CN210868307U

CN210868307U - Energy-conserving single face heat dissipation PCB board

Info

Publication number: CN210868307U
Application number: CN201921709913.5U
Authority: CN
Inventors: 夏善福
Original assignee: Dongguan Hongyun Electronics Co ltd
Current assignee: Dongguan Hongyun Electronics Co ltd
Priority date: 2019-10-14
Filing date: 2019-10-14
Publication date: 2020-06-26
Anticipated expiration: 2029-10-14

Abstract

The utility model discloses an energy-conserving single face heat dissipation PCB board, including the PCB board body, the bottom of PCB board body is provided with a plurality of electronic components, the both ends of PCB board body all are provided with a plurality of mounting holes one respectively, the bottom of PCB board body is provided with the heating panel, the both ends of heating panel all be provided with respectively a plurality of with a mounting hole assorted mounting hole two, the heating panel with through a plurality of bolt fixed connection between the PCB board body, the nut is passed through to the one end of bolt fixed, the top of heating panel be provided with a plurality of with electronic components assorted cover shell, the inside packing of cover shell has heat conduction silica gel, one side of cover shell is provided with the silica gel injection hole, a plurality of louvres have been seted up on the heating panel, the bottom of heating panel is provided with a plurality of radiating fin. Has the advantages that: make the PCB board have good heat dispersion to need not extra power consumption, effectively practice thrift the electric energy.

Description

Energy-conserving single face heat dissipation PCB board

Technical Field

The utility model relates to a PCB board technical field particularly, relates to an energy-conserving single face heat dissipation PCB board.

Background

Pcb (printed Circuit board), which is called printed Circuit board in chinese, is an important electronic component, is a support for electronic components, and is a carrier for electrical connection of electronic components. It is called a "printed" circuit board because it is made using electronic printing. The PCB board can produce a large amount of heats in the course of the work, and current PCB board heat dispersion is not good, can influence the life of PCB board.

An effective solution to the problems in the related art has not been proposed yet.

SUMMERY OF THE UTILITY MODEL

To the problem among the correlation technique, the utility model provides an energy-conserving single face heat dissipation PCB board to overcome the above-mentioned technical problem that current correlation technique exists.

Therefore, the utility model discloses a specific technical scheme as follows:

an energy-saving single-side heat dissipation PCB comprises a PCB body, wherein the bottom end of the PCB body is provided with a plurality of electronic components, the two ends of the PCB body are respectively provided with a plurality of first mounting holes, the bottom of the PCB body is provided with a heat dissipation plate, a plurality of mounting holes II matched with the mounting holes I are respectively arranged at the two ends of the heat dissipation plate, the heat dissipation plate is fixedly connected with the PCB body through a plurality of bolts which are inserted into the first mounting hole and the second mounting hole, one end of the bolt is fixed by a nut, the top end of the heat dissipation plate is provided with a plurality of casing shells matched with the electronic components, the interior of the casing is filled with heat-conducting silica gel, one side of the casing is provided with a silica gel injection hole, a plurality of heat dissipation holes are formed in the heat dissipation plate, and a plurality of heat dissipation fins are arranged at the bottom end of the heat dissipation plate.

Further, the heat dissipation holes may be formed to have different diameters according to specific positions thereof on the heat dissipation plate.

Furthermore, a casing matched with the electronic component is arranged on the heat dissipation plate according to the position and the size of the electronic component, and the size of the casing is larger than that of the electronic component.

Furthermore, gaskets are respectively arranged between the bolt and the PCB body and between the nut and the heat dissipation plate.

Furthermore, an insulating sleeve is arranged between the bolt and the first mounting hole.

Further, the inside wall of cover shell is provided with seal gasket.

Furthermore, the gasket and the sealing gasket are made of insulating materials respectively.

The utility model has the advantages that: through setting up the energy-conserving single face heat dissipation PCB board that comprises mounting hole one, heating panel, mounting hole two, bolt, nut, cover shell, heat conduction silica gel, silica gel injection hole, louvre and radiating fin to make the PCB board have good heat dispersion, and need not additionally to use electricity, effectively practice thrift the electric energy.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an energy-saving single-sided heat dissipation PCB according to an embodiment of the present invention;

fig. 2 is a top view of a heat dissipating plate of an energy-saving single-sided heat dissipating PCB according to an embodiment of the present invention.

In the figure:

1. a PCB body; 2. an electronic component; 3. a first mounting hole; 4. a heat dissipation plate; 5. a second mounting hole; 6. a bolt; 7. a nut; 8. a housing; 9. heat conducting silica gel; 10. a silica gel injection hole; 11. heat dissipation holes; 12. a heat dissipating fin; 13. a gasket; 14. an insulating sleeve; 15. a gasket seal.

Detailed Description

For further explanation of the embodiments, the drawings are provided as part of the disclosure and serve primarily to illustrate the embodiments and, together with the description, to explain the principles of operation of the embodiments, and to provide further explanation of the invention and advantages thereof, it will be understood by those skilled in the art that various other embodiments and advantages of the invention are possible, and that elements in the drawings are not to scale and that like reference numerals are generally used to designate like elements.

According to the utility model discloses an embodiment provides an energy-conserving single face heat dissipation PCB board.

The first embodiment is as follows:

as shown in fig. 1-2, an energy-saving single-sided heat dissipation PCB according to an embodiment of the present invention comprises a PCB body 1, a plurality of electronic components 2 are disposed at the bottom end of the PCB body 1, a plurality of first mounting holes 3 are respectively disposed at both ends of the PCB body 1, a heat dissipation plate 4 is disposed at the bottom of the PCB body 1, a plurality of second mounting holes 5 matching with the first mounting holes 3 are respectively disposed at both ends of the heat dissipation plate 4, the heat dissipation plate 4 and the PCB body 1 are fixedly connected by a plurality of bolts 6 inserted into the first mounting holes 3 and the second mounting holes 5, one end of each bolt 6 is fixed by a nut 7, a plurality of casing shells 8 matching with the electronic components 2 are disposed at the top end of the heat dissipation plate 4, heat conductive silica gel 9 is filled in the casing shells 8, a silica gel injection hole 10 is disposed at one side of the casing shells 8, a plurality of heat dissipation holes 11 are formed in the heat dissipation plate 4, and a plurality of heat dissipation fins 12 are arranged at the bottom end of the heat dissipation plate 4.

The specific arrangement and function of the silica gel injection hole 10 will be described in detail below.

As shown in fig. 1, the silicone injection hole 10 is located at one side of the housing 8, so that the heat conductive silicone 9 can be periodically injected into one side of the housing 8 without detaching the heat dissipation plate 4 from the PCB body 1, thereby facilitating the use.

By means of the technical scheme, the energy-saving single-side heat dissipation PCB is formed by the first mounting hole 3, the second heat dissipation plate 4, the second mounting hole 5, the bolt 6, the nut 7, the casing 8, the heat conduction silica gel 9, the silica gel injection hole 10, the heat dissipation holes 11 and the heat dissipation fins 12, so that the PCB has good heat dissipation performance, extra electricity is not needed, and electric energy is effectively saved.

Example two:

as shown in fig. 1-2, the heat dissipation hole 11 can be opened to different diameters according to the specific position of the heat dissipation plate 4, a casing 8 matched with the position and size of the electronic component 2 is arranged on the heat dissipation plate 4 according to the position and size of the electronic component 2, the size of the casing 8 is larger than the size of the electronic component 2, gaskets 13 are respectively arranged between the bolt 6 and the PCB body 1 and between the nut 7 and the heat dissipation plate 4, insulating sleeves 14 are arranged between the bolt 6 and the first mounting hole 3, a sealing gasket 15 is arranged on the inner side wall of the casing 8, and the gaskets 13 and the sealing gasket 15 are respectively made of insulating materials.

As can be seen from fig. 1-2, a gasket 13 is respectively disposed between the bolt 6 and the PCB body 1 and between the nut 7 and the heat dissipation plate 4, an insulating sleeve 14 is disposed between the bolt 6 and the first mounting hole 3, and a sealing gasket 15 is disposed on an inner side wall of the casing 8, and the design of the gasket 13, the insulating sleeve 14 and the sealing gasket 15 is conventional and therefore will not be described in detail.

For the convenience of understanding the technical solution of the present invention, the following detailed description is made on the working principle or the operation mode of the present invention in the practical process.

When in actual application, mainly be electronic components 2 and produce the heat in PCB board body 1's use, the heat that electronic components 2 produced passes through on heat conduction silica gel 9 transmits heating panel 4 fast, then on transmitting radiating fin 12, can dispel the heat fast, when heat conduction silica gel 9 is not enough, through silica gel injection hole 10 to injection heat conduction silica gel 9 in the cover shell 8 to need not to dismantle heating panel 4, convenient to use.

To sum up, with the help of the above technical scheme of the utility model, through setting up the energy-conserving single face heat dissipation PCB board that comprises mounting hole one 3, heating panel 4, mounting hole two 5, bolt 6, nut 7, cover shell 8, heat conduction silica gel 9, silica gel injection hole 10, louvre 11 and radiating fin 12 to make the PCB board have good heat dispersion, and need not extra power consumption, effectively practice thrift the electric energy.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. An energy-saving single-side heat dissipation PCB is characterized by comprising a PCB body (1), wherein a plurality of electronic components (2) are arranged at the bottom end of the PCB body (1), a plurality of mounting holes I (3) are respectively formed at two ends of the PCB body (1), a heat dissipation plate (4) is arranged at the bottom of the PCB body (1), a plurality of mounting holes II (5) matched with the mounting holes I (3) are respectively formed at two ends of the heat dissipation plate (4), the heat dissipation plate (4) and the PCB body (1) are fixedly connected through a plurality of bolts (6) inserted into the mounting holes I (3) and the mounting holes II (5), one end of each bolt (6) is fixed through a nut (7), a plurality of casing shells (8) matched with the electronic components (2) are arranged at the top end of the heat dissipation plate (4), the heat dissipation structure is characterized in that heat conduction silica gel (9) is filled in the shell (8), a silica gel injection hole (10) is formed in one side of the shell (8), a plurality of heat dissipation holes (11) are formed in the heat dissipation plate (4), and a plurality of heat dissipation fins (12) are arranged at the bottom end of the heat dissipation plate (4).

2. An energy-saving single-sided heat dissipation PCB board as claimed in claim 1, wherein the heat dissipation holes (11) can be opened to different diameters according to their specific positions on the heat dissipation plate (4).

3. An energy-saving single-sided heat dissipation PCB board as claimed in claim 1, wherein a casing (8) is provided on the heat dissipation plate (4) according to the position and size of the electronic component (2), and the size of the casing (8) is larger than the size of the electronic component (2).

4. An energy-saving single-sided heat dissipation PCB board as claimed in claim 1, wherein gaskets (13) are respectively arranged between the bolt (6) and the PCB board body (1) and between the nut (7) and the heat dissipation plate (4).

5. An energy-saving single-sided heat dissipation PCB board as claimed in claim 1, wherein an insulating sleeve (14) is arranged between the bolt (6) and the first mounting hole (3).

6. An energy-saving single-sided heat-dissipating PCB as claimed in claim 4, wherein the inner side wall of the casing (8) is provided with a sealing gasket (15).

7. The PCB of claim 6, wherein the gasket (13) and the sealing gasket (15) are made of insulating materials.