CN218277527U - Circuit board with good heat dissipation performance - Google Patents
Circuit board with good heat dissipation performance Download PDFInfo
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- CN218277527U CN218277527U CN202222452596.1U CN202222452596U CN218277527U CN 218277527 U CN218277527 U CN 218277527U CN 202222452596 U CN202222452596 U CN 202222452596U CN 218277527 U CN218277527 U CN 218277527U
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- circuit board
- fixedly arranged
- base plate
- heat
- heat dissipation
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Abstract
The utility model relates to a technical field of circuit board discloses a circuit board that heat dispersion is good, including the foundation plate, the fixed circuit board that is provided with in upper end of foundation plate, the fixed sealed lid that is provided with in upper end of circuit board, the bottom mounting of foundation plate is provided with a pair of data interface, the fixed a plurality of wires that are provided with in upper end of foundation plate, it is a plurality of the wire both ends all are provided with the through-hole. The utility model discloses in, the circuit board that a heat dispersion is good of this design passes through the foundation plate when using, sealed lid cooperation is sealed fills up and is pressed from both sides the closed clamp of circuit board in the centre, make circuit board itself possess good leakproofness, thereby possess good waterproof grease proofing performance, the semiconductor heat radiation structure who sets up simultaneously sealed covering can absorb the produced heat of the circuit board that is in the encapsulated situation work fast and derive, play good heat radiation structure, compare traditional air-cooled heat dissipation, the radiating efficiency of semiconductor is higher, make the work efficiency of circuit board higher, and is worth promoting.
Description
Technical Field
The utility model relates to a technical field of circuit board especially relates to a circuit board that heat dispersion is good.
Background
Printed circuit boards have taken an important position in the electronics industry. In recent decades, the printed circuit board manufacturing industry in China develops rapidly, many problems to be solved are discovered along with the development, most of materials of the existing PCB radiating layer are aluminum plates or ceramics, the heat conducting performance of the two materials is poor, the temperature of the radiating layer of a corresponding area right below an element is high, the temperature of other areas is low, the local temperature of the element is too high, and the element cannot work normally.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the shortcoming that exists among the prior art, and the circuit board that a heat dispersion is good that proposes, the circuit board that a heat dispersion is good of this design is through the semiconductor heat radiation structure and the dustproof waterproof grease proofing structure that set up when using, has solved traditional circuit board during operation radiating efficiency low and easy because the oil feed of intaking leads to the shortcoming that circuit corrosion damaged.
In order to achieve the above purpose, the utility model provides a following technical scheme:
a circuit board with good heat dissipation performance comprises a base substrate, wherein a circuit board is fixedly arranged at the upper end of the base substrate, a sealing cover is fixedly arranged at the upper end of the circuit board, a pair of data interfaces are fixedly arranged at the bottom end of the base substrate, a plurality of conducting wires are fixedly arranged at the upper end of the base substrate, through holes are formed in the two ends of the conducting wires, a chip is electrically connected to one side of the upper end of the circuit board, welding blocks are fixedly arranged on the four sides of the chip and are matched with the through holes, sealing gaskets are fixedly arranged at the bottom end of the sealing cover and the four sides of the upper end of the base substrate and are matched with the circuit board in a sealing manner, a fixing frame is fixedly arranged in the middle of the sealing cover, cold-end insulating ceramic tiles are fixedly arranged on one side, close to the base substrate, of the inner side of the fixing frame, far away from the base substrate, hot-end insulating ceramic tiles are fixedly arranged on one side of the inner side of the fixing frame, a heat conducting plate is fixedly arranged in the middle of the upper end of the fixing frame, and a plurality of heat conducting plates are fixedly arranged at the upper end of the heat conducting plate;
through the technical scheme, the device of this design passes through the base plate when using, sealed lid cooperation is sealed fills up and is being in the centre with the closed clamp of circuit board, make circuit board itself possess good leakproofness, thereby possess good waterproof and oilproof performance, the semiconductor heat radiation structure who sets up simultaneously on the sealed lid can be with being in the produced heat of the circuit board of encapsulated situation work and absorbing the derivation fast, play good heat radiation structure, compare traditional heat-conduction heat dissipation, the radiating effect of semiconductor is better, make the work efficiency of circuit board higher, be worth promoting.
Furthermore, the base plate, the circuit board and the sealing cover are fixedly connected through a plurality of fixing bolts at four corners, and gaskets are fixedly sleeved on the inner sides of the fixing bolts;
through above-mentioned technical scheme, the fixing bolt easy to assemble fixing device that sets up, the packing ring that sets up makes tighter that fixing bolt installed.
Furthermore, a plurality of heat dissipation columns are fixedly arranged on the four sides of the upper end of the heat conduction plate at equal intervals and close to the side edges, and top plates are fixedly connected to the upper ends of the heat dissipation columns;
through the technical scheme, the heat dissipation columns play a role in improving the heat dissipation efficiency of the hot-end insulating ceramic chip.
Furthermore, a pair of ventilation openings are symmetrically formed in the upper end of the top plate, and the ventilation openings are matched with the cooling fans;
through above-mentioned technical scheme, the ventilation structure has been constituteed in the clearance between the many heat dissipation posts of ventilation opening cooperation that sets up.
Furthermore, a plurality of pairs of metal conductors are fixedly arranged at equal intervals at one end of the cold end insulating ceramic chip far away from the base plate and one end of the hot end insulating ceramic chip close to the base plate, and a plurality of N-type semiconductors and P-type semiconductors are sequentially and electrically connected in series between the plurality of pairs of metal conductors;
through the technical scheme, the semiconductor heat dissipation structure of the device is formed by the design of the structure, and the heat dissipation efficiency of the device is greatly improved.
Further, the bottom end of the fixing frame is fixedly connected with a heat-conducting silica gel pad, and the heat-conducting silica gel pad is in heat-conducting fit with the chip on the circuit board;
through the technical scheme, the heat generated by the arranged heat conducting silica gel pad is conveniently absorbed by the cold end insulating ceramic chip.
Furthermore, a plurality of components and connectors are fixedly arranged at the upper end of the circuit board, welding blocks are fixedly arranged at the positions, located at the plurality of components and connectors, of the upper end of the circuit board, the plurality of components, connectors and chips are electrically connected with one another through a plurality of leads, and the pair of data interfaces are electrically connected with the circuit board through leads;
through the technical scheme, the design of the structure is convenient for the installation of components, connectors and chips on the circuit board.
Furthermore, limiting holes are formed in four corners of the upper end of the base plate, the circuit board and the sealing cover, and the fixing bolts and the limiting holes are in threaded fit with each other;
through the technical scheme, the limiting holes are convenient for fixing the fixing bolts.
The utility model discloses following beneficial effect has:
1. the utility model discloses in, base plate through setting up, sealed lid, sealed pad, fixing bolt has constituteed the grease proofing waterproof structure of device, in this structure, four sides of upper end of base plate are all fixed and are provided with sealed pad, four sides of bottom of sealed lid are all fixed and are provided with sealed pad, and base plate and sealed all through the fixing bolt of four corners department with circuit board fixed connection in the intermediate position, the sealed pad that the cooperation set up, can be fixed with circuit board seal, and the gas tightness is good, excellent gas tightness and airtight space, make the circuit board possess good grease proofing waterproof performance, the equipment is conveniently dismantled to a plurality of fixing bolt's design simultaneously so that the circuit board, be convenient for overhaul the circuit board and maintain the change, the global design practicality is good.
2. The utility model discloses in, heat conduction silica gel pad through the setting, fixed frame, the insulating ceramic chip of cold junction, the insulating ceramic chip of hot junction, radiator fan, the heat dissipation post, the heat radiation structure of device has been constituteed to roof and vent, in this structure, when circuit board during operation, components and parts and chip can produce very big heat because of calculation processing, therefore can be through opening radiator fan, and the semiconductor heat radiation structure circular telegram of constituteing for the insulating ceramic chip of cold junction and the insulating ceramic chip of hot junction, under the Peltier effect, the cold junction insulating ceramic chip can rapid heat absorption, the insulating ceramic chip of hot junction can send heat fast, the heat that the circuit board produced is absorbed by the insulating ceramic chip of cold junction along heat conduction silica gel pad, accomplish the quick heat dissipation of airtight circuit board down, the heat that the insulating ceramic chip of hot junction produced is along the even a plurality of heat conduction on a plurality of heat dissipation posts of heat-conducting plate, radiator fan's high-speed rotation, take in air from the vent with high-speed form, and blow off along the clearance between a plurality of heat dissipation posts, the heat dissipation, the quick conduction of heat conduction on the heat dissipation post is walked away, accomplish the insulating heat dissipation, the whole design is compared in traditional heat dissipation fan heat dissipation structure, the radiating efficiency of this design is high-speed, can be worth promoting under the high temperature that will produce in the short time, high temperature, the high-speed.
Drawings
Fig. 1 is a cross-sectional view of a circuit board with good heat dissipation performance provided by the present invention;
fig. 2 is a top view of a circuit board with good heat dissipation performance according to the present invention;
fig. 3 is a top view of a base plate of a circuit board with good heat dissipation performance according to the present invention;
fig. 4 is an axonometric view of a heat dissipation structure of a circuit board with good heat dissipation performance provided by the utility model;
fig. 5 is an enlarged schematic view of a portion a of fig. 1.
Illustration of the drawings:
1. a limiting hole; 2. a component; 3. a circuit board; 4. a connector assembly; 5. a chip; 6. a base plate; 7. welding the blocks; 8. a wire; 9. a through hole; 10. fixing the bolt; 11. a heat-conducting silica gel pad; 12. a fixing frame; 13. a top plate; 14. a vent; 15. a heat radiation fan; 16. a heat conducting plate; 17. a hot end insulating ceramic chip; 18. a cold end insulating ceramic sheet; 19. a sealing cover; 20. a gasket; 21. a gasket; 22. a data interface; 23. a metal conductor; 24. an N-type semiconductor; 25. a P-type semiconductor; 26. a heat-dissipating stud.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides an embodiment: a circuit board with good heat dissipation performance comprises a base plate 6, a circuit board 3 is fixedly arranged at the upper end of the base plate 6, a sealing cover 19 is fixedly arranged at the upper end of the circuit board 3, a pair of data interfaces 22 is fixedly arranged at the bottom end of the base plate 6, a plurality of leads 8 are fixedly arranged at the upper end of the base plate 6, through holes 9 are respectively arranged at two ends of the plurality of leads 8, a chip 5 is electrically connected to one side of the upper end of the circuit board 3, welding blocks 7 are fixedly arranged on four sides of the chip 5, the welding blocks 7 are mutually matched with the through holes 9, the bottom end of the sealing cover 19 and the four sides of the upper end of the base plate 6 are all fixedly provided with sealing gaskets 21, the sealing gaskets 21 are all matched with the circuit board 3 in a sealing mode, the fixing frame 12 is fixedly arranged at the middle position of the sealing cover 19, one side, close to the base plate 6, of the inner side of the fixing frame 12 is fixedly provided with cold-end insulating tiles 18, one side, far away from the base plate 6, of the inner side of the fixing frame 12 is fixedly provided with hot-end insulating tiles 17, the heat conduction plate 16 is fixedly arranged at the middle position of the upper end of the fixing frame 12, and the upper end of the heat conduction plate 16 is fixedly provided with a plurality of radiating fans 15.
The base plate 6, circuit board 3 and sealed lid 19 all carry out fixed connection through a plurality of fixing bolt 10 of four corners department, the equal fixed cover in inboard of a plurality of fixing bolt 10 is equipped with packing ring 20, the equal equidistance of the equal side position of four sides in upper end of heat-conducting plate 16 is provided with a plurality of heat dissipation post 26, the upper end fixedly connected with roof 13 of a plurality of heat dissipation post 26, a pair of vent 14 has been seted up to the upper end symmetry of roof 13, a pair of vent 14 all mutually supports with a pair of radiator fan 15, the one end that base plate 6 was kept away from to cold junction insulating ceramic chip 18 and the equal equidistance of one end that hot junction insulating ceramic chip 17 is close to base plate 6 are fixed and are provided with a plurality of pairs of metallic conductor 23, all series connection electric connection has a plurality of N type semiconductor 24 and P type semiconductor 25 in proper order between a plurality of pairs of metallic conductor 23, the bottom fixedly connected with heat conduction silica gel pad 11 of fixed frame 12, heat conduction silica gel pad 11 all mutually heat conduction cooperation with chip 5 on circuit board 3, the upper end of circuit board 3 is fixed and is provided with a plurality of components 2 and connector 4, the equal fixed and is provided with welding piece 7 in the position that the upper end of a plurality of components 2 that the upper end of base plate 2 that the upper end is located a plurality of components 2 and connector 4, a plurality of connector 8 through a plurality of each other fixed connection of each other wire 3 and the equal wire 3, a plurality of connector 8, a plurality of connector 10 all fixed connection of connector 1 and the equal connector 3, a plurality of the equal connector 10 of the mutual electric connection of the mutual limit board of the mutual electric connection of the equal wire 3 and the mutual limit board 10 of limit hole of limit board 10 of limit board, a plurality of limit board 10 of limit wire 3, the mutual connection of limit wire 3 and the mutual connection of limit board 10 are seted up.
The working principle is as follows: the circuit board with good heat dissipation performance is characterized in that four sides of the upper end of a base plate 6 are fixedly provided with sealing gaskets 21, four sides of the bottom end of a sealing cover 19 are fixedly provided with sealing gaskets 21, the base plate 6 and the sealing cover 19 fixedly connect the circuit board 3 at the middle position through fixing bolts 10 at four corners, the circuit board 3 can be fixed in a sealing manner by the sealing gaskets 21 arranged in a matching manner, the air tightness is good, the air tightness and the sealing space are excellent, the circuit board 3 has good oil-proof and water-proof performance, meanwhile, the circuit board 3 is convenient to disassemble and assemble due to the design of the plurality of fixing bolts 10, the circuit board 3 is convenient to overhaul, maintain and replace, the whole design has good practicability, when the circuit board 3 works, the components 2 and the chips 5 generate great heat due to calculation processing, and therefore, the heat dissipation fan 15 can be opened, and the semiconductor heat dissipation structure composed of the cold end insulating ceramic chip 18 and the hot end insulating ceramic chip 17 is electrified, under the Peltier effect, the cold end insulating ceramic chip 18 can rapidly absorb heat, the hot end insulating ceramic chip 17 can rapidly emit heat, the heat generated by the circuit board 3 is absorbed by the cold end insulating ceramic chip 18 along the heat conducting silica gel pad 11, the rapid heat dissipation of the circuit board 3 under the sealing is completed, the heat generated by the hot end insulating ceramic chip 17 is uniformly conducted to a plurality of heat dissipation columns 26 along the heat conducting plate 16, the high-speed rotation of the heat dissipation fan 15 draws air from the ventilation opening 14 in a high-speed manner and blows the air out along the gaps among the heat dissipation columns 26, the heat on the heat dissipation columns 26 is rapidly conducted away, the rapid heat dissipation of the hot end insulating ceramic chip 17 is completed, compared with the traditional fan heat dissipation structure, the heat dissipation efficiency of the whole design is extremely high, the generated high temperature can be rapidly pressed down in a short time, the practicability is good, and the popularization is worth.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (8)
1. A circuit board with good heat dissipation performance comprises a base plate (6), and is characterized in that: a circuit board (3) is fixedly arranged at the upper end of the base plate (6), a sealing cover (19) is fixedly arranged at the upper end of the circuit board (3), and a pair of data interfaces (22) is fixedly arranged at the bottom end of the base plate (6);
the upper end of the base plate (6) is fixedly provided with a plurality of leads (8), through holes (9) are formed in two ends of the leads (8), one side of the upper end of the circuit board (3) is electrically connected with a chip (5), welding blocks (7) are fixedly arranged on four sides of the chip (5), the welding blocks (7) are matched with the through holes (9), sealing gaskets (21) are fixedly arranged on the bottom end of the sealing cover (19) and four sides of the upper end of the base plate (6), and the sealing gaskets (21) are matched with the circuit board (3) in a sealing mode;
a fixing frame (12) is fixedly arranged in the middle of the sealing cover (19), a cold-end insulating ceramic sheet (18) is fixedly arranged on one side, close to the base plate (6), of the inner side of the fixing frame (12), a hot-end insulating ceramic sheet (17) is fixedly arranged on one side, far away from the base plate (6), of the inner side of the fixing frame (12), a heat conducting plate (16) is fixedly arranged in the middle of the upper end of the fixing frame (12), and a plurality of radiating fans (15) are fixedly arranged at the upper end of the heat conducting plate (16).
2. The circuit board with good heat dissipation performance according to claim 1, wherein: the base plate (6), the circuit board (3) and the sealing cover (19) are fixedly connected through a plurality of fixing bolts (10) at four corners, and washers (20) are fixedly sleeved on the inner sides of the fixing bolts (10).
3. The circuit board with good heat dissipation performance according to claim 1, wherein: the heat-conducting plate is characterized in that a plurality of heat-radiating columns (26) are fixedly arranged on the four sides of the upper end of the heat-conducting plate (16) at equal intervals close to the side edges, and a top plate (13) is fixedly connected to the upper ends of the heat-radiating columns (26).
4. The circuit board of claim 3, wherein: a pair of ventilation openings (14) is symmetrically formed in the upper end of the top plate (13), and the ventilation openings (14) are matched with the cooling fans (15).
5. The circuit board with good heat dissipation performance according to claim 1, wherein: and a plurality of pairs of metal conductors (23) are fixedly arranged at equal intervals at one end of the cold end insulating ceramic chip (18) far away from the base plate (6) and one end of the hot end insulating ceramic chip (17) close to the base plate (6), and a plurality of N-type semiconductors (24) and P-type semiconductors (25) are sequentially and electrically connected in series between the plurality of pairs of metal conductors (23).
6. The circuit board with good heat dissipation performance according to claim 1, wherein: the bottom end of the fixing frame (12) is fixedly connected with a heat-conducting silica gel pad (11), and the heat-conducting silica gel pad (11) is in heat-conducting fit with a chip (5) on the circuit board (3) mutually.
7. The circuit board with good heat dissipation performance according to claim 1, wherein: the circuit board is characterized in that a plurality of components (2) and connectors (4) are fixedly arranged at the upper end of the circuit board (3), welding blocks (7) are fixedly arranged at positions, located at the plurality of components (2) and the connectors (4), of the upper end of the circuit board (3), the components (2), the connectors (4) and the chips (5) are electrically connected with one another through a plurality of leads (8), and the data interfaces (22) are electrically connected with the circuit board (3) through the leads (8).
8. The circuit board with good heat dissipation performance according to claim 2, wherein: limiting holes (1) are formed in four corners of the upper end of the base plate (6), the circuit board (3) and the sealing cover (19), and the plurality of fixing bolts (10) are in threaded fit with the limiting holes (1) in a mutual threaded fit mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222452596.1U CN218277527U (en) | 2022-09-16 | 2022-09-16 | Circuit board with good heat dissipation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222452596.1U CN218277527U (en) | 2022-09-16 | 2022-09-16 | Circuit board with good heat dissipation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218277527U true CN218277527U (en) | 2023-01-10 |
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ID=84712808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222452596.1U Active CN218277527U (en) | 2022-09-16 | 2022-09-16 | Circuit board with good heat dissipation performance |
Country Status (1)
| Country | Link |
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| CN (1) | CN218277527U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116489954A (en) * | 2023-04-27 | 2023-07-25 | 泗洪步鑫电机制造有限公司 | Motor drive equipment convenient to effective maintenance |
| WO2023151708A3 (en) * | 2023-04-20 | 2024-01-04 | 苏州有单互联网科技有限公司 | Electronic element heat dissipation assembly |
-
2022
- 2022-09-16 CN CN202222452596.1U patent/CN218277527U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023151708A3 (en) * | 2023-04-20 | 2024-01-04 | 苏州有单互联网科技有限公司 | Electronic element heat dissipation assembly |
| CN116489954A (en) * | 2023-04-27 | 2023-07-25 | 泗洪步鑫电机制造有限公司 | Motor drive equipment convenient to effective maintenance |
| CN116489954B (en) * | 2023-04-27 | 2024-02-13 | 泗洪步鑫电机制造有限公司 | Motor drive equipment convenient to effective maintenance |
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