CN218039176U - Three-phase diode rectifier bridge module - Google Patents
Three-phase diode rectifier bridge module Download PDFInfo
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- CN218039176U CN218039176U CN202222393780.3U CN202222393780U CN218039176U CN 218039176 U CN218039176 U CN 218039176U CN 202222393780 U CN202222393780 U CN 202222393780U CN 218039176 U CN218039176 U CN 218039176U
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Abstract
The utility model relates to the technical field of semiconductors, and discloses a three-phase diode rectifier bridge module, which comprises an installation mechanism, wherein a heat dissipation mechanism is arranged outside the installation mechanism; the installation mechanism comprises a mounting seat, the surface of the mounting seat is fixedly connected with a protective shell, a three-phase rectifier module is arranged inside the protective shell, and a wiring port is formed in the upper end of the three-phase rectifier module. This three-phase diode rectifier bridge module, install the device wholly through the mount pad and fix, interconnecting link passes through the sealing washer and is connected with three-phase rectifier module, thereby make the protective housing upper end sealed, carry out waterproof dustproof and circuit protection to three-phase rectifier module through the protective housing, through the inside fixed connection of heat conduction ceramic plate and three-phase rectifier module, thereby derive the inside heat of three-phase rectifier module, thereby derive the heat bottom surface of heat conduction ceramic plate through the fin, because there is the space between mount pad and the protective housing bottom, thereby be convenient for the air admission, take away fin surface heat.
Description
Technical Field
The utility model relates to the field of semiconductor technology, specifically be a three-phase diode rectifier bridge module.
Background
The three-phase diode rectifier bridge switch module is a device which is formed by connecting six ultrafast recovery diode chips and a high-power high-voltage thyristor chip according to a certain circuit and then packaging the chips together in a PP (polypropylene) shell.
According to a three-phase diode rectifier bridge module that patent publication number CN 210325769U provided, which comprises a housin, the upper surface of casing is provided with support heat dissipation portion isotructure, the device has the radiating advantage of heat conduction, the insulating problem of current heat radiation structure has been solved, but the device exports the heat dissipation through the heat of insulating heat conduction material in with the casing, belong to natural heat dissipation, this heat dissipation mode is in the higher place of outdoor temperature, can lead to the conducting strip heat dissipation slow, the inside difficult problem of dispelling the heat of three-phase diode rectifier bridge module.
We therefore propose a three-phase diode bridge module to solve the problems in the background above.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a three-phase diode rectifier bridge module to solve the problems in the prior art,
in order to achieve the above object, the utility model provides a following technical scheme: a three-phase diode rectifier bridge module comprises an installation mechanism, wherein a heat dissipation mechanism is arranged outside the installation mechanism;
the mounting mechanism comprises a mounting seat, the upper surface of the mounting seat is fixedly connected with a protective shell, a three-phase rectification module is arranged in the protective shell, a wiring port is formed in the upper end of the three-phase rectification module, and a sealing ring is arranged at the upper part of the wiring port;
install fixedly through the mount pad to the device is whole, and interconnecting link passes through the sealing washer and is connected with three-phase rectifier module to make the protective housing upper end sealed, carry out waterproof dustproof and circuit protection to three-phase rectifier module through the protective housing.
The heat dissipation mechanism comprises a heat conduction ceramic plate, a heat dissipation sheet is fixedly connected to the bottom surface of the heat conduction ceramic plate, sealant is arranged outside the heat dissipation sheet, a semiconductor radiator is arranged on the outer side of the heat conduction ceramic plate, and a fixing shell is fixedly connected to the outer portion of the semiconductor radiator.
Through heat conduction ceramic plate and the inside fixed connection of three-phase rectifier module, thereby derive the inside heat of three-phase rectifier module, thereby derive the heat of heat conduction ceramic plate through the fin, thereby the bottom surface is derived, because there is the space between mount pad and the protective housing bottom, thereby the air of being convenient for gets into, take away fin surface heat, carry out the cooling of naturally dispelling the heat, this mechanism avoids protective housing and mount pad laminating fixed, the gathering of the protective housing bottom heat that leads to is difficult to spill out, when the external temperature is higher, especially be in tropical high temperature area, open semiconductor radiator this moment and refrigerate the cooling to heat conduction ceramic plate outside one end, semiconductor radiator is small and refrigerate fast, lead to inside the three-phase rectifier module with low temperature through heat conduction ceramic plate, reduce the inside heat of three-phase rectifier module, effectively solve the three-phase rectifier module and dispel the difficult problem in high temperature weather, heat conduction ceramic plate coefficient of heat conduction is high and insulating, be convenient for this structure dispels the heat and cool down and guarantee the security, semiconductor radiator internal circuit connection is current well-known technology, often be used in electronic component heat dissipation fields such as computer motherboard, can adjust the refrigeration temperature through positive display screen and button of semiconductor radiator, guarantee the cooling effect to three-phase rectifier module, this mechanism simple to installation, the temperature regulation control of being convenient for.
Preferably, the bottoms of the two sides of the protective shell are provided with supporting plates which are symmetrically distributed, and the upper surface of the mounting seat is fixedly connected with the lower ends of the supporting plates.
Preferably, the radiating fins are arranged on the inner side of the supporting plate and are distributed at equal intervals.
The protective housing is fixedly connected with the mounting seat through the supporting plates at the bottoms of the two sides, so that a space is reserved between the mounting seat and the protective housing, and the radiating fins are convenient to conduct heat and radiate heat.
Preferably, a plurality of fin run through the protective housing bottom, sealed glue sets up between fin and the protective housing.
A plurality of fin run through the protective housing bottom, increase the radiating effect, sealed glue sets up between fin and protective housing, seals fixedly to the junction of fin and protective housing, reaches water-proof effects.
Preferably, the heat conducting ceramic plate is arranged inside the three-phase rectification module and penetrates through the protection shell.
Preferably, the heat-conducting ceramic plate is L-shaped, and one end of the outer side of the heat-conducting ceramic plate is fixedly connected with the inside of the semiconductor radiator.
The heat conducting ceramic plate is L-shaped, so that the heat conducting ceramic plate is conveniently connected with the semiconductor radiator, and the heat conducting ceramic plate is cooled through the refrigeration of the semiconductor radiator.
Preferably, the fixed shell is fixedly connected to the outer side surface of the protective shell, and one end of the outer side of the heat-conducting ceramic plate is arranged inside the fixed shell.
Compared with the prior art, the utility model provides a three-phase diode rectifier bridge module possesses following beneficial effect:
1. this three-phase diode rectifier bridge module, through heat conduction ceramic plate and the inside fixed connection of three-phase rectifier module, thereby derive the inside heat of three-phase rectifier module, thereby derive the heat of heat conduction ceramic plate through the fin, because there is the space between mount pad and the protective housing bottom, thereby be convenient for the air to get into, take away fin surface heat, carry out the natural heat dissipation cooling, this mechanism avoids protective housing and mount pad laminating fixed, the gathering of the protective housing bottom heat that leads to is difficult to spill out, when the external temperature is higher, especially be in tropical high temperature area, open the semiconductor radiator and refrigerate the cooling to heat conduction ceramic plate outside one end this moment, the semiconductor radiator is small and refrigerate fast, through heat conduction ceramic plate with inside the leading-in three-phase rectifier module of low temperature, reduce the inside heat of three-phase rectifier module, effectively solve the problem of three-phase rectifier module difficult at high temperature weather heat dissipation, heat conduction coefficient of heat conduction is high and insulating, be convenient for this structure dispels the heat and cool down and guarantee the security simultaneously, the inside circuit connection of semiconductor radiator is current well-known technology, be often used in electronic component heat dissipation fields such as computer mainboard, can adjust the refrigeration temperature through positive display screen and button of semiconductor radiator, guarantee the effect of three-phase rectifier module, the installation of this mechanism, be convenient for temperature regulation control.
2. This three-phase diode rectifier bridge module installs fixedly through the mount pad to the device is whole, and interconnecting link passes through the sealing washer and is connected with three-phase rectifier module to make the protective housing upper end sealed, carry out waterproof dustproof and circuit protection to three-phase rectifier module through the protective housing.
Drawings
FIG. 1 is a schematic view of the internal structure of the present invention;
FIG. 2 is a schematic sectional view of the fixing shell of the present invention;
FIG. 3 is a schematic view of the outer side structure of the fixing shell of the present invention;
fig. 4 is a schematic view of the front connection structure of the semiconductor heat sink of the present invention.
Wherein: 1. an installation mechanism; 2. a heat dissipation mechanism; 101. a mounting seat; 102. a protective shell; 103. a three-phase rectification module; 104. a wiring port; 105. a seal ring; 201. a heat conductive ceramic plate; 202. a heat sink; 203. sealing glue; 204. a semiconductor heat sink; 205. and (4) fixing the shell.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Please refer to fig. 1-4.
A three-phase diode rectifier bridge module comprises an installation mechanism 1, wherein a heat dissipation mechanism 2 is arranged outside the installation mechanism 1;
the installation mechanism 1 comprises an installation base 101, a protective shell 102 is fixedly connected to the upper surface of the installation base 101, a three-phase rectification module 103 is arranged inside the protective shell 102, a wiring port 104 is arranged at the upper end of the three-phase rectification module 103, and a sealing ring 105 is arranged at the upper part of the wiring port 104;
install fixedly through mount pad 101 to the device is whole, and interconnecting link passes through sealing washer 105 and is connected with three-phase rectifier module 103 to make protective housing 102 upper end sealed, carry out waterproof dustproof and circuit protection to three-phase rectifier module 103 through protective housing 102.
The heat dissipation mechanism 2 comprises a heat-conducting ceramic plate 201, a heat dissipation sheet 202 is fixedly connected to the bottom surface of the heat-conducting ceramic plate 201, a sealant 203 is arranged outside the heat dissipation sheet 202, a semiconductor radiator 204 is arranged outside the heat-conducting ceramic plate 201, and a fixing shell 205 is fixedly connected to the outside of the semiconductor radiator 204.
Through the inside fixed connection of heat conduction ceramic plate 201 and three-phase rectifier module 103, thereby derive the inside heat of three-phase rectifier module 103, thereby derive the bottom surface with the heat of heat conduction ceramic plate 201 through fin 202, because there is the space between mount pad 101 and the protective housing 102 bottom, thereby be convenient for the air to get into, take away fin 202 surface heat, carry out the natural heat dissipation cooling, this mechanism avoids protective housing 102 and mount pad 101 laminating fixed, the gathering of the protective housing 102 bottom heat that leads to is difficult to spill out, when the external temperature is higher, especially be in tropical high temperature area, open semiconductor radiator 204 and refrigerate the cooling to heat conduction ceramic plate 201 outside one end this moment, semiconductor radiator 204 is small and refrigerate fast, lead into three-phase rectifier module 103 inside with low temperature through heat conduction ceramic plate 201, reduce the inside heat of three-phase rectifier module 103, effectively solve the problem of three-phase rectifier module 103 at high temperature weather heat dissipation difficulty, heat conduction coefficient is high and insulating, the structure of being convenient for dispel the heat and cool the cooling and guarantee the security, semiconductor radiator 204 internal circuit connection is known technology, be commonly used in electronic component heat dissipation fields such as computer mainboard, can adjust this mechanism's temperature through the positive display screen and the button and can adjust this mechanism, the convenient temperature regulation effect of the rectifier module 103.
The bottom of the two sides of the protective shell 102 is provided with support plates which are symmetrically distributed, and the upper surface of the mounting seat 101 is fixedly connected with the lower ends of the support plates.
The heat dissipation fins 202 are disposed inside the support plate, and the heat dissipation fins 202 are distributed in a plurality of equal intervals.
The protective shell 102 is fixedly connected with the mounting seat 101 through the supporting plates at the bottoms of the two sides, so that a space is formed between the mounting seat 101 and the protective shell 102, and heat conduction and heat dissipation of the heat dissipation fins 202 are facilitated.
The plurality of heat dissipation fins 202 penetrate through the bottom of the protective shell 102, and the sealant 203 is disposed between the heat dissipation fins 202 and the protective shell 102.
The plurality of radiating fins 202 penetrate through the bottom of the protective shell 102, the radiating effect is improved, the sealant 203 is arranged between the radiating fins 202 and the protective shell 102, the connecting positions of the radiating fins 202 and the protective shell 102 are sealed and fixed, and the waterproof effect is achieved.
The heat-conducting ceramic plate 201 is arranged inside the three-phase rectification module 103, and the heat-conducting ceramic plate 201 penetrates through the outside of the protective shell 102.
The heat conducting ceramic plate 201 is L-shaped, and one end of the outer side of the heat conducting ceramic plate 201 is fixedly connected with the inside of the semiconductor heat sink 204.
The heat-conducting ceramic plate 201 is L-shaped, so that the heat-conducting ceramic plate 201 is conveniently connected with the semiconductor radiator 204, and the heat-conducting ceramic plate 201 is cooled by the semiconductor radiator 204.
The fixed shell 205 is fixedly connected to the outer side surface of the protective shell 102, and one end of the outer side of the heat conducting ceramic plate 201 is arranged inside the fixed shell 205.
When the structure is used, the heat inside the three-phase rectification module 103 is led out through the heat conducting ceramic plate 201 and the internal fixed connection of the three-phase rectification module 103, the heat inside the three-phase rectification module 103 is led out through the radiating fins 202, thereby leading out the heat of the heat conducting ceramic plate 201 from the bottom surface, because a gap exists between the bottom of the mounting seat 101 and the bottom of the protective shell 102, thereby facilitating air entering, taking away the heat on the surface of the radiating fins 202, and performing natural heat dissipation and cooling, the structure prevents the protective shell 102 from being fixedly attached to the mounting seat 101, the heat at the bottom of the protective shell 102 is difficult to dissipate, when the external temperature is high, especially in a tropical high-temperature area, at the moment, the semiconductor radiator 204 is opened to cool down the outer end of the heat conducting ceramic plate 201, the semiconductor radiator 204 is small in size and fast in cooling, the heat dissipation is conducted into the three-phase rectification module 103 through the heat conducting ceramic plate 201, the internal heat of the three-phase rectification module 103 is reduced, the problem that the three-phase rectification module 103 is difficult to dissipate heat in high-temperature weather is effectively solved, the heat conducting ceramic plate 201 is high in heat conducting, the cooling, the structure can cool down and can ensure the safety of the rectification module, the three-phase rectification module, the safety control mechanism, and the three-phase rectification module is convenient for temperature adjustment.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A three-phase diode rectifier bridge module, includes installation mechanism (1), its characterized in that: a heat dissipation mechanism (2) is arranged outside the mounting mechanism (1);
the installation mechanism (1) comprises an installation base (101), the upper surface of the installation base (101) is fixedly connected with a protective shell (102), a three-phase rectification module (103) is arranged inside the protective shell (102), the upper end of the three-phase rectification module (103) is provided with a wiring port (104), and the upper part of the wiring port (104) is provided with a sealing ring (105);
radiating mechanism (2) are including heat conduction ceramic plate (201), heat conduction ceramic plate (201) bottom surface fixedly connected with fin (202), fin (202) outside is provided with sealed glue (203), the heat conduction ceramic plate (201) outside is provided with semiconductor radiator (204), semiconductor radiator (204) outside fixedly connected with set casing (205).
2. The three-phase diode rectifier bridge module of claim 1, wherein: the protective housing (102) both sides bottom is provided with the backup pad, two backup pads symmetric distribution, mount pad (101) upper surface and backup pad lower extreme fixed connection.
3. The three-phase diode rectifier bridge module of claim 1, wherein: the radiating fins (202) are arranged on the inner side of the supporting plate, and the radiating fins (202) are distributed in a plurality of equal intervals.
4. The three-phase diode rectifier bridge module of claim 1, wherein: the plurality of radiating fins (202) penetrate through the bottom of the protective shell (102), and the sealing glue (203) is arranged between the radiating fins (202) and the protective shell (102).
5. The three-phase diode rectifier bridge module of claim 1, wherein: the heat conduction ceramic plate (201) is arranged inside the three-phase rectification module (103), and the heat conduction ceramic plate (201) penetrates through the outside of the protection shell (102).
6. The three-phase diode rectifier bridge module of claim 1, wherein: the heat conducting ceramic plate (201) is L-shaped, and one end of the outer side of the heat conducting ceramic plate (201) is fixedly connected with the inside of the semiconductor radiator (204).
7. The three-phase diode rectifier bridge module of claim 1, wherein: the fixed shell (205) is fixedly connected to the outer side surface of the protective shell (102), and one end of the outer side of the heat-conducting ceramic plate (201) is arranged inside the fixed shell (205).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222393780.3U CN218039176U (en) | 2022-09-05 | 2022-09-05 | Three-phase diode rectifier bridge module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222393780.3U CN218039176U (en) | 2022-09-05 | 2022-09-05 | Three-phase diode rectifier bridge module |
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| Publication Number | Publication Date |
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| CN218039176U true CN218039176U (en) | 2022-12-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202222393780.3U Active CN218039176U (en) | 2022-09-05 | 2022-09-05 | Three-phase diode rectifier bridge module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117199044A (en) * | 2023-09-18 | 2023-12-08 | 先之科半导体科技(东莞)有限公司 | High-gate breakdown voltage field effect transistor |
-
2022
- 2022-09-05 CN CN202222393780.3U patent/CN218039176U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117199044A (en) * | 2023-09-18 | 2023-12-08 | 先之科半导体科技(东莞)有限公司 | High-gate breakdown voltage field effect transistor |
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