CN219164597U

CN219164597U - Cell-phone medium plate structure

Info

Publication number: CN219164597U
Application number: CN202223535179.XU
Authority: CN
Inventors: 邓良玉; 朱耀峰; 钱鑫
Original assignee: Wujiang Leiou Industry Co ltd
Current assignee: Wujiang Leiou Industry Co ltd
Priority date: 2022-12-29
Filing date: 2022-12-29
Publication date: 2023-06-09
Anticipated expiration: 2032-12-29

Abstract

The utility model discloses a mobile phone middle plate structure, which comprises a middle plate main body and a heat dissipation structure; the periphery of the inner surface of the middle plate main body is provided with a flanging, and the middle position of the inner surface of the middle plate main body is provided with a containing groove for installing a mobile phone motherboard; the heat radiation structure is including the symmetry setting two heat conduction grooves in the holding tank both sides, the one end and the holding tank of heat conduction groove are linked together, be equipped with the heat dissipation opening that is linked together with the other end of heat conduction groove on the turn-ups, be equipped with the heat conduction piece between heat dissipation opening and the holding tank, the heat conduction piece is the T shape, the heat conduction piece includes first heat conduction limit and the second heat conduction limit of body coupling, first heat conduction limit is located the holding tank, first heat conduction limit is used for contacting with mobile phone motherboard, the second heat conduction limit is located the heat conduction groove, the second heat conduction limit stretches into in the heat dissipation opening. According to the mobile phone middle plate structure, the heat dissipation structure is arranged, so that heat generated by a mobile phone main board arranged in a middle plate main body can be rapidly dissipated, the purpose of reducing the working temperature of a mobile phone is achieved, and the service life is prolonged.

Description

Cell-phone medium plate structure

Technical Field

The utility model relates to a middle plate structure of a mobile phone.

Background

Along with the development of communication technology, smart phones are becoming more and more popular, the demand of smart phones is also greatly increased, and the smart phones generally consist of a screen, a main board, a mobile phone middle board and a battery. But the existing mobile phone middle plate has low heat dissipation efficiency, so that heat of a mobile phone main plate arranged on the mobile phone middle plate cannot be timely dissipated, the mobile phone temperature is increased, and the normal operation of the mobile phone is affected. Therefore, an improvement on the structure of the middle plate of the existing mobile phone is needed to improve the heat dissipation efficiency.

Disclosure of Invention

The utility model aims to provide a mobile phone middle plate structure which is reasonable in structure, and by arranging a heat dissipation structure, heat generated by a mobile phone main board arranged in a middle plate main body can be rapidly dissipated, so that the purpose of reducing the working temperature of a mobile phone is achieved, and the service life of the mobile phone is prolonged.

In order to achieve the above purpose, the technical scheme of the utility model is to design a mobile phone middle plate structure, which comprises a middle plate main body and a heat dissipation structure;

the periphery of the inner surface of the middle plate main body is provided with a flanging, and the middle position of the inner surface of the middle plate main body is provided with a containing groove for installing a mobile phone motherboard;

the heat radiation structure includes two heat conduction grooves of symmetry setting in the holding tank both sides, the one end and the holding tank of heat conduction groove are linked together, be equipped with the heat dissipation opening that is linked together with the other end of heat conduction groove on the turn-ups, be equipped with the heat conduction piece between heat dissipation opening and the holding tank, this heat conduction piece is T shape, and this heat conduction piece includes first heat conduction limit and the second heat conduction limit of body coupling, first heat conduction limit is located the holding tank, and first heat conduction limit is used for contacting with the cell-phone mainboard, the second heat conduction limit is located the heat conduction groove, and the one end that first heat conduction limit was kept away from to the second heat conduction limit stretches into in the heat dissipation opening.

Preferably, a plurality of heat dissipation holes are formed in the outer surface of the middle plate main body at positions corresponding to the accommodating grooves.

Preferably, the plurality of heat dissipation holes are arranged at equal intervals, and the heat dissipation holes are in a strip shape.

Preferably, a first heat insulation pad is arranged between the first heat conduction edge and the groove wall of the accommodating groove, and a second heat insulation pad is arranged between the second heat conduction edge and the groove wall of the heat conduction groove.

Preferably, the heat conducting member is a copper heat conducting member.

Preferably, the inner surface of the middle plate main body is provided with four bud holes, and the four bud holes are respectively arranged at the corners of the middle plate main body.

The utility model has the advantages and beneficial effects that: the utility model provides a cell-phone medium plate structure, its is rational in infrastructure, through setting up heat radiation structure, can make the produced heat of cell-phone mainboard of installing in the medium plate main part distribute fast, reaches the purpose that reduces cell-phone operating temperature, is favorable to increase of service life. And, through setting up the hole of drawing buds, be convenient for carry out fixed mounting with the medium plate main part.

Drawings

Fig. 1 is a schematic view of the inner surface of a midplane body in accordance with the present utility model.

Fig. 2 is an enlarged view at a in fig. 1.

Fig. 3 is an enlarged view at B in fig. 1.

Fig. 4 is a schematic view of the outer surface of the main body of the middle plate in the present utility model.

Detailed Description

The following describes the embodiments of the present utility model further with reference to the drawings and examples. The following examples are only for more clearly illustrating the technical aspects of the present utility model, and are not intended to limit the scope of the present utility model.

The technical scheme of the utility model is as follows:

as shown in fig. 1 to 4, a middle plate structure of a mobile phone includes a middle plate body 1 and a heat dissipation structure;

the periphery of the inner surface of the middle plate main body 1 is provided with a flanging 2, and the middle position of the inner surface of the middle plate main body 1 is provided with a containing groove 3 for installing the mobile phone motherboard 100;

the heat radiation structure includes two heat conduction grooves 4 of symmetry setting in holding tank 3 both sides, the one end and the holding tank 3 of heat conduction groove 4 are linked together, be equipped with the heat dissipation opening 5 that is linked together with the other end of heat conduction groove 4 on the turn-ups 2, be equipped with the heat conduction spare between heat dissipation opening 5 and the holding tank 3, this heat conduction spare is T shape, and this heat conduction spare includes first heat conduction limit 6 and the second heat conduction limit 7 of an organic whole connection, first heat conduction limit 6 is arranged in holding tank 3, and first heat conduction limit 6 is used for contacting with mobile phone motherboard 100, second heat conduction limit 7 is arranged in heat conduction groove 4, and the one end that first heat conduction limit 6 was kept away from to second heat conduction limit 7 stretches into in the heat dissipation opening 5. Through adopting above-mentioned scheme, by the contact of the first heat conduction limit 6 of heat conduction spare and the mobile phone motherboard 100 of installing in holding tank 3, the heat that makes mobile phone motherboard 100 in-process production conducts to second heat conduction limit 7 through first heat conduction limit 6, and the heat is outwards discharged through the heat dissipation opening 5 on the turn-ups 2 by second heat conduction limit 7 again to reach radiating purpose.

Further, a plurality of heat dissipation holes 8 are formed in the outer surface of the middle plate main body 1 at positions corresponding to the accommodating grooves 3. Through adopting above-mentioned scheme, the heat that still accessible louvre 8 produced in the cell-phone mainboard 100 working process outwards discharges to further promote the radiating effect.

Further, the heat dissipation holes 8 are arranged at equal intervals, and the heat dissipation holes 8 are in a strip shape.

Further, a first heat insulation pad 9 is arranged between the first heat conduction edge 6 and the groove wall of the accommodating groove 3, and a second heat insulation pad 10 is arranged between the second heat conduction edge 7 and the groove wall of the heat conduction groove 4. By adopting the scheme, the heat insulation pad can effectively prevent heat from radiating to other electronic components on the middle plate main body 1.

Further, the heat conducting piece is a copper heat conducting piece.

Further, four sprouting holes 11 are formed in the inner surface of the middle plate main body 1, and the four sprouting holes 1 are respectively formed in corners of the middle plate main body 1. By adopting the above-described configuration, the middle plate main body 1 can be fixedly mounted through the sprouting holes 11.

The foregoing is merely a preferred embodiment of the present utility model, and it should be noted that it will be apparent to those skilled in the art that several modifications and variations can be made without departing from the technical principle of the present utility model, and these modifications and variations should also be regarded as the scope of the utility model.

Claims

1. The mobile phone middle plate structure is characterized by comprising a middle plate main body and a heat dissipation structure;

2. The mobile phone middle plate structure according to claim 1, wherein a plurality of heat dissipation holes are formed in the outer surface of the middle plate body at positions corresponding to the accommodating grooves.

3. The mobile phone middle plate structure according to claim 2, wherein the plurality of heat dissipation holes are arranged at equal intervals, and the heat dissipation holes are in a strip shape.

4. The mobile phone middle plate structure according to claim 3, wherein a first heat insulation pad is arranged between the first heat conduction edge and the groove wall of the accommodating groove, and a second heat insulation pad is arranged between the second heat conduction edge and the groove wall of the heat conduction groove.

5. The cell phone midplane structure of claim 4, wherein the thermally conductive member is a copper thermally conductive member.

6. The cell phone middle plate structure according to claim 1, wherein the middle plate body is provided with four bud holes on an inner surface thereof, the four bud holes being respectively provided at corners of the middle plate body.