat-conducting property, so that the upper cooling plate and the lower cooling plate have good heat-absorbing property, and the guide plate can be rapidly cooled by the semiconductor refrigerating sheet. Copper enables the box body, the upper radiating aluminum fins and the lower radiating aluminum fins to form a good heat conductor, and the effect of accelerating heat conduction is achieved. The utility model relates to a simple structure, the cooling effect is good, water-saving's backward flow soldering tin machine cooling device.
Drawings
FIG. 1 is a schematic view of a cooling device of a reflow soldering machine;
fig. 2 is a cross-sectional view at a in fig. 1.
In the figure: the structure comprises a box body 1, a supporting foot 2, a heat radiating device 3, an upper heat radiating aluminum fin 4, a lower heat radiating aluminum fin 5, an electric heating plate 6, a box door 7, a handle 8, a PCB circuit board 9, an upper cooling plate 10, a lower cooling plate 11, a guide plate 12, a cooling water channel 13, a connecting rod 14, a semiconductor refrigerating sheet 15, a connecting pipe 16, a water inlet pipe 17, a water outlet pipe 18, a water pump 19 and a water cooling device 20.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution:
the utility model provides a backward flow soldering tin machine cooling device, includes box 1, it is connected with chamber door 7 to rotate on the rear end face of box 1, is provided with electric heating board 6 on the box 1 except that the inside wall of chamber door 7, is provided with water cooling plant 20 on the box 1, water cooling plant 20 includes cooling plate 10 and lower cooling plate 11, go up cooling plate 10 fixed connection on the last lateral wall of box 1, down cooling plate 11 fixed connection is on the lower lateral wall of box 1, goes up cooling plate 10 and lower cooling plate 11 horizontal align to grid in box 1, goes up cooling plate 10 and is provided with cooling water course 13 in the cooling plate 11 down, cooling water course 13 mesocycle has cold water.
During welding, the PCB 9 is placed in the box body 1, the electric heating plate 6 heats the PCB 9 for a certain time, one-time welding of welding spots on the surface of the PCB 9 is completed, and the handle 8 is pulled to control opening and closing of the box door 7 for the PCB 9 to enter and exit the box body 1; after welding, cold water circulates in the cooling water channels 13 in the upper cooling plate 10 and the lower cooling plate 11 to cool the PCB 9, and the parallel arrangement and the spiral winding arrangement of the cooling water channels 13 improve the water cooling effect.
Preferably, a semiconductor refrigeration piece 15 is fixedly mounted on the front end face of the box body 1 through a connecting rod 14, a guide plate 12 is fixedly connected to one side end face of the semiconductor refrigeration piece 15 facing the box body 1, a water channel is arranged in the guide plate 12, and two ends of the water channel are connected with the cooling water channel 13 through a pipeline.
The semiconductor refrigerating sheet 15 cools water flowing out of the cooling water channel 13, and the cooled water enters the cooling water channel 13 again to cool the PCB 9, so that the cooling water is recycled.
Preferably, a water pump 19 is fixedly mounted on the right end face of the box body 1, a water inlet end of the water pump 19 is connected with one end of the water channel through a water inlet pipe 17, a water outlet end of the water pump 19 is connected with one end of the cooling water channel 13 through a water outlet pipe 18, and one end of the cooling water channel 13, which is far away from the water outlet pipe 18, is connected with one end of the water channel, which is far away from the water inlet pipe 17, through a connecting pipe.
The water pump 19 provides power for the circulation of water in the cooling water channel 13 and channels.
Preferably, the bottom of the box body 1 is fixedly connected with a group of supporting legs 2, the upper end surface and the lower end surface of the box body 1 are provided with heat dissipation devices 3, and each heat dissipation device 3 comprises an upper heat dissipation aluminum fin 4 arranged on the upper end surface of the box body 1 and a lower heat dissipation aluminum fin 5 arranged on the lower end surface of the box body 1.
The upper and lower heat dissipating aluminum fins 4 and 5 are used to assist in cooling the PCB board 9.
Preferably, the upper and lower cooling plates 10 and 11 and the guide plate 12 are made of copper.
Copper has good heat-conducting property, so that the upper cooling plate 10 and the lower cooling plate 11 have good heat-absorbing property, and the guide plate 12 can be rapidly cooled by the semiconductor refrigeration sheet 15.
Preferably, the case 1, the upper heat radiating aluminum fins 4 and the lower heat radiating aluminum fins 5 are made of copper.
Copper enables the box body 1, the upper radiating aluminum fins 4 and the lower radiating aluminum fins 5 to form a good heat conductor, and the effect of accelerating heat conduction is achieved.
The utility model discloses a theory of operation is: during welding, the PCB 9 is placed in the box body 1, the electric heating plate 6 heats the PCB 9 for a certain time, one-time welding of welding spots on the surface of the PCB 9 is completed, and the handle 8 is pulled to control opening and closing of the box door 7 for the PCB 9 to enter and exit the box body 1; after welding, cold water circulates in the cooling water channels 13 in the upper cooling plate 10 and the lower cooling plate 11 to cool the PCB 9, and the parallel arrangement and the spiral winding arrangement of the cooling water channels 13 improve the water cooling effect. The semiconductor refrigerating sheet 15 cools water flowing out of the cooling water channel 13, and the cooled water enters the cooling water channel 13 again to cool the PCB 9, so that the cooling water is recycled. The water pump 19 provides power for the circulation of water in the cooling water channel 13 and channels. The upper and lower heat dissipating aluminum fins 4 and 5 are used to assist in cooling the PCB board 9. Copper has good heat-conducting property, so that the upper cooling plate 10 and the lower cooling plate 11 have good heat-absorbing property, and the guide plate 12 can be rapidly cooled by the semiconductor refrigeration sheet 15. Copper enables the box body 1, the upper radiating aluminum fins 4 and the lower radiating aluminum fins 5 to form a good heat conductor, and the effect of accelerating heat conduction is achieved.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. The utility model provides a reflow soldering machine cooling device, includes box (1), its characterized in that: rotate on the rear end face of box (1) and be connected with chamber door (7), be provided with electric heating board (6) on box (1) except that on the outside inside wall of chamber door (7), be provided with water cooling plant (20) on box (1), water cooling plant (20) include cooling plate (10) and lower cooling plate (11), go up cooling plate (10) fixed connection on the last lateral wall of box (1), cooling plate (11) fixed connection is on the lower lateral wall of box (1) down, goes up cooling plate (10) and cooling plate (11) horizontal align to grid in box (1) down, goes up cooling plate (10) and is provided with cooling water course (13) down in cooling plate (11), cooling water course (13) mesocycle has cold water.
2. The cooling device of reflow soldering machine as claimed in claim 1, wherein: the semiconductor refrigerating device is characterized in that a semiconductor refrigerating piece (15) is fixedly mounted on the front end face of the box body (1) through a connecting rod (14), the semiconductor refrigerating piece (15) is fixedly connected with a guide plate (12) on the end face of one side of the box body (1), a water channel is arranged in the guide plate (12), and two ends of the water channel are connected with a cooling water channel (13) through a pipeline.
3. The cooling device of reflow soldering machine as claimed in claim 2, wherein: fixed mounting has water pump (19) on the right-hand member face of box (1), the end of intaking of water pump (19) links to each other through the one end of inlet tube (17) with the water course, and the play water end of water pump (19) links to each other through outlet pipe (18) and cooling water course (13) one end, the one end that outlet pipe (18) were kept away from in cooling water course (13) is passed through connecting pipe (16) and is linked to each other with the one end that inlet tube (17) were kept away from in the water course.
4. The cooling device of reflow soldering machine as claimed in claim 1, wherein: the bottom fixedly connected with of box (1) is a set of supporting legs (2), and the up end and the lower terminal surface of box (1) are provided with heat abstractor (3), heat abstractor (3) are including setting up last heat dissipation aluminium fin (4) on box (1) up end and setting up lower heat dissipation aluminium fin (5) on box (1) lower terminal surface.
5. The cooling device of reflow soldering machine as claimed in claim 2, wherein: the upper cooling plate (10), the lower cooling plate (11) and the guide plate (12) are made of copper.
6. The cooling device of reflow soldering machine as claimed in claim 4, wherein: the box body (1), the upper heat-radiating aluminum fins (4) and the lower heat-radiating aluminum fins (5) are made of copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922141474.9U CN210967381U (en) | 2019-12-04 | 2019-12-04 | Cooling device of reflow soldering machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922141474.9U CN210967381U (en) | 2019-12-04 | 2019-12-04 | Cooling device of reflow soldering machine |
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| Publication Number | Publication Date |
|---|---|
| CN210967381U true CN210967381U (en) | 2020-07-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201922141474.9U Active CN210967381U (en) | 2019-12-04 | 2019-12-04 | Cooling device of reflow soldering machine |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112605145A (en) * | 2020-12-01 | 2021-04-06 | 浙江富丽华铝业有限公司 | High-efficient cooling device is used in aluminium alloy hot extrusion moulding |
| CN114980545A (en) * | 2022-07-27 | 2022-08-30 | 四川恩巨实业有限公司 | PCB soldering tin cooling device |
-
2019
- 2019-12-04 CN CN201922141474.9U patent/CN210967381U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112605145A (en) * | 2020-12-01 | 2021-04-06 | 浙江富丽华铝业有限公司 | High-efficient cooling device is used in aluminium alloy hot extrusion moulding |
| CN114980545A (en) * | 2022-07-27 | 2022-08-30 | 四川恩巨实业有限公司 | PCB soldering tin cooling device |
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