CN212364949U - Copper-aluminum computer radiating fin with high heat dissipation performance - Google Patents
Copper-aluminum computer radiating fin with high heat dissipation performance Download PDFInfo
- Publication number
- CN212364949U CN212364949U CN202021443867.1U CN202021443867U CN212364949U CN 212364949 U CN212364949 U CN 212364949U CN 202021443867 U CN202021443867 U CN 202021443867U CN 212364949 U CN212364949 U CN 212364949U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- heat
- radiating
- copper pipe
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 title claims abstract description 9
- 230000017525 heat dissipation Effects 0.000 title claims description 58
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 58
- 239000010949 copper Substances 0.000 claims abstract description 58
- 229910052802 copper Inorganic materials 0.000 claims abstract description 58
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 32
- 238000001816 cooling Methods 0.000 claims description 11
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 description 8
- 239000006185 dispersion Substances 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to the technical field of computer radiating fins, in particular to a high-radiating copper-aluminum computer radiating fin, which comprises a radiating base, wherein a heat conducting copper pipe is embedded in the radiating base, the middle part and two ends of the heat conducting copper pipe both penetrate through the radiating base and extend upwards, the top of the radiating base is fixedly connected with a radiating plate, a radiating aluminum sheet is fixedly arranged in the radiating plate, the radiating aluminum sheet is distributed in a grid structure, the heat of computer components is transmitted to the inside of the radiating aluminum sheet by the arranged heat conducting copper pipe, the radiating aluminum sheet is arranged in the grid structure, the radiating area is increased, and the grid connection part is connected with the heat conducting copper pipe and a square copper pipe, so that the heat transmission of the heat conducting copper pipe is more uniform, the arranged connecting copper pipe uniformly distributes the heat into the cavity of the radiating aluminum sheet in the grid structure, allowing faster heat transfer.
Description
Technical Field
The utility model relates to a computer fin technical field especially relates to a copper aluminium system computer fin of high heat dissipating.
Background
The radiating fin is a device for radiating heat of electronic elements which are easy to generate heat in electrical appliances, and is made of aluminum alloy, brass or bronze into plate, sheet or multi-sheet, for example, a CPU in a computer needs to use a relatively large radiating fin, a power tube, a line tube and a power amplifier in a power amplifier all use radiating fins, and a layer of heat-conducting silicone grease is coated on the contact surface of the electronic elements and the radiating fins when the radiating fin is used, so that the heat generated by the elements is more effectively conducted to the radiating fins and then is radiated to the ambient air through the radiating fins.
Obviously, the heat sink has become an essential part of the computer, however, the heat sink in the prior art has low heat dissipation efficiency, which results in that the heat generated by the computer cannot be well discharged when a user runs large-scale software.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects of low heat dissipation efficiency and the like in the prior art and providing a copper-aluminum computer cooling fin with high heat dissipation performance.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the design is a high heat dissipating's copper aluminium system computer fin, including the heat dissipation base, the inside heat conduction copper pipe that inlays of heat dissipation base, the middle part and the both ends of heat conduction copper pipe all run through the heat dissipation base and upwards extend, the top fixedly connected with heating panel of heat dissipation base, the inside fixed mounting of heating panel has the heat dissipation aluminum sheet, the heat dissipation aluminum sheet is latticed structural distribution, the heat conduction copper pipe is kept away from the square copper pipe of tip fixedly connected with of heat dissipation base, and square copper pipe sets up on the heating panel, heat conduction copper pipe and square copper pipe all set up at the latticed junction of heat dissipation aluminum sheet, the through-hole has been seted up on the heat dissipation aluminum sheet, and is two sets of fixed connection copper pipe between the square copper pipe, it all sets up at.
Preferably, a heat dissipation silicone layer is coated between the heat dissipation plate and the heat dissipation base.
Preferably, the two sides of the heat dissipation plate are both provided with mounting seats, and the mounting seats are provided with mounting holes.
Preferably, the connecting copper pipe is densely provided with cooling holes.
The utility model provides a pair of high heat dissipating's copper aluminium system computer fin, beneficial effect lies in: the utility model discloses a heat conduction copper pipe that sets up transmits the heat of computer components and parts to the inside of heat dissipation aluminum sheet, the heat dissipation aluminum sheet sets up to latticed structure, not only increase heat radiating area, and latticed junction all with heat conduction copper pipe and square copper union coupling, thereby make heat conduction copper pipe's heat transfer more even, the connection copper pipe of setting is with the even distribution of heat in latticed structure's the heat dissipation aluminum plate's of grid structure cavity, make heat transfer faster, discharge the heat through the through-hole of setting on fan heat aluminum sheet, high efficiency is swift, the heat dispersion preferred.
Drawings
Fig. 1 is a schematic structural view of a copper-aluminum computer cooling fin with high heat dissipation performance according to the present invention;
fig. 2 is a schematic view of the structure of the connecting copper pipe of the copper-aluminum computer cooling fin with high heat dissipation performance of the present invention.
In the figure: 1. a heat dissipation base; 2. a heat conducting copper pipe; 3. a heat dissipation plate; 4. radiating aluminum sheets; 5. a square copper tube; 6. a mounting seat; 7. mounting holes; 8. a through hole; 9. connecting a copper pipe; 10. a heat-dissipating silicone layer; 11. and (6) cooling the holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-2, a high heat dissipating's copper aluminium system computer fin, including heat dissipation base 1, heat conduction copper pipe 2 has been inlayed to heat dissipation base 1 inside, heat conduction copper pipe 2's middle part and both ends all run through heat dissipation base 1 and upwards extend, heat dissipation base 1's top fixedly connected with heating panel 3, the inside fixed mounting of heating panel 3 has heat dissipation aluminum sheet 4, heat dissipation aluminum sheet 4 is the latticed structure and distributes, heat conduction copper pipe 2 keeps away from the square copper pipe 5 of the end fixedly connected with of heat dissipation base 1, and square copper pipe 5 sets up on heating panel 3, heat conduction copper pipe 2 and square copper pipe 5 all set up at the latticed junction of heat dissipation aluminum sheet 4, through-hole 8 has been seted up on the heat dissipation aluminum sheet 4, fixed connection copper pipe 9 between two sets of square copper pipes 5, connection copper pipe 9.
Heat dissipation silicone grease layer 10 has been paintd between heating panel 3 and the heat dissipation base 1, heat dissipation silicone grease layer 10 makes heat transfer faster, the both sides of heating panel 3 all are provided with mount pad 6, and seted up mounting hole 7 on the mount pad 6, mounting hole 7 through setting up is convenient to the device's installation, connect and densely covered on copper pipe 9 and seted up cooling hole 11, the cooling hole 11 of setting is convenient for discharge the heat of connecting copper pipe 9, and contact with outside cold wind, it is blocking to cool down.
A working mode; the during operation, install the fin on the radiating computer components and parts of needs through mount pad 6, heat conduction copper pipe 2 on the heat dissipation base 1 is with the heat absorption transmission of computer components and parts to square copper pipe 5 in, latticed heat dissipation aluminum sheet 4 of setting not only increases heat radiating area, and be connected square copper pipe 5 and heat conduction copper pipe 2 and the net department of heat dissipation aluminum sheet 4, increase thermal transfer area, thereby make heat dissipation aluminum sheet 4 can be better with heat transfer dispersion, through setting up through-hole 8 on heat dissipation aluminum sheet 4 with the heat discharge, high efficiency is swift, heat dispersion is good.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (4)
1. The utility model provides a high heat dissipating's copper aluminium system computer fin, includes radiating base (1), its characterized in that: the heat-conducting copper pipe (2) is embedded in the heat-radiating base (1), the middle part and two ends of the heat-conducting copper pipe (2) penetrate through the heat-radiating base (1) and extend upwards, the top of the heat dissipation base (1) is fixedly connected with a heat dissipation plate (3), a heat dissipation aluminum sheet (4) is fixedly arranged inside the heat dissipation plate (3), the heat dissipation aluminum sheets (4) are distributed in a grid structure, the end part of the heat conduction copper pipe (2) far away from the heat dissipation base (1) is fixedly connected with a square copper pipe (5), the square copper tube (5) is arranged on the heat dissipation plate (3), the heat conduction copper tube (2) and the square copper tube (5) are both arranged at the latticed connection part of the heat dissipation aluminum sheet (4), the radiating aluminum sheet (4) is provided with a through hole (8), the two groups of square copper tubes (5) are fixedly connected with a connecting copper tube (9), the connecting copper pipes (9) are arranged at the latticed connecting positions of the heat dissipation aluminum sheets (4).
2. The copper-aluminum computer cooling fin with high heat dissipation performance of claim 1, wherein: and a heat dissipation silicone layer (10) is coated between the heat dissipation plate (3) and the heat dissipation base (1).
3. The copper-aluminum computer cooling fin with high heat dissipation performance of claim 1, wherein: the two sides of the heat dissipation plate (3) are provided with mounting seats (6), and mounting holes (7) are formed in the mounting seats (6).
4. The copper-aluminum computer cooling fin with high heat dissipation performance of claim 1, wherein: the connecting copper pipe (9) is densely provided with cooling holes (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021443867.1U CN212364949U (en) | 2020-07-21 | 2020-07-21 | Copper-aluminum computer radiating fin with high heat dissipation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021443867.1U CN212364949U (en) | 2020-07-21 | 2020-07-21 | Copper-aluminum computer radiating fin with high heat dissipation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212364949U true CN212364949U (en) | 2021-01-15 |
Family
ID=74131205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021443867.1U Expired - Fee Related CN212364949U (en) | 2020-07-21 | 2020-07-21 | Copper-aluminum computer radiating fin with high heat dissipation performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212364949U (en) |
-
2020
- 2020-07-21 CN CN202021443867.1U patent/CN212364949U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210115 |