CN212211497U

CN212211497U - Rigid-flex board

Info

Publication number: CN212211497U
Application number: CN202020959844.XU
Authority: CN
Inventors: 彭添; 刘元和; 黄加胜
Original assignee: Zhuhai Xinye Electronic Technology Co Ltd
Current assignee: Zhuhai Xinye Electronic Technology Co Ltd
Priority date: 2020-05-29
Filing date: 2020-05-29
Publication date: 2020-12-22
Anticipated expiration: 2030-05-29

Abstract

The utility model discloses a rigid-flexible printed circuit board, which comprises a rigid circuit board, a rigid substrate layer, an insulating layer, a circuit layer and an ink layer, wherein the rigid substrate layer, the insulating layer, the circuit layer and the ink layer are arranged from bottom to top in sequence; the heat dissipation assembly arranged at the lower end of the rigid substrate layer comprises a heat dissipation plate, wherein a heat dissipation groove is formed in the heat dissipation plate, and heat conduction silicone grease is coated in the heat dissipation groove. Reach the radiating effect of circuit board through set up radiator unit in rigid substrate layer lower extreme, the area of contact of heating panel and rigid substrate layer is big, the heat that can absorb is more, the radiating groove of seting up on the heating panel can increase the heat radiating area of heating panel to increase the radiating efficiency, the heat conduction silicone grease of coating can further strengthen the circuit board heat dissipation in the radiating groove, and the heat conduction silicone grease coating is difficult for being scraped in the radiating groove, reduces the number of times of recoating heat conduction silicone grease. The heat-conducting silicone grease is commonly used on electric appliances; the wiring layer is made of copper.

Description

Rigid-flex board

Technical Field

The utility model relates to a circuit board technical field, in particular to soft or hard combination board.

Background

Printed wiring boards are often used in various electronic products, and the purpose thereof is to save wiring space.

However, when the circuit board is used, the circuit in the circuit board is often fused due to heat generation, and the fused circuit can cause the failure of the electrical appliance.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a soft or hard combination board can solve the radiating problem of circuit board.

According to the utility model discloses a rigid-flex board of first aspect embodiment, include: the hard circuit board comprises a hard substrate layer, an insulating layer, a circuit layer and an ink layer which are sequentially arranged from bottom to top; the heat dissipation assembly arranged at the lower end of the rigid substrate layer comprises a heat dissipation plate, wherein a heat dissipation groove is formed in the heat dissipation plate, and heat conduction silicone grease is coated in the heat dissipation groove.

According to the utility model discloses rigid-flex board has following beneficial effect at least: through rigid substrate layer lower extreme sets up radiator unit reaches the radiating effect of circuit board, the heating panel with rigid substrate layer's area of contact is big, and the heat that can absorb is more set up on the heating panel the radiating groove can increase the heat radiating area of heating panel to increase the radiating efficiency the heat conduction silicone grease of coating in the radiating groove can further strengthen the circuit board heat dissipation, and the heat conduction silicone grease coating is in difficult quilt is scraped in the radiating groove, reduces the number of times of recoating heat conduction silicone grease.

According to the utility model discloses a some embodiments still include the flexible line way board, rigid line way board is provided with two, the flexible line way board is connected two between the rigid line way board, the flexible line way board with rigid line way board combines, can adapt to constrictive space, conveniently buckles.

According to some embodiments of the utility model, the flexible line way board is connected through crossing the cab apron the rigid line way board sets up it can prevent to cross the cab apron the flexible line way board with rigid line way board lug connection breaks off when causing to buckle.

According to some embodiments of the utility model, the transition plate is the graphite cake, and graphite can electrically conduct to the graphite cake bending performance is good.

According to the utility model discloses a some embodiments, the lower extreme of crossing the cab apron is provided with the fin, fin one end is connected flexible line way board, the other end is connected the heating panel sets up the fin can with flexible line way board's heat conduction extremely the heating panel increases flexible line way board's heat dissipation.

According to some embodiments of the utility model, the radiating groove is the S-shaped setting and is in on the heating panel, the S-shaped can increase the distribution area of radiating groove reaches better radiating effect.

According to some embodiments of the present invention, the cross section of the heat dissipation groove is trapezoidal, and the large end of the trapezoid faces downward, so that the opening of the heat dissipation groove for dissipating heat is wider, which is beneficial to dissipating heat; and meanwhile, the heat-conducting silicone grease is conveniently coated.

According to some embodiments of the present invention, the rigid substrate layer is made of copper or aluminum, which is more easily heat conductive and can absorb heat generated by the line nearby.

According to some embodiments of the present invention, the heat dissipation plate is made of copper, and the heat conductivity of copper is good and the cost is low.

According to some embodiments of the present invention, the insulating layer is made of polyimide, which has good heat resistance and good insulation properties.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of a rigid-flex board according to an embodiment of the present invention;

FIG. 2 is an enlarged view of a portion of FIG. 1 at A;

fig. 3 is a bottom view of the plate for combining soft and hard shown in fig. 1.

A rigid circuit board 100, a rigid substrate layer 110, an insulating layer 120, a circuit layer 130, an ink layer 140,

A heat dissipation assembly 200, a heat dissipation plate 210, a heat dissipation groove 220, a flexible circuit board 300, a transition plate 400,

And a heat sink 410.

Detailed Description

Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood as excluding the number, and the terms greater than, less than, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.

Referring to fig. 1 to 3, a rigid-flex board includes a rigid circuit board 100, which includes a rigid substrate layer 110, an insulating layer 120, a circuit layer 130, and an ink layer 140 sequentially disposed from bottom to top; the heat dissipation assembly 200 disposed at the lower end of the rigid substrate layer 110 includes a heat dissipation plate 210, wherein a heat dissipation groove 220 is formed on the heat dissipation plate 210, and a heat conductive silicone grease is coated in the heat dissipation groove 220. The heat dissipation assembly 200 is arranged at the lower end of the rigid substrate layer 110 to achieve the effect of dissipating heat of the circuit board, the contact area between the heat dissipation plate 210 and the rigid substrate layer 110 is large, more heat can be absorbed, the heat dissipation groove 220 formed in the heat dissipation plate 210 can increase the heat dissipation area of the heat dissipation plate 210 to increase the heat dissipation efficiency, the heat dissipation of the circuit board can be further enhanced by the heat conduction silicone grease coated in the heat dissipation groove 220, the heat conduction silicone grease is coated in the heat dissipation groove 220 and is not easy to scrape off, and the number of times of recoating the heat conduction silicone grease is reduced. It is noted that the heat conductive silicone is commonly used in electrical appliances; the wiring layer is made of copper.

In some embodiments, the heat sink 210 may be provided with a plurality of heat sink fins, one end of each heat sink fin is connected to the heat sink 210, and the other end of each heat sink fin extends downward. The fins may be straight or curved, it being understood that the fins are made of copper or aluminum.

The flexible printed circuit board is characterized by further comprising two flexible printed circuit boards 300, the two rigid printed circuit boards 100 are arranged, the flexible printed circuit boards 300 are connected between the two rigid printed circuit boards 100, and the flexible printed circuit boards 300 and the rigid printed circuit boards 100 are combined to adapt to narrow space and be convenient to bend. It is understood that the flexible printed circuit board 300 also includes a base layer made of polyimide material, a circuit layer made of copper, and an insulating layer, which is an ink layer, coated with solder resist ink. Since the polyimide material is used as the base layer of the flexible printed circuit board 300, the flexible printed circuit board 300 has good bending performance.

In some embodiments, the flexible circuit board 300 is connected to the rigid circuit board 100 through the transition plate 400, and the transition plate 400 is provided to prevent the flexible circuit board 300 and the rigid circuit board 100 from being disconnected when being bent due to direct connection. It should be noted that the strength of the transition plate 400 is between the rigid circuit board 100 and the flexible circuit board 300, that is, the hardness of the transition plate 400 is smaller than that of the rigid circuit board 100 and larger than that of the flexible circuit board 300.

In some embodiments, the transition plate 400 is a graphite plate, which can be conductive and has good bending properties. It can be understood that the transition plate 400 is used for conducting the flexible circuit board 300 and the rigid circuit board 100, so as to facilitate signal transmission; it is understood that the substrate and the wiring layer of the transition plate 400 are made of graphite, and the substrate and the wiring layer are connected by an insulating layer.

In some embodiments, the lower end of the transition plate 400 is provided with a heat sink 410, one end of the heat sink 410 is connected to the flexible circuit board 300, and the other end is connected to the heat sink 210, and the heat sink 410 is configured to conduct heat of the flexible circuit board 300 to the heat sink 210, so as to increase heat dissipation of the flexible circuit board 300. It is understood that the heat sink 410 is provided in an L shape, one of two sections of the L shape is connected to the transition plate 400, and the other section is connected to the heat sink 210, so as to increase the contact area between the heat sink 410 and the transition plate 400 and the contact area between the heat sink 410 and the heat sink 210, and adapt to the connection between the flexible circuit board 300 and the rigid circuit board 100. It will be understood that two segments of the L-shape refer to the two segments demarcated by the corners of the L-shape.

In some embodiments, the heat dissipation grooves 220 are disposed on the heat dissipation plate 210 in an S shape, and the S shape can increase the distribution area of the heat dissipation grooves 220 to achieve a better heat dissipation effect.

In some embodiments, the heat dissipation grooves 220 may also be arranged in a bar shape, the heat dissipation grooves 220 in the bar shape are arranged in a plurality of strips, and the heat dissipation grooves 220 in the bar shape are distributed in the heat dissipation plate 210.

In some embodiments, the cross section of the heat sink 220 is trapezoidal, and the large end of the trapezoid faces downward, so that the heat sink 220 has a wider opening for heat dissipation, which is beneficial to heat dissipation; and meanwhile, the heat-conducting silicone grease is conveniently coated.

In some embodiments, the cross-section of the heat sink 220 may also be tapered, with the larger end of the taper facing downward.

In some embodiments, the rigid substrate layer 110 is made of copper or aluminum, which is more thermally conductive and can absorb heat generated by the wires nearby.

In some embodiments, the heat dissipation plate 210 is made of copper, which has good thermal conductivity and low cost.

In some embodiments, the insulating layer 120 is made of polyimide, which has good heat resistance and good insulation properties.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.

Claims

1. A rigid-flex board, comprising:

the hard circuit board (100) comprises a hard substrate layer (110), an insulating layer (120), a circuit layer (130) and an ink layer (140) which are sequentially arranged from bottom to top;

the heat dissipation assembly (200) arranged at the lower end of the rigid substrate layer (110) comprises a heat dissipation plate (210), wherein a heat dissipation groove (220) is formed in the heat dissipation plate (210), and heat conduction silicone grease is coated in the heat dissipation groove (220).

2. The rigid-flex board according to claim 1, wherein: the flexible printed circuit board is characterized by further comprising two flexible printed circuit boards (300), wherein the two rigid printed circuit boards (100) are arranged, and the flexible printed circuit boards (300) are connected between the two rigid printed circuit boards (100).

3. The board of claim 2, wherein: the flexible circuit board (300) is connected with the rigid circuit board (100) through a transition board (400).

4. The board of claim 3, wherein: the transition plate (400) is a graphite plate.

5. The board of claim 3, wherein: the lower end of the transition plate (400) is provided with a radiating fin (410), one end of the radiating fin (410) is connected with the flexible circuit board (300), and the other end of the radiating fin is connected with the radiating plate (210).

6. The rigid-flex board according to claim 1, wherein: the heat dissipation groove (220) is arranged on the heat dissipation plate (210) in an S shape.

7. The rigid-flex board according to any one of claims 1 to 6, wherein: the section of the heat dissipation groove (220) is trapezoidal, and the large end of the trapezoid faces downwards.

8. The rigid-flex board according to claim 1, wherein: the rigid substrate layer (110) is made of copper or aluminum.

9. The rigid-flex board according to claim 1, wherein: the heat dissipation plate (210) is made of copper.

10. The rigid-flex board according to claim 1, wherein: the insulating layer (120) is made of polyimide.