CN210630127U - Upper cover heat dissipation type fanless network management machine - Google Patents
Upper cover heat dissipation type fanless network management machine Download PDFInfo
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- CN210630127U CN210630127U CN201921235020.1U CN201921235020U CN210630127U CN 210630127 U CN210630127 U CN 210630127U CN 201921235020 U CN201921235020 U CN 201921235020U CN 210630127 U CN210630127 U CN 210630127U
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Abstract
The utility model discloses an upper cover heat dissipation type fanless network management machine, which comprises a main shell and a cover plate covered on the main shell; the main shell is provided with an accommodating cavity, and a circuit board is arranged in the accommodating cavity; the inner side wall of the cover plate is connected with a heat dissipation module used for dissipating heat of the circuit board, and the heat dissipation module comprises a heat conduction strip and a heat conduction block; one side of the heat conducting strip is connected with one side of the heat conducting block, and the other side of the heat conducting strip is connected with the inner side wall of the cover plate; the other side of the heat conducting block is connected with the circuit board; the outer side wall of the cover plate is provided with a heat dissipation rib; borrow this, it combines the design of heat dissipation muscle through heat conduction strip, heat conduction piece, dispels the heat to inside circuit board, has satisfied the heat dissipation needs, has guaranteed the operation of normal work, and need not the fan, has simplified inner structure, possesses better dustproof performance and seal.
Description
Technical Field
The utility model relates to a network equipment field technique especially indicates a no fan network management machine of upper cover heat dissipation type.
Background
With the continuous development and progress of network devices, more and more network managers are provided. Network management machine among the prior art can produce a large amount of heats at the internal component in the use, need dispel the heat to the internal component, in order to guarantee the operation of its normal work, for this reason, network management machine among the prior art can set up radiator fan in its inside usually in order to dispel the heat to the internal component, but radiator fan is too big, lead to occupation space great, influence the installation overall arrangement of internal component, and need set up the wind gap on network management machine's casing to radiator fan, lead to the dust to get into inside the network management machine easily, also can not adopt the radiating network management machine of forced air cooling form a bit, lead to the heat of its during operation can't in time distribute, influence its normal work and life.
Therefore, a new technology needs to be developed to solve the above problems.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model discloses to the disappearance that prior art exists, its main objective provides a no fan network management machine of upper cover heat dissipation type, and it combines the design of heat dissipation muscle through heat conduction strip, heat conduction piece, dispels the heat to inside circuit board, has satisfied the heat dissipation needs, has guaranteed the operation of normal work, and need not the fan, has simplified inner structure, possesses better dustproof performance and seal.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a top cover heat dissipation type fanless network management machine comprises a main shell and a cover plate covered on the main shell;
the main shell is provided with an accommodating cavity, and a circuit board is arranged in the accommodating cavity; the inner side wall of the cover plate is connected with a heat dissipation module used for dissipating heat of the circuit board, and the heat dissipation module comprises a heat conduction strip and a heat conduction block; one side of the heat conducting strip is connected with one side of the heat conducting block, and the other side of the heat conducting strip is connected with the inner side wall of the cover plate; the other side of the heat conducting block is connected with the circuit board; the outer side wall of the cover plate is provided with heat dissipation ribs.
As a preferred scheme, be provided with a plurality of constant head tanks that are used for fixing a position the heat conduction strip on the inside wall of apron, correspondingly, the heat conduction strip has a plurality of, and a plurality of heat conduction strips adapt to in the corresponding constant head tank respectively.
As a preferred scheme, one side of each heat conduction strip is connected to one side of the heat conduction block, and the other side of each heat conduction strip is connected to the inner side wall of the corresponding positioning groove.
As a preferable scheme, a connection block for connecting a heat conduction block is arranged on the circuit board, one side of the connection block is connected above the circuit board, and the other side of the heat conduction block is tightly attached to the other side of the connection block.
As a preferred scheme, a power supply, a hard disk and an expansion board are further arranged in the accommodating cavity, and the power supply, the hard disk and the expansion board are all electrically connected to the circuit board.
As a preferred scheme, the heat dissipation ribs are provided with a plurality of heat dissipation ribs, and the plurality of heat dissipation ribs are arranged on the outer side wall of the cover plate at intervals.
As a preferable scheme, the contact part of the heat conduction strip and the heat conduction block is coated with first heat conduction glue; and the contact part of the heat conduction strip and the cover plate is coated with second heat conduction glue.
As a preferable scheme, a first connecting hole is formed in the heat conducting block, and correspondingly, a second connecting hole is formed in the inner side wall of the cover plate, and the first connecting hole and the second connecting hole are connected through screws in a locking mode.
Preferably, the heat conducting strips and the heat conducting blocks are made of copper.
As a preferred scheme, the cover plate is an aluminum profile cover plate.
Compared with the prior art, the utility model obvious advantage and beneficial effect have, particularly, can know by above-mentioned technical scheme, it mainly is through heat conduction strip, the design of heat conduction piece combination heat dissipation muscle, with heat on the circuit board transmit to the heat conduction piece in proper order, heat conduction strip, the apron, the heat dissipation muscle, thereby make the produced heat of inside circuit board can in time give off through the apron, the heat dissipation needs have been satisfied, the operation of normal work has been guaranteed, and need not the fan, the inner structure has been simplified, possesses better dustproof performance and seal.
To more clearly illustrate the structural features and technical means of the present invention and the specific objects and functions achieved thereby, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Drawings
FIG. 1 is a schematic diagram of the overall structure of an embodiment of the present invention;
FIG. 2 is an exploded view of an embodiment of the present invention;
FIG. 3 is another angular schematic view of the structure shown in FIG. 2;
FIG. 4 is another exploded view of an embodiment of the present invention;
fig. 5 is another angular schematic of the structure shown in fig. 4.
The attached drawings indicate the following:
10. main body case 20, cover plate
21. Heat radiation rib 22, positioning groove
30. Circuit board 40, heat conduction strip
50. Heat conducting block 60, joining block
70. Power supply 80, hard disk
90. Expansion board 101 and first connection hole
102. And a second connection hole.
Detailed Description
Fig. 1 to 5 show specific structures of embodiments of the present invention.
First, it should be noted that in the following description, some terms such as "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience of describing technical solutions of the present invention and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation or be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
The upper cover heat dissipation type fanless network management machine comprises a main shell 10 and a cover plate 20 covered on the main shell; the main housing has an accommodating chamber in which a circuit board 30 is disposed; the inner side wall of the cover plate 20 is connected with a heat dissipation module for dissipating heat of the circuit board 30, and the heat dissipation module comprises a heat conduction strip 40 and a heat conduction block 50; one side of the heat conducting strip 40 is connected to one side of the heat conducting block 50, and the other side is connected to the inner side wall of the cover plate 20; the other side of the heat conducting block 50 is connected with the circuit board 30; the outer side wall of the cover plate 20 is provided with heat dissipating ribs 21.
Specifically, a plurality of positioning grooves 22 for positioning the heat conducting strips 40 are arranged on the inner side wall of the cover plate 20, correspondingly, a plurality of heat conducting strips 40 are provided, and the plurality of heat conducting strips 40 are respectively adapted to the corresponding positioning grooves 22; one side of each heat conduction strip 40 is connected with one side of the heat conduction block 50, and the other side is connected with the inner side wall of the corresponding positioning groove 22; the heat conducting block 50 is exposed below the cover plate 20; the heat conducting block 50 is provided with a first connecting hole 101, correspondingly, the inner side wall of the cover plate 20 is provided with a second connecting hole 102, and the first connecting hole 101 and the second connecting hole 102 are locked and connected through screws; here, the second connection hole 102 is a blind hole.
The circuit board 30 is provided with a connecting block 60 for connecting the heat conducting block 50, one side of the connecting block 60 is connected to the upper side of the circuit board 30, and the other side of the heat conducting block 50 is tightly attached to the other side of the connecting block 60. Therefore, the heat on the circuit board 30 can be sequentially transmitted to the heat conducting block 50, the heat conducting strip 40 and the cover plate 20 through the connecting block 60 by arranging the connecting block 60, and thus, the heat dissipation of the circuit board 30 can be realized without designing a fan.
The accommodating cavity is also internally provided with a power supply 70, a hard disk 80 and an expansion board 90, wherein the power supply 70, the hard disk 80 and the expansion board 90 are all electrically connected to the circuit board 30, in addition, the expansion board 90 is also provided with a connecting block 60, and the connecting block 60 is correspondingly provided with a heat conducting block 50 and a heat conducting strip 40, so that the heat of main heating elements on the circuit board 30 can be dissipated.
In addition, in this embodiment, the heat dissipation ribs 21 have a plurality of, and a plurality of heat dissipation ribs 21 are arranged on the outer side wall of the cover plate 20 at intervals, so that a heat dissipation groove is formed between two adjacent heat dissipation ribs 21, and thus through the design of the heat dissipation ribs 21, the heat dissipation area of the cover plate 20 can be increased, and the overall heat dissipation performance is improved.
In this embodiment, preferably, the contact portion of the heat conducting strip 40 and the heat conducting block 50 is coated with a first heat conducting adhesive, and the contact portion of the heat conducting strip 40 and the cover plate 20 is coated with a second heat conducting adhesive, which has excellent heat conducting performance and excellent bonding strength, so as to ensure stable connection among the heat conducting strip 40, the heat conducting block 50, and the cover plate 20; and, preferably, the heat conduction strip 40, the heat conduction block 50 and the cover plate 20 are connected together by welding, of course, other methods can be adopted, and only the heat conduction strip 40, the heat conduction block 50 and the cover plate 20 need to be connected together, which is not described herein.
Also, preferably, the heat conduction strips 40 and the heat conduction blocks 50 are made of copper, so as to increase the heat conduction effect of the heat conduction strips 40 and the heat conduction blocks 50; the cover plate 20 is preferably an aluminum section cover plate 20; of course, the heat conduction strips 40, the heat conduction blocks 50, and the cover plate 20 are not limited to the above materials.
To sum up, the design of the utility model is mainly characterized in that the heat on the circuit board is sequentially transferred to the heat conducting block, the heat conducting strip, the cover plate and the heat dissipation rib through the design of combining the heat conducting strip and the heat conducting block with the heat dissipation rib, so that the heat generated by the internal circuit board can be dissipated through the cover plate in time, the heat dissipation requirement is met, the normal operation is ensured, the fan is not needed, the internal structure is simplified, and the dustproof performance and the sealing performance are better; through this kind of heat radiation structure, it can satisfy the heat dissipation demand of high-power consumption network management machine.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any slight modifications, equivalent changes and modifications made by the technical spirit of the present invention to the above embodiments are all within the scope of the technical solution of the present invention.
Claims (10)
1. The utility model provides an upper cover heat dissipation type no fan network management machine which characterized in that: comprises a main shell and a cover plate covered on the main shell;
the main shell is provided with an accommodating cavity, and a circuit board is arranged in the accommodating cavity; the inner side wall of the cover plate is connected with a heat dissipation module used for dissipating heat of the circuit board, and the heat dissipation module comprises a heat conduction strip and a heat conduction block; one side of the heat conducting strip is connected with one side of the heat conducting block, and the other side of the heat conducting strip is connected with the inner side wall of the cover plate; the other side of the heat conducting block is connected with the circuit board; the outer side wall of the cover plate is provided with heat dissipation ribs.
2. The top-cover heat-dissipation fanless network manager of claim 1, wherein: be provided with a plurality of constant head tanks that are used for fixing a position the heat conduction strip on the inside wall of apron, correspondingly, the heat conduction strip has a plurality of, and a plurality of heat conduction strips adapt to respectively in the corresponding constant head tank.
3. The top-cover heat-dissipation fanless network manager of claim 2, wherein: one side of each heat conduction strip is connected to one side of the heat conduction block, and the other side of each heat conduction strip is connected to the inner side wall of the corresponding positioning groove.
4. The top-cover heat-dissipation fanless network manager of claim 1, wherein: the circuit board is provided with a connecting block used for connecting the heat conducting block, one side of the connecting block is connected above the circuit board, and the other side of the heat conducting block is tightly attached to the other side of the connecting block.
5. The top-cover heat-dissipation fanless network manager of claim 1, wherein: the accommodating cavity is also internally provided with a power supply, a hard disk and an expansion board which are electrically connected with the circuit board.
6. The top-cover heat-dissipation fanless network manager of claim 1, wherein: the heat dissipation rib has a plurality of, and a plurality of heat dissipation rib interval arranges on the lateral wall of apron.
7. The top-cover heat-dissipation fanless network manager of claim 1, wherein: the contact part of the heat conduction strip and the heat conduction block is coated with first heat conduction glue; and the contact part of the heat conduction strip and the cover plate is coated with second heat conduction glue.
8. The top-cover heat-dissipation fanless network manager of claim 1, wherein: the heat conduction block is provided with a first connecting hole, correspondingly, a second connecting hole is formed in the inner side wall of the cover plate, and the first connecting hole and the second connecting hole are connected through screws in a locking mode.
9. The top-cover heat-dissipation fanless network manager of claim 1, wherein: the heat conducting strips and the heat conducting blocks are made of copper.
10. The top-cover heat-dissipation fanless network manager of claim 1, wherein: the cover plate is an aluminum profile cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921235020.1U CN210630127U (en) | 2019-08-01 | 2019-08-01 | Upper cover heat dissipation type fanless network management machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921235020.1U CN210630127U (en) | 2019-08-01 | 2019-08-01 | Upper cover heat dissipation type fanless network management machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210630127U true CN210630127U (en) | 2020-05-26 |
Family
ID=70764668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921235020.1U Active CN210630127U (en) | 2019-08-01 | 2019-08-01 | Upper cover heat dissipation type fanless network management machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210630127U (en) |
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2019
- 2019-08-01 CN CN201921235020.1U patent/CN210630127U/en active Active
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