CN211478831U

CN211478831U - Structured light module

Info

Publication number: CN211478831U
Application number: CN202020282455.8U
Authority: CN
Inventors: 刘志伟; 韩江; 戴伦学
Original assignee: Fuzhou Rockchip Electronics Co Ltd
Current assignee: Rockchip Electronics Co Ltd
Priority date: 2020-03-10
Filing date: 2020-03-10
Publication date: 2020-09-11
Anticipated expiration: 2030-03-10

Abstract

The utility model discloses a structured light module, a serial communication port, include: PCB board, structured light subassembly, communication port, IC unit, casing. The IC unit, the structured light assembly and the communication port are arranged on the PCB, the structured light assembly is electrically connected with the IC unit, and the IC unit is electrically connected with the communication port; the communication port is used for connecting external equipment, and the structured light component is used for projecting structured light to the surface of an object, receiving and collecting structured light data and transmitting the structured light data to the IC unit. The shell is provided with a through hole which is used for accommodating the structured light assembly; and one side is also provided with an opening for accommodating the communication port. The PCB is arranged in the shell and connected with the shell, the structured light assembly is arranged in the through hole, and the communication port is arranged in the opening. According to the technical scheme, the IC unit is arranged in the structured light module, so that the integration degree of the structured light module is improved, and the equipment development cost is saved.

Description

Structured light module

Technical Field

The utility model relates to an electronic equipment technical field especially relates to a structured light module.

Background

Structured light is a set of system structures consisting of a light projector and a camera. The light projector is used for projecting specific light information to the surface of an object and the background, and the specific light information is collected by the camera. Information such as the position and depth of the object is calculated from the change of the optical signal caused by the object, and the entire three-dimensional space is restored. However, in the conventional electronic device, the structured light units are independent units, and in order to achieve the acquisition of various structured lights, a plurality of different structured light units are required, and the units all need to be controlled and assembled separately, which not only increases the complexity of device development, but also increases the production and use costs.

SUMMERY OF THE UTILITY MODEL

Therefore, it is desirable to provide a structured light module, which improves the integration degree of the structured light module, thereby saving the equipment development cost.

To achieve the above object, the present invention provides a structured light module, comprising: the PCB board, the structure optical assembly, the communication port, the IC unit and the shell;

the IC unit, the structured light assembly and the communication port are arranged on the PCB, the structured light assembly is electrically connected with the IC unit, and the IC unit is electrically connected with the communication port; the communication port is used for connecting external equipment, and the structured light assembly is used for projecting structured light to the surface of an object, receiving and collecting structured light data and transmitting the structured light data to the IC unit;

the shell is provided with a through hole which is used for accommodating the structured light assembly; and one side is also provided with an opening for accommodating the communication port;

the PCB is arranged in the shell and connected with the shell, the structured light assembly is arranged in the through hole, and the communication port is arranged in the opening.

Further, still include: a heat sink; a heat sink is coupled to the IC unit, the heat sink for dissipating heat from the IC unit.

Further, still include:

the IC unit is arranged on one side of the PCB, and the structured light assembly is arranged on the other side of the PCB.

Furthermore, the radiating fin is connected with the shell, one side of the radiating fin, which is attached to the IC unit, is of a planar structure, and a plurality of strip-shaped bulges are arranged on the other side of the radiating fin.

Further, the heat sink is connected to the housing by screws.

Furthermore, the radiating fin and the shell are respectively provided with a positioning hole and a positioning column, and the positioning column is used for being inserted into the positioning hole to position the radiating fin and the shell.

Furthermore, fixing lugs are further arranged on two sides of the radiating fin, and a plurality of fixing holes are further formed in the fixing lugs and used for fixing the structured light module.

Further, the structured light assembly comprises: an IR module, an RGB module, a flood light source, or a projector.

Further, the number of the IC units is more than two.

Further, the communication port is a USB port.

Different from the prior art, the technical scheme enables the structured light module to have higher integration level by arranging the IC unit and the communication port in the structured light module. The structured light module analyzes the structured light data received and collected by the structured light assembly through the IC unit and outputs the structured light data to external equipment through the communication port, so that the external equipment originally used for analyzing the structured light assembly to receive and collect the data is greatly saved, the integration level of the module is improved, the module is miniaturized, and the equipment development cost is saved.

Drawings

FIG. 1 is a diagram of the structure of the structured light module;

FIG. 2 is an exploded view of the structured light module;

FIG. 3 is a view of the housing structure;

fig. 4 is a view showing the structure of the heat sink.

Description of reference numerals:

1. a structured light assembly;

11. an IR module;

12. an RGB module;

13. a flood light source;

14. a projector;

2. a PCB board;

3. a communication port;

4. an IC unit;

5. a housing;

6. a heat sink;

7. fixing the ear;

8. positioning holes;

9. a positioning column;

10. and (7) fixing holes.

Detailed Description

To explain technical contents, structural features, and objects and effects of the technical solutions in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.

Referring to fig. 1 to 4, in order to improve the integration level of the structured light module, the present embodiment provides a solution for implementing the integration of the structured light module, where the structured light module includes: PCB board 2, structured light subassembly 1, communication port 3, IC unit 4. The IC unit 4, the structured light assembly 1 and the communication port 3 are all arranged on the PCB 2, the structured light assembly 1 is electrically connected with the IC unit 4, and the IC unit 4 is electrically connected with the communication port 3; the communication port 3 is used for connecting external equipment, and the structured light assembly 1 is used for projecting structured light to the surface of an object, receiving and collecting structured light data, and transmitting the structured light data to the IC unit 4. In this embodiment, the structured light assembly 1 includes: the IR module 11, the RGB module 12, the floodlight 13 or the projector 14 are electrically connected with the IC unit 4 respectively, and the IR module 11, the RGB module 12, the floodlight 13 and the projector 14 are electrically connected with the IC unit 4 respectively. It should be noted that, in this embodiment, the electrical connection between the structured light assembly 1 and the IC unit 4 may be implemented by a flat cable, or by printing a trace on the PCB 2, and the connection between the IC unit 4 and the communication port 3 may also be implemented by a flat cable or by disposing a trace on the PCB 2. The structured light component 1 sends the collected data information to the IC unit 4 for processing, and the IC unit 4 transmits the processed data information to the external device connected thereto through the communication port 3, where the external device may be a PC or the like. It should be noted that, in some embodiments, the communication port 3 may be a USB port or the like. Meanwhile, in order to increase the rate of information processing, there may be a plurality of IC units 4, and in this embodiment, two are preferable. According to the technical scheme, the IC unit 4 and the communication port 3 are arranged in the structured light module, so that the structured light module has higher integration level. The module passes through IC unit 4 analysis the structured light data that structured light subassembly 1 received, was gathered to pass through communication port 3 exports to external equipment, has saved to a great extent originally and has been used for analyzing structured light subassembly 1 and received, gather data external equipment, has also improved the integrated level of module simultaneously, makes the module miniaturized.

Referring to fig. 4, in order to protect the devices in the module, the structured light module of this embodiment further includes: a housing 5; the shell 5 is provided with a plurality of through holes for accommodating the structured light assembly 1. And one side is also provided with an opening for accommodating the communication port 3. The housing 5 may be made of a metal material. The PCB 2 is arranged on the shell 5 and connected with the shell 5, the structured light assembly 1 is arranged in the through hole, and the communication port 3 is arranged in the opening. The PCB 2 and the housing 5 are fixed and connected by a screw. Namely, the PCB 2 and the housing 5 are provided with corresponding threaded holes at the connecting position, and screws connect the PCB 2 and the housing 5 together through the two threaded holes. Of course, non-detachable connections may also be used, such as: welding, and the like. In some embodiments, a snap-fit connection may also be used. The arrangement of the housing 5 will provide a good working environment for the structured light module.

Because of IC unit 4 can produce higher temperature at the during operation, in order to prevent its damage because of overheated leading to, improve simultaneously IC unit 4's work efficiency, this embodiment, the structured light module still includes: and a heat sink 6. In order to prevent the IC unit 4 from overheating, the heat sink 6 should be disposed near the IC unit 4 to reduce the heat of the IC unit 4. For this purpose, the present embodiment provides a heat sink 6, and the heat sink 6 is attached to the IC unit 4 for conducting heat away from the IC unit 4. The heat sink 6 in this embodiment is small in size and is attached only to the IC unit 4. Damage of the IC unit 4 due to overheating is prevented. It should be noted that the IC unit 4 and the heat sink 6 are connected by a heat conductive silicone grease. The heat conductive silicone grease has good thermal conductivity and adhesiveness, and it does not cause the viscosity to be weakened by overheating of the IC unit 4, causing the heat sink 6 to fall.

Of course, referring to fig. 3, in some embodiments, in order to optimize the heat dissipation effect, the inventor adjusts the position of the IC unit 4, that is, the IC unit 4 is disposed on one side of the PCB 2, and the structured light assembly 1 and the communication port 3 are disposed on the other side of the PCB 2; the heat radiating fin 6 is connected with the shell 5, the heat radiating fin 6 is connected with the IC unit 4 through heat-conducting silicone grease, and the heat radiating fin 6 is made of metal materials. In this embodiment, one side of the heat sink 6 attached to the IC unit 4 is a planar structure, and a plurality of strip-shaped protrusions are disposed on the other side. The plurality of strip-shaped protrusions increase the heat transfer rate by increasing the area of the heat sink 6 in order to increase the contact area with air. It should be noted that in this embodiment, the heat sink 6 and the housing 5 are respectively provided with a positioning hole 8 and a positioning post 9, and the positioning post 9 is used for being inserted into the positioning hole 8 to achieve positioning of the heat sink and the housing.

In order to facilitate the installation of the structured light module, please refer to fig. 3, in this embodiment, the heat sink 6 is further provided with a fixing lug 7, in this embodiment, one end of the fixing lug 7 connected with the heat sink 6 is provided with a plurality of holes, and the holes are sleeved on the heat sink 6. And a plurality of fixing holes 10 are further formed in the other end of the fixing lug 7 and used for fixing the structured light module on other equipment. In some embodiments, two fixing lugs 7 are respectively disposed on two sides of the heat sink 6. Of course, the fixing lug can also be designed in a non-centrosymmetric manner, and the non-centrosymmetric design is used for preventing a structured light module from being installed reversely during assembly.

It should be noted that, although the above embodiments have been described herein, the scope of the present invention is not limited thereby. Therefore, based on the innovative concept of the present invention, the changes and modifications of the embodiments described herein, or the equivalent structure or equivalent process changes made by the contents of the specification and the drawings of the present invention, directly or indirectly apply the above technical solutions to other related technical fields, all included in the protection scope of the present invention.

Claims

1. A structured light module, comprising: the PCB board, the structure optical assembly, the communication port, the IC unit and the shell;

2. A structured light module according to claim 1, further comprising: a heat sink; a heat sink is coupled to the IC unit, the heat sink for dissipating heat from the IC unit.

3. A structured light module according to claim 2, further comprising:

4. The structured light module of claim 3, wherein the heat sink is connected to the housing, wherein the heat sink is attached to the IC unit and has a planar structure on one side and a plurality of protrusions on the other side.

5. A structured light module according to claim 3, wherein the heat sink is attached to the housing by screws.

6. The structured light module of claim 3, wherein the heat sink and the housing are respectively provided with a positioning hole and a positioning post, and the positioning post is inserted into the positioning hole to position the heat sink and the housing.

7. A structured light module according to claim 3, wherein fixing lugs are further provided on both sides of the heat sink, and a plurality of fixing holes are further provided on the fixing lugs for fixing the structured light module.

8. A structured light module according to claim 1, wherein the structured light assembly comprises: an IR module, an RGB module, a flood light source, or a projector.

9. The structured light module of claim 1, wherein there are more than two of said IC units.

10. A structured light module according to claim 1, wherein the communication port is a USB port.