CN221354866U

CN221354866U - Conduction machine case

Info

Publication number: CN221354866U
Application number: CN202323221740.1U
Authority: CN
Inventors: 陆益东; 李森; 徐兆光
Original assignee: Shanghai Tongrong Electronic Technology Co ltd
Current assignee: Shanghai Tongrong Electronic Technology Co ltd
Filing date: 2023-11-28
Publication date: 2024-07-16
Anticipated expiration: 2033-11-28

Abstract

The utility model discloses a conduction case which comprises a mounting frame (1), wherein a front end cover (2), side plates (3), a top plate (4) and a copper block plate (5) are respectively arranged on the outer side of the mounting frame (1), a plurality of mounting grooves (10) are formed in the mounting frame (1), mounting plates (1.1) are arranged on two sides of the mounting frame (1), a rear end plate (1.2) is further arranged at the rear end of the mounting frame (1), a heat dissipation cover plate (6) propped against the mounting plates (1.1) is arranged on the end faces of the plurality of mounting grooves (10), a plurality of heat dissipation grooves (7) are formed in the mounting plates (1.1), the heat dissipation grooves (7) extend from one end of the mounting plates (1.1) to the rear end plate (1.2) to form an L-shaped structure, heat dissipation pipes (8) are further arranged in the heat dissipation grooves (7), and the copper block plate (5) is a heat conducting piece. The utility model can effectively radiate heat of the functional modules in the sealed space without adopting the air cooling effect, thereby improving the application range of the device.

Description

Conduction machine case

Technical Field

The utility model relates to the technical field of communication equipment installation, in particular to a conductive chassis.

Background

Currently, communication devices generally include a power module, a signal acquisition module, a signal processing module, a data storage module, and the like. When in use, the modules are collectively and intensively arranged in the same box body for use, the modules in the box body are required to be subjected to heat dissipation treatment in the use process, and the air cooling mode is generally adopted for heat dissipation; however, when the device is used in a sealed space, the heat dissipation effect of the device is reduced due to the fact that the air cooling heat dissipation mode is affected by poor air fluidity, and therefore the use quality requirement of the device is affected.

Disclosure of Invention

The utility model aims to overcome the technical defects and provide a conduction case used in a closed space.

In order to solve the problems, the technical scheme of the utility model is as follows: the conduction case comprises a mounting frame, wherein a front end cover, a side plate, a top plate and a copper block plate are respectively arranged on the outer side of the mounting frame, and a plurality of mounting grooves are formed in the mounting frame;

The heat dissipation device comprises a mounting frame, wherein mounting plates are arranged on two sides of the mounting frame, a rear end plate is further arranged at the rear end of the mounting frame, heat dissipation cover plates propped against the mounting plates are arranged on end faces of a plurality of mounting grooves, a plurality of heat dissipation grooves are arranged on the mounting plates, the heat dissipation grooves extend from one ends of the mounting plates to the rear end plate and form an L-shaped structure, heat dissipation pipes are further arranged in the heat dissipation grooves, and the copper block plates are heat conduction pieces

Further, a plurality of radiating grooves are distributed in a staggered manner from top to bottom in sequence along the height direction of the mounting plate, and the radiating pipes are arranged in a flat structure.

Further, heat conduction silicone grease is respectively smeared on the contact parts of the inner walls of the radiating pipes and the radiating grooves.

Further, heat conduction silicone grease is coated at the contact position of the inner side surface of the copper block plate and the radiating pipe.

Further, the heat radiating pipes are respectively filled with phase-change heat conducting medium.

Further, a stabilizer bar is provided between the two said side mounting plates remote from the rear end plate.

Further, a bottom plate matched with the mounting plate and the rear end plate is arranged on the bottom surface of the mounting frame.

Compared with the prior art, the utility model has the advantages that:

1. Under the cooperation of the heat dissipation cover plate on the end face of the mounting groove, the heat dissipation grooves on the mounting plate and the rear end plate and the heat dissipation pipes, the heat generated by the module during operation can be firstly conducted to the heat dissipation cover plate under the action of the copper block plate, and is conducted to the heat dissipation pipes through the mounting plate, and finally, the heat is rapidly dissipated through the heat dissipation cover plate and the heat dissipation pipes;

2. The flat structure of the radiating pipe and the phase change heat conducting medium filled in the radiating pipe can increase the contact area between the heat pipe and the mounting plates on two sides of the equipment through the flat radiating pipe, so that the heat conduction efficiency is increased, and the heat can be rapidly transferred to the other end through the phase change heat conducting medium under the condition that one end of the radiating pipe is provided with heat, so that the transmission efficiency of the device is improved.

Drawings

Fig. 1 is an overall construction diagram of the present utility model.

Fig. 2 is a first perspective exploded view of the present utility model.

Fig. 3 is a second perspective exploded view of the present utility model.

FIG. 4 is an enlarged view of the utility model at A in FIG. 3

As shown in the figure: 1. a mounting frame; 1.1, mounting plate; 1.2, a rear end plate; 1.3, a bottom plate; 2. a front end cover; 3. a side plate; 4. a top plate; 5. a copper block plate; 6. a heat-dissipating cover plate; 7. a heat sink; 8. a heat radiating pipe; 9. a stabilizer bar; 10. a mounting groove; 11. a functional module; 12. and a power supply module.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model; all other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

As shown in fig. 1 to 4, a conductive chassis includes a mounting frame 1, wherein a front end cover 2, a side plate 3, a top plate 4 and a copper block plate 5 are respectively disposed at the outer side of the mounting frame 1 and form a box structure together, a plurality of mounting slots 10 are disposed in the mounting frame 1, and function modules 11 and power modules 12 thereof are effectively connected through the mounting slots 10, and the mounting frame 1 further includes a GPU module (user providing), a network switching module (user providing), a main control module (user providing), a storage module (user providing), an interface module (user providing), a device back plate and the like. The internal module configuration can be optionally configured according to the functional requirements of the user on the equipment.

The both sides of installing frame 1 are equipped with mounting panel 1.1, and the rear end still is equipped with back end plate 1.2, be equipped with the heat dissipation apron 6 that offsets with mounting panel 1.1 on the terminal surface of a plurality of mounting grooves 10, and heat dissipation apron 6 tip and functional module 11, power module 12's heat dissipation department laminating sets up mutually, be equipped with a plurality of heat dissipation grooves 7 on the mounting panel 1.1, heat dissipation groove 7 extends to on the back end plate 1.2 and forms L type structure from mounting panel 1.1 one end, still be equipped with cooling tube 8 in the heat dissipation groove 7, still be full of phase change heat conduction medium in a plurality of cooling tubes 8 respectively, through phase change heat conduction medium, under the circumstances that the one end of cooling tube 8 has heat, can be rapidly with the heat transfer to the other end, thereby improve the conveying efficiency of this device, copper plate 5 is the heat conduction piece and is red copper piece material, still be equipped with stabilizer bar 9 between two side direction mounting panels 1.1 of keeping away from back end plate 1.2, stabilizer bar 9 can increase the connection stability of installing frame 1, still be equipped with on the mounting frame 1 bottom plate 1.3 that cooperatees with mounting panel 1.1, back end plate 1.2.

The heat dissipation grooves 7 are distributed in a staggered manner from top to bottom in the height direction of the mounting plate 1.1, the heat dissipation pipes 8 are arranged in a flat structure, the contact area between the heat pipes and the mounting plates on two sides of the equipment can be increased through the flat heat dissipation pipes, the heat conduction efficiency is increased, the heat conduction silicone grease with high heat conductivity is respectively smeared at the contact points of the inner walls of the heat dissipation pipes 8 and the heat dissipation grooves 7, thus the heat of the functional modules 11 and the power modules 12 absorbed on the mounting plates 1.1 on two sides can be rapidly conducted into the heat dissipation pipes 8, the inner side surface of the copper block plate 5 is attached to the end part of the heat dissipation pipe 8, the heat conduction silicone grease with high heat conductivity is smeared at the contact points of the copper block plate 5 and the heat dissipation pipes 8, the heat on the copper block plate 5 at the rear part of the equipment is rapidly taken away in actual installation.

In specific use, the device is placed into the sealed space for use after the equipment is completed according to actual needs, in the use, heat generated by the functional module 11 and the power module 12 is firstly conducted to the mounting plates 1.1 on two sides through the heat dissipation cover plates 6 matched with the functional module, under the action of heat conduction silicone grease, heat on the mounting plates 1.1 can be rapidly conducted into the heat dissipation pipes 8, under the action of phase change heat conduction media in the heat dissipation pipes 8, the heat is conducted to the other ends of the heat dissipation pipes 8, under the action of the heat conduction silicone grease, the heat is rapidly conducted onto the copper block plates 5, finally, heat is rapidly taken away through the external cooling part, through the heat conduction design, the device adopts complete conduction type heat dissipation operation, and under the condition of no fan heat dissipation, the heat generated by the functional module can also be rapidly taken away during operation, and the heat dissipation requirement of the whole device is met.

The utility model and its embodiments have been described above with no limitation, and the actual construction is not limited to the embodiments of the utility model as shown in the drawings. In summary, if one of ordinary skill in the art is informed by this disclosure, a structural manner and an embodiment similar to the technical solution should not be creatively devised without departing from the gist of the present utility model.

Claims

1. The utility model provides a conduction machine case, includes installing frame (1), the outside of installing frame (1) is equipped with front end housing (2), curb plate (3), roof (4) and copper plate (5) respectively, a plurality of mounting grooves (10), its characterized in that have been seted up in installing frame (1):

The heat dissipation device is characterized in that mounting plates (1.1) are arranged on two sides of the mounting frame (1), rear end plates (1.2) are further arranged at the rear ends, heat dissipation cover plates (6) propped against the mounting plates (1.1) are arranged on the end faces of the mounting grooves (10), a plurality of heat dissipation grooves (7) are arranged on the mounting plates (1.1), the heat dissipation grooves (7) extend from one ends of the mounting plates (1.1) to the rear end plates (1.2) and form an L-shaped structure, heat dissipation pipes (8) are further arranged in the heat dissipation grooves (7), and the copper block plates (5) are heat conduction pieces.

2. A conductive chassis according to claim 1, wherein: the heat dissipation grooves (7) are sequentially staggered from top to bottom along the height direction of the mounting plate (1.1), and the heat dissipation pipes (8) are arranged in a flat structure.

3. A conductive chassis according to claim 2, wherein: and heat conduction silicone grease is respectively smeared on the contact parts of the inner walls of the radiating pipes (8) and the radiating grooves (7).

4. A conductive chassis according to any one of claims 1-3, wherein: and heat conduction silicone grease is also smeared at the contact part of the inner side surface of the copper block plate (5) and the radiating pipe (8).

5. A conductive chassis according to claim 1, wherein: the heat radiating pipes (8) are also respectively filled with phase-change heat conducting medium.

6. A conductive chassis according to claim 1, wherein: a stabilizer bar (9) is also arranged between the two mounting plates (1.1) which are far away from the rear end plate (1.2).

7. A conductive chassis according to claim 1, wherein: the bottom surface of the mounting frame (1) is also provided with a bottom plate (1.3) which is matched with the mounting plate (1.1) and the rear end plate (1.2).