CN211090423U - Electronic equipment with heat dissipation function - Google Patents
Electronic equipment with heat dissipation function Download PDFInfo
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- CN211090423U CN211090423U CN201922194900.5U CN201922194900U CN211090423U CN 211090423 U CN211090423 U CN 211090423U CN 201922194900 U CN201922194900 U CN 201922194900U CN 211090423 U CN211090423 U CN 211090423U
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Abstract
The utility model discloses an electronic equipment with heat dissipation function, including metal casing, heating element, metal support frame and mainboard, form the holding chamber in the metal casing, metal support frame locates the holding intracavity will first cavity and second cavity are separated into to the holding chamber, heating element locates just be located on the metal support frame first cavity, heating element is equipped with first conductive part, the mainboard is located the second cavity, correspond on the mainboard first conductive part is equipped with the second conductive part, the second conductive part with first conductive part is pegged graft. By adopting the scheme of the embodiment, the heating element and the mainboard can be separated, so that the heat emitted by the heating element is not gathered around the mainboard any more, and the operation of electronic components on the mainboard at normal working temperature is facilitated. In addition, the heat conducting component and the metal support frame are utilized to transfer heat to the metal shell, so that the heat dissipation effect of the electronic equipment can be effectively improved.
Description
Technical Field
The utility model relates to a heat radiation structure technical field especially relates to an electronic equipment with heat dissipation function.
Background
At present, in electronic devices (for example, mapping equipment and vehicle-mounted equipment), heating elements (for example, a power supply, a heating IC, a radio station, and the like) are often built in, and in order to electrically connect the heating elements and a main board, there are two mounting methods, one of which is to electrically connect the heating elements and the main board by inserting terminals into each other, and then to fix the heating elements to the main board by screws, bolts, and the like; and secondly, the heating element is arranged on the bottom shell of the equipment, and then the heating element is electrically connected with the mainboard through an electric wire. However, in the first mode, because the heating element generates a large amount of heat when working, the heating element and the mainboard are mounted together, the heat generated by the heating element can be directly gathered around the mainboard, so that the electronic components on the mainboard work under high heat, and the electronic components on the mainboard are easy to operate and break down after a long time. And adopt above-mentioned mode two, not only be unfavorable for the electric connection between heating element and the mainboard and be connected, produce the line ball risk easily, also higher to the space requirement of equipment drain pan moreover.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model discloses electronic equipment with heat dissipation function can effectively separate heating element and mainboard, not only is favorable to the heat dissipation, but also is favorable to the electricity of heating element and mainboard to be connected.
In order to realize the above-mentioned purpose, the embodiment of the utility model discloses electronic equipment with heat dissipation function, including metal casing, heating element, metal support frame and mainboard, form the holding chamber in the metal casing, metal support frame locates the holding intracavity will first cavity and second cavity are separated into to the holding chamber, heating element locates just be located on the metal support frame first cavity, heating element is equipped with first conductive part, the mainboard is located the second cavity, correspond on the mainboard first conductive part is equipped with the second conductive part, the second conductive part with first conductive part is pegged graft.
Preferably, the metal shell and the metal support frame are made of aluminum alloy, magnesium alloy or magnesium-aluminum alloy, so that the heat conduction and heat dissipation effects are good.
As an optional implementation manner, in an embodiment of the present invention, the electronic device further includes a heat conducting component, the heat conducting component is disposed on the heating element, and the heat conducting component is connected to the metal shell.
As an optional implementation manner, in an embodiment of the present invention, the heat conducting member includes a first heat conducting portion and a second heat conducting portion, the first heat conducting portion is attached to the heating element, the second heat conducting portion extends upward from the first heat conducting portion and is attached to the inner wall surface of the accommodating chamber, and a first heat dissipation path is formed between the first heat conducting portion, the second heat conducting portion and the inner wall surface of the accommodating chamber.
As an optional implementation manner, in an embodiment of the present invention, a heat conductive silica gel is disposed on the second heat conduction portion, and the heat conductive silica gel is attached to an inner wall surface of the accommodating cavity.
As an optional implementation manner, in an embodiment of the present invention, the first cavity is formed between the upper surface of the metal supporting frame and the top surface of the accommodating cavity, the second cavity is formed between the bottom surface of the accommodating cavity and the lower surface of the metal supporting frame, and the heating element is attached to the upper surface of the metal supporting frame.
As an optional implementation manner, in an embodiment of the present invention, the metal supporting frame extends outward to form a first connection portion, and the inner wall surface of the accommodating cavity is provided with a second connection portion corresponding to the first connection portion, and the second connection portion is connected to the first connection portion;
and a second heat dissipation path is formed among the upper surface of the metal support frame, the first connecting part and the second connecting part.
As an optional implementation manner, in the embodiment of the present invention, the first connecting portion includes a first step portion and a second step portion, the first step portion is from the bottom of the metal supporting frame extends outward, the second step portion is from the bottom of the first step portion extends outward, the first step portion is equipped with a first step surface, the first step surface is parallel to the lower surface of the metal supporting frame and has a distance, the second step portion is equipped with a second step surface and a third step surface, the second step surface is connected to the first step surface, the main board is connected to the first step surface and the second step surface, the third step surface is arranged opposite to the second step surface, and the third step surface is connected to the second connecting portion.
As an optional implementation manner, in an embodiment of the present invention, the second conductive portion extends upward from the main board to the first cavity to be plugged with the first conductive portion.
As an optional implementation manner, in an embodiment of the present invention, the first conductive part is a connection port, and the second conductive part is a connection terminal, or the connection port is provided on the second conductive part, and the first conductive part is a connection terminal.
As an alternative implementation, in the embodiment of the present invention, the heat generating element is a radio station, a power supply, or a heat generating IC.
Compared with the prior art, the beneficial effects of the utility model reside in that:
(1) the heat dissipation effect is good. The utility model discloses electronic equipment with heat dissipation function separates into first cavity and second cavity through metal brace frame with metal casing's holding chamber, then sets up heating element at first cavity, and the mainboard setting is at the second cavity to can separate heating element and mainboard, make the heat that heating element gived off no longer gather around the mainboard, the radiating effect is good, is favorable to electronic components on the mainboard to move under normal operating temperature.
(2) The installation is convenient and the mainboard and the electric connection of heating element are convenient. The first conductive part is arranged on the heating element, the second conductive part is arranged on the main board, and the second conductive part is utilized to upwards extend from the main board to the first cavity to be connected with the first conductive part in an inserting mode, so that the electric conduction of the main board and the heating element is facilitated, and the wiring of the main board and the heating element is simplified without a wiring mode.
In addition, set up the heat conduction part of being connected with metal casing on heating element, utilize heat conduction part to conduct the heat that heating element sent to metal casing to can in time distribute away the heat that heating element upper portion sent. And to the heat that heating element lower part sent, then through set up the first connecting portion of being connected with metal casing on the metal support frame, by metal support frame, first connecting portion with heat transfer to metal casing, and then distribute away. That is, adopt the scheme of this embodiment, heating element's heat can in time be given off, no longer gathers inside metal casing, and the radiating effect is good.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is an exploded schematic view of an electronic device with a heat dissipation function according to the present embodiment;
fig. 2 is a schematic view of the internal connection of the electronic device with a heat dissipation function according to the present embodiment;
fig. 3 is an enlarged view at a in fig. 2.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are used primarily to better describe the invention and its embodiments, and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in the present invention can be understood by those of ordinary skill in the art as appropriate.
Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Furthermore, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the specific nature and configuration may be the same or different), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.
The technical solution of the present invention will be further described with reference to the following embodiments and the accompanying drawings.
Referring to fig. 1 to 3, an embodiment of the present invention provides an electronic device 100 with a heat dissipation function, including a metal housing 10, a heating element 20, a metal supporting frame 30 and a main board 40. An accommodating cavity is formed in the metal shell 10, the metal support frame 30 is arranged in the accommodating cavity and divides the accommodating cavity into a first cavity 11 and a second cavity 12, the heating element 20 is arranged on the metal support frame 30 and located in the first cavity 11, and the heating element 20 is provided with a first conductive part 21. The main board 40 is disposed in the second cavity 12, and a second conductive portion 41 is disposed on the main board 40 corresponding to the first conductive portion 21, wherein the second conductive portion 41 is plugged into the first conductive portion 21.
Adopt the electronic equipment 100 with heat dissipation function of this embodiment, through set up metal support frame 30 in metal casing 10, utilize metal support frame 30 can separate into first cavity 11 and second cavity 12 with the inside holding chamber of metal casing 10, locate first cavity 11 and second cavity 12 respectively with heating element 20 and mainboard 40, thereby can separate mainboard 40 and heating element 20, not only can reduce the signal interference of heating element 20 to electronic components on mainboard 40, the heat that also can avoid heating element 20 to send simultaneously gathers on mainboard 40 and leads to electronic components to work under high temperature for a long time and make the condition of present operation trouble. Meanwhile, the connection between the metal support frame 30 and the metal shell 10 is utilized, so that the heat generated by the heating element 20 can be conducted to the metal shell 10 for heat dissipation, and the heat dissipation effect is good. In addition, the first conductive part 21 of the heating element 20 is inserted into the second conductive part 41 of the motherboard 40, which is also beneficial to the electrical conduction between the motherboard 40 and the heating element 20, and the conduction mode is fast and convenient.
It is appreciated that the electronic device 100 may be a mapping device, an in-vehicle device, or the like. The heat generating component 20 may be a power supply, a heat generating IC, a station, etc. within the electronic device 100. The metal casing 10 may be an outer casing of the device, and the material thereof may be metal aluminum, aluminum alloy, magnesium alloy or magnesium-aluminum alloy, so as to have a good heat dissipation effect.
In the embodiment, when the metal supporting frame 30 is disposed in the metal housing 10, the first cavity 11 is formed between the upper surface 31 of the metal supporting frame and the top surface of the accommodating cavity, and the second cavity 12 is formed between the bottom surface of the accommodating cavity and the lower surface of the metal supporting frame 30. That is, when the metal supporting frame 30 is disposed in the metal casing 10, the metal casing 10 is divided into the first cavity 11 and the second cavity 12 disposed up and down. Specifically, the metal supporting frame 30 may be approximately in a shell shape, and the bottom surface of the accommodating cavity is covered by the metal supporting frame, so as to form the second cavity 12 between the bottom surface of the accommodating cavity and the main board 40, and the main board 40 is disposed on the bottom surface of the accommodating cavity and located in the second cavity 12, so that the main board 40 can be separated from the heating element 20, thereby not only effectively preventing the heat generated by the heating element 20 from being collected around the main board 40, but also avoiding the interference of the heating element 20 on the electronic components on the main board 40.
Further, in order to facilitate electrical conduction between the heating element 20 and the main board 40, the second conductive portion 41 may extend upward from the main board 40 to the first cavity 11 to be plugged with the first conductive portion 21. Specifically, the first conductive part 21 may be a connection port provided on the heat generating element 20, and the second conductive part 41 may be a connection terminal provided protruding on the main board 40, so as to implement plugging. Alternatively, the first conductive part 21 is a terminal, the second conductive part 41 is protruded on the main board 40, and the second conductive part 41 is provided with a connection port, and the connection port is plugged with the terminal.
The mode of inserting the conductive parts replaces the traditional mode of connecting wires, the connection mode is quicker and more reliable, and the wiring design in the metal shell 10 can be simplified.
In this embodiment, in order to improve the heat dissipation effect of the electronic device 100, the electronic device 100 further includes a heat conducting member 50, the heat conducting member 50 may be disposed on the heat generating element 20, and the heat conducting member 50 is connected to the metal housing 10 for conducting the heat generated by the heat generating element 20 to the metal housing 10. Specifically, the heat conducting member 50 is located in the first cavity 11, and includes a first heat conducting portion 51 and a second heat conducting portion 52, where the first heat conducting portion 51 is used to attach to the heating element 20, the second heat conducting portion 52 extends upward from the first heat conducting portion 51 and attaches to the inner wall surface of the accommodating cavity, and a second heat dissipation path is formed between the first heat conducting portion 51, the second heat conducting portion 52 and the inner wall surface of the accommodating cavity, so that the heat emitted by the heating element 20 can be dissipated outward along the second heat dissipation path, thereby achieving heat conduction to the metal housing and further dissipating to the external environment. That is, by further providing the heat conduction member 50 on the heating element 20, the heat emitted from the heating element 20 can be conducted to the metal case 10 by the heat conduction member 50, and then emitted through the metal case 10.
Further, in order to facilitate heat conduction, the second heat conduction portion 52 is provided with a heat conduction silica gel 53, and the heat conduction silica gel 53 is attached to the inner wall surface of the accommodating cavity, so that heat can be conducted to the accommodating cavity through the heat conduction silica gel 53, and further dissipated through the metal shell 10.
In the present embodiment, since the heating element 20 is disposed on the metal supporting frame 30, in order to conduct the heat generated by the heating element 20 to the metal casing 10 by using the metal supporting frame 30 for emission, the metal supporting frame 30 extends outward to form a first connection portion 32, the inner wall surface of the accommodating cavity is provided with a second connection portion 13 corresponding to the first connection portion 32, and the second connection portion 13 is connected to the first connection portion 32. That is, the first connection portion 32 provided at the outer side of the metal supporting frame 30 is connected to the second connection portion 13 of the metal shell 10 by the first connection portion 32, so that the metal supporting frame 30 is connected to the metal shell 10, and thus, when the heat generating component 20 is disposed on the upper surface 31 of the metal supporting frame 30, a second heat dissipation path for dissipating heat generated by the heat generating component 20 is formed among the upper surface 31 of the metal supporting frame 30, the first connection portion 32 and the second connection portion 13.
Specifically, the first connecting portion 32 is a multi-step extending outwardly from the metal supporting frame 30, and includes a first step portion 32a and a second step portion 32b, the first step portion 32a may extend outwardly from the bottom of the metal supporting frame 30, and the second step portion 32b extends outwardly from the bottom of the first step portion 32 a. The first step portion 32a is provided with a first step surface 321, and the first step surface 321 is parallel to the lower surface of the metal supporting frame 30 and has a distance therebetween. The second stepped portion 32b is provided with a second stepped surface 322 and a third stepped surface 323, the second stepped surface 322 is connected to the first stepped surface 321, the main plate 40 is connected to the first stepped surface 321 and the second stepped surface 322, the second stepped surface 322 is provided opposite to the third stepped surface 323, and the third stepped surface 323 is connected to the second connecting portion 13. That is to say, when the main board 40 is disposed in the second cavity 12, the main board 40 does not directly contact with the lower surface of the metal supporting frame 30, but has a distance therebetween, so as to avoid the situation that the heat is directly transferred to the lower surface due to the heating element 20 being directly disposed on the upper surface 31 of the metal supporting frame 30, and then the main board 40 is heated, thereby effectively blocking the influence of the heat of the heating element 20 on the main board 40.
Further, the second connecting portion 13 is a step disposed on the bottom surface of the accommodating cavity, and a fourth step surface 131 is disposed corresponding to the third step surface 323, and the third step surface 323 is attached to the fourth step surface 131. In this way, the heat generated by the heating element 20 can be transferred to the first step surface 321 of the first step portion 32a via the upper surface 31 of the metal supporting frame 30, then transferred to the second step surface 322 and the third step surface 323 via the first step surface 321, and further transferred to the fourth step surface 131 via the third step surface 323 to be emitted. That is, the upper surface 31, the first step surface 321, the second step surface 322, the third step surface 323, and the fourth step surface 131 of the metal supporting frame 30 constitute the second heat dissipation path, which can transfer and dissipate part of the heat generated by the heating element 20 attached to the upper surface 31 of the metal supporting frame 30.
The utility model discloses electronic equipment with heat dissipation function separates into first cavity and second cavity through metal brace frame with metal casing's holding chamber, then sets up heating element at first cavity, and the mainboard setting is at the second cavity to can separate heating element and mainboard, make the heat that heating element gived off no longer gather around the mainboard. Then through set up the heat-conducting part on heating element and be connected to metal casing, form first heat dissipation route to and through being connected of metal support frame and metal casing, form second heat dissipation route, thereby can send via first heat dissipation route to the heat in the first cavity, the heat in the second cavity can send via second heat dissipation route, and the radiating effect is good, is favorable to electronic components on the mainboard to move under normal operating temperature.
The electronic device with a heat dissipation function disclosed in the embodiments of the present invention is described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the description of the above embodiments is only used to help understand the electronic device with a heat dissipation function and its core idea; meanwhile, for the general technical personnel in the field, according to the idea of the present invention, there are changes in the specific implementation and application scope, and in summary, the content of the present specification should not be understood as the limitation of the present invention.
Claims (10)
1. The utility model provides an electronic equipment with heat dissipation function, its characterized in that, includes metal casing, heating element, metal support frame and mainboard, form the holding chamber in the metal casing, metal support frame locates the holding intracavity and will the holding chamber is separated into first cavity and second cavity, heating element locates on the metal support frame and be located first cavity, heating element is equipped with first conductive part, the mainboard is located the second cavity, correspond on the mainboard first conductive part is equipped with the second conductive part, the second conductive part with first conductive part is pegged graft.
2. The electronic device of claim 1, further comprising a thermal conductive member disposed on the heat generating element, the thermal conductive member being connected to the metal housing.
3. The electronic device according to claim 2, wherein the heat conducting member includes a first heat conducting portion attached to the heat generating element and a second heat conducting portion extending upward from the first heat conducting portion and attached to an inner wall surface of the accommodating chamber, and a first heat dissipation path is formed between the first heat conducting portion and the inner wall surface of the accommodating chamber.
4. The electronic device of claim 3, wherein the second heat conducting portion is provided with a heat conducting silica gel, and the heat conducting silica gel is attached to an inner wall surface of the accommodating cavity.
5. The electronic device according to any one of claims 1 to 4, wherein the first cavity is formed between an upper surface of the metal supporting frame and a top surface of the accommodating cavity, the second cavity is formed between a bottom surface of the accommodating cavity and a lower surface of the metal supporting frame, and the heating element is attached to the upper surface of the metal supporting frame.
6. The electronic device of claim 5, wherein the metal supporting frame is extended outward to form a first connecting portion, an inner wall surface of the accommodating cavity is provided with a second connecting portion corresponding to the first connecting portion, and the second connecting portion is connected with the first connecting portion;
and a second heat dissipation path is formed among the upper surface of the metal support frame, the first connecting part and the second connecting part.
7. The electronic device according to claim 6, wherein the first connecting portion includes a first step portion and a second step portion, the first step portion extends outward from the bottom of the metal support frame, the second step portion extends outward from the bottom of the first step portion, the first step portion is provided with a first step surface, the first step surface is parallel to the lower surface of the metal support frame and has a distance therebetween, the second step portion is provided with a second step surface and a third step surface, the second step surface is connected to the first step surface, the main board is connected to the first step surface and the second step surface, the third step surface is arranged opposite to the second step surface, and the third step surface is connected to the second connecting portion.
8. The electronic device of claim 5, wherein the second conductive portion extends upward from the motherboard to the first cavity to mate with the first conductive portion.
9. The electronic device according to claim 8, wherein the first conductive part is a connection port and the second conductive part is a connection terminal, or wherein a connection port is provided on the second conductive part and the first conductive part is a connection terminal.
10. The electronic device of any of claims 1-4, wherein the heat generating component is a station, a power supply, or a heat generating IC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922194900.5U CN211090423U (en) | 2019-12-09 | 2019-12-09 | Electronic equipment with heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922194900.5U CN211090423U (en) | 2019-12-09 | 2019-12-09 | Electronic equipment with heat dissipation function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211090423U true CN211090423U (en) | 2020-07-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922194900.5U Active CN211090423U (en) | 2019-12-09 | 2019-12-09 | Electronic equipment with heat dissipation function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211090423U (en) |
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2019
- 2019-12-09 CN CN201922194900.5U patent/CN211090423U/en active Active
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