CN212231976U - Circuit board with cooling and heat dissipation functions - Google Patents
Circuit board with cooling and heat dissipation functions Download PDFInfo
- Publication number
- CN212231976U CN212231976U CN202021138966.9U CN202021138966U CN212231976U CN 212231976 U CN212231976 U CN 212231976U CN 202021138966 U CN202021138966 U CN 202021138966U CN 212231976 U CN212231976 U CN 212231976U
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- heat dissipation
- circuit board
- heat
- cooling
- liquid storage
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Abstract
The utility model discloses a circuit board with cooling and heat dissipation functions, which comprises a circuit board body, a first heat dissipation device and a second heat dissipation device; the circuit board body: the left side and the right side are both fixed with U-shaped mounting seats through screws; the first heat dissipation device: the heat dissipation box is fixed between the two U-shaped mounting seats, openings are formed in the front side face and the rear side face of the heat dissipation box, radiating fins are uniformly arranged between the inner walls of the top end and the bottom end of the heat dissipation box, the bottom end of the heat dissipation box is in contact with the top end of the circuit board body, and the fan is mounted on the front side face of the heat dissipation box; a second heat dissipation device: include heat pipe, connecting pipe, water pump and liquid storage pot, the middle part at each fin is fixed to the heat pipe, the liquid storage pot is fixed on outside fixed station, and its internally mounted has semiconductor refrigeration piece, temperature sensor and water pump, and this circuit board with cooling heat dissipation function's radiating efficiency is high, can cool down the circuit board by the efficient.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a circuit board with cooling heat dissipation function.
Background
The circuit board makes circuit miniaturation, intuitionistic, plays an important role with electrical apparatus overall arrangement to fixed circuit's batch production and optimization, and the circuit board is in the course of the work, and each part can heat up along with the state of work on the circuit board gradually, if not carry out the heat dissipation processing, probably because high temperature causes each part life on the circuit board to shorten, the heat dissipation of the adoption fin more of current circuit board, radiating efficiency is limited, can not be timely to the circuit board processing of cooling down.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to overcome current defect, provide a circuit board with cooling heat dissipation function, the radiating efficiency of this circuit board with cooling heat dissipation function is high, can cool down the circuit board by the efficient, can effectively solve the problem in the background art.
In order to achieve the above object, the utility model provides a following technical scheme: a circuit board with cooling and heat dissipation functions comprises a circuit board body, a first heat dissipation device and a second heat dissipation device;
the circuit board body: the left side and the right side are both fixed with U-shaped mounting seats through screws;
the first heat dissipation device: the heat dissipation box is fixed between the two U-shaped mounting seats, openings are formed in the front side face and the rear side face of the heat dissipation box, radiating fins are uniformly arranged between the inner walls of the top end and the bottom end of the heat dissipation box, the bottom end of the heat dissipation box is in contact with the top end of the circuit board body, and the fan is mounted on the front side face of the heat dissipation box;
a second heat dissipation device: the heat-conducting pipe is fixed in the middle of each radiating fin, the liquid storage tank is fixed on an external fixing table, a semiconductor refrigerating fin, a temperature sensor and a water pump are installed in the liquid storage tank, the water outlet end of the liquid storage tank is communicated with the water inlet end of the heat-conducting pipe through a first connecting pipe, the water inlet end of the liquid storage tank is communicated with the water outlet end of the heat-conducting pipe through a second connecting pipe, and the water outlet of the water pump is communicated with the water outlet end of the liquid storage tank through a water pipe;
wherein: the input ends of the water pump, the semiconductor refrigerating sheet and the fan are electrically connected with the output end of an external single chip microcomputer, and the input end of the external single chip microcomputer is electrically connected with the output ends of the temperature sensor and an external power supply.
Further, still include the fixed plate, the fixed plate is equipped with two sets ofly, and welds respectively at the left and right sides face of heat dissipation case, the draw-in groove has been seted up on the top of U type mount pad, be equipped with the apron in the draw-in groove, the spout has been seted up to its inner wall, the side of apron is equipped with the draw runner, draw runner and spout sliding connection, and fixed plate, apron pass through bolted connection with U type mount pad, adopt the fixed mode of pressfitting to utilize the bolt fastening, be convenient for install fixedly to the heat dissipation case, and dismantle the convenience.
Further, still include first joint and second joint, the first joint is equipped with two, and establishes respectively the end of intaking and the play water end at the liquid storage pot, the second joint is equipped with two, and establishes respectively in the side of heat pipe, the both ends of connecting pipe respectively with first joint and second joint threaded connection, the connecting pipe adopts the threaded connection mode, easy to assemble.
Further, still include the mount pad, the mount pad parallel fixation is on the inner wall of heat dissipation case, the fan passes through the screw fixation on the mount pad, predetermines the mount pad, helps the installation and the dismantlement of fan, makes things convenient for the later stage to dismantle the maintenance.
Furthermore, the top end of the heat dissipation box is uniformly provided with through holes, the heat dissipation fins are inserted into the through holes and connected with the heat dissipation box through screws, and each heat dissipation fin can be detached, so that the heat dissipation fins can be replaced conveniently, and the detachability of the heat dissipation box is improved.
Compared with the prior art, the beneficial effects of the utility model are that: this circuit board with cooling heat dissipation function has following benefit:
this circuit board with cooling heat dissipation function adopts split type connection structure, all can realize quick dismouting between each part, helps the later stage to dismantle the maintenance, on the heat dissipation cooling of circuit board body, adopts fin and fan cooperation, takes away the heat, cooperates with second heat abstractor simultaneously, and the coolant liquid takes away the heat of some on the fin to can realize the high efficiency cooling of circuit board body, help prolonging the life of circuit board body.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic front view of the present invention;
3 fig. 33 3 is 3 a 3 schematic 3 view 3 of 3 the 3 cross 3- 3 sectional 3 structure 3 of 3 the 3 plane 3 a 3- 3 a 3 of 3 the 3 present 3 invention 3. 3
In the figure: the heat dissipation device comprises a 1U-shaped mounting seat, a 2 clamping groove, a 3 fixing plate, a 4 first heat dissipation device, a 41 fan, a 42 heat dissipation box, a 5 circuit board body, a 6 second heat dissipation device, a 61 heat conduction pipe, a 62 connecting pipe, a 63 water pump, a 64 liquid storage tank, a 7 mounting seat, 8 heat dissipation fins, a 9 cover plate, a 10 first connector, a 11 semiconductor refrigeration piece, a 12 temperature sensor and a 13 second connector.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1
Referring to fig. 1-3, the present invention provides a technical solution: a circuit board with cooling and heat dissipation functions comprises a circuit board body 5, a first heat dissipation device 4 and a second heat dissipation device 6;
a circuit board body 5: the U-shaped mounting seats 1 are fixed on the left side and the right side through screws, and the U-shaped mounting seats 1 are preset at two ends of the circuit board body 5 and are mainly used for fixing the heat dissipation box 42;
first heat sink 4: comprises a fan 41 and a heat dissipation box 42, the heat dissipation box 42 is fixed between two U-shaped mounting seats 1, the front side and the back side of the heat dissipation box 42 are both provided with openings which facilitate the circulation of air, heat dissipation fins 8 are evenly arranged between the inner walls of the top end and the bottom end of the heat dissipation box 42, the top end of the heat dissipation box 42 is evenly provided with through holes, the heat dissipation fins 8 are inserted in the through holes and are connected with the heat dissipation box 42 through screws, the heat dissipation fins 8 are fixed by adopting screws, the heat dissipation fins 8 are convenient to mount, thereby being beneficial to realizing the standardized production in factories, the bottom end of the heat dissipation box is contacted with the top end of a circuit board body 5, the heat transfer can be realized between the heat dissipation fins and the circuit board body 5, the fan 41 is mounted on the front side of the heat dissipation box 42, the mounting seats 7 are fixed on, the heat dissipation box is characterized by further comprising two groups of fixing plates 3, the fixing plates 3 are welded on the left side surface and the right side surface of the heat dissipation box 42 respectively, a clamping groove 2 is formed in the top end of the U-shaped mounting seat 1, a cover plate 9 is arranged in the clamping groove 2, a sliding groove is formed in the inner wall of the clamping groove, a sliding strip is arranged on the side surface of the cover plate 9 and is in sliding connection with the sliding groove, the fixing plates 3, the cover plate 9 and the U-shaped mounting seat 1 are connected through bolts, when the fixing plates 3 are installed, the fixing plates 3 are aligned to the positions of the clamping grooves 2, then the cover plate 9 is slid, and;
second heat sink 6: the intelligent temperature control device comprises a heat conduction pipe 61, connecting pipes 62, a water pump 63 and a liquid storage tank 64, wherein the heat conduction pipe 61 is fixed in the middle of each radiating fin 8, refrigerating liquid flows in the heat conduction pipe 61 and can take away heat in each radiating fin 8, the liquid storage tank 64 is fixed on an external fixing table, a semiconductor refrigerating sheet 11, a temperature sensor 12 and the water pump 63 are installed in the liquid storage tank 64, the refrigerating end of the semiconductor refrigerating sheet 11 is located in the liquid storage tank 64, the heating end of the semiconductor refrigerating sheet is located outside the equipment, the temperature sensor 12 can monitor the temperature of the refrigerating liquid in real time and conveniently and intelligently control the temperature, the water outlet end of the semiconductor refrigerating sheet is communicated with the water inlet end of the heat conduction pipe 61 through a first connecting pipe 62, the water inlet end of the semiconductor refrigerating sheet is communicated with the water outlet end of the heat conduction pipe 61 through a second connecting pipe 62, the intelligent temperature control, the first joint 10 and the second joint 13 are arranged to facilitate the split connection of the second heat dissipation device 6, a user can perform wire arrangement installation by himself according to the actual spatial position, a water outlet of the water pump 63 is communicated with a water outlet end of the liquid storage tank 64 through a water pipe, during actual operation, the water pump 63 pumps chilled liquid into the first connecting pipe 62, then the chilled liquid flows through the heat conduction pipe 61 to realize heat transfer with each heat dissipation fin 8, and after absorbing heat on the surface of the heat dissipation fin 8, the chilled liquid enters the liquid storage tank 64 along the second connecting pipe 62, and during the period, the semiconductor refrigeration fin 11 is always in an operating state;
wherein: the input ends of the water pump 63, the semiconductor refrigerating sheet 11 and the fan 41 are electrically connected with the output end of an external single chip microcomputer, and the input end of the external single chip microcomputer is electrically connected with the temperature sensor 12 and the output end of an external power supply.
When in use: the temperature on the circuit board body 5 is transferred to the surface of each cooling fin 8 in the cooling box 42, when the fan 41 rotates, the air at the front end and the rear end of the cooling box 42 is driven to flow, a part of heat on the surface of each cooling fin 8 is taken away, meanwhile, the cooling liquid is pumped into the first connecting pipe 62 by the water pump 63 and then flows through the heat conduction pipe 61 to be transferred with each cooling fin 8, after the heat on the surface of each cooling fin 8 is absorbed, the cooling liquid enters the liquid storage tank 64 along the second connecting pipe 62, and the semiconductor cooling fins 11 are always in a working state in the process, so that water cooling circulation is formed, and the purpose of reducing the surface temperature.
It should be noted that the specific model of the external single chip microcomputer disclosed in this embodiment is DZC-9011, the preferred model of the water pump 63 is QC3000-7135, the preferred model of the semiconductor chilling plate 11 is TEO1-050, the preferred model of the fan 41 is FP-108-1-S1-BU, the preferred model of the temperature sensor 12 is TD-6112-8331, and the external single chip microcomputer controls the water pump 63, the semiconductor chilling plate 11 and the fan 41 to operate by a method commonly used in the prior art.
Example 2
In addition to or as an alternative to embodiment 1, embodiment 2 provides a more economical solution, accommodating smaller area circuit boards.
The utility model provides a circuit board with cooling heat dissipation function, comprises circuit board body and the positive metal cold drawing of detachable setting at circuit board body, metal cold drawing is integrative to be made, and it openly has a plurality of heat dissipation wind channels, and the main heating element position that its back corresponds on the circuit board body is provided with heat conduction silica gel, and heat conduction silica gel transmits the heat of the last heating element of circuit board body to the metal cold drawing on, and the metal cold drawing adopts aluminium system cold drawing, and its heat conductivility and economic nature can reach the balance, and the heat discharges through the positive heat dissipation wind channel of metal cold drawing, and the other radiator fan that can dispose of circuit board can further be quick discharges the heat through the fan.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a circuit board with cooling heat dissipation function which characterized in that: comprises a circuit board body (5), a first heat sink (4) and a second heat sink (6);
circuit board body (5): the left side and the right side are both fixed with U-shaped mounting seats (1) through screws;
first heat sink (4): the heat dissipation device comprises a fan (41) and a heat dissipation box (42), wherein the heat dissipation box (42) is fixed between two U-shaped mounting seats (1), openings are formed in the front side face and the rear side face of the heat dissipation box, heat dissipation fins (8) are uniformly arranged between the inner walls of the top end and the bottom end of the heat dissipation box, the bottom end of the heat dissipation box is in contact with the top end of a circuit board body (5), and the fan (41) is mounted on the front side face of the heat dissipation box (42);
second heat sink (6): the heat-conducting pipe (61) is fixed in the middle of each radiating fin (8), the liquid storage tank (64) is fixed on an external fixing table, a semiconductor refrigerating sheet (11), a temperature sensor (12) and the water pump (63) are installed in the liquid storage tank (64), the water outlet end of the liquid storage tank is communicated with the water inlet end of the heat-conducting pipe (61) through a first connecting pipe (62), the water inlet end of the liquid storage tank is communicated with the water outlet end of the heat-conducting pipe (61) through a second connecting pipe (62), and the water outlet of the water pump (63) is communicated with the water outlet end of the liquid storage tank (64) through a water pipe;
wherein: the input ends of the water pump (63), the semiconductor refrigerating sheet (11) and the fan (41) are electrically connected with the output end of the external singlechip, and the input end of the external singlechip is electrically connected with the temperature sensor (12) and the output end of an external power supply.
2. The circuit board with cooling and heat dissipation functions of claim 1, wherein: still include fixed plate (3), fixed plate (3) are equipped with two sets ofly, and weld respectively at the left and right sides face of heat dissipation case (42), draw-in groove (2) have been seted up on the top of U type mount pad (1), be equipped with apron (9) in draw-in groove (2), the spout has been seted up to its inner wall, the side of apron (9) is equipped with the draw runner, draw runner and spout sliding connection, and fixed plate (3), apron (9) pass through bolted connection with U type mount pad (1).
3. The circuit board with cooling and heat dissipation functions of claim 1, wherein: still include first joint (10) and second joint (13), first joint (10) are equipped with two, and establish respectively the end of intaking and the play water end of liquid storage pot (64), second joint (13) are equipped with two, and establish respectively the side at heat pipe (61), the both ends of connecting pipe (62) respectively with first joint (10) and second joint (13) threaded connection.
4. The circuit board with cooling and heat dissipation functions of claim 1, wherein: still include mount pad (7), mount pad (7) parallel fixation is on the inner wall of radiator box (42), fan (41) pass through the screw fixation on mount pad (7).
5. The circuit board with cooling and heat dissipation functions of claim 1, wherein: the top end of the heat dissipation box (42) is uniformly provided with through holes, and the heat dissipation fins (8) are inserted into the through holes and connected with the heat dissipation box (42) through screws.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021138966.9U CN212231976U (en) | 2020-06-18 | 2020-06-18 | Circuit board with cooling and heat dissipation functions |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021138966.9U CN212231976U (en) | 2020-06-18 | 2020-06-18 | Circuit board with cooling and heat dissipation functions |
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| Publication Number | Publication Date |
|---|---|
| CN212231976U true CN212231976U (en) | 2020-12-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021138966.9U Active CN212231976U (en) | 2020-06-18 | 2020-06-18 | Circuit board with cooling and heat dissipation functions |
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| CN (1) | CN212231976U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113347852A (en) * | 2021-05-21 | 2021-09-03 | 无锡海鲸半导体科技有限公司 | Grid structure of GaN-based power device |
| CN113543601A (en) * | 2021-07-30 | 2021-10-22 | 南昌智产科技有限公司 | Data mining system for predicting new service potential users |
-
2020
- 2020-06-18 CN CN202021138966.9U patent/CN212231976U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113347852A (en) * | 2021-05-21 | 2021-09-03 | 无锡海鲸半导体科技有限公司 | Grid structure of GaN-based power device |
| CN113543601A (en) * | 2021-07-30 | 2021-10-22 | 南昌智产科技有限公司 | Data mining system for predicting new service potential users |
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