CN214676027U

CN214676027U - 5G intelligent power supply structure

Info

Publication number: CN214676027U
Application number: CN202120564506.0U
Authority: CN
Inventors: 周泉
Original assignee: Hunan Kangpu Communication Technology Co ltd
Current assignee: Hunan Kangpu Communication Technology Co ltd
Priority date: 2021-03-19
Filing date: 2021-03-19
Publication date: 2021-11-09
Anticipated expiration: 2031-03-19

Abstract

The utility model discloses a 5G intelligent power supply structure, which comprises a housin, inside circuit mainboard, COM board, SIM card and the keysets of working a telephone switchboard of being equipped with of casing, circuit mainboard respectively with COM board and wiring keysets electric connection, the SIM card locate on the casing lateral wall and with COM board electric connection, the keysets of working a telephone switchboard with pass the power connection electric connection of casing lateral wall, be equipped with the radio frequency socket on the casing lateral wall. The utility model discloses a design shell structure, set up circuit mainboard, COM board, SIM card and wiring keysets inside the casing jointly, with the unified shell of circuit board sharing of multiple power, utilize a plurality of power to connect the input and the output that have realized multiple power.

Description

5G intelligent power supply structure

Technical Field

The utility model belongs to the technical field of power supply unit, concretely relates to 5G intelligent power supply structure.

Background

Current power of little standing mainly uses forced convection heat dissipation, lead to inside circuit plate can't be isolated with external environment, though can be rain-proof, when nevertheless rainy moist weather, the atmospheric pressure difference that forced convection leads to still can make the box inside or condense the drop of water on the circuit board, seriously influence equipment stability in use, simultaneously because use forced convection design, need additionally increase mechanical parts and electrical component, like fan, refrigeration plant and pipeline etc. lead to the equipment volume increase, inconvenient installation.

The existing micro-station power supply usually has a structure which can only realize power output, the installation is inconvenient, the shell generally uses metal plates, and the installation strength is not enough.

SUMMERY OF THE UTILITY MODEL

In order to overcome the problem among the prior art, the utility model provides a 5G intelligent power supply structure, unified structure, with the unified shell of the circuit board sharing of multiple power, realized the input and the output of multiple power, use the design of naturally dispelling the heat simultaneously, reduced the quantity of equipment electrical part and machine part, increase the installation convenience and the stability of equipment.

In order to achieve the above object, the utility model discloses a following technical scheme realizes:

the utility model provides a 5G intelligent power supply structure, inside circuit mainboard, COM board, SIM card and the patch board of working a telephone switchboard of being equipped with of casing, circuit mainboard respectively with COM board and patch board electric connection of working a telephone switchboard, the SIM card locate on the casing lateral wall and with COM board electric connection, the patch board of working a telephone switchboard with pass the power connection electric connection of casing lateral wall, be equipped with the radio frequency socket on the casing lateral wall.

As an optional implementation manner, in the 5G intelligent power supply structure provided by the utility model, be equipped with multiseriate heat dissipation substrate on the casing, adjacent two are listed as form the radiating groove between the heat dissipation substrate, dispel the inside heat of casing through the heat dissipation substrate.

As an optional implementation manner, in the 5G intelligent power supply structure provided by the utility model, the casing includes first casing and second casing, first casing is the cavity structure, the second casing is the apron structure.

As an optional implementation manner, in the 5G intelligent power supply structure provided by the utility model, the heat dissipation substrate is provided on the first casing, the arrangement direction of the heat dissipation substrate is the same as the length direction of the first casing.

As an optional implementation manner, in the 5G intelligent power supply structure provided by the utility model, a sealing strip is arranged between the first casing and the second casing to form a sealed butt joint.

As an optional implementation manner, in the 5G intelligent power supply structure provided by the utility model, the first casing and the second casing are detachably connected through a bolt structure.

As an optional implementation manner, in the 5G intelligent power supply structure provided by the utility model, the circuit board is installed through the heat-conducting plate inside the casing, the circuit board with be equipped with the heat dissipation material layer between the heat-conducting plate.

As an optional implementation manner, in the 5G intelligent power supply structure provided by the utility model, be equipped with the SIM card apron on the casing lateral wall, the SIM card apron with be equipped with the apron sealing strip between the casing lateral wall.

As an optional implementation manner, in the 5G intelligent power supply structure provided by the utility model, a waterproof net mouth is arranged on the side wall of the shell.

As an optional implementation manner, in the 5G intelligent power supply structure provided by the utility model, a waterproof breathable assembly is arranged on the casing.

As an optional implementation manner, in the 5G intelligent power supply structure provided by the utility model, a handle is arranged on the upper portion of the casing, and the handle is fixed on the casing through screws.

In the present application, the SIM, the english name Subscriber Identity Module, and the SIM card in the present application are used as the Subscriber Identity Module; COM board, english name cluster communication port, serial communication port, COM board in this application uses as the interface board

The utility model discloses beneficial effect as follows:

(1) the utility model discloses a 5G intelligent power supply structure through designing shell structure, sets up circuit mainboard, COM board, SIM card and wiring keysets inside same casing jointly, with the unified shell of circuit board sharing of multiple power, utilizes a plurality of power connection to realize the input and the output of multiple power.

(2) The utility model discloses an among the 5G intelligent power supply structure, the design of using forced convection among the current product has been removed, through adopting the shell that has high heat dissipation function, and at the external design heat dissipation substrate of shell, utilize natural convection to dispel the heat and realized the inside sealed with external environment of casing, the atmospheric pressure difference of having avoided using forced convection design to produce leads to the box inside or on the circuit board condensation drop of water, seriously influence equipment stability in use, avoided additionally increasing mechanical parts and electrical components, the equipment volume has been reduced, be favorable to the installation more.

Drawings

Fig. 1 is an explosion diagram of a 5G intelligent power supply structure disclosed by the utility model;

fig. 2 is a perspective view of a 5G intelligent power supply structure disclosed by the utility model;

FIG. 3 is a perspective view of another perspective of the 5G smart power architecture;

the above reference numerals:

1. a circuit main board; 2. a COM plate; 3. a SIM card; 4. a wiring adapter plate; 5. a power supply connector; 6. a radio frequency socket;

31. a SIM card cover plate; 32. a cover plate sealing strip;

71. a first housing; 72. a second housing; 73. a sealing strip; 8. a heat-dissipating substrate; 9. a waterproof net port; 10. a waterproof breathable component; 11. a handle.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

As shown in fig. 1-3, this embodiment provides a 5G intelligent power supply structure, which includes a housing, wherein a circuit board 1, a COM board 2, an SIM card 3, and a wiring adapter board 4 are disposed inside the housing, the circuit board 1 is electrically connected to the COM board 2 and the wiring adapter board 4, the SIM card 3 is disposed on a side wall of the housing and electrically connected to the COM board 2, the wiring adapter board 4 is electrically connected to a power connector 5 penetrating through the side wall of the housing, and a radio frequency socket 6 is disposed on the side wall of the housing.

In a specific implementation process, as shown in fig. 1, the circuit main board 1 is installed on the upper portion of the housing, the COM board 2 and the SIM card 3 are installed on the side wall of the housing far away from the circuit main board 1, the wiring adapter board 4 is installed on the lower portion of the housing, the side wall of the lower portion of the housing is provided with a plurality of power connectors 5 for electrically connecting with the wiring adapter board 4 to realize input and output of multiple powers, and the side wall of the lower portion of the housing is further provided with a radio frequency socket 6 for connecting an antenna, 5G or WiFi.

As a further improved embodiment, the housing includes a first housing 71 and a second housing 72, wherein the first housing 71 is a cavity structure, and the second housing 72 is a cover structure.

As a further modified embodiment, a sealing strip 73 is provided between the first casing 71 and the second casing 72 to form a sealing interface.

In this embodiment, the cavity structure of the first housing 71 is a rectangular parallelepiped structure, the circuit board 1, the COM board 2, the SIM card 3, and the wiring adapter board 4 are installed in an inner cavity of the rectangular parallelepiped structure, the second housing 72 is disposed thereon, the first housing 71 and the second housing 72 are detachably connected by a bolt structure, a hexagon socket head cap screw M6 is used for fixing in this embodiment, and a sealing strip 73 is disposed between the first housing 71 and the second housing 72 to form a sealed butt joint.

As a further improved embodiment, a plurality of rows of heat dissipating substrates 8 are provided on the housing, a heat dissipating groove is formed between two adjacent rows of heat dissipating substrates 8, the heat inside the housing is dissipated through the heat dissipating substrates 8, further, the heat dissipating substrates 8 are provided on the first housing 71, and the arrangement direction of the heat dissipating substrates 8 is the same as the length direction of the first housing 71.

In the specific implementation process, the plurality of heat dissipation substrates 8 are arranged on the first shell 71, the arrangement direction of the heat dissipation substrates is consistent with the length direction of the shell, a heat dissipation channel is formed between every two adjacent rows of heat dissipation substrates 8, the heat inside the shell is dissipated through large-area contact of the heat dissipation substrates 8 and air, condensation of water drops inside the shell or on a circuit board caused by forced convection heat dissipation is avoided, the use stability of equipment is influenced, meanwhile, additional mechanical parts and electrical parts such as a fan, refrigeration equipment, pipelines and the like are avoided, and the size of the equipment is reduced.

As a further improved embodiment, the circuit main board 1 is installed inside the casing through a heat conducting plate, and a heat dissipating material layer is disposed between the circuit main board 1 and the heat conducting plate.

In the concrete implementation process, casing internally mounted has the heat-conducting plate, and circuit board 1 installs on the heat-conducting plate, and in this embodiment, the heat-conducting plate is the aluminum alloy plate, still scribbles the heat sink material between circuit board 1 and the heat-conducting plate, and in this embodiment, the heat sink material is heat dissipation silicone grease for directly leading-in the shell with the heat that circuit board produced, externally give off through heat dissipation substrate 8 on the shell.

As a further improved embodiment, a SIM card cover plate 31 is arranged on the side wall of the shell, and a cover sealing strip 32 is arranged between the SIM card cover plate 31 and the side wall of the shell.

In this embodiment, the SIM card 3 is installed on the side wall of the housing far away from the circuit main board 1, the SIM card cover plate 31 is installed on the side wall of the housing outside, and the cover sealing strip 2 is further installed between the SIM card cover plate 31 and the side wall of the housing for waterproofing.

As a further improved embodiment, a waterproof net port 9 and a waterproof breathable assembly 10 are arranged on the side wall of the shell.

In the specific implementation process, the side wall of the lower part of the shell is provided with a waterproof net port 9 and a waterproof breathable component 10, and in this embodiment, the waterproof breathable component 10 is a waterproof breathable valve and is used for ensuring the pressure inside the shell to be balanced, so that the tightness of the shell is not affected by the change of external air pressure.

As a further improved embodiment, the upper part of the shell is provided with a handle 11, and the handle 11 is fixed on the shell through screws, so that the carrying and the transferring are convenient.

The utility model discloses an installation as follows:

the circuit main board 1 is installed on the first shell 71 through screws according to the positions of the installation holes, then the COM board 2, the SIM card 3 and the wiring adapter plate 4 are installed on the first shell 71 through screws according to the positions of the installation holes in sequence, the waterproof net port 9, the radio frequency socket 6, the power connector 5 and the waterproof vent valve 10 are installed on the side wall of the shell through corresponding hole positions and are fixed through nuts with parts, after the internal circuit module is wired, the sealing strip 73 is installed on the first shell 71 and is pressed tightly, then the second shell 72 is fixed on the first shell 71 through the hexagon socket head cap screws M5, finally the cover plate sealing strip 32 is installed on the SIM card cover plate 31, and the handle 11 is installed on the upper portion of the shell.

The foregoing is a more detailed description of the invention, taken in conjunction with the specific preferred embodiments thereof, and it is not intended that the invention be limited to the specific embodiments disclosed herein. To the utility model belongs to the field of the ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement, all should regard as belonging to the utility model discloses a protection scope.

Claims

1. The utility model provides a 5G intelligent power supply structure, its characterized in that, includes the casing, inside circuit mainboard, COM board, SIM card and the wiring keysets of being equipped with of casing, the circuit mainboard respectively with COM board and wiring keysets electric connection, the SIM card locate on the casing lateral wall and with COM board electric connection, the wiring keysets with pass the power connector electric connection of casing lateral wall, be equipped with the radio frequency socket on the casing lateral wall.

2. The 5G intelligent power supply structure according to claim 1, wherein a plurality of rows of heat dissipation substrates are arranged on the housing, and a heat dissipation groove is formed between the heat dissipation substrates in two adjacent rows.

3. The 5G intelligent power supply structure according to claim 2, wherein the housing comprises a first housing and a second housing, the first housing is a cavity structure, and the second housing is a cover structure.

4. The 5G intelligent power supply structure according to claim 3, wherein the heat dissipation substrates are arranged on the first shell, and the arrangement direction of the heat dissipation substrates is consistent with the length direction of the first shell.

5. The 5G intelligent power supply structure according to claim 3, wherein a sealing strip is arranged between the first shell and the second shell to form a sealed butt joint.

6. A5G intelligent power supply structure according to any one of claims 1-5, wherein the circuit main board is mounted inside the casing through a heat conducting plate, and a heat radiating material layer is arranged between the circuit main board and the heat conducting plate.

7. The 5G intelligent power supply structure according to claim 1, wherein a SIM card cover plate is arranged on the side wall of the shell, and a cover plate sealing strip is arranged between the SIM card cover plate and the side wall of the shell.

8. The 5G intelligent power supply structure according to claim 1, wherein a waterproof net port is arranged on a side wall of the shell.

9. The 5G intelligent power supply structure according to claim 1, wherein a waterproof and breathable component is arranged on the shell.

10. The 5G intelligent power supply structure according to claim 1, wherein a handle is arranged on the upper portion of the casing, and the handle is fixed on the casing through screws.