CN212851558U - Radio frequency sensor chip mounting, fixing and protecting device - Google Patents

Radio frequency sensor chip mounting, fixing and protecting device Download PDF

Info

Publication number
CN212851558U
CN212851558U CN202021843818.7U CN202021843818U CN212851558U CN 212851558 U CN212851558 U CN 212851558U CN 202021843818 U CN202021843818 U CN 202021843818U CN 212851558 U CN212851558 U CN 212851558U
Authority
CN
China
Prior art keywords
chip
shell
circuit board
heat dissipation
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202021843818.7U
Other languages
Chinese (zh)
Inventor
宋清卿
黄鑫权
孙茂然
刘帆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Digital Efficiency Research Institute Foshan Co ltd
Original Assignee
Digital Efficiency Research Institute Foshan Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Digital Efficiency Research Institute Foshan Co ltd filed Critical Digital Efficiency Research Institute Foshan Co ltd
Priority to CN202021843818.7U priority Critical patent/CN212851558U/en
Application granted granted Critical
Publication of CN212851558U publication Critical patent/CN212851558U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

The utility model discloses a protection device is fixed in radio frequency sensor chip installation relates to the electronic components field, to the poor problem of current miniaturized passive radiating radio transmitter heat dissipation protective effect, now proposes following scheme, and it includes the shell, set up the cavity in the shell, just install spliced pole, circuit board, chip, shell fragment and heating panel in the cavity, the shell is the level form, just the bottom and the shell of spliced pole are fixed connection, the spliced pole is mutually perpendicular form with the shell, just the circuit board is located the top of spliced pole, the spliced pole is symmetric distribution about the four corners of circuit board, just the chip is located the top of circuit board, the chip is fixed connection with the circuit board. The utility model discloses novel structure, and the device simple structure easily produces, and integrated chip protection and chip heat dissipation function, the effectual relatively poor problem of miniaturized passive radiating radio transmitter heat dissipation protective effect of having solved.

Description

Radio frequency sensor chip mounting, fixing and protecting device
Technical Field
The utility model relates to an electronic components field especially relates to a radio frequency sensor chip installation fixed protection device.
Background
The radio technology utilizes electromagnetic waves for information interaction, a radio transmitting device is also matched with a radio receiving device in the radio equipment, and a related radio frequency chip is required for encoding and decoding work when a radio carrying information which we want to express is transmitted and translated after the radio carrying the information is received, so that the chip is an important core part in the radio equipment.
High-power radio equipment, its radio frequency chip is when possessing great transmitting power, also there is higher calorific capacity, the operating environment that high temperature accumulation can make the radio frequency chip worsens rapidly, serious can lead to the chip card to pause, the trouble takes place the desolder even, consequently all can install the fin additional on the chip and assist the heat dissipation generally, but the semi-enclosed shell structure of seting up the louvre is generally adopted to current miniaturized (passive heat dissipation) high-power radio transmitting device, the radiating effect of fin has been weakened greatly, and the louvre also makes the device inside receive external pollution easily, consequently, in order to solve above-mentioned problem, we have proposed a radio frequency sensor chip installation fixed protection device.
SUMMERY OF THE UTILITY MODEL
The utility model provides a pair of fixed protection device of radio frequency sensor chip installation has solved the poor problem of miniaturized passive radiating radio transmitter heat dissipation protective effect.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a radio frequency sensor chip mounting, fixing and protecting device comprises a shell, wherein a cavity is arranged in the shell, and the cavity is internally provided with a connecting column, a circuit board, a chip, a spring plate and a heat dissipation plate, the shell is horizontal, the bottom end of the connecting column is fixedly connected with the shell, the connecting column and the shell are mutually vertical, the circuit board is positioned at the top end of the connecting column, the connecting column is symmetrically distributed around four corners of the circuit board, the chip is positioned at the top end of the circuit board, the chip is fixedly connected with the circuit board, the chip is electrically connected with the circuit board, the elastic sheet is positioned at the top end of the chip, and the heat dissipation plate is positioned at the top end of the elastic sheet, the elastic sheet is in sliding connection with the heat dissipation plate, the top end of the shell is positioned at the heat dissipation plate and is provided with a heat dissipation groove in a matching mode, and the heat dissipation groove penetrates through the top end of the shell.
Preferably, the top of circuit board is located spliced pole department and all matches and installs the screw, just the bottom of screw all runs through in the circuit board, the bottom of screw all is threaded connection with the spliced pole.
Preferably, the elastic sheet and the chip are parallel to each other, and a silicone grease layer is filled between the elastic sheet and the chip in a matching manner.
Preferably, the top of heating panel is sealing connection with the top inner wall of shell, just the top fixedly connected with fin of heating panel, fin and heating panel are mutually perpendicular form, just the fin is evenly distributed about the top of heating panel, the fin all is cup jointed with the radiating groove.
Preferably, the bottom fixedly connected with baffle of heating panel, just the baffle is the symmetric distribution about the shell fragment, the guide slot has all been seted up at the both ends that the baffle is close to each other, just the guide slot runs through in the baffle, the both ends of shell fragment all are sliding connection with the guide slot.
Preferably, an antenna is installed at one end of the housing in a matched manner, and the antenna is electrically connected with the circuit board.
The utility model has the advantages that:
1. the device is through the elasticity of shell fragment for the heat dissipation plate pushes up the top of shell and covers the radiating groove, thereby makes the radiating groove on shell top sealed, with the inside dust or its pollutant of avoiding getting into the device.
2. The device is characterized in that most area of the radiating plate is in contact with the outside air through the radiating grooves, the contact area is increased through the radiating fins, waste heat generated by the chip is conducted to the outside of the shell through the silicone grease layer, the elastic sheets, the radiating plate and the radiating fins, and the running environment of the chip is improved.
In conclusion, the device is simple in structure and easy to produce, integrates chip protection and chip heat dissipation functions, and effectively solves the problem that the heat dissipation protection effect of the miniaturized passive heat dissipation radio transmitter is poor.
Drawings
Fig. 1 is a top view of the present invention.
Fig. 2 is a sectional view of the internal structure of the present invention.
Fig. 3 is a cross-sectional view of a-a in fig. 2 according to the present invention.
Reference numbers in the figures: 1. a housing; 2. a cavity; 3. connecting columns; 4. a circuit board; 5. a screw; 6. a chip; 7. a silicone layer; 8. a spring plate; 9. a heat sink; 10. a heat dissipation plate; 11. a heat sink; 12. a guide plate; 13. a guide groove; 14. an antenna.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-3, a chip mounting, fixing and protecting device for a radio frequency sensor comprises a housing 1, wherein a cavity 2 is formed in the housing 1, a connecting column 3, a circuit board 4, a chip 6, a spring plate 8 and a heat dissipation plate 10 are installed in the cavity 2, the housing 1 is horizontal, the bottom end of the connecting column 3 is fixedly connected with the housing 1, the connecting column 3 and the housing 1 are mutually vertical, the circuit board 4 is positioned at the top end of the connecting column 3, the connecting column 3 is symmetrically distributed on four corners of the circuit board 4, the chip 6 is positioned at the top end of the circuit board 4, the chip 6 is fixedly connected with the circuit board 4, the chip 6 is electrically connected with the circuit board 4, the spring plate 8 is positioned at the top end of the chip 6, the heat dissipation plate 10 is positioned at the top end of the spring plate 8, and the spring plate 8 is in sliding connection with, the top end of the shell 1 is positioned at a heat dissipation plate 10 and is provided with a heat dissipation groove 9 in a matching manner, the heat dissipation groove 9 penetrates through the top end of the shell 1, the top end of the circuit board 4 is positioned at a connecting column 3 and is provided with a screw 5 in a matching manner, the bottom end of the screw 5 penetrates through the circuit board 4, the bottom end of the screw 5 is in threaded connection with the connecting column 3, the elastic sheet 8 and the chip 6 are in a mutually parallel shape, a silicone grease layer 7 is filled between the elastic sheet 8 and the chip 6 in a matching manner, the top end of the heat dissipation plate 10 is in sealed connection with the inner wall of the top end of the shell 1, the top end of the heat dissipation plate 10 is fixedly connected with a heat dissipation plate 11, the heat dissipation plate 11 and the heat dissipation plate 10 are in a mutually perpendicular shape, the heat dissipation plate 11 is uniformly distributed on the top end of the heat, and the guide plate 12 is symmetrically distributed about the elastic sheet 8, the guide grooves 13 are formed in two ends of the guide plate 12 close to each other, the guide grooves 13 penetrate through the guide plate 12, two ends of the elastic sheet 8 are slidably connected with the guide grooves 13, the antenna 14 is installed at one end of the shell 1 in a matched mode, and the antenna 14 is electrically connected with the circuit board 4.
The working principle is as follows: the device provides a structure integrating chip 6 protection and chip 6 heat dissipation, the elastic sheet 8 of the device is made of brass alloy thin sheet with good elasticity, the heat dissipation plate 10 and the heat dissipation sheet 11 of the device are made of red copper alloy with good heat conduction and heat dissipation performance, the elastic sheet 8 is connected with the chip 6 through the silicone layer 7, the silicone layer 7 has the functions of filling gaps, enhancing heat conduction and enhancing insulation, the two ends of the elastic sheet 8 penetrate through a guide plate 12 (refer to figure 2) below the heat dissipation plate 10 after being bent, the heat dissipation plate 10 is propped against the top end of the shell 1 to cover the heat dissipation groove 9 through the elasticity of the elastic sheet 8, so that the heat dissipation groove 9 at the top end of the shell 1 is sealed to prevent dust or pollutants from entering the device, meanwhile, most area of the heat dissipation plate 10 is contacted with the outside air through the heat dissipation groove 9, and the contact area is increased through the heat dissipation sheet, waste heat generated by the chip 6 is conducted to the outside of the shell 1 through the silicone grease layer 7, the elastic sheet 8, the heat dissipation plate 10 and the heat dissipation fins 11, and the operating environment of the chip 6 is improved.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims (6)

1. A radio frequency sensor chip mounting, fixing and protecting device comprises a shell (1) and is characterized in that a cavity (2) is formed in the shell (1), a connecting column (3), a circuit board (4), a chip (6), an elastic sheet (8) and a heat dissipation plate (10) are mounted in the cavity (2), the shell (1) is horizontal, the bottom end of the connecting column (3) is fixedly connected with the shell (1), the connecting column (3) and the shell (1) are mutually vertical, the circuit board (4) is positioned at the top end of the connecting column (3), the connecting column (3) is symmetrically distributed about four corners of the circuit board (4), the chip (6) is positioned at the top end of the circuit board (4), the chip (6) is fixedly connected with the circuit board (4), and the chip (6) is electrically connected with the circuit board (4), the spring plate (8) is located at the top end of the chip (6), the heat dissipation plate (10) is located at the top end of the spring plate (8), the spring plate (8) is in sliding connection with the heat dissipation plate (10), the top end of the shell (1) is located at the position of the heat dissipation plate (10) and matched with the heat dissipation groove (9), and the heat dissipation groove (9) penetrates through the top end of the shell (1).
2. The chip mounting, fixing and protecting device for the radio frequency sensor according to claim 1, wherein screws (5) are mounted on the top ends of the circuit boards (4) at the connecting posts (3) in a matching manner, the bottom ends of the screws (5) penetrate through the circuit boards (4), and the bottom ends of the screws (5) are in threaded connection with the connecting posts (3).
3. The chip mounting, fixing and protecting device of a radio frequency sensor according to claim 1, wherein the spring (8) and the chip (6) are parallel to each other, and a silicone layer (7) is filled between the spring (8) and the chip (6) in a matching manner.
4. The radio frequency sensor chip mounting, fixing and protecting device according to claim 1, wherein the top end of the heat dissipating plate (10) is hermetically connected to the inner wall of the top end of the housing (1), the top end of the heat dissipating plate (10) is fixedly connected with a heat dissipating fin (11), the heat dissipating fin (11) and the heat dissipating plate (10) are perpendicular to each other, the heat dissipating fins (11) are uniformly distributed on the top end of the heat dissipating plate (10), and the heat dissipating fins (11) are all sleeved with the heat dissipating grooves (9).
5. The chip mounting, fixing and protecting device for the radio frequency sensor according to claim 1, wherein a guide plate (12) is fixedly connected to the bottom end of the heat dissipating plate (10), the guide plate (12) is symmetrically distributed about the elastic sheet (8), guide grooves (13) are respectively formed in two ends of the guide plate (12) close to each other, the guide grooves (13) penetrate through the guide plate (12), and two ends of the elastic sheet (8) are slidably connected with the guide grooves (13).
6. The chip mounting, fixing and protecting device for the radio frequency sensor according to claim 1, wherein an antenna (14) is mounted at one end of the housing (1) in a matching manner, and the antenna (14) is electrically connected with the circuit board (4).
CN202021843818.7U 2020-08-29 2020-08-29 Radio frequency sensor chip mounting, fixing and protecting device Active CN212851558U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021843818.7U CN212851558U (en) 2020-08-29 2020-08-29 Radio frequency sensor chip mounting, fixing and protecting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021843818.7U CN212851558U (en) 2020-08-29 2020-08-29 Radio frequency sensor chip mounting, fixing and protecting device

Publications (1)

Publication Number Publication Date
CN212851558U true CN212851558U (en) 2021-03-30

Family

ID=75142083

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021843818.7U Active CN212851558U (en) 2020-08-29 2020-08-29 Radio frequency sensor chip mounting, fixing and protecting device

Country Status (1)

Country Link
CN (1) CN212851558U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022242510A1 (en) * 2021-05-18 2022-11-24 华为技术有限公司 Heat dissipation apparatus and vehicle-mounted module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022242510A1 (en) * 2021-05-18 2022-11-24 华为技术有限公司 Heat dissipation apparatus and vehicle-mounted module

Similar Documents

Publication Publication Date Title
CN101600325B (en) Combination heat sink of closed shell electronic equipment
KR102134756B1 (en) Connector
US20110293284A1 (en) Optical module and optical communication system
CN104377940B (en) The modular power source that a kind of thermal diffusivity is good
CN201467613U (en) Combined radiator for electronic device with enclosed shell
JPH0526936Y2 (en)
CN212851558U (en) Radio frequency sensor chip mounting, fixing and protecting device
CN208225802U (en) A kind of compact solid state relay that heat sinking function is excellent
CN108633213B (en) Electronic device
CN114379393A (en) Cooling flow channel structure of multiplexing metal-based circuit board and vehicle-mounted charger
CN212676249U (en) Semiconductor with long service life
CN212696447U (en) Shielding heat dissipation structure, single board and terminal
CN211200164U (en) Barrier gate radar
CN211478831U (en) Structured light module
CN208889482U (en) A kind of capacitance structure and electrical equipment
CN216134743U (en) Mobile terminal
CN220476180U (en) Equipment with radiating component
CN217145669U (en) Cooling flow channel structure of multiplexing metal-based circuit board and vehicle-mounted charger
CN213044021U (en) Ceramic radiating fin fixing mechanism
CN217259648U (en) Heat radiation structure of direct current charging pile charging module
CN218920817U (en) High-precision communication filter shell
CN217331199U (en) Remote measuring terminal
CN218977134U (en) Small-sized frequency converter
CN217307532U (en) Frequency converter structure
CN219247880U (en) Access switch for wind power control system

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant