CN211606928U - Controller, automobile electronic water pump and automobile electronic compressor - Google Patents
Controller, automobile electronic water pump and automobile electronic compressor Download PDFInfo
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- CN211606928U CN211606928U CN202020113224.4U CN202020113224U CN211606928U CN 211606928 U CN211606928 U CN 211606928U CN 202020113224 U CN202020113224 U CN 202020113224U CN 211606928 U CN211606928 U CN 211606928U
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Abstract
The embodiment of the utility model provides a be applicable to controller technical field, provide a controller, automotive electronics water pump and automotive electronics compressor for automotive electronics, include: a high temperature resistant printed board; the second printed board is arranged above the high-temperature-resistant printed board, and the high-temperature-resistant printed board is electrically connected with the second printed board; a connecting piece for connecting the high temperature resistant printed board and the second printed board; the electronic components are arranged on the high-temperature-resistant printed board and the second printed board and comprise high-heating devices, and the high-heating devices are arranged on the high-temperature-resistant printed board. The embodiment of the utility model provides a through set up second printing board above high temperature resistant printing board, increased the arrangement area, with the high device that generates heat setting on high temperature resistant printing board, and can't arrange other electronic components on high temperature resistant printing board and arrange on second printing board, like this, when electronic components or wiring are too much can't arrange on high temperature resistant printing board, just need not to increase the area of high temperature resistant printing board, and then reduce the volume of controller.
Description
Technical Field
The utility model belongs to the technical field of the controller, especially, relate to a controller, automotive electronics water pump and automotive electronics compressor.
Background
With the continuous development of the scientific and technological society, more and more electronic products need to be controlled by using a controller, wherein the controller mainly comprises a printed circuit board and electronic components arranged on the printed circuit board, the printed circuit board is called a printed circuit board for short, and the printed circuit board is called a pcb (printed circuit board for short), and the printed circuit board mainly plays a role in connecting various electronic components.
The printed board is provided with a bonding pad, a mounting hole, a connecting wire and the like, wherein the bonding pad is used for welding a metal hole of a pin of a component, the via hole is used for connecting the connecting wire between layers, the mounting hole is used for fixing the printed board, and the connecting wire is used for connecting the pin of the electronic component.
However, because the electronic space of the automobile is limited, the area of the controller and the area of the printed board adopted by the controller are smaller, and when the number of electronic components is large, the electronic components cannot be all arranged on the printed board with the limited area.
SUMMERY OF THE UTILITY MODEL
An embodiment of the utility model provides a controller aims at solving among the automotive electronics too much and can't all arrange the problem on the printing board of a limited area.
The embodiment of the utility model provides a realize like this, provide a controller for automotive electronics, include:
a high temperature resistant printed board;
the second printed board is arranged above the high-temperature-resistant printed board, and the high-temperature-resistant printed board is electrically connected with the second printed board;
the connecting piece is used for connecting the high-temperature-resistant printed board and the second printed board;
and the electronic components are arranged on the high-temperature-resistant printed board and the second printed board and comprise high-heating devices, and the high-heating devices are arranged on the high-temperature-resistant printed board.
Further, the second printed board is a single-sided board, a double-sided board or a multi-layer board.
Furthermore, the electronic components are arranged on the side of the high-temperature-resistant printed board facing the second printed board and the second printed board.
Furthermore, one end of the connecting piece is attached to the high-temperature-resistant printed board.
Furthermore, one end of the connecting piece is provided with a bending part, and the bending part is attached to the high-temperature-resistant printed board.
Furthermore, the connecting piece is provided with an elastically deformable buffer part.
Further, the substrate of the high temperature resistant printed board is made of a metal material.
Further, the substrate of the high temperature resistant printed board is made of a ceramic material.
Further, the substrate of the second printed board is a resin printed board, a bakelite board, a composite printed board or a glass fiber board.
The automobile electronic water pump comprises a heat dissipation device and the controller, wherein the heat dissipation device is arranged on one side, away from the second printed board, of the high-temperature-resistant printed board.
An automobile electronic compressor comprises a heat dissipation device and the controller, wherein the heat dissipation device is arranged on one side, away from a second printed board, of a high-temperature-resistant printed board.
The embodiment of the utility model provides a through set up second printing board above high temperature resistant printing board, the arrangement area has been increased, with the high device that generates heat setting on high temperature resistant printing board, and other electronic components that can't arrange on high temperature resistant printing board arrange on second printing board, thus, when electronic components or wiring are too much can't arrange on high temperature resistant printing board, need not to increase the area of high temperature resistant printing board, can solve electronic components too much and can't all arrange the problem on the printing board of a limited area, and then reduce the volume of controller.
Drawings
Fig. 1 is a schematic diagram of a first structure of a controller according to an embodiment of the present invention;
fig. 2 is a schematic view of a first structure of a connecting body in a controller according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a second structure of a controller according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a second structure of a connecting body in a controller according to an embodiment of the present invention;
wherein, 1, a high temperature resistant printed board; 21. a high heat generating device; 22. a low heat generating device; 3. a second printed board; 4. a connecting member; 41. a bending part; 42. a buffer portion.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
An embodiment of the utility model provides a controller for automotive electronics, include: a high temperature resistant printed board; the second printed board is arranged above the high-temperature-resistant printed board, and the high-temperature-resistant printed board is electrically connected with the second printed board; a connecting piece for connecting the high temperature resistant printed board and the second printed board; the electronic components are arranged on the high-temperature-resistant printed board and the second printed board and comprise high-heating devices, and the high-heating devices are arranged on the high-temperature-resistant printed board. The embodiment of the utility model provides a through set up second printing board above high temperature resistant printing board, the arrangement area has been increased, with the high device that generates heat setting on high temperature resistant printing board, and other electronic components that can't arrange on high temperature resistant printing board arrange on second printing board, thus, when electronic components or wiring are too much can't arrange on high temperature resistant printing board, need not to increase the area of high temperature resistant printing board, can solve electronic components too much and can't all arrange the problem on the printing board of a limited area, and then reduce the volume of controller.
Example one
The present embodiment provides a controller for automotive electronics, as shown in fig. 1, comprising:
a high temperature resistant printed board 1;
the second printed board 3 is arranged above the high-temperature-resistant printed board 1, and the high-temperature-resistant printed board 1 is electrically connected with the second printed board 3;
a connecting member 4 connecting the high temperature resistant printed board 1 and the second printed board 3;
the electronic components are arranged on the high-temperature-resistant printed board 1 and the second printed board 3 and comprise high-heat-generating devices 21, and the high-heat-generating devices 21 are arranged on the high-temperature-resistant printed board 1.
This embodiment is through setting up second printing board 3 in high temperature resistant printing board 1 top, the arrangement area has been increased, set up high heat-generating device 21 on high temperature resistant printing board 1, and other electronic components that can't arrange on high temperature resistant printing board 1 arrange on second printing board 3, thus, when electronic components or wiring are too much to arrange on high temperature resistant printing board 1, need not to increase the area of high temperature resistant printing board 1, can solve too much and can't all arrange the problem on the printing board of a limited area of electronic components, and then reduce the volume of controller.
Specifically, the substrate of the high-temperature-resistant printed board 1 can be made of a ceramic material, that is, the high-temperature-resistant printed board 1 is a ceramic board, so that the ceramic material is insulated, and when the ceramic material is used as the substrate, the ceramic material does not need to be subjected to insulation treatment, so that the manufacturing cost can be saved.
Specifically, the base material of the high-temperature-resistant printed board 1 may also be made of a metal material, and an insulating layer needs to be provided between the base material and the copper foil, but the metal is easy to process relative to ceramic.
The high-temperature-resistant printed board 1 can be an aluminum printed board or a copper printed board, and the processing cost can be saved because aluminum and copper are easy to process and the cost for processing the via hole is low. Of course, an aluminum alloy printed board, an iron printed board, a brass printed board, or the like may be selected.
The insulating layer is made of insulating materials such as polyvinyl chloride, polyethylene or polypropylene, and mainly insulates a base material of the high-temperature-resistant printed board 1 made of a metal material and a copper foil, so that short circuit caused by the fact that electronic components are affected by the metal material is avoided.
The base material of the high-temperature-resistant printed board 1 is made of metal materials, and the metal materials have the characteristic of easiness in processing, so that the high-temperature-resistant printed board 1 is convenient to process, the yield of the high-temperature-resistant printed board is improved, the metal materials are easy to dissipate heat, and the high-temperature-resistant printed board has a heat dissipation effect.
Specifically, the base material of the second printed board 3 is a resin printed board, a bakelite board, a composite printed board, a glass fiber board, or the like, and the printed boards are low in material cost and easy to process, so that the manufacturing cost of the second printed board 3 can be reduced. Of course, if the cost is not considered, the second printed board 3 may be made of a rubber board, a plastic board, a ceramic board, a metal board after insulation treatment, or the like.
The embodiment of the utility model provides an in, high temperature resistant printing board 1 chooses for use metal or pottery etc. as the substrate, for the second printing board 3 that makes substrates such as resin, more high temperature resistant.
Specifically, the connecting members 4 may be conductive bodies or non-conductive bodies, and as shown in fig. 1, the connecting members 4 are two, three, or four, etc.
Specifically, if connecting piece 4 is the electric conductor, high temperature resistant printing board is directly connected through connecting piece 4 electricity with the second printing board, and connecting piece 4 can play the effect of supporting second printing board 3, makes and keeps certain height between high temperature resistant printing board 1 and the second printing board 3, prevents that second printing board 3 from taking up the surface area of high temperature resistant printing board 1, makes the surface area maximize that can arrange electronic components on high temperature resistant printing board 1, is convenient for arrange electronic components to 1 on the high temperature resistant printing board. The conductor may be made of a conductive material such as copper, aluminum alloy, or the like.
Certainly, when the connecting member 4 is a non-conductive body (i.e., a support body), the high temperature resistant printed board and the second printed board need to be electrically connected through another electric wire, and the connecting member 4 can play a role in supporting the second printed board 3.
Specifically, the electronic component includes a switching tube (such as a MOS tube, a triode, and the like), a heating resistor, an insulated gate bipolar transistor, a resistor, an inductor, a capacitor, and the like, wherein the high heat generating device 21 is a device through which a large current flows, thereby generating heat with power consumption, such as a field effect transistor, a heating resistor, an insulated gate bipolar transistor, and the like, and the low heat generating device 22 includes a resistor, an inductor, a capacitor, and the like.
In order to avoid the high heat-generating devices 21 from damaging the printed board, the high heat-generating devices 21 are arranged on the high-temperature-resistant printed board 1 to ensure that the printed board is not damaged, and the low heat-generating devices 22 have less heat generation, so that when electronic components cannot be arranged on the high-temperature-resistant printed board 1, part of the low heat-generating devices 22 or all of the low heat-generating devices 22 can be arranged on the second printed board 3.
Example two
As another alternative embodiment of this embodiment, the second printed board 3 is a single-sided board, a double-sided board, or a multilayer board.
Specifically, the second printed board 3 may be a single-sided board, and when electronic components or wires are sufficiently arranged on one side surface, the cost can be saved; the second printed board 3 may be a double-sided board, so that electronic components may be arranged on both sides of the second printed board 3 to increase the arrangement area of the electronic components on the second printed board 3, so that more electronic components may be arranged on the second printed board 3.
Specifically, the second printed board 3 may be further configured as a multilayer board, so that electronic components may be arranged on the multilayer board, and the arrangement area of the electronic components on the second printed board 3 is further increased, so that more electronic components may be arranged on the second printed board 3.
Of course, in order to increase the layout area on the limited number of boards, the boards may also be configured as a double-sided board, and the boards are supported and connected by the connecting members 4 (conductors or supporting bodies and wires), so that more electronic components can be arranged on the limited number of boards.
In this embodiment, the second printed board 3 is provided as a double-sided board or a multilayer board, so that the arrangement area of the electronic components on the second printed board 3 can be increased, and more electronic components can be arranged on the second printed board 3.
EXAMPLE III
As another alternative embodiment of this embodiment, as shown in fig. 3, electronic components are provided on the side of the high temperature resistant printed board 1 facing the second printed board 3 and on the second printed board 3.
Specifically, through setting up electronic components on high temperature resistant printed board 1 towards second printed board 3 one side and second printed board 3, be equivalent to, electronic components only sets up on high temperature resistant printed board 1 towards second printed board 3 one side and second printed board 3, no matter whether there is the copper foil in the opposite side of high temperature resistant printed board 1, all do not install any electronic components, can make things convenient for heat radiation structure's setting like this, with dispel the heat to the electronic components on high temperature resistant printed board 1, heat radiation structure is like coating heat conduction silicone grease, installation fin or direct and quick-witted case contact etc..
In the embodiment, the electronic component is only installed on one side of the high-temperature-resistant printed board 1, so that the high-temperature-resistant printed board 1 is not required to be provided with the through hole, the damage of the high-temperature-resistant printed board 1 caused by the through hole on the high-temperature-resistant printed board 1 is avoided, and the manufacturing cost of the high-temperature-resistant printed board 1 is saved. Certainly, the radiating surface can not set up naked copper, has avoided the condition of electrical short circuit, has promoted the steadiness and the reliability of product, can also practice thrift the cost.
Example four
As another alternative embodiment of the present invention, as shown in fig. 1, one end of the connecting member 4 is attached to the high temperature resistant printed board 1.
Specifically, the connecting member 4 may be attached to the high temperature resistant printed board 1 by means of conductive glue, welding, or the like.
This embodiment is through pasting the one end of connecting piece 4 and establishing on high temperature resistant printing board 1, just need not to set up the mounting hole on high temperature resistant printing board 1 to can avoid the damage of high temperature resistant printing board 1 that the mounting hole processing caused, and the insulation processing after the mounting hole processing, with reduction in production and processing cost.
EXAMPLE five
As another optional embodiment of the present invention, as shown in fig. 2, one end of the connecting member 4 is provided with a bending portion 41, and as shown in fig. 1, the bending portion 41 is attached to the high temperature resistant printed board 1.
Specifically, as shown in fig. 2, the connecting member 4 is in an L-shaped structure or a transverse U-shaped structure, and of course, the bending portion 41 may be in other structures, such as a Z-shaped structure, an S-shaped structure, etc., according to actual situations. However, the bent portion 41 is preferably a flat structure parallel to the high temperature resistant printed board 1, so that it can be better attached to the high temperature resistant printed board 1.
In this embodiment, the bending portion 41 is disposed and attached to the high temperature resistant printed board 1 through the bending portion 41, so that the attachment area can be increased, and the second printed board 3 can be more stably mounted above the high temperature resistant printed board 1.
Specifically, the bending portion 41 is attached to the high-temperature-resistant printed board 1, so that the contact area with the high-temperature-resistant printed board 1 can be increased, and at this time, the connecting member 4 can flow through a larger current through the bending portion 41, so that a circuit portion requiring a large current can be arranged on the second printed board 3.
EXAMPLE six
As another alternative embodiment of the present invention, as shown in fig. 4, an elastically deformable buffer portion 42 is provided on the connecting member 4.
Specifically, the buffer portion 42 is formed by bending once, and the elastic deformability is provided for the connection member 4 by the elastic effect of the bending structure, so that the elastic deformability of the buffer portion 42 can be increased. Of course, the buffer portion 42 may be formed by bending a plurality of times according to actual requirements.
This embodiment can absorb part of the external force by the elastic deformation of the buffer portion 42 when the second printed board 3 is subjected to the external force by providing the buffer portion 42 on the connecting member 4, and can move the second printed board 3 along with the elastic deformation of the buffer portion 42 to prevent the second printed board 3 from being directly subjected to the force to cause the damage thereof.
EXAMPLE seven
The embodiment provides an automotive electronic water pump, which comprises a heat dissipation device and a controller described in any one of the first embodiment to the sixth embodiment, wherein the heat dissipation device is arranged on one side, away from a second printed board, of a high-temperature-resistant printed board.
Specifically, this heat abstractor is the metal casing etc. of electronic pump, fin, equipment, is provided with the heat conduction material in the middle of this heat abstractor and high temperature resistant printing board 1, like heat conduction silicone grease, heat conduction glue, casting glue etc. through set up the heat conduction material in the middle of heat abstractor and high temperature resistant printing board 1, can promote the heat conduction effect, and then promote heat abstractor's radiating efficiency.
This embodiment is through using this controller on automobile electronic water pump, can increase another printing board, makes high heat-generating device 21 can arrange on high temperature resistant printing board 1 to dispel the heat to high heat-generating device 21 through heat abstractor, promote the radiating effect of high heat-generating device 21, and can't arrange on high temperature resistant printing board 1 partial electronic components arrange on second printing board 3, avoided electronic components can't all arrange the condition at the printing board of a limited area.
Example eight
The embodiment provides an electronic compressor for an automobile, which comprises a heat dissipation device and a controller described in any one of the first embodiment to the sixth embodiment, wherein the heat dissipation device is arranged on one side of a high-temperature-resistant printed board far away from a second printed board.
Specifically, the heat dissipation device is a metal shell of a heat dissipation sheet, a refrigerant radiator or a compressor, heat conduction materials such as heat conduction silicone grease, heat conduction glue, potting glue and the like are arranged between the heat dissipation device and the high-temperature-resistant printed board 1, and the heat conduction effect can be improved by arranging the heat conduction materials between the heat dissipation device and the high-temperature-resistant printed board 1, so that the heat dissipation efficiency of the heat dissipation device is improved.
This embodiment is through using this controller on automobile electronic compressor, can increase another printed board, makes high heat-generating device 21 can arrange on high temperature resistant printed board 1 to dispel the heat to high heat-generating device 21 through heat abstractor, promote the radiating effect of high heat-generating device 21, and can't arrange on high temperature resistant printed board 1 partial electronic components arrange on second printed board 3, avoided electronic components can't all arrange the condition at the printed board of a limited area.
To sum up, the embodiment of the utility model provides a through set up second printing board above high temperature resistant printing board, increased the arrangement area, set up high heating device on high temperature resistant printing board, and can't arrange other electronic components on high temperature resistant printing board and arrange on second printing board, like this, when electronic components or wiring are too much to arrange on high temperature resistant printing board, just need not to increase the area of high temperature resistant printing board, and then reduce the volume of controller. By arranging the second printed board into a double-panel or multi-layer board, the arrangement area of the electronic components on the second printed board can be increased, and more electronic components can be arranged on the second printed board. Through only installing electronic components in one side of high temperature resistant printing board, need not to set up the via hole on making high temperature resistant printing board, avoided setting up the via hole on high temperature resistant printing board and the high temperature resistant printing board that causes damages, saved the cost of manufacture of high temperature resistant printing board, and the cooling surface need not to set up naked copper, has avoided the condition of electrical short circuit, has promoted the steadiness and the reliability of product. One end of the connecting piece is attached to the high-temperature-resistant printed board, so that a mounting hole is not required to be formed in the high-temperature-resistant printed board, the high-temperature-resistant printed board can be prevented from being damaged by machining of the mounting hole, insulation treatment after machining of the mounting hole is avoided, and production and machining cost is reduced. Through setting up the portion of bending to paste through the portion of bending and establish on high temperature resistant printing board, thereby can increase and paste the area, make the second printing board more firm install in the top of high temperature resistant printing board. By arranging the buffer part on the connecting piece, when the second printed board is acted by external force, part of the external force can be absorbed through the elastic deformation of the buffer part, and the second printed board moves along with the elastic deformation of the buffer part, so that the second printed board is prevented from being damaged due to the fact that the second printed board directly bears the force.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (11)
1. A controller for automotive electronics, comprising:
a high temperature resistant printed board;
the second printed board is arranged above the high-temperature-resistant printed board, and the high-temperature-resistant printed board is electrically connected with the second printed board;
the connecting piece is used for connecting the high-temperature-resistant printed board and the second printed board;
and the electronic components are arranged on the high-temperature-resistant printed board and the second printed board and comprise high-heating devices, and the high-heating devices are arranged on the high-temperature-resistant printed board.
2. The controller of claim 1, wherein the second printed board is a single-sided board, a double-sided board, or a multi-layer board.
3. The controller according to claim 1, wherein the electronic components are provided on a side of the high temperature resistant printed board facing the second printed board and on the second printed board.
4. The controller of claim 1, wherein one end of the connector is attached to the high temperature resistant printed board.
5. The controller of claim 4, wherein one end of the connecting piece is provided with a bending part, and the bending part is attached to the high-temperature-resistant printed board.
6. A control as claimed in claim 1, wherein the link is provided with a resiliently deformable bumper.
7. The controller according to any one of claims 1 to 6, wherein the substrate of the high temperature resistant printed board is made of a metal material.
8. The controller according to any one of claims 1 to 6, wherein the substrate of the high temperature resistant printed board is made of a ceramic material.
9. The controller according to any one of claims 1 to 6, wherein the substrate of the second printed board is a resin printed board, a bakelite board, a composite printed board, or a glass fiber board.
10. An automotive electronic water pump, characterized by comprising a heat dissipation device and the controller of any one of claims 1 to 9, wherein the heat dissipation device is arranged on one side of the high temperature resistant printed board far away from the second printed board.
11. An automotive electronic compressor, characterized by comprising a heat dissipation device and the controller of any one of claims 1 to 9, wherein the heat dissipation device is arranged on the side of the high temperature resistant printed board far away from the second printed board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020113224.4U CN211606928U (en) | 2020-01-17 | 2020-01-17 | Controller, automobile electronic water pump and automobile electronic compressor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020113224.4U CN211606928U (en) | 2020-01-17 | 2020-01-17 | Controller, automobile electronic water pump and automobile electronic compressor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211606928U true CN211606928U (en) | 2020-09-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020113224.4U Active CN211606928U (en) | 2020-01-17 | 2020-01-17 | Controller, automobile electronic water pump and automobile electronic compressor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211606928U (en) |
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2020
- 2020-01-17 CN CN202020113224.4U patent/CN211606928U/en active Active
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