CN209822622U - A chip packaging structure - Google Patents

Abstract

The utility model relates to a chip packaging structure, which comprises a casing, at least one chip arranged in the casing, at least one mounting substrate arranged in the casing for chip installation and corresponding to the chip, and arranged on both sides of the casing The conductive connection part; the conductive connection part includes at least one first conductive connection part and at least one second conductive connection part; at least one first conductive connection part is arranged on one side or both sides of each mounting substrate and penetrates toward the outside of the housing out; at least one second conductive connection portion is arranged on one side of one or more mounting substrates and passes out toward the outside of the housing; each second conductive connection portion includes two conductive pins that are separated and arranged side by side and arranged on the corresponding A heat conduction part is provided between adjacent conductive pins for heat conduction; the heat conduction part is at least partly located outside the casing, so that the heat of the chip can be dissipated. The chip packaging structure has the advantages of simple structure, good heat conduction and heat dissipation effects.

Description

A chip packaging structure

technical field

The utility model relates to a packaging structure, in particular to a chip packaging structure.

Background technique

In the integrated circuit manufacturing process, it is generally necessary to package the chip. When the chip is packaged, the chip is usually placed in the casing, and the pins are exposed from both sides of the casing, and each pin is separated and independently set. , it is generally only used for electrical conduction or signal transmission, and it cannot dissipate the heat of the chip and dissipate heat from the chip. Therefore, the heat dissipation effect of the existing chip packaging structure is relatively low.

Utility model content

The technical problem to be solved by the utility model is to provide an improved chip packaging structure.

The technical solution adopted by the utility model to solve the technical problem is: to construct a chip packaging structure, including a housing, at least one chip arranged in the housing, arranged in the housing for chip installation and compatible with the At least one mounting substrate corresponding to the chip, and conductive connection parts arranged on both sides of the housing;

The conductive connection part includes at least one first conductive connection part and at least one second conductive connection part; the at least one first conductive connection part is arranged on one side or both sides of each of the mounting substrates and faces the shell Passing out from the outside of the body; the at least one second conductive connection part is disposed on one side of one or more of the mounting substrates and passes out toward the outside of the housing;

Each of the second conductive connection parts includes two conductive pins that are separated and arranged side by side, and a heat conduction part arranged between the adjacent conductive pins for heat conduction; the heat conduction part is at least partially located at the outside the casing.

Preferably, the conductive pin and the heat conduction part are integrally formed.

Preferably, the first conductive connection portion and the second conductive connection portion disposed on the same side of the installation substrate are integrally formed with the installation substrate.

Preferably, the first conductive connection part includes a first pin;

The conductive pins include second pins; the second pins include a first bent section that is connected to the mounting substrate and is bent and set, and is disposed on the first bent section away from the mounting substrate one end and a second bent section bent from the first bent section;

The heat conduction portion is disposed between the first bent sections of two adjacent conductive pins.

Preferably, the at least one first conductive connection part is arranged on one side of the casing, and the at least one second conductive connection part is arranged on the other side of the casing;

The at least one first conductive connection portion located on one side of the housing includes 8 first pins or 12 first pins;

The at least one second conductive connection part located on the other side of the housing includes 8 or 12 of the second pins.

Preferably, the at least one mounting substrate includes one mounting substrate; the at least one first conductive connection part is disposed on one or both sides of the mounting substrate; the at least one second conductive connection part is disposed on the mounting substrate substrate side.

Preferably, the at least one mounting substrate includes several mounting substrates; the at least one first conductive connection part is provided on one or both sides of each mounting substrate; the at least one first conductive connection part is provided on the several mounting substrates. One or more of the substrates are mounted on one side of the substrate.

Preferably, the at least one second conductive connection part includes a plurality of second conductive connection parts; the heat conduction part between two adjacent second conductive connection parts extends toward the opposite side and connect to each other

Preferably, a lead is provided between the chip and the first conductive connection part to realize electrical connection and/or signal transmission.

Preferably, the material of the mounting substrate and the second conductive connection part includes a heat dissipation base material.

Implementing the chip packaging structure of the utility model has the following beneficial effects: the chip packaging structure is provided with conductive connection parts on both sides of the housing where the chip is provided, and through the two conductive connection parts of the second conductive connection part of the conductive connection part. A heat conduction part is arranged between the conductive pins, and the heat conduction part is at least partly arranged outside the casing, so that the heat on the mounting substrate can be exported, and then the chip can be dissipated to improve the heat dissipation effect of the chip packaging structure.

Description of drawings

The utility model will be further described below in conjunction with accompanying drawing and embodiment, in the accompanying drawing:

Fig. 1 is a structural schematic diagram of the first embodiment of the chip packaging structure of the present invention;

Fig. 2 is a structural schematic diagram of the other side of the first embodiment of the chip packaging structure of the utility model shown in Fig. 1;

Fig. 3 is a structural schematic diagram of the second embodiment of the chip packaging structure of the present invention;

Fig. 4 is a structural schematic diagram of the other side of the second embodiment of the chip packaging structure of the utility model shown in Fig. 3;

FIG. 5 is a structural schematic diagram of a third embodiment of the chip packaging structure of the present invention.

Detailed ways

In order to have a clearer understanding of the technical features, purposes and effects of the utility model, the specific implementation of the utility model is described in detail with reference to the accompanying drawings.

1 to 2 show the first embodiment of the chip packaging structure of the present invention. The chip package structure can package the chip, and has the advantages of simple structure and good heat dissipation effect.

As shown in Figures 1 to 2, the chip packaging structure includes a housing 11, at least one chip 13, at least one mounting substrate 12, and a conductive connection portion 14; the at least one chip 13 is arranged in the housing 11, the The mounting substrate 12 is arranged in the casing 11 , which is arranged correspondingly to the chip 13 , and which can be used for the chip 13 to be mounted on. The conductive connection part 14 is arranged on both sides of the housing 11, it passes through the housing 11, partly exposed outside the housing 11, and it is connected with the chip 13, and it can conduct electrical conduction or signal transmission.

Further, the casing 11 may include an upper casing and a lower casing. The upper case and the lower case can be detachably connected for easy assembly and disassembly. Specifically, the upper case and the lower case may be connected by a buckle. Of course, it can be understood that in some other embodiments, the casing 11 is not limited to include an upper casing and a lower casing. The casing 11 can be made of insulating material, specifically, in this embodiment, the casing 11 can be made of plastic material. Of course, it can be understood that in some other embodiments, the casing 11 is not limited to be made of plastic material.

Further, the at least one mounting substrate 12 may include one or several mounting substrates 12 arranged side by side in the housing 11; in this embodiment, preferably, the at least one mounting substrate 12 includes There are two mounting substrates 12; the mounting substrate 12 and the chip 13 are provided in one-to-one correspondence, so as to facilitate the mounting of the chip 13. In this embodiment, the mounting substrate may be a metal substrate, and several solder joints may be provided on the mounting substrate 12 to be soldered to the chip 13 for electrical connection. The chip 13 can be soldered on the mounting substrate 12 . The installation substrate 12 can be made of metal material. In this embodiment, the installation substrate 12 can be made of nickel, aluminum, copper or nickel alloy, aluminum alloy and other materials. In this embodiment, the mounting substrate 12 may be made of a metal material with better thermal conductivity or heat dissipation. Specifically, it can be made of aluminum or aluminum alloy.

Further, the at least one chip 13 includes one or more chips. In this embodiment, the at least one chip 13 includes two chips 13 , and the two chips 13 are arranged on the at least one mounting substrate 12 correspondingly. The chip 13 can be connected to the mounting substrate 12 by providing wires. The chip 13 may include a carrier, a core circuit loaded on the carrier, a protection circuit, and the like.

Further, in this embodiment, the conductive connection part 14 can be connected to electric energy, and can also be used for signal transmission. The conductive connection part 14 includes at least one first conductive connection part 141 and at least one second conductive connection part 142; the at least one first conductive connection part 141 may include one or more first conductive connection parts 141; A conductive connecting portion 141 can be provided on one or both sides of each mounting substrate 12 , and it can pass out toward the outside of the housing 11 to connect with the circuit board to access power or signals. The at least one second conductive connection portion 142 may be disposed on one side of one or more mounting substrates 12 and pass out toward the outside of the casing 11 to connect with a circuit board for accessing power or signals.

In this embodiment, the at least one mounting substrate 12 includes several mounting substrates 12; the at least one first conductive connection portion 141 is disposed on one or both sides of each mounting substrate, and the at least one second conductive connection portion 142 It is arranged on one side of one or more mounting substrates 12 among the plurality of mounting substrates 12 . Specifically, the mounting substrate 12 includes two mounting substrates, wherein the first conductive connection part 141 is provided on both sides of one mounting substrate 12, and only one first conductive connection part 141 is provided on one side, and the other side is provided with the first conductive connection part 141. There are a plurality of first conductive connection parts 141; the other mounting substrate 12 is only provided with a first conductive connection part 141 on one side; the at least one second conductive connection part 142 includes a second conductive connection part 142; the second The conductive connection portion 142 is disposed on the other side of the mounting substrate 12 on which the first conductive connection portion 141 is provided only on one side.

Of course, it can be understood that in some other embodiments, when the mounting substrate 12 only includes one mounting substrate 12, the at least one first conductive connection portion 141 can be disposed on one side or both sides of the mounting substrate 12, the At least one second conductive connection part 142 may be disposed on one side of the mounting substrate 12 .

In this embodiment, the first conductive connection part 141 may include a first pin; the first pin includes a main body part of the pin and a connecting part connected with the main body part of the pin; the connecting part is arranged on the casing 11 , which can be connected to the chip 13 . The main part of the pin can pass through the casing 11 and be connected to the circuit board to receive power or transmit signals. In this embodiment, the chip 13 and the first conductive connection portion 141 may be connected by setting wires, so as to realize electrical connection and/or signal transmission. Specifically, one end of the lead wire can be connected to the chip 13 , and the other end can be connected to the connecting part.

In this embodiment, in this embodiment, the second conductive connection part 142 can be made of heat dissipation material, which can be made of metal material with better heat dissipation performance, specifically, it can be made of aluminum or aluminum alloy. to make. In this embodiment, the first conductive connection portion 141 and the second conductive connection portion 142 disposed on the same side of the mounting substrate 12 can be integrally formed with the mounting substrate 12 to facilitate packaging and electrical connection.

Further, each second conductive connection part 142 includes two conductive pins 1421 and a heat conduction part 1422; the two conductive pins 1421 are separated and arranged side by side, and the heat conduction part 1422 is arranged between the adjacent conductive pins 1421 During this time, it can be used to dissipate heat, and then the chip 13 can dissipate heat, so as to improve the service life of the chip 13 . In this embodiment, the heat conduction part 1422 is at least partly located outside the casing 11, and it can dissipate the heat of the chip 13 to the environment to improve the heat dissipation effect. In this embodiment, the conductive pin 1421 and the heat conduction portion 1422 can be integrally formed to facilitate the installation of the second conductive connection portion 142 .

The conductive pin 1421 may include a second pin; the second pin may include a first bent section and a second bent section; the first bent section is connected to the mounting substrate 12 and bent, and It can be used to connect the heat conducting part 1422 ; the second bent section is disposed at the end of the first bent section away from the mounting substrate 12 , and bent with the first bent section, and can be connected to a circuit board.

In this embodiment, the heat conducting portion 1422 is disposed between the first bent sections of two adjacent conductive pins, and may be integrally formed with the first bent sections. Of course, it can be understood that in some other embodiments, it can also be detachably connected thereto.

3 and 4 show a second embodiment of the chip packaging structure of the present invention, which is different from the first embodiment in that, in some embodiments, the at least one conductive connection part 141 can be arranged on the casing On one side of the housing 11 , the at least one second conductive connection portion 142 may be disposed on the other side of the housing 11 . Specifically, the at least one first conductive connection portion 141 is disposed on one side of the mounting substrate 12, and the at least one second conductive connection portion 142 includes a plurality of second conductive connection portions 142; specifically, in this embodiment, It includes two second conductive connecting parts 142 ; they are respectively disposed on the other side of each mounting substrate 12 correspondingly. The at least one first conductive connection part 141 on one side of the housing 11 may include 2n first conductive connection parts; specifically, it may include 8 or 12 first pins; At least one second conductive connection part 142 may include n second conductive connection parts, that is, include 2n conductive pins, specifically, it may include 8 or 12 second pins.

Fig. 5 shows the third embodiment of the chip packaging structure of the present invention, which is different from the second embodiment in that the heat conduction part 1422 between the two second conductive connecting parts 142 arranged oppositely faces the One side is extended and connected to each other, so that the heat conduction area of the heat conduction part 1422 can be increased, thereby improving the heat conduction efficiency.

It can be understood that the above examples only express the preferred implementation of the present utility model, and its description is more specific and detailed, but it cannot be interpreted as a limitation of the utility model patent scope; it should be pointed out that for ordinary people in the art For those skilled in the art, under the premise of not departing from the concept of the utility model, the above-mentioned technical features can be freely combined, and some deformations and improvements can also be made, all of which belong to the protection scope of the utility model; The equivalent transformations and modifications made in the scope of the claims of the utility model shall all fall within the scope of the claims of the utility model.

Claims (10)

1. The chip packaging structure is characterized by comprising a shell (11), at least one chip (13) arranged in the shell (11), at least one mounting substrate (12) which is arranged in the shell (11) and used for mounting the chip (13) and corresponds to the chip (13), and conductive connecting parts (14) arranged at two sides of the shell (11);

the conductive connection (14) comprises at least one first conductive connection (141) and at least one second conductive connection (142); the at least one first conductive connecting part (141) is arranged on one side or two sides of each mounting substrate (12) and penetrates out of the shell (11); the at least one second conductive connecting part (142) is arranged on one side of one or more mounting substrates (12) and penetrates out of the shell (11);

each second conductive connecting part (142) comprises two conductive pins (1421) which are separated and arranged side by side and a heat conducting part (1422) which is arranged between the adjacent conductive pins (1421) for conducting heat conduction; the heat conducting portion (1422) is located at least partially outside the housing (11).

2. The chip package structure according to claim 1, wherein the conductive leads (1421) and the thermal conductive portion (1422) are integrally formed.

3. The chip packaging structure according to claim 1, wherein the first conductive connection portion (141) and the second conductive connection portion (142) disposed on the same side of the mounting substrate (12) are integrally formed with the mounting substrate (12).

4. The chip package structure according to claim 1, wherein the first conductive connection (141) comprises a first pin;

the conductive pin (1421) comprises a second pin; the second pin comprises a first bending section which is connected with the mounting substrate (12) and is bent, and a second bending section which is arranged at one end of the first bending section far away from the mounting substrate (12) and is bent with the first bending section;

the heat conducting part (1422) is arranged between the first bending sections of the two adjacent conductive pins.

5. The chip packaging structure according to claim 4, wherein the at least one first conductive connection (141) is disposed on one side of the housing (11) and the at least one second conductive connection (142) is disposed on the other side of the housing (11);

the at least one first conductive connection part (141) at one side of the housing comprises 8 first pins, or 12 first pins;

the at least one second conductive connection (142) at the other side of the housing includes 8 second pins, or 12 second pins.

6. The chip package structure according to claim 1, wherein the at least one mounting substrate (12) comprises one of the mounting substrates (12); the at least one first conductive connection (141) is disposed on one or both sides of the mounting substrate (12); the at least one second conductive connection portion (142) is provided on the mounting substrate (12) side.

7. The chip package structure according to claim 1, wherein the at least one mounting substrate (12) comprises a number of mounting substrates (12); the at least one first conductive connection portion (141) is provided on one side or both sides of each mounting substrate (12); the at least one second conductive connection (142) is disposed on one side of one or more of the mounting substrates (12) of the number of mounting substrates (12).

8. The chip packaging structure according to claim 7, wherein the at least one second conductive connection portion (142) comprises a plurality of the second conductive connection portions (142); the heat conducting parts (1422) between two adjacent second conductive connecting parts (142) extend towards the opposite side and are connected with each other.

9. The chip package according to claim 1, wherein a lead (15) is provided between the chip (13) and the first conductive connection (141) for electrical connection and/or signal transmission.

10. The chip package structure according to claim 1, wherein the material of the mounting substrate (12) and the second conductive connecting portion (142) comprises a heat-dissipating base material.