CN210136679U - LED display screen using semiconductor refrigerating sheet for heat dissipation - Google Patents

LED display screen using semiconductor refrigerating sheet for heat dissipation Download PDF

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Publication number
CN210136679U
CN210136679U CN201921357991.3U CN201921357991U CN210136679U CN 210136679 U CN210136679 U CN 210136679U CN 201921357991 U CN201921357991 U CN 201921357991U CN 210136679 U CN210136679 U CN 210136679U
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heat dissipation
semiconductor
shell
display screen
semiconductor refrigeration
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Expired - Fee Related
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CN201921357991.3U
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Chinese (zh)
Inventor
何书专
张振东
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Nanjing Mingmu Video Technology Co ltd
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Nanjing Mingmu Video Technology Co ltd
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Abstract

The utility model discloses an LED display screen radiating by using semiconductor refrigeration pieces, a plurality of slots are arranged on the top plane of an installation shell, an LED module is fixed at the position of each slot, one LED module is sealed correspondingly with one slot, a plurality of semiconductor refrigeration pieces are arranged in the inner cavity of the installation shell, the heating surface of each semiconductor refrigeration piece is fixed on the bottom plane of the inner cavity of the installation shell, the refrigeration surface of each semiconductor refrigeration piece is arranged towards the LED module, and heat-radiating silicone grease is coated between each semiconductor refrigeration piece and the installation shell; the end face of the mounting shell is provided with a wire arranging hole, and the conducting wires on the semiconductor refrigeration piece are discharged out of the mounting shell through the wire arranging hole. The utility model discloses can guarantee to have good heat-sinking capability under the airtight circumstances of the screen body, make the screen body have higher protection level. The utility model discloses a semiconductor refrigeration piece heat dissipation, the cold side of semiconductor refrigeration piece is towards the LED module to effectively reduce the inside temperature of LED display screen.

Description

一种应用半导体制冷片散热的LED显示屏A kind of LED display screen using semiconductor refrigeration sheet to dissipate heat

技术领域:Technical field:

本实用新型涉及一种应用半导体制冷片散热的LED显示屏。The utility model relates to an LED display screen which uses a semiconductor refrigerating sheet to dissipate heat.

背景技术:Background technique:

随着科学技术的不断发展,LED显示屏广泛用于信息发布、广告宣传、交通诱导等众多领域,成为日常生活的必不可缺的一部分。但当前LED户外产品应用中,屏体为散热在壳体开孔造成屏体防护等级低,且散热效率不高。因此在大幅提高屏体防护等级且能保证屏体散热效率的技术,势必能在行业内带来深远影响。With the continuous development of science and technology, LED display is widely used in many fields such as information release, advertising, traffic guidance, etc., and has become an indispensable part of daily life. However, in the current application of LED outdoor products, the screen body has a hole in the casing for heat dissipation, resulting in a low protection level of the screen body and a low heat dissipation efficiency. Therefore, the technology that greatly improves the protection level of the screen and can ensure the heat dissipation efficiency of the screen is bound to have a profound impact in the industry.

发明内容:Invention content:

本实用新型是为了解决上述现有技术存在的问题而提供一种应用半导体制冷片散热的LED显示屏。The utility model provides an LED display screen which uses a semiconductor refrigeration sheet to dissipate heat in order to solve the problems existing in the above-mentioned prior art.

本实用新型所采用的技术方案有:一种应用半导体制冷片散热的LED显示屏,包括LED模组、安装壳以及具有发热面和制冷面的半导体制冷片,所述安装壳的顶端平面上设有若干个槽孔,在每个槽孔的位置处固定一个LED模组,且一个LED模组对应将一个槽孔密封,若干个半导体制冷片设于安装壳的内腔中,且半导体制冷片的发热面固定于安装壳的内腔底平面上,半导体制冷片的制冷面朝向LED模组设置,在半导体制冷片与安装壳之间涂有散热硅脂;在安装壳的端面上设有排线孔,半导体制冷片上的导线通过排线孔排出安装壳外。The technical scheme adopted by the utility model is as follows: an LED display screen using a semiconductor refrigerating sheet for heat dissipation, comprising an LED module, a mounting shell and a semiconductor refrigerating sheet with a heating surface and a cooling surface, and a top plane of the mounting shell is provided with There are several slot holes, an LED module is fixed at the position of each slot hole, and one LED module corresponds to a slot hole, and several semiconductor refrigeration chips are arranged in the inner cavity of the installation shell, and the semiconductor refrigeration chips The heating surface is fixed on the bottom plane of the inner cavity of the installation shell, the cooling surface of the semiconductor refrigeration sheet is arranged towards the LED module, and heat dissipation silicone grease is applied between the semiconductor refrigeration sheet and the installation shell; Wire holes, the wires on the semiconductor refrigeration chip are discharged out of the installation shell through the wire holes.

进一步地,所述安装壳包括上壳体和底盖散热板,所述上壳体为底端开口的矩形状结构, 底盖散热板固定于上壳体上,且底盖散热板将上壳体的底开口封闭,槽孔开设在上壳体的顶端面上,半导体制冷片固定连接在底盖散热板的内端面上。Further, the installation case includes an upper case and a bottom cover heat dissipation plate, the upper case is a rectangular structure with an open bottom end, the bottom cover heat dissipation plate is fixed on the upper case, and the bottom cover heat dissipation plate connects the upper case. The bottom opening of the body is closed, the slot hole is opened on the top surface of the upper shell, and the semiconductor refrigeration chip is fixedly connected to the inner end surface of the heat dissipation plate of the bottom cover.

进一步地,所述底盖散热板的外端面上设有若干散热齿。Further, a plurality of heat dissipation teeth are provided on the outer end surface of the bottom cover heat dissipation plate.

进一步地,所述上壳体和底盖散热板之间设有散热板密封条。Further, a heat-dissipating plate sealing strip is arranged between the upper casing and the heat-dissipating plate of the bottom cover.

进一步地,在每个LED模组和安装壳之间设置有模组密封条。Further, a module sealing strip is arranged between each LED module and the mounting shell.

进一步地,所述安装壳的排线孔上固定有防水接头。Further, a waterproof connector is fixed on the cable hole of the installation shell.

本实用新型具有如下有益效果:The utility model has the following beneficial effects:

本实用新型能够保证屏体密闭情况下有良好的散热能力,使屏体具有更高的防护等级。本实用新型采用半导体制冷片散热,半导体制冷片的冷面朝向LED模组,从而有效降低LED显示屏内部温度。The utility model can ensure that the screen body has a good heat dissipation capacity under the condition of airtightness, so that the screen body has a higher protection level. The utility model adopts the semiconductor refrigerating sheet to dissipate heat, and the cold surface of the semiconductor refrigerating sheet faces the LED module, thereby effectively reducing the internal temperature of the LED display screen.

附图说明:Description of drawings:

图 1 为本实用新型结构图。Figure 1 is a structural diagram of the utility model.

图 2 为本实用新型局部放大图。Figure 2 is a partial enlarged view of the utility model.

图 3 为本实用新型中半导体制冷片在底盖散热板上的结构图。FIG. 3 is a structural diagram of the semiconductor refrigeration sheet on the bottom cover heat sink in the present invention.

具体实施方式:Detailed ways:

下面结合附图对本实用新型作进一步的说明。The utility model will be further described below in conjunction with the accompanying drawings.

如图1至图3,本实用新型一种应用半导体制冷片散热的LED显示屏,包括LED模组1、安装壳2以及具有发热面和制冷面的半导体制冷片3,在安装壳2的顶端平面上设有若干个槽孔,在每个槽孔的位置处固定一个LED模组1,且一个LED模组1对应将一个槽孔密封。若干个半导体制冷片3设于安装壳2的内腔中,且半导体制冷片3的发热面固定于安装壳2的内腔底平面上,半导体制冷片3的制冷面朝向LED模组1设置,在半导体制冷片3与安装壳2之间涂有散热硅脂。在安装壳2的端面上设有排线孔,半导体制冷片3上的导线通过排线孔排出安装壳2外。As shown in FIGS. 1 to 3 , an LED display screen of the present invention using a semiconductor cooling sheet for heat dissipation includes an LED module 1 , a mounting shell 2 and a semiconductor cooling sheet 3 having a heating surface and a cooling surface. At the top of the mounting shell 2 A plurality of slot holes are arranged on the plane, and an LED module 1 is fixed at the position of each slot hole, and one LED module 1 correspondingly seals one slot hole. Several semiconductor refrigeration chips 3 are arranged in the inner cavity of the installation shell 2, and the heating surface of the semiconductor refrigeration chips 3 is fixed on the bottom plane of the inner cavity of the installation shell 2, and the cooling surface of the semiconductor refrigeration chips 3 is arranged towards the LED module 1, Heat-dissipating silicone grease is applied between the semiconductor cooling chip 3 and the mounting shell 2 . The end face of the mounting shell 2 is provided with a wiring hole, and the wires on the semiconductor refrigeration chip 3 are discharged out of the mounting shell 2 through the wiring hole.

本实用新型中的安装壳2的底面为可拆卸结构,其结构具体为:安装壳2包括上壳体21和底盖散热板22,上壳体21为底端开口的矩形状结构, 底盖散热板22固定于上壳体21上,且底盖散热板22将上壳体21的底开口封闭,槽孔开设在上壳体21的顶端面上,半导体制冷片3固定连接在底盖散热板22的内端面上。The bottom surface of the mounting shell 2 in the present invention is a detachable structure, and its structure is specifically: the mounting shell 2 includes an upper shell 21 and a bottom cover heat dissipation plate 22, the upper shell 21 is a rectangular structure with an open bottom end, and the bottom cover The heat dissipation plate 22 is fixed on the upper casing 21, and the bottom cover heat dissipation plate 22 closes the bottom opening of the upper casing 21, the slot is opened on the top surface of the upper casing 21, and the semiconductor refrigeration chip 3 is fixedly connected to the bottom cover to dissipate heat. on the inner end face of the plate 22 .

在底盖散热板22的外端面上设有若干散热齿23,散热齿23可以增加散热面积。A plurality of heat dissipation teeth 23 are provided on the outer end surface of the heat dissipation plate 22 of the bottom cover, and the heat dissipation teeth 23 can increase the heat dissipation area.

为保证上壳体21和底盖散热板22之间的密封性,在上壳体21和底盖散热板22之间设有散热板密封条。In order to ensure the airtightness between the upper casing 21 and the heat dissipation plate 22 of the bottom cover, a heat dissipation plate sealing strip is provided between the upper casing 21 and the heat dissipation plate 22 of the bottom cover.

为保证LED模组1和安装壳2之间的密封性,在每个LED模组1和安装壳2之间设置有模组密封条4。In order to ensure the sealing between the LED module 1 and the installation shell 2 , a module sealing strip 4 is arranged between each LED module 1 and the installation shell 2 .

在安装壳2的排线孔上固定有防水接头6,半导体制冷片3上的导线通过防水接头6排出安装壳2外。A waterproof connector 6 is fixed on the cable hole of the installation shell 2 , and the wires on the semiconductor refrigeration chip 3 are discharged out of the installation shell 2 through the waterproof connector 6 .

本实用新型能够保证屏体密闭情况下有良好的散热能力,使屏体具有更高的防护等级。本实用新型采用半导体制冷片散热,半导体制冷片的冷面朝向LED模组,从而有效降低LED显示屏内部温度。The utility model can ensure that the screen body has a good heat dissipation capacity under the condition of airtightness, so that the screen body has a higher protection level. The utility model adopts the semiconductor refrigerating sheet to dissipate heat, and the cold surface of the semiconductor refrigerating sheet faces the LED module, thereby effectively reducing the internal temperature of the LED display screen.

以上所述仅是本实用新型的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本实用新型原理的前提下还可以作出若干改进,这些改进也应视为本实用新型的保护范围。The above are only the preferred embodiments of the present invention. It should be pointed out that for those skilled in the art, some improvements can be made without departing from the principles of the present invention, and these improvements should also be regarded as the present invention. The scope of protection of the utility model.

Claims (6)

1. The utility model provides an use radiating LED display screen of semiconductor refrigeration piece which characterized in that: the LED cooling structure comprises an LED module (1), an installation shell (2) and a semiconductor cooling piece (3) with a heating surface and a cooling surface, wherein a plurality of slots are formed in the top plane of the installation shell (2), the LED module (1) is fixed at the position of each slot, one LED module (1) is correspondingly sealed with one slot, a plurality of semiconductor cooling pieces (3) are arranged in the inner cavity of the installation shell (2), the heating surface of each semiconductor cooling piece (3) is fixed on the bottom plane of the inner cavity of the installation shell (2), the cooling surface of each semiconductor cooling piece (3) faces towards the LED module (1), and heat dissipation silicone grease is coated between each semiconductor cooling piece (3) and the installation shell (2); the end face of the mounting shell (2) is provided with a wire arranging hole, and the conducting wires on the semiconductor refrigeration piece (3) are discharged out of the mounting shell (2) through the wire arranging hole.
2. The LED display screen using the semiconductor chilling plate for heat dissipation as claimed in claim 1, wherein: the mounting shell (2) comprises an upper shell (21) and a bottom cover heat dissipation plate (22), the upper shell (21) is of a rectangular structure with an open bottom end, the bottom cover heat dissipation plate (22) is fixed on the upper shell (21), the bottom opening of the upper shell (21) is sealed by the bottom cover heat dissipation plate (22), a slotted hole is formed in the top end face of the upper shell (21), and the semiconductor refrigeration piece (3) is fixedly connected to the inner end face of the bottom cover heat dissipation plate (22).
3. The LED display screen using the semiconductor chilling plate for heat dissipation as claimed in claim 2, wherein: the outer end face of the bottom cover heat dissipation plate (22) is provided with a plurality of heat dissipation teeth (23).
4. The LED display screen using the semiconductor chilling plate for heat dissipation as claimed in claim 2, wherein: and a heat dissipation plate sealing strip is arranged between the upper shell (21) and the bottom cover heat dissipation plate (22).
5. The LED display screen using the semiconductor chilling plate for heat dissipation as claimed in claim 1, wherein: a module sealing strip (4) is arranged between each LED module (1) and the mounting shell (2).
6. The LED display screen using the semiconductor chilling plate for heat dissipation as claimed in claim 1, wherein: and a waterproof joint (6) is fixed on the wire arrangement hole of the mounting shell (2).
CN201921357991.3U 2019-08-21 2019-08-21 LED display screen using semiconductor refrigerating sheet for heat dissipation Expired - Fee Related CN210136679U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921357991.3U CN210136679U (en) 2019-08-21 2019-08-21 LED display screen using semiconductor refrigerating sheet for heat dissipation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921357991.3U CN210136679U (en) 2019-08-21 2019-08-21 LED display screen using semiconductor refrigerating sheet for heat dissipation

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CN210136679U true CN210136679U (en) 2020-03-10

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117092555A (en) * 2023-10-19 2023-11-21 中科信创技术有限公司 5G communication cable open circuit detection equipment and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117092555A (en) * 2023-10-19 2023-11-21 中科信创技术有限公司 5G communication cable open circuit detection equipment and method
CN117092555B (en) * 2023-10-19 2024-01-23 中科信创技术有限公司 5G communication cable open circuit detection equipment and method

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Granted publication date: 20200310

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