CN215897801U

CN215897801U - Mobile phone heat dissipation back clip and heat dissipation body thereof

Info

Publication number: CN215897801U
Application number: CN202122089266.6U
Authority: CN
Inventors: 杨强; 冯志燕
Original assignee: Suzhou Inplus Electronics Co ltd
Current assignee: Suzhou Inplus Electronics Co ltd
Priority date: 2021-09-01
Filing date: 2021-09-01
Publication date: 2022-02-22
Anticipated expiration: 2031-09-01

Abstract

The present disclosure relates to heat dissipation devices, and particularly to a heat dissipation back clip for a mobile phone. The technical scheme adopted by the utility model is as follows: the heat dissipation body comprises a bottom plate and a heat dissipation fin group, wherein the lower surface of the heat dissipation fin group is fixedly connected to the upper surface of the bottom plate, and the heat dissipation fin group is formed by mutually connecting a plurality of heat dissipation fins formed by stamping. A heat dissipation back clamp of a mobile phone comprises a base, a semiconductor refrigeration wafer, the heat dissipation body, a fan, a circuit board connected with the fan and a shell, wherein a space used for assembling the semiconductor refrigeration wafer is formed in the inner surface of the base, the heat dissipation body is installed on the semiconductor refrigeration wafer, and the fan is installed inside the heat dissipation body. The utility model has the advantages that: the structure is simple, the processing efficiency is high, the use cost is low, the heat dissipation area is large, and the heat dissipation effect is good.

Description

Mobile phone heat dissipation back clip and heat dissipation body thereof

Technical Field

The present disclosure relates to heat dissipation devices, and particularly to a heat dissipation back clip for a mobile phone.

Background

With the continuous development of smart phones, the performance of the mobile phones is higher and higher due to the appearance of dual-core and multi-core mobile phones, and the following problems also start to appear, especially, the heating of the mobile phones becomes a common phenomenon of the smart phones, especially, the temperature of the high-end smart phones can even reach 45-50 ℃ when the high-end smart phones play games or watch videos, so that the use of the mobile phones is influenced, and the service lives of the mobile phones and batteries are also influenced. In order to solve the above problems, mobile phone radiators have been developed.

The heat radiator of the mobile phone in the existing market is mainly composed of a base plate and a plurality of heat radiating teeth which are integrally formed on the base plate in a die-casting or CNC machining mode, and the heat radiator with the structure has the defects of small heat radiating area, poor heat radiating effect and high use cost. In summary, the existing heat sinks for mobile phones are increasingly unable to meet the requirements of users. Therefore, a new technical solution needs to be provided.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a mobile phone heat dissipation back clip and a heat dissipation body thereof, which have the advantages of large heat dissipation area, good heat dissipation effect and capability of saving use cost.

In order to achieve the purpose, the utility model provides the following technical scheme:

the heat dissipation body comprises a bottom plate and a heat dissipation fin group, wherein the lower surface of the heat dissipation fin group is fixedly connected to the upper surface of the bottom plate, and the heat dissipation fin group is formed by mutually connecting a plurality of heat dissipation fins formed by stamping.

The further technical scheme is as follows:

each punched radiating fin is provided with a buckling part, and the plurality of radiating fins are buckled into a whole string by the buckling parts to form the radiating fin group.

Or, the punched radiating fins are welded with each other to form the radiating fin group.

The further technical scheme is as follows:

the lower surface of the radiating fin group is connected to the upper surface of the bottom plate in a welding mode.

The bottom plate is provided with a plurality of positioning holes.

And a positioning lug is arranged on the surface of the bottom plate deviating from the radiating fin group.

The heat dissipation back clamp comprises a base, a semiconductor refrigeration wafer, the heat dissipation body, a fan, a circuit board connected with the fan and a shell, wherein a space used for assembling the semiconductor refrigeration wafer is formed in the inner surface of the base, the heat dissipation body is installed on the semiconductor refrigeration wafer, and the fan is installed inside the heat dissipation body.

Preferably, the first and second liquid crystal materials are,

and two sides of the semiconductor refrigeration wafer are coated with heat conducting paste respectively.

Compared with the prior art, the mobile phone heat dissipation back clip and the heat dissipation body thereof provided by the utility model have the following technical effects:

1. according to the heat radiation body of the mobile phone heat radiation back clip, the heat radiation fin group formed by independent stamping replaces the traditional heat radiation teeth, the number of the adopted heat radiation fins is large, the specific surface area is large, the heat radiation area can be increased on the whole, and the heat radiation effect is improved.

2. The heat radiation body of the mobile phone heat radiation back clip has the advantages of simple structure, easy processing, high processing efficiency and low use cost.

3. The mobile phone heat dissipation back clip manufactured by the heat dissipation body disclosed by the utility model has the advantages of simple and reasonable structure, good overall heat dissipation effect and strong service performance.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic front view of the housing of FIG. 1 with the housing removed;

FIG. 3 is a schematic view of the back side of the base shown in FIG. 1 with the base removed;

fig. 4 is a schematic diagram of a back structure of the base plate.

Fig. 5 is a schematic structural view of a heat-dissipating fin set.

In the above drawings: 1. the cooling structure comprises a bottom plate, 1-1 parts of positioning holes, 1-2 parts of positioning bumps, 2 parts of cooling fin groups, 2-1 parts of cooling fins, 3 parts of a base, 4 parts of a semiconductor cooling wafer, 5 parts of a fan, 6 parts of a shell.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It is to be understood that the described embodiments are merely exemplary of the utility model, and not restrictive of the full scope of the utility model. All other embodiments, which can be derived by a person skilled in the art from the examples given herein without any inventive step, are within the scope of the present invention.

As a first embodiment of the present invention, the heat sink of the mobile phone heat dissipation back clip of the present invention includes a bottom plate 1 and a heat dissipation fin group 2, wherein a lower surface of the heat dissipation fin group 2 is fixedly connected to an upper surface of the bottom plate 1, and the heat dissipation fin group is formed by connecting a plurality of punched heat dissipation fins 2-1 to each other. In this embodiment, the bottom plate 1 is circular, but in other embodiments, it may also be oval or rectangular, and the shape is not limited.

Preferably, as a second embodiment of the present invention, in this embodiment, a further limitation is imposed on the first embodiment, each stamped heat dissipation fin 2-1 is respectively provided with a fastening portion, and the fastening portions are utilized to fasten a plurality of heat dissipation fins 2-1 into a whole string to form the heat dissipation fin group.

Preferably, as a third embodiment of the present invention, this embodiment is also a further limitation to the first embodiment, and the heat sink fin group may be formed by welding each stamped heat sink fin to each other.

In the second and third embodiments, the heat dissipating fin group is circular, and in other embodiments, the heat dissipating fin group may also be oval or rectangular, and the shape thereof is not limited. In the above embodiment, the air guide channels are formed between the adjacent heat dissipation fins, and the specific surface area of the heat dissipation fins is large, so that the air outlet efficiency can be improved, the heat dissipation efficiency can be further improved, and the heat can be rapidly dispersed from the plurality of air guide channels.

Preferably, as a fourth embodiment of the present invention, this embodiment is further limited to the above embodiment, and in this embodiment, the lower surface of the heat dissipation fin group 2 is connected to the upper surface of the base plate 1 by welding. In other embodiments, the heat dissipating fin group 2 may also be fixed on the upper surface of the base plate 1 by other methods, and the specific connection manner is not limited.

Referring to fig. 1, as a fifth embodiment of the present invention, the present embodiment discloses a mobile phone heat dissipation back clip, where the heat dissipation back clip includes a base 3, a semiconductor cooling wafer 4, a heat dissipation body disclosed in the first to fourth embodiments, a fan 5, a circuit board (not shown in the figure) connected to the fan, and a housing 6, a space for assembling the semiconductor cooling wafer 4 is provided on an inner surface of the base 3, the heat dissipation body, i.e., a heat dissipation fin group 2, is installed on the semiconductor cooling wafer 4, and the fan 5 is installed inside the heat dissipation fin group 2 and fixed on a bottom plate 1. In this embodiment, the semiconductor cooling chip 4 can absorb heat during operation to achieve cooling effect, and the generated heat is conducted to the bottom plate 1 and is rapidly dissipated by the fan 5 and the heat dissipating fin set 2. The cavity that shell 6 and base 3 cooperate and form for place above each part, be provided with a plurality of air current mouths on the upper surface of shell 6 and side, can be used to the heat and scatter fast through the opening passageway of air current mouth.

Preferably, as a sixth embodiment of the present invention, in this embodiment, a fifth embodiment is further defined, where the bottom plate 1 is provided with a plurality of positioning holes 1-1, and a surface of the bottom plate 1, which faces away from the heat dissipation fin group, is provided with positioning bumps 1-2. The positioning holes 1-1 are used for being matched with the positioning columns on the base 3 and used for fixing the position of the bottom plate to keep the bottom plate stable, and the positioning bumps 1-2 are used for positioning the semiconductor refrigeration wafer 4 and can prevent the semiconductor refrigeration wafer 4 from sliding.

Preferably, as a seventh embodiment of the present invention, this embodiment is a further improvement of the above embodiment, and both sides of the semiconductor cooling wafer 4 are coated with heat conductive pastes respectively. So as to improve the heat conduction effect of the semiconductor refrigeration chip.

When the mobile phone heat dissipation back clamp is used, the mobile phone heat dissipation back clamp can be fixed on electronic equipment by adopting the elastic clamping jaw, and can also be fixed on the electronic equipment in a magnetic suction mode. The specific fixing manner is not limited.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

Claims

1. A radiator of cell-phone heat dissipation back splint which characterized in that: the heat dissipation body comprises a bottom plate (1) and a heat dissipation fin group (2), wherein the lower surface of the heat dissipation fin group (2) is fixedly connected to the upper surface of the bottom plate (1), and the heat dissipation fin group is formed by mutually connecting a plurality of heat dissipation fins (2-1) formed by stamping.

2. The heat sink of the heat dissipation back clip of the mobile phone as claimed in claim 1, wherein: each punched heat radiation fin (2-1) is respectively provided with a buckling part, and the plurality of heat radiation fins (2-1) are buckled into a whole string by the buckling parts to form the heat radiation fin group.

3. The heat sink of the heat dissipation back clip of the mobile phone as claimed in claim 1, wherein: and all the punched radiating fins (2-1) are welded with each other to form the radiating fin group.

4. The heat sink for the handset heat sink clip according to claim 1, 2 or 3, wherein: the lower surface of the radiating fin group (2) is connected to the upper surface of the bottom plate (1) in a welding mode.

5. The heat sink of the heat dissipation back clip of the mobile phone as claimed in claim 4, wherein: the bottom plate (1) is provided with a plurality of positioning holes (1-1).

6. The heat sink of the handset heat sink clip according to claim 5, wherein: and a positioning bump (1-2) is arranged on the surface of the bottom plate (1) deviating from the radiating fin group (2).

7. The utility model provides a cell-phone heat dissipation back splint which characterized in that: the heat dissipation back splint comprises a base (3), a semiconductor refrigeration wafer (4), the heat dissipation body as claimed in any one of claims 1 to 5, a fan (5), a circuit board connected with the fan (5) and a shell (6), wherein a space for assembling the semiconductor refrigeration wafer (4) is formed in the inner surface of the base (3), the heat dissipation body is installed on the semiconductor refrigeration wafer (4), and the fan (5) is installed inside the heat dissipation body.

8. The heat dissipation back clip for mobile phone of claim 7, wherein: and two sides of the semiconductor refrigeration wafer (4) are coated with heat conducting paste respectively.