CN210167350U - Field-effect tube with heat dissipation device - Google Patents
Field-effect tube with heat dissipation device Download PDFInfo
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- CN210167350U CN210167350U CN201921296586.5U CN201921296586U CN210167350U CN 210167350 U CN210167350 U CN 210167350U CN 201921296586 U CN201921296586 U CN 201921296586U CN 210167350 U CN210167350 U CN 210167350U
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Abstract
The utility model discloses a field effect transistor with heat abstractor. The utility model provides a field effect transistor with heat abstractor, includes heat conduction base plate, first heating panel and second heating panel, the front of heat conduction base plate has set firmly epoxy encapsulation casing, first mounting hole has been seted up to the inside of heat conduction base plate, two first draw-in grooves have been seted up in the front of heat conduction base plate. The utility model relates to a can be through first fin and second fin, can improve the heat-sinking capability of field effect transistor self, and the second draw-in groove through the positive design of the second draw-in groove of the positive design of heat conduction base plate and the first draw-in groove and the second draw-in groove of the positive design, can realize the swift dismantlement between second heating panel and the field effect transistor, synthesize above-mentioned design, just can combine the actual service power of field effect transistor, install first fin or second fin additional to field effect transistor, thereby satisfy the heat dissipation requirement of field effect transistor in the in-service use, the design degree of difficulty of circuit board has been reduced.
Description
Technical Field
The utility model relates to an electronic component technical field specifically is a field effect transistor with heat abstractor.
Background
Electronic components, which are basic elements in electronic circuits, are usually packaged individually and have two or more leads or metal contacts, and the electronic components are connected to each other to form an electronic circuit with specific functions, such as: amplifiers, radio receivers, oscillators, etc., electronic components that are generally individually packaged include resistors, capacitors, inductors, transistors, diodes, triodes, field effect transistors, etc., and in the art, reference is made to a field effect transistor provided with a heat sink.
The heat dissipation technology of electronic components is crucial in the circuit, and currently, the heat dissipation technology of field effect transistors has three problems in practical application: first, the high-power field effect tube has limited self heat dissipation capability, and the heat dissipation effect can be ensured only by additionally installing a heat dissipation fin, which causes certain trouble to the layout of electronic elements on a circuit board; in some circuits, sometimes the actual use power of the field effect transistor is not large, but the self heat dissipation capability still cannot meet the heat dissipation requirement, and the heat dissipation requirement can be met only by depending on other heat dissipation fins, so that the circuit layout of the circuit board is influenced, the design difficulty of the circuit board is increased, and the volume of the circuit board is increased; when the field effect transistor is fixedly installed on the large-scale radiating fin, the installation hole of the field effect transistor may not be aligned with the screw hole of the radiating device, thereby causing great trouble to the installation work of the field effect transistor. To this end, we provide a fet with a heat sink to solve the above problems.
SUMMERY OF THE UTILITY MODEL
One) technical problem to be solved
The utility model aims at providing a field effect transistor with heat abstractor in order to remedy the not enough of prior art.
II) technical scheme
In order to achieve the above object, the utility model provides a following technical scheme: a field effect tube with a heat dissipation device comprises a heat conduction substrate, a first heat dissipation plate and a second heat dissipation plate, wherein an epoxy resin packaging shell is fixedly arranged on the front face of the heat conduction substrate, a first mounting hole is formed in the heat conduction substrate, two first clamping grooves are formed in the front face of the heat conduction substrate and are symmetrical, heat conduction plates are fixedly connected to the left side face and the right side face of the heat conduction substrate and are symmetrical, a second clamping groove is formed in the two heat conduction plates, and a group of second mounting holes are formed in the front faces of the two heat conduction plates;
a clamping end R and a clamping end S which are matched with the two second clamping grooves are arranged on one side face of the first heat dissipation plate, and the first heat dissipation plate can be arranged on the front face of the heat conduction plate through the clamping end R and the clamping end S which are respectively clamped in the two second clamping grooves;
the front of second heating panel is two fixed plates of fixedly connected with, fixedly connected with cardboard between two fixed plates, a side of cardboard near the second heating panel is equipped with card end T and card end W with two first draw-in groove looks adaptations, through card end T and card end W joint respectively in the inside of two first draw-in grooves, can make the front of second heating panel laminate mutually with the back of heat conduction base plate.
Furthermore, the front surface of the heat conducting substrate is provided with annular anti-skidding grains, and the annular anti-skidding grains are located on the periphery of the first mounting hole.
Furthermore, the first mounting hole and the second mounting hole are both strip-shaped.
Furthermore, the heat conducting plate and the heat conducting substrate are processed at one time, and the back surface of the heat conducting plate and the back surface of the heat conducting substrate are in the same plane.
Furthermore, the front surface of the first heat dissipation plate is fixedly provided with first heat dissipation fins which are parallel to each other, and the first heat dissipation fins and the first heat dissipation plate are formed by one-time processing.
Furthermore, the back of the second heat dissipation plate is fixedly provided with second heat dissipation fins which are parallel to each other, and the second heat dissipation fins and the second heat dissipation plate are formed by one-time processing.
III) beneficial effects
Compared with the prior art, this field effect transistor with heat abstractor possesses following beneficial effect:
firstly, the method comprises the following steps: the utility model can make the first heat radiation plate clamped on the front surface of the base plate through the second clamping groove designed on the front surface of the heat conduction base plate and the first heat radiation plate matched with the second clamping groove, can improve the heat radiation capability of the field effect tube, can realize the quick disassembly between the first heat radiation plate and the base plate, and can make the front surface of the second heat radiation plate jointed with the back surface of the heat conduction base plate through the first clamping groove designed on the front surface of the heat conduction base plate and the clamping plate matched with the first clamping groove, can improve the heat radiation capability of the field effect tube, can realize the quick disassembly between the second heat radiation plate and the field effect tube, and can combine the actual service power of the field effect tube by combining the design, and additionally arranging the first radiating fin or the second radiating fin on the field effect tube, thereby satisfying the heat radiation requirement of the field effect tube in the actual use, and reducing the dependence of the field effect tube on, the layout difficulty of electronic elements on the circuit board and the design difficulty of the circuit board are reduced, and the size of the circuit board can be reduced.
Secondly, the method comprises the following steps: the utility model discloses a first mounting hole of the bar of design on the base plate to and the second mounting hole of the bar of design on the heat-conducting plate, when the field effect transistor is fixed with other heat abstractor installation, the mounting hole of reducible field effect transistor and the condition that heat abstractor's silk hole is not counterpointed make field effect transistor and other heat abstractor's installation work more convenient.
Drawings
Fig. 1 is a front view of the field effect transistor of the present invention;
fig. 2 is a schematic structural view of a first heat dissipating plate according to the present invention;
FIG. 3 is a diagram illustrating the effect of the field effect transistor and the first heat sink;
fig. 4 is a top view of the fet and the first heat sink in fig. 3 according to the present invention;
fig. 5 is a schematic structural view of a second heat dissipating plate according to the present invention;
FIG. 6 is a diagram showing the effect of the field effect transistor and the second heat sink;
fig. 7 is a top view of the fet and the second heat sink of fig. 6 according to the present invention.
In the figure: 1. a heat conductive substrate; 2. a first mounting hole; 3. annular anti-slip lines; 4. a first card slot; 5. an epoxy resin encapsulating housing; 6. a heat conducting plate; 7. a second card slot; 8. a second mounting hole; 9. a first heat dissipation plate; 10. a first heat sink; 11. clamping a plate; 12. a fixing plate; 13. a second heat sink; 14. a second heat dissipation plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1-7, the utility model provides a technical solution: a field effect transistor with a heat dissipation device comprises a heat conduction substrate 1, a first heat dissipation plate 9 and a second heat dissipation plate 14, wherein an epoxy resin packaging shell 5 is fixedly arranged on the front surface of the heat conduction substrate 1, a first mounting hole 2 is formed in the heat conduction substrate 1, two first clamping grooves 4 are formed in the front surface of the heat conduction substrate 1, the two first clamping grooves 4 are symmetrical, heat conduction plates 6 are fixedly connected to the left side surface and the right side surface of the heat conduction substrate 1, the two heat conduction plates 6 are symmetrical, second clamping grooves 7 are formed in the two heat conduction plates 6, and a group of second mounting holes 8 are formed in the front surfaces of the two heat conduction plates 6;
a clamping end R and a clamping end S which are matched with the two second clamping grooves 7 are arranged on one side face of the first heat dissipation plate 9, and the first heat dissipation plate 9 can be arranged on the front face of the heat conduction plate 6 through the clamping end R and the clamping end S which are respectively clamped in the two second clamping grooves 7;
two fixed plates 12 of front fixedly connected with of second heating panel 14, fixedly connected with cardboard 11 between two fixed plates 12, a side of cardboard 11 that is close to second heating panel 14 is equipped with the card end T and the card end W with two first draw-in grooves 4 looks adaptations, through card end T and card end W joint respectively in the inside of two first draw-in grooves 4, can make the front of second heating panel 14 laminate mutually with the back of heat conduction base plate 1.
Further, the front surface of the heat conducting substrate 1 is provided with annular anti-slip patterns 3, and the annular anti-slip patterns 3 are located on the periphery of the first mounting hole 2. Through the designed annular anti-slip lines 3, looseness of the field effect tube after installation can be avoided.
Further, the first mounting hole 2 and the second mounting hole 8 are both bar-shaped. Through the scheme, when the field effect tube is fixedly installed on other heat dissipation devices, the situation that the installation hole of the field effect tube is not aligned with the screw hole of the heat dissipation device can be reduced, and the field effect tube is more convenient to install.
Further, the heat conducting plate 6 and the heat conducting substrate 1 are formed by one-time processing, and the back surface of the heat conducting plate 6 and the back surface of the heat conducting substrate 1 are the same plane. This arrangement can ensure the adhesion between the front surface of the second heat dissipation plate 14 and the back surface of the heat conductive substrate 1.
Furthermore, the front surface of the first heat dissipation plate 9 is fixedly provided with first heat dissipation fins 10 which are parallel to each other, and the first heat dissipation fins 10 and the first heat dissipation plate 9 are formed by one-time processing. This arrangement can further enhance the heat dissipation capability of the first heat dissipation plate 9.
Furthermore, the back of the second heat dissipation plate 14 is fixedly provided with a second heat dissipation sheet 13 in parallel, and the second heat dissipation sheet 13 and the second heat dissipation plate 14 are formed by one-time processing. This arrangement can further enhance the heat dissipation capability of the second heat dissipation plate 14.
The working principle is as follows: when the actual use power of the field effect transistor is very high, the field effect transistor must be installed on other heat dissipation devices, at this time, the second heat dissipation plate 14 does not participate in use, and when the field effect transistor is installed and fixed with other heat dissipation devices, the situation that the installation hole of the field effect transistor is not aligned with the screw hole of the heat dissipation device can be avoided as much as possible through the first strip-shaped installation hole 2 designed on the substrate 1 and the second strip-shaped installation hole 8 designed on the heat conduction plate, so that the installation work of the field effect transistor and other heat dissipation devices is more convenient; when the actual power of the field effect transistor is not high, the first heat sink 10 and the second heat sink 13 can improve the heat dissipation capability of the field effect transistor, maintain the normal working temperature of the field effect transistor, reduce the dependency of the field effect transistor on other heat dissipation devices, and through the second slot 7 designed on the front surface of the heat conduction substrate 1 and the first heat sink 9 matched with the second slot 7, the first heat sink 9 can be clamped on the front surface of the substrate 1, and the quick disassembly between the first heat sink 9 and the substrate 1 can be realized, and through the first slot 4 designed on the front surface of the heat conduction substrate 1 and the clip board 11 matched with the first slot 4, the front surface of the second heat sink 14 can be jointed with the back surface of the heat conduction substrate 1, and the quick disassembly between the second heat sink 14 and the field effect transistor can be realized, and by combining the above designs, the actual power of the field effect transistor can be combined, the first heat dissipation plate 9 or the second heat dissipation plate 14 is additionally arranged on the field effect transistor, so that the heat dissipation requirement of the field effect transistor in practical use is met, the dependence of the field effect transistor on other heat dissipation devices is reduced, the layout difficulty of electronic elements on the circuit board and the design difficulty of the circuit board are reduced, and the size of the circuit board can be reduced.
It should be noted that, in this document, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a field effect transistor with heat abstractor, includes heat conduction base plate, first heating panel and second heating panel, its characterized in that: the front surface of the heat-conducting substrate is fixedly provided with an epoxy resin packaging shell, a first mounting hole is formed in the heat-conducting substrate, two first clamping grooves are formed in the front surface of the heat-conducting substrate and are symmetrical, heat-conducting plates are fixedly connected to the left side surface and the right side surface of the heat-conducting substrate, the two heat-conducting plates are symmetrical, a second clamping groove is formed in each of the two heat-conducting plates, and a group of second mounting holes is formed in the front surfaces of the two heat-conducting plates;
a clamping end R and a clamping end S which are matched with the two second clamping grooves are arranged on one side face of the first heat dissipation plate, and the first heat dissipation plate can be arranged on the front face of the heat conduction plate through the clamping end R and the clamping end S which are respectively clamped in the two second clamping grooves;
the front of second heating panel is two fixed plates of fixedly connected with, fixedly connected with cardboard between two fixed plates, a side of cardboard near the second heating panel is equipped with card end T and card end W with two first draw-in groove looks adaptations, through card end T and card end W joint respectively in the inside of two first draw-in grooves, can make the front of second heating panel laminate mutually with the back of heat conduction base plate.
2. The fet provided with a heat dissipating device as set forth in claim 1, wherein: the front surface of the heat conduction substrate is provided with annular anti-skidding grains, and the annular anti-skidding grains are located on the periphery of the first mounting hole.
3. The fet provided with a heat dissipating device as set forth in claim 1, wherein: the first mounting hole and the second mounting hole are both in a strip shape.
4. The fet provided with a heat dissipating device as set forth in claim 1, wherein: the heat conducting plate and the heat conducting substrate are processed at one time, and the back surface of the heat conducting plate and the back surface of the heat conducting substrate are the same plane.
5. The fet provided with a heat dissipating device as set forth in claim 1, wherein: the front surface of the first heat dissipation plate is fixedly provided with first heat dissipation fins which are parallel to each other, and the first heat dissipation fins and the first heat dissipation plate are formed by one-time processing.
6. The fet provided with a heat dissipating device as set forth in claim 1, wherein: the back of the second heat dissipation plate is fixedly provided with second heat dissipation fins which are parallel to each other, and the second heat dissipation fins and the second heat dissipation plate are formed by one-time processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921296586.5U CN210167350U (en) | 2019-08-05 | 2019-08-05 | Field-effect tube with heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921296586.5U CN210167350U (en) | 2019-08-05 | 2019-08-05 | Field-effect tube with heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210167350U true CN210167350U (en) | 2020-03-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921296586.5U Active CN210167350U (en) | 2019-08-05 | 2019-08-05 | Field-effect tube with heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210167350U (en) |
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2019
- 2019-08-05 CN CN201921296586.5U patent/CN210167350U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Field effect tube with heat dissipation device Effective date of registration: 20210714 Granted publication date: 20200320 Pledgee: Shenzhen hi tech investment small loan Co.,Ltd. Pledgor: Shenzhen Dipu Electronics Co.,Ltd. Registration number: Y2021980006145 |