CN214068714U - A chip heterogenous integrated packaging structure - Google Patents
A chip heterogenous integrated packaging structure Download PDFInfo
- Publication number
- CN214068714U CN214068714U CN202120265257.5U CN202120265257U CN214068714U CN 214068714 U CN214068714 U CN 214068714U CN 202120265257 U CN202120265257 U CN 202120265257U CN 214068714 U CN214068714 U CN 214068714U
- Authority
- CN
- China
- Prior art keywords
- chip
- heat
- shell
- packaging shell
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本实用新型公开了一种芯片异质集成封装结构，包括基座和第一封装外壳，基座内壁左右两端上方开设有卡槽，卡槽内卡装有导热板，导热板两端均连接有卡块，卡块卡装在卡槽内，基座顶部左侧设有第一封装外壳，第一封装外壳底端左侧连接有连接板，连接板外侧设置有紧固螺钉，紧固螺钉透过连接板固定在基座上，第一封装外壳右端中间连接有连接块，连接块右侧上下两端均连接有挡块，第一封装外壳右端设有第二封装外壳，第二封装外壳内壁左侧开设有凹槽，连接块卡装在凹槽内，第一封装外壳与第二封装外壳外表面均设置有散热片；本实用新型具有方便快速拆卸封装外壳、便于芯片的检修、增加芯片的散热效率、提高芯片的使用寿命的优点。
The utility model discloses a chip heterogeneity integrated packaging structure, which comprises a base and a first packaging shell. A card slot is provided above the left and right ends of an inner wall of the base, a heat-conducting plate is clamped in the card slot, and both ends of the heat-conducting plate are connected to each other. There is a card block, the card block is installed in the card slot, the top left side of the base is provided with a first encapsulation shell, the left side of the bottom end of the first encapsulation shell is connected with a connecting plate, the outer side of the connecting plate is provided with fastening screws, the fastening screws It is fixed on the base through the connecting plate, a connecting block is connected in the middle of the right end of the first encapsulation shell, and the upper and lower ends of the right side of the connecting block are connected with stoppers. The left side of the inner wall is provided with a groove, the connecting block is clamped in the groove, and the outer surfaces of the first package shell and the second package shell are provided with heat sinks; The heat dissipation efficiency of the chip and the advantages of improving the service life of the chip.
Description
Technical Field
The utility model belongs to the technical field of the chip package technique and specifically relates to a heterogeneous integrated packaging structure of chip is related to.
Background
The shell for installing the semiconductor integrated circuit chip plays a role in placing, fixing, sealing, protecting the chip and enhancing the electric heating performance, and is also a bridge for communicating the internal world of the chip with an external circuit, namely, a joint on the chip is connected to pins of the package shell by leads, and the pins are connected with other devices by leads on a printed board, so that the package plays an important role in a CPU and other LSI integrated circuits;
the design of integrated chip can pile up more multilayer chip in less space, and the heat that the chip that piles up produced influences each other, produce more heat in same encapsulation, the heat dissipation can not in time lead to the fact adverse effect to the use of chip, current chip packaging structure only has simple heat radiation structure, the heat that gives off when unable satisfying the chip and using, reduce chip life, and current encapsulation dismantles comparatively trouble, unable quick dismantlement chip, lead to the unable quick maintenance of chip, therefore, we provide a chip heterogeneous integrated packaging structure.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a heterogeneous integrated packaging structure of chip has the convenient maintenance of dismantling encapsulation shell, the chip of being convenient for fast, increases the radiating efficiency of chip, improves the life's of chip advantage, has solved the problem among the prior art.
The above utility model discloses an above-mentioned utility model purpose can realize through following technical scheme: a chip heterogeneous integration packaging structure comprises a base and a first packaging shell, wherein clamping grooves are formed above the left end and the right end of the inner wall of the base, a heat conducting plate is clamped in the clamping grooves, clamping blocks are connected to two ends of the heat conducting plate and clamped in the clamping grooves, a chip is connected to the inner wall of the base at the bottom end of the heat conducting plate, a first packaging shell is arranged on the left side of the top of the base, a connecting plate is connected to the left side of the bottom end of the first packaging shell, fastening screws are arranged on the outer side of the connecting plate and fixed on the base through the connecting plate, a connecting block is connected to the middle of the right end of the first packaging shell, a stop block is connected to the upper end and the lower end of the right side of the connecting block, a sealing gasket is connected to the surface of the first packaging shell on the upper side and the lower side of the connecting block, a second packaging shell is arranged on the right end of the first packaging shell, and the left side of the inner wall of the second packaging shell is provided with a groove, the connecting block is clamped in the groove, the first packaging shell is connected with the second packaging shell through the connecting block, and cooling fins are arranged on the outer surfaces of the first packaging shell and the second packaging shell.
The utility model discloses further set up to: and a gasket is arranged at the joint of the fastening screw and the connecting plate.
Through adopting above-mentioned technical scheme, improve fastening screw and connecting plate's be connected compactness.
The utility model discloses further set up to: the connecting block is in sliding connection with the groove.
Through adopting above-mentioned technical scheme, make first encapsulation shell and second encapsulation shell to outside side stretching, conveniently dismantle and install.
The utility model discloses further set up to: the heat conducting plate is tightly connected with the chip.
By adopting the technical scheme, the heat generated by the chip is conveniently and quickly conducted on the heat conducting plate.
The utility model discloses further set up to: the first packaging shell is connected with the connecting plate in an integrated mode.
Through adopting above-mentioned technical scheme, increase the bulk strength of first encapsulation shell and connecting plate.
The utility model discloses further set up to: the first packaging shell and the second packaging shell are the same in size, and the second packaging shell is provided with a connecting plate and fastening screws.
Through adopting above-mentioned technical scheme, increase the leakproofness between first encapsulation shell and second encapsulation shell and the base.
To sum up in the above, the utility model discloses a beneficial technological effect does:
1. this heterogeneous integrated packaging structure of chip is in the use, and structurally, unscrew fastening screw, to the outside first encapsulation shell of stretching and second encapsulation shell, first encapsulation shell drives the connecting block and moves to the outside, and the connecting block slides in the recess, and the dog on the connecting block can prevent that the connecting block from breaking away from the recess, makes first encapsulation shell and second encapsulation shell break away from the base fast, makes things convenient for quick dismantlement encapsulation shell, the maintenance of the chip of being convenient for.
2. Structurally, the heat-conducting plate clamps in the draw-in groove of base through the fixture block of both sides, prevents that the heat-conducting plate skew from influencing thermal conduction, and the heat transfer that the chip will produce in the course of the work gives the heat-conducting plate, and the heat-conducting plate gives the fin with the heat transfer, and the fin gives off the heat to the air, increases the radiating efficiency of chip, improves the life of chip.
Drawings
Fig. 1 is a schematic overall structure diagram of a chip heterogeneous integrated package structure according to the present invention;
fig. 2 is a schematic diagram of an internal structure of a chip heterogeneous integrated package structure according to the present invention;
fig. 3 is a general schematic diagram of a package structure of a chip heterogeneous integrated package structure according to the present invention;
fig. 4 is a schematic diagram of the internal structure of the base of the chip heterogeneous integrated package structure according to the present invention;
fig. 5 is a schematic diagram of the overall structure of the heat-conducting plate of the heterogeneous integrated chip package structure of the present invention.
In the figure, 1, a base; 2. a connecting plate; 3. fastening screws; 4. a gasket; 5. a first package housing; 6. a heat sink; 7. a gasket; 8. connecting blocks; 9. a groove; 10. a stopper; 11. a chip; 12. a card slot; 13. a clamping block; 14. a heat conducting plate; 15. a second package housing.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, rather than all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative work belong to the protection scope of the present invention based on the embodiments of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Referring to fig. 1, 2, 3, 4 and 5, the chip heterogeneous integration package structure disclosed by the present invention comprises a base 1 and a first package housing 5, wherein a slot 12 is formed above the left and right ends of the inner wall of the base 1, a heat conducting plate 14 is clamped in the slot 12, two ends of the heat conducting plate 14 are connected with a clamping block 13, the clamping block 13 is clamped in the slot 12, the inner wall of the base 1 at the bottom end of the heat conducting plate 14 is connected with a chip 11, the left side of the top of the base 1 is provided with the first package housing 5, the left side of the bottom end of the first package housing 5 is connected with a connecting plate 2, the outer side of the connecting plate 2 is provided with a fastening screw 3, the fastening screw 3 is fixed on the base 1 through the connecting plate 2, the middle of the right end of the first package housing 5 is connected with a connecting block 8, the upper, the right end of the first packaging shell 5 is provided with a second packaging shell 15, the left side of the inner wall of the second packaging shell 15 is provided with a groove 9, the connecting block 8 is clamped in the groove 9, the first packaging shell 5 is connected with the second packaging shell 15 through the connecting block 8, and the outer surfaces of the first packaging shell 5 and the second packaging shell 15 are provided with radiating fins 6.
In this embodiment, when in use, the fastening screw 3 is unscrewed to stretch the first package housing 5 and the second package housing 15 to the outside, the first package housing 5 drives the connecting block 8 to move to the outside, the connecting block 8 slides in the groove 9, the stopper 10 on the connecting block 8 can prevent the connecting block 8 from separating from the groove 9, so that the first package housing 5 and the second package housing 15 can be quickly separated from the base 1, the first package housing 5 and the second package housing 15 can be conveniently and quickly detached, the chip 11 can be conveniently overhauled, the heat conducting plate 14 is clamped in the clamping groove 12 of the base 1 through the clamping blocks 13 on both sides, the heat conducting plate 14 is prevented from being deviated to affect the conduction of heat, similarly, the first package housing 5 and the second package housing 15 are fixed on the base 1, the sealing gasket 7 on the first package housing 5 can increase the sealing performance between the two package housings, the chip 11 transfers the generated heat to the heat conducting plate 14 in the working process, the heat conducting plate 14 transfers heat to the radiating fins 6, and the radiating fins 6 radiate the heat to the air, so that the radiating efficiency of the chip 11 is improved, and the service life of the chip 11 is prolonged.
Referring to fig. 1, a gasket 4 is arranged at the joint of the fastening screw 3 and the connecting plate 2, so that the connection tightness of the fastening screw 3 and the connecting plate 2 is improved.
Referring to fig. 2, the connection block 8 is slidably connected to the groove 9, so that the first package housing 5 and the second package housing 15 are stretched outwards, and are convenient to detach and mount.
Referring to fig. 2, the thermal conductive plate 14 is closely coupled to the chip 11, facilitating rapid conduction of heat generated by the chip 11 to the thermal conductive plate 14.
Referring to fig. 3, the first package housing 5 is integrally connected to the connection board 2, so as to increase the overall strength of the first package housing 5 and the connection board 2.
Referring to fig. 3, the first and second package housings 5 and 15 are the same in size, and the second package housings 15 are provided with the connection plate 2 and the fastening screws 3, so as to increase the sealing performance between the first and second package housings 5 and 15 and the base 1.
The implementation principle of the embodiment is as follows:
the utility model relates to a chip heterogeneous integrated packaging structure, when using, during the use, the fastening screw 3 is unscrewed, stretch first encapsulation shell 5 and second encapsulation shell 15 to the outside, first encapsulation shell 5 drives connecting block 8 to move to the outside, connecting block 8 slides in recess 9, the dog 10 on connecting block 8 can prevent connecting block 8 from breaking away from recess 9, make first encapsulation shell 5 and second encapsulation shell 15 break away from base 1 fast, conveniently dismantle first encapsulation shell 5 and second encapsulation shell 15 fast, the maintenance of chip 11 is convenient, heat-conducting plate 14 clamps in the draw-in groove 12 of base 1 through the fixture block 13 of both sides, prevent heat-conducting plate 14 skew from influencing the conduction of heat, fix first encapsulation shell 5 and second encapsulation shell 15 on base 1 similarly, the sealed pad 7 on first encapsulation shell 5 can increase the leakproofness between two encapsulation shells, the heat that chip 11 will produce in the course of the work gives heat-conducting plate 14, and heat-conducting plate 14 gives heat-radiating fin 6 with heat transfer, and heat-radiating fin 6 gives off the heat to the air, increases chip 11's radiating efficiency, improves chip 11's life to solve the technical problem who exists among the prior art.
Having shown and described the basic principles and principal features of the invention and advantages thereof, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof; the present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein, and any reference signs in the claims are not intended to be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. A chip heterogeneous integrated packaging structure comprises a base (1) and a first packaging shell (5), and is characterized in that: the heat-conducting plate is characterized in that clamping grooves (12) are formed above the left end and the right end of the inner wall of the base (1), a heat-conducting plate (14) is clamped in the clamping grooves (12), clamping blocks (13) are connected to the two ends of the heat-conducting plate (14), the clamping blocks (13) are clamped in the clamping grooves (12), a chip (11) is connected to the inner wall of the base (1) at the bottom end of the heat-conducting plate (14), a first packaging shell (5) is arranged on the left side of the top of the base (1), a connecting plate (2) is connected to the left side of the bottom end of the first packaging shell (5), fastening screws (3) are arranged on the outer side of the connecting plate (2), the fastening screws (3) are fixed on the base (1) through the connecting plate (2), a connecting block (8) is connected to the middle of the right end of the first packaging shell (5), the upper end and the lower end of the right side of the connecting block (8) are both connected with stopping blocks (10), sealing gaskets (7) are connected to the surfaces of the first packaging shell (5) on the upper side and the lower side of the connecting block (8), the right end of the first packaging shell (5) is provided with a second packaging shell (15), the left side of the inner wall of the second packaging shell (15) is provided with a groove (9), the connecting block (8) is clamped in the groove (9), the first packaging shell (5) is connected with the second packaging shell (15) through the connecting block (8), and the outer surfaces of the first packaging shell (5) and the second packaging shell (15) are respectively provided with a radiating fin (6).
2. The chip heterogeneous integrated packaging structure of claim 1, wherein: and a gasket (4) is arranged at the joint of the fastening screw (3) and the connecting plate (2).
3. The chip heterogeneous integrated packaging structure of claim 1, wherein: the connecting block (8) is in sliding connection with the groove (9).
4. The chip heterogeneous integrated packaging structure of claim 1, wherein: the heat conducting plate (14) is tightly connected with the chip (11).
5. The chip heterogeneous integrated packaging structure of claim 1, wherein: the first packaging shell (5) is connected with the connecting plate (2) in an integrated manner.
6. The chip heterogeneous integrated packaging structure of claim 1, wherein: the first packaging shell (5) and the second packaging shell (15) are the same in size, and the second packaging shell (15) is provided with a connecting plate (2) and a fastening screw (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120265257.5U CN214068714U (en) | 2021-01-31 | 2021-01-31 | A chip heterogenous integrated packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120265257.5U CN214068714U (en) | 2021-01-31 | 2021-01-31 | A chip heterogenous integrated packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214068714U true CN214068714U (en) | 2021-08-27 |
Family
ID=77393351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120265257.5U Expired - Fee Related CN214068714U (en) | 2021-01-31 | 2021-01-31 | A chip heterogenous integrated packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214068714U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115172295A (en) * | 2022-08-12 | 2022-10-11 | 安徽龙芯微科技有限公司 | Wafer-level chip packaging structure and manufacturing method thereof |
-
2021
- 2021-01-31 CN CN202120265257.5U patent/CN214068714U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115172295A (en) * | 2022-08-12 | 2022-10-11 | 安徽龙芯微科技有限公司 | Wafer-level chip packaging structure and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204721777U (en) | Electronic device and liquid cooling type heat dissipation structure thereof | |
| CN108807312B (en) | Heat radiator | |
| TW200836044A (en) | Heat-dissipating module | |
| CN214068714U (en) | A chip heterogenous integrated packaging structure | |
| CN209420193U (en) | A kind of power supply adaptor radiator structure | |
| CN218602417U (en) | Fixing part structure for chip packaging | |
| CN209420245U (en) | The copper aluminium mixing shielding case that embedded copper billet directly radiates | |
| CN222928293U (en) | Small-volume inversion device | |
| CN209608536U (en) | power converter | |
| WO2025107727A1 (en) | Power system, electric drive system, and vehicle | |
| CN212573229U (en) | Power electronic component packaging hardware | |
| CN210694213U (en) | Heat dissipation device for wireless access point | |
| CN2664179Y (en) | Heat sink and heat pipe structure | |
| CN210133520U (en) | A circuit board with a plastic encapsulation structure | |
| CN217822752U (en) | Integrated circuit packaging structure for multi-chip packaging | |
| CN211403364U (en) | Heat dissipation device for electrical equipment | |
| CN209594178U (en) | A kind of switching tube radiator structure and vehicle power supply | |
| CN209298100U (en) | semiconductor element | |
| TWI273379B (en) | Heat sink module | |
| CN206802775U (en) | An efficient heat dissipation LED module | |
| CN219203145U (en) | Double-sided heat conduction type transistor cooling components | |
| CN219222335U (en) | A kind of LED light emitting device | |
| CN206708822U (en) | A kind of rapid thermal conduction LED light bar backing structure | |
| CN221653026U (en) | Servo driver base plate heat radiation structure | |
| CN222483352U (en) | Multi-chip package integrated circuit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210827 |