CN210136679U - LED display screen using semiconductor refrigerating sheet for heat dissipation - Google Patents
LED display screen using semiconductor refrigerating sheet for heat dissipation Download PDFInfo
- Publication number
- CN210136679U CN210136679U CN201921357991.3U CN201921357991U CN210136679U CN 210136679 U CN210136679 U CN 210136679U CN 201921357991 U CN201921357991 U CN 201921357991U CN 210136679 U CN210136679 U CN 210136679U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- semiconductor
- shell
- display screen
- semiconductor refrigeration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
技术领域:Technical field:
本实用新型涉及一种应用半导体制冷片散热的LED显示屏。The utility model relates to an LED display screen which uses a semiconductor refrigerating sheet to dissipate heat.
背景技术:Background technique:
随着科学技术的不断发展,LED显示屏广泛用于信息发布、广告宣传、交通诱导等众多领域,成为日常生活的必不可缺的一部分。但当前LED户外产品应用中,屏体为散热在壳体开孔造成屏体防护等级低,且散热效率不高。因此在大幅提高屏体防护等级且能保证屏体散热效率的技术,势必能在行业内带来深远影响。With the continuous development of science and technology, LED display is widely used in many fields such as information release, advertising, traffic guidance, etc., and has become an indispensable part of daily life. However, in the current application of LED outdoor products, the screen body has a hole in the casing for heat dissipation, resulting in a low protection level of the screen body and a low heat dissipation efficiency. Therefore, the technology that greatly improves the protection level of the screen and can ensure the heat dissipation efficiency of the screen is bound to have a profound impact in the industry.
发明内容:Invention content:
本实用新型是为了解决上述现有技术存在的问题而提供一种应用半导体制冷片散热的LED显示屏。The utility model provides an LED display screen which uses a semiconductor refrigeration sheet to dissipate heat in order to solve the problems existing in the above-mentioned prior art.
本实用新型所采用的技术方案有:一种应用半导体制冷片散热的LED显示屏,包括LED模组、安装壳以及具有发热面和制冷面的半导体制冷片,所述安装壳的顶端平面上设有若干个槽孔,在每个槽孔的位置处固定一个LED模组,且一个LED模组对应将一个槽孔密封,若干个半导体制冷片设于安装壳的内腔中,且半导体制冷片的发热面固定于安装壳的内腔底平面上,半导体制冷片的制冷面朝向LED模组设置,在半导体制冷片与安装壳之间涂有散热硅脂;在安装壳的端面上设有排线孔,半导体制冷片上的导线通过排线孔排出安装壳外。The technical scheme adopted by the utility model is as follows: an LED display screen using a semiconductor refrigerating sheet for heat dissipation, comprising an LED module, a mounting shell and a semiconductor refrigerating sheet with a heating surface and a cooling surface, and a top plane of the mounting shell is provided with There are several slot holes, an LED module is fixed at the position of each slot hole, and one LED module corresponds to a slot hole, and several semiconductor refrigeration chips are arranged in the inner cavity of the installation shell, and the semiconductor refrigeration chips The heating surface is fixed on the bottom plane of the inner cavity of the installation shell, the cooling surface of the semiconductor refrigeration sheet is arranged towards the LED module, and heat dissipation silicone grease is applied between the semiconductor refrigeration sheet and the installation shell; Wire holes, the wires on the semiconductor refrigeration chip are discharged out of the installation shell through the wire holes.
进一步地,所述安装壳包括上壳体和底盖散热板,所述上壳体为底端开口的矩形状结构, 底盖散热板固定于上壳体上,且底盖散热板将上壳体的底开口封闭,槽孔开设在上壳体的顶端面上,半导体制冷片固定连接在底盖散热板的内端面上。Further, the installation case includes an upper case and a bottom cover heat dissipation plate, the upper case is a rectangular structure with an open bottom end, the bottom cover heat dissipation plate is fixed on the upper case, and the bottom cover heat dissipation plate connects the upper case. The bottom opening of the body is closed, the slot hole is opened on the top surface of the upper shell, and the semiconductor refrigeration chip is fixedly connected to the inner end surface of the heat dissipation plate of the bottom cover.
进一步地,所述底盖散热板的外端面上设有若干散热齿。Further, a plurality of heat dissipation teeth are provided on the outer end surface of the bottom cover heat dissipation plate.
进一步地,所述上壳体和底盖散热板之间设有散热板密封条。Further, a heat-dissipating plate sealing strip is arranged between the upper casing and the heat-dissipating plate of the bottom cover.
进一步地,在每个LED模组和安装壳之间设置有模组密封条。Further, a module sealing strip is arranged between each LED module and the mounting shell.
进一步地,所述安装壳的排线孔上固定有防水接头。Further, a waterproof connector is fixed on the cable hole of the installation shell.
本实用新型具有如下有益效果:The utility model has the following beneficial effects:
本实用新型能够保证屏体密闭情况下有良好的散热能力,使屏体具有更高的防护等级。本实用新型采用半导体制冷片散热,半导体制冷片的冷面朝向LED模组,从而有效降低LED显示屏内部温度。The utility model can ensure that the screen body has a good heat dissipation capacity under the condition of airtightness, so that the screen body has a higher protection level. The utility model adopts the semiconductor refrigerating sheet to dissipate heat, and the cold surface of the semiconductor refrigerating sheet faces the LED module, thereby effectively reducing the internal temperature of the LED display screen.
附图说明:Description of drawings:
图 1 为本实用新型结构图。Figure 1 is a structural diagram of the utility model.
图 2 为本实用新型局部放大图。Figure 2 is a partial enlarged view of the utility model.
图 3 为本实用新型中半导体制冷片在底盖散热板上的结构图。FIG. 3 is a structural diagram of the semiconductor refrigeration sheet on the bottom cover heat sink in the present invention.
具体实施方式:Detailed ways:
下面结合附图对本实用新型作进一步的说明。The utility model will be further described below in conjunction with the accompanying drawings.
如图1至图3,本实用新型一种应用半导体制冷片散热的LED显示屏,包括LED模组1、安装壳2以及具有发热面和制冷面的半导体制冷片3,在安装壳2的顶端平面上设有若干个槽孔,在每个槽孔的位置处固定一个LED模组1,且一个LED模组1对应将一个槽孔密封。若干个半导体制冷片3设于安装壳2的内腔中,且半导体制冷片3的发热面固定于安装壳2的内腔底平面上,半导体制冷片3的制冷面朝向LED模组1设置,在半导体制冷片3与安装壳2之间涂有散热硅脂。在安装壳2的端面上设有排线孔,半导体制冷片3上的导线通过排线孔排出安装壳2外。As shown in FIGS. 1 to 3 , an LED display screen of the present invention using a semiconductor cooling sheet for heat dissipation includes an
本实用新型中的安装壳2的底面为可拆卸结构,其结构具体为:安装壳2包括上壳体21和底盖散热板22,上壳体21为底端开口的矩形状结构, 底盖散热板22固定于上壳体21上,且底盖散热板22将上壳体21的底开口封闭,槽孔开设在上壳体21的顶端面上,半导体制冷片3固定连接在底盖散热板22的内端面上。The bottom surface of the
在底盖散热板22的外端面上设有若干散热齿23,散热齿23可以增加散热面积。A plurality of
为保证上壳体21和底盖散热板22之间的密封性,在上壳体21和底盖散热板22之间设有散热板密封条。In order to ensure the airtightness between the
为保证LED模组1和安装壳2之间的密封性,在每个LED模组1和安装壳2之间设置有模组密封条4。In order to ensure the sealing between the
在安装壳2的排线孔上固定有防水接头6,半导体制冷片3上的导线通过防水接头6排出安装壳2外。A
本实用新型能够保证屏体密闭情况下有良好的散热能力,使屏体具有更高的防护等级。本实用新型采用半导体制冷片散热,半导体制冷片的冷面朝向LED模组,从而有效降低LED显示屏内部温度。The utility model can ensure that the screen body has a good heat dissipation capacity under the condition of airtightness, so that the screen body has a higher protection level. The utility model adopts the semiconductor refrigerating sheet to dissipate heat, and the cold surface of the semiconductor refrigerating sheet faces the LED module, thereby effectively reducing the internal temperature of the LED display screen.
以上所述仅是本实用新型的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本实用新型原理的前提下还可以作出若干改进,这些改进也应视为本实用新型的保护范围。The above are only the preferred embodiments of the present invention. It should be pointed out that for those skilled in the art, some improvements can be made without departing from the principles of the present invention, and these improvements should also be regarded as the present invention. The scope of protection of the utility model.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921357991.3U CN210136679U (en) | 2019-08-21 | 2019-08-21 | LED display screen using semiconductor refrigerating sheet for heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921357991.3U CN210136679U (en) | 2019-08-21 | 2019-08-21 | LED display screen using semiconductor refrigerating sheet for heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210136679U true CN210136679U (en) | 2020-03-10 |
Family
ID=69708867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921357991.3U Expired - Fee Related CN210136679U (en) | 2019-08-21 | 2019-08-21 | LED display screen using semiconductor refrigerating sheet for heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210136679U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117092555A (en) * | 2023-10-19 | 2023-11-21 | 中科信创技术有限公司 | 5G communication cable open circuit detection equipment and method |
-
2019
- 2019-08-21 CN CN201921357991.3U patent/CN210136679U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117092555A (en) * | 2023-10-19 | 2023-11-21 | 中科信创技术有限公司 | 5G communication cable open circuit detection equipment and method |
| CN117092555B (en) * | 2023-10-19 | 2024-01-23 | 中科信创技术有限公司 | 5G communication cable open circuit detection equipment and method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101583255A (en) | Electronic equipment chassis | |
| CN101083888A (en) | Heat radiating device | |
| CN210136679U (en) | LED display screen using semiconductor refrigerating sheet for heat dissipation | |
| CN2703295Y (en) | LED light source module for signs | |
| CN204231857U (en) | Nano-fluid spiral microchannel heat abstractor | |
| CN204836913U (en) | Composite radiator and thermal module | |
| CN206413344U (en) | Liquid for IGBT module soaks cooling device | |
| CN106231836A (en) | Closed display device and assemble method thereof | |
| CN201773834U (en) | A cooling mechanism for an integrated power module | |
| CN205071594U (en) | Electronic equipment radiator | |
| CN218039176U (en) | Three-phase diode rectifier bridge module | |
| CN204314453U (en) | A kind of microwave radiometer air duct heat dissipating device | |
| CN219320632U (en) | Infrared lens refrigeration structure | |
| CN206539931U (en) | A kind of heat dissipation LED combines lamp plate | |
| CN206802775U (en) | An efficient heat dissipation LED module | |
| CN221930561U (en) | A high-efficiency overall heat dissipation device for LED display screen | |
| CN210630121U (en) | Waterproof air cooling system of electronic equipment | |
| CN202160364U (en) | Outdoor power box body | |
| CN209401258U (en) | A kind of waterproof LED display screen | |
| CN208572306U (en) | Communication power supply case | |
| CN113594100A (en) | Refrigeration type packaging structure of miniaturized volume | |
| CN221057411U (en) | Semiconductor chip packaging structure | |
| CN207820427U (en) | a cooling device | |
| CN205902262U (en) | Closed display device | |
| CN206250183U (en) | A kind of radiating enhanced integrated circuit packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200310 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |