CN212786009U - Printed circuit board with good heat dissipation performance - Google Patents
Printed circuit board with good heat dissipation performance Download PDFInfo
- Publication number
- CN212786009U CN212786009U CN202021618480.5U CN202021618480U CN212786009U CN 212786009 U CN212786009 U CN 212786009U CN 202021618480 U CN202021618480 U CN 202021618480U CN 212786009 U CN212786009 U CN 212786009U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- circuit board
- layer
- printed circuit
- air duct
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a printed circuit board that heat dispersion is good, including the printed circuit board body, the printed circuit board body comprises heat dissipation layer, first basic unit, first conducting layer, second basic unit and second conducting layer, the heat dissipation layer is located first basic unit with between the second basic unit, first conducting layer is located the top of first basic unit, the second conducting layer is located the top of second basic unit, a plurality of heat dissipation channels have been seted up to the inside on heat dissipation layer, heat dissipation channel's one end is provided with air duct one, air duct one is kept away from heat dissipation channel's one end cooperatees with the fan and is connected, heat dissipation channel's the other end is provided with air duct two, the cover is equipped with the heat dissipation cover on the air duct two, the bottom of heat dissipation cover is provided with the fin. Has the advantages that: the printed circuit board has good heat dissipation performance, the working efficiency of the circuit board is improved, and the service life of the circuit board is prolonged.
Description
Technical Field
The utility model relates to a printed circuit board technical field particularly, relates to a printed circuit board that heat dispersion is good.
Background
Printed circuit boards are used in various electronic products. In areas with dense circuit boards or in devices or circuits through which large current passes, good heat dissipation performance needs to be satisfied, otherwise, the printed circuit board may deform due to high temperature, the service life of the printed circuit board is shortened, and the stability and the service life of electronic products are also reduced. The existing heat dissipation mode is that a heat sink is separately configured for a device with large heat dissipation, and a heat dissipation fan is configured on the whole plate.
An effective solution to the problems in the related art has not been proposed yet.
SUMMERY OF THE UTILITY MODEL
To the problem in the correlation technique, the utility model provides a printed circuit board that heat dispersion is good to overcome the above-mentioned technical problem that current correlation technique exists.
Therefore, the utility model discloses a specific technical scheme as follows:
the utility model provides a printed circuit board that heat dispersion is good, includes the printed circuit board body, the printed circuit board body comprises heat dissipation layer, first basic unit, first conducting layer, second basic unit and second conducting layer, the heat dissipation layer is located first basic unit with between the second basic unit, first conducting layer is located the top of first basic unit, the second conducting layer is located the top of second basic unit, a plurality of heat dissipation channels have been seted up to the inside on heat dissipation layer, the one end of heat dissipation channel is provided with air duct one, air duct one is kept away from heat dissipation channel's one end cooperatees with the fan and is connected, heat dissipation channel's the other end is provided with air duct two, the cover is equipped with the heat dissipation cover on the air duct two, the bottom of heat dissipation cover is provided with the fin.
Furthermore, the heat dissipation layer, the first base layer and the second base layer are respectively provided with a plurality of conductive columns connected with the first conductive layer and the second conductive layer.
Furthermore, a through hole is formed in the heat dissipation layer at a position close to the conductive post.
Furthermore, the first air guide pipe is fixedly connected with the fan through an air guide cover.
Further, the inside packing of heat dissipation cover has heat conduction silica gel, the top of heat dissipation cover is provided with the feed inlet.
Furthermore, a plurality of radiating fins are arranged at the bottom end of the radiating fin.
Furthermore, the heat dissipation layer, the first air duct, the second air duct, the heat dissipation sleeve, the heat dissipation fins and the heat dissipation fins are made of copper materials respectively.
The utility model has the advantages that: through setting up the printed circuit board that heat dispersion is good that comprises heat dissipation layer, first basic unit, first conducting layer, second basic unit, second conducting layer, heat dissipation channel, air duct one, fan, air duct two, heat dissipation cover, fin, lead electrical pillar, through-hole, air guide cover, heat conduction silica gel, feed inlet and radiating fin to make this printed circuit board have better heat dispersion, improve the work efficiency and the life of circuit board.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a printed circuit board with good heat dissipation performance according to an embodiment of the present invention;
fig. 2 is a side view of a printed circuit board with good heat dissipation performance according to the embodiment of the present invention.
In the figure:
1. a printed circuit board body; 2. a heat dissipation layer; 3. a first base layer; 4. a first conductive layer; 5. a second base layer; 6. a second conductive layer; 7. a heat dissipation channel; 8. a first gas guide pipe; 9. a fan; 10. a second gas guide pipe; 11. a heat dissipation sleeve; 12. a heat sink; 13. a conductive post; 14. a through hole; 15. a gas guide hood; 16. heat conducting silica gel; 17. a feed inlet; 18. and (4) radiating fins.
Detailed Description
For further explanation of the embodiments, the drawings are provided as part of the disclosure and serve primarily to illustrate the embodiments and, together with the description, to explain the principles of operation of the embodiments, and to provide further explanation of the invention and advantages thereof, it will be understood by those skilled in the art that various other embodiments and advantages of the invention are possible, and that elements in the drawings are not to scale and that like reference numerals are generally used to designate like elements.
According to the utility model discloses an embodiment provides a printed circuit board that heat dispersion is good.
The first embodiment is as follows:
as shown in fig. 1-2, a printed circuit board with good heat dissipation performance according to an embodiment of the present invention includes a printed circuit board body 1, wherein the printed circuit board body 1 is composed of a heat dissipation layer 2, a first base layer 3, a first conductive layer 4, a second base layer 5 and a second conductive layer 6, the heat dissipation layer 2 is located between the first base layer 3 and the second base layer 5, the first conductive layer 4 is located on the top end of the first base layer 3, the second conductive layer 6 is located on the top end of the second base layer 5, a plurality of heat dissipation channels 7 are disposed inside the heat dissipation layer 2, a first air duct 8 is disposed at one end of the heat dissipation channel 7, one end of the first air duct 8, which is far away from the heat dissipation channel 7, is connected to a fan 9 in a matching manner, a second air duct 10 is disposed at the other end of the heat dissipation channel 7, and a heat dissipation sleeve, the bottom end of the heat dissipation sleeve 11 is provided with a heat dissipation fin 12.
By means of the technical scheme, the printed circuit board with good heat dissipation performance is formed by the heat dissipation layer 2, the first base layer 3, the first conducting layer 4, the second base layer 5, the second conducting layer 6, the heat dissipation channel 7, the first air guide pipe 8, the fan 9, the second air guide pipe 10, the heat dissipation sleeve 11, the heat dissipation fins 12, the conductive posts 13, the through holes 14, the air guide cover 15, the heat conduction silica gel 16, the feed inlet 17 and the heat dissipation fins 18, so that the printed circuit board has good heat dissipation performance, the working efficiency of the circuit board is improved, and the service life of the circuit board is prolonged.
Example two:
as shown in fig. 1-2, the heat dissipation layer 2, the first base layer 3 and the second base layer 5 are respectively provided with a plurality of conductive posts 13 connected to the first conductive layer 4 and the second conductive layer 6 inside, a through hole 14 is formed in a position on the heat dissipation layer 2 near the conductive posts 13, the first air duct 8 is fixedly connected to the fan 9 through an air guide cover 15, the heat dissipation sleeve 11 is filled with heat conductive silica gel 16 inside, the top end of the heat dissipation sleeve 11 is provided with a feed inlet 17, the bottom end of the heat dissipation plate 12 is provided with a plurality of heat dissipation fins 18, the heat dissipation layer 2, the first air duct 8, the second air duct 10, the heat dissipation sleeve 11, the heat dissipation plate 12 and the heat dissipation fins 18 are respectively made of copper, the first conductive layer 4 and the second conductive layer 6 can be electrically connected through the conductive posts 13, and through the through hole 14, the conductive column 13 can be prevented from contacting the heat dissipation layer 2, the heat conductivity can be improved by the heat conductive silicone 16, and the heat dissipation efficiency can be improved by the heat dissipation fins 18.
For the convenience of understanding the technical solution of the present invention, the following detailed description is made on the working principle or the operation mode of the present invention in the practical process.
During practical application, on heat transfer to heat dissipation layer 2 on first basic unit 3, first conducting layer 4, second basic unit 5 and the second conducting layer 6, improve the inside air flow rate of heat dissipation channel 7 through air duct 8, fan 9 to can improve the radiating efficiency, can dispel the heat through heat dissipation cover 11, fin 12, heat conduction silica gel 16 and radiating fin 18 on can transferring partial heat to air duct two 10 in addition.
In conclusion, with the help of the above technical scheme of the utility model, through the setting by heat dissipation layer 2, first basic unit 3, first conducting layer 4, second basic unit 5, second conducting layer 6, heat dissipation channel 7, air duct 8, fan 9, air duct two 10, heat dissipation cover 11, fin 12, lead the printed circuit board that heat dispersion is good that electrical pillar 13, through-hole 14, air guide cover 15, heat conduction silica gel 16, feed inlet 17 and radiating fin 18 constitute to make this printed circuit board have better heat dispersion, improve the work efficiency and the life of circuit board.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A printed circuit board with good heat dissipation performance is characterized by comprising a printed circuit board body (1), wherein the printed circuit board body (1) is composed of a heat dissipation layer (2), a first base layer (3), a first conductive layer (4), a second base layer (5) and a second conductive layer (6), the heat dissipation layer (2) is located between the first base layer (3) and the second base layer (5), the first conductive layer (4) is located at the top end of the first base layer (3), the second conductive layer (6) is located at the top end of the second base layer (5), a plurality of heat dissipation channels (7) are formed in the heat dissipation layer (2), one ends of the heat dissipation channels (7) are provided with air guide pipes (8), and one ends, far away from the heat dissipation channels (7), of the air guide pipes (8) are matched and connected with a fan (9), the other end of the heat dissipation channel (7) is provided with a second air duct (10), the second air duct (10) is sleeved with a heat dissipation sleeve (11), and the bottom end of the heat dissipation sleeve (11) is provided with a heat dissipation fin (12).
2. The printed circuit board with good heat dissipation performance according to claim 1, wherein a plurality of conductive columns (13) connected with the first conductive layer (4) and the second conductive layer (6) are respectively disposed inside the heat dissipation layer (2), the first base layer (3) and the second base layer (5).
3. The printed circuit board with good heat dissipation performance according to claim 2, wherein a through hole (14) is formed in the heat dissipation layer (2) at a position close to the conductive pillar (13).
4. The printed circuit board with good heat dissipation performance according to claim 1, wherein the first air guide tube (8) is fixedly connected with the fan (9) through an air guide cover (15).
5. The printed circuit board with good heat dissipation performance according to claim 1, wherein the heat dissipation sleeve (11) is filled with heat conductive silica gel (16), and a feed inlet (17) is formed at the top end of the heat dissipation sleeve (11).
6. A printed circuit board with good heat dissipation performance according to claim 1, wherein the bottom end of the heat sink (12) is provided with a plurality of heat dissipation fins (18).
7. The printed circuit board with good heat dissipation performance according to claim 6, wherein the heat dissipation layer (2), the first air duct (8), the second air duct (10), the heat dissipation sleeve (11), the heat dissipation fins (12) and the heat dissipation fins (18) are all made of copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021618480.5U CN212786009U (en) | 2020-08-06 | 2020-08-06 | Printed circuit board with good heat dissipation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021618480.5U CN212786009U (en) | 2020-08-06 | 2020-08-06 | Printed circuit board with good heat dissipation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212786009U true CN212786009U (en) | 2021-03-23 |
Family
ID=75050495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021618480.5U Active CN212786009U (en) | 2020-08-06 | 2020-08-06 | Printed circuit board with good heat dissipation performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212786009U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113677087A (en) * | 2021-08-20 | 2021-11-19 | 万安裕高电子科技有限公司 | High-heat-dissipation SMT and processing method thereof |
-
2020
- 2020-08-06 CN CN202021618480.5U patent/CN212786009U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113677087A (en) * | 2021-08-20 | 2021-11-19 | 万安裕高电子科技有限公司 | High-heat-dissipation SMT and processing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6324058B1 (en) | Heat-dissipating apparatus for an integrated circuit device | |
| CN108417546B (en) | Power electronic module | |
| CN212786009U (en) | Printed circuit board with good heat dissipation performance | |
| CN209787545U (en) | Printed circuit board | |
| CN103384465A (en) | Heat conducting system with electronic power element adhered on circuit board | |
| CN203250734U (en) | Chip queue radiator and chip array radiator which can replace chips | |
| CN111384011A (en) | Heat dissipation device and method | |
| US20040227230A1 (en) | Heat spreaders | |
| CN205355038U (en) | Heat pipe cooling ware structure of IGBT module in converter | |
| CN219019403U (en) | Structure for improving current capacity and optimizing heat dissipation of unmanned aerial vehicle electrically-tuned PCB | |
| CN212573098U (en) | Durable type circuit board suitable for fill electric pile | |
| CN203416495U (en) | Heat conduction system with electronic power components mounted on circuit board | |
| CN220383421U (en) | Power supply | |
| CN220326092U (en) | Hardware heat radiation structure | |
| CN218072232U (en) | Circuit board with water-cooling function | |
| CN221151828U (en) | Heat radiation structure of power device in controller | |
| CN219042314U (en) | Electronic product heat dissipation device | |
| CN211128756U (en) | High-temperature-resistant electronic device element | |
| CN211019837U (en) | Printed circuit board fast dispels heat | |
| CN213522893U (en) | High-temperature-resistant electronic device element for smart phone | |
| CN219107782U (en) | High heat conduction PCB circuit board | |
| CN209803724U (en) | Large core heat radiation module in MIMI-PC host | |
| CN215991724U (en) | Circuit board with heat dissipation function | |
| CN218959192U (en) | Heat radiation structure of circuit board in shell | |
| CN210868307U (en) | Energy-conserving single face heat dissipation PCB board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |